GB0011567D0 - Surface-metallised plastic package and method for fabricating the same - Google Patents

Surface-metallised plastic package and method for fabricating the same

Info

Publication number
GB0011567D0
GB0011567D0 GBGB0011567.5A GB0011567A GB0011567D0 GB 0011567 D0 GB0011567 D0 GB 0011567D0 GB 0011567 A GB0011567 A GB 0011567A GB 0011567 D0 GB0011567 D0 GB 0011567D0
Authority
GB
United Kingdom
Prior art keywords
fabricating
same
plastic package
metallised plastic
metallised
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0011567.5A
Other versions
GB2362264A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to GB0011567A priority Critical patent/GB2362264A/en
Publication of GB0011567D0 publication Critical patent/GB0011567D0/en
Publication of GB2362264A publication Critical patent/GB2362264A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
GB0011567A 2000-05-12 2000-05-12 Surface-metallisated plastic package where metallisation is performed by lifting off masked region Withdrawn GB2362264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0011567A GB2362264A (en) 2000-05-12 2000-05-12 Surface-metallisated plastic package where metallisation is performed by lifting off masked region

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0011567A GB2362264A (en) 2000-05-12 2000-05-12 Surface-metallisated plastic package where metallisation is performed by lifting off masked region

Publications (2)

Publication Number Publication Date
GB0011567D0 true GB0011567D0 (en) 2000-06-28
GB2362264A GB2362264A (en) 2001-11-14

Family

ID=9891533

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0011567A Withdrawn GB2362264A (en) 2000-05-12 2000-05-12 Surface-metallisated plastic package where metallisation is performed by lifting off masked region

Country Status (1)

Country Link
GB (1) GB2362264A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105161432A (en) * 2015-09-17 2015-12-16 中芯长电半导体（江阴）有限公司 Chip packaging method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339305A (en) * 1981-02-05 1982-07-13 Rockwell International Corporation Planar circuit fabrication by plating and liftoff
US5395740A (en) * 1993-01-27 1995-03-07 Motorola, Inc. Method for fabricating electrode patterns
US5338391A (en) * 1993-10-12 1994-08-16 Motorola, Inc. Method of making a substrate having selectively releasing conductive runners

Also Published As

Publication number Publication date
GB2362264A (en) 2001-11-14

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)