Α7 Β7 ^ y// 五、發明說明（ 的上視示意圖。 第二b圖顯示本發明中晶圓運送裝置 沿第二a圖截面線2b-2b的截面示意圖。 第三 a圖顯示本發明中晶圓運送裝置 的上視示意圖。 第三b圊顯示本發明中晶圓運送裝置 沿第三a圖截面線3b-3b的截面示意圖。 第四a圖顯示本發明中晶圓運送裝置 的上視示意圖。 第四b圊顯示本發明中晶圓運送裝置 沿第四a圖裁面線4b-4b的截面示意圖。 第五a圖顯示本發明中晶圓運送裝置 的上視示意圖。 第五b圖顯示本發明中晶圓運送裝置 沿第五a圊載面線5b-5b的載面示意圖。 其第一實施例 其第二實施例 其第二實施例 其第三實施例 其第三實施例 其第四實施例 其第四實施例 (請先閱讀背面之注意事項再填寫本頁) 圖號，掛照說明= 裝--------訂----I----線 經濟部智慧財產局員工消費合作社印製 2b-5b 10 12 20-20b 22-22b 24-24b 截面線 晶圓運送臂 氣孔 第一區域 第二區域 絕緣材質 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） « A7 B7 五、發明説明（） 域 領 明 發 送送 運運 之以 趙用 物及 種法 一方 與的 係送 明運 發圓 本晶 種 於 5¾ 有 是 別 特 an* 有 法 方 置 裝 的 圓 晶 景 背 明 發 各 行 進 上 圓 晶 於 了 為 中 程 了 為 而 行 進 來 台 機 的 同 不 a?· 種 製各 的用 體應 導須 半常 在經 程 製運 同的 不利 種力 運的一 圓度由 晶確圓 用準晶 使置將 須位的 便及定 ,、穩 換間而 轉時速 間、快 台全夠 機安能 的求須 同講必 不中置 於程裝 圓製送 晶前運 使目圓 是在晶 或。， 圓置下 晶裝量 送送考 因 是 或 、 振 、 落 掉 免不 避置 ’位 中置 之放 室生 應產 反而 - 移 另位 至的 移中 轉程 室過 應動 反移 題 問 的 等 確 正 {請先閱讀背面之注意事項再填寫本頁) 參見第一圖所示，為一傳統的晶圓運送臂 10的上視 示意圖，在運送過程中的快速運動下，於加速及減速的過 程中，單純靠晶圓重量所產生的重力，並無法將晶圓穩定 的固定於晶圓運送臂之上，因此傳統的晶圓運送臂1 0，會 採用真空吸附的方式，利用其與晶圓接觸面上為數眾多的 小孔，如圖中之氣孔 12所示，於晶圓放置後，進行柚氣 的動作以使氣孔1 2内的壓力下降，利用氣孔1 2與外界的 壓力差所產生的力量，將晶圓固定於晶圓運送臂10之上， 而欲卸下晶圓時，則恢復氣孔 12内的壓力，再將晶圓放 置於機台中的晶圓承座之上。 本紙張尺度適用中國國家標準（CNS ) A4规格（210X297公釐） A7 B7 吸附的方式，在一般的大氣環境 等於或大於一大氣壓時，可產生 然而以目前的半導體的製程而 力極低的環境下進行，因此機台 力極低，傳統的晶圓運送臂 10 式，在此種低壓或真空的環境下 〇 0在低壓的環境下運作時，僅能 持晶圓的固定’在微小的固定力 10運送過程的加速及減速度降 臂10運送的速度大為降低，造 送效率的降低，且由於晶圓的固 免晶圓的位移，因此很容易造成 性欠佳的問題，亦會造成晶圓放 程進行的準確度》 一種晶圓運送的方法。 提供一種晶圓運送的方法及其裝 對晶圓良好的固定性，提昇晶圓 確度。 提供一種圓足性良好的晶圓運送 於低壓或真空的環境之中，使運 五、發明説明（） 此種利用壓力差產生 下，也就是於外界壓力約 良好的吸附及固定效果， 言，有許多的製程是在壓 間晶圓轉換運送的環境壓 利用壓差或真空吸附的方 完全無法發揮固定的效果 因此，晶園運送臂1 藉由重力產生的摩擦力維 量下，便需將晶圊運送臂 至最小，而使得晶圓運送 成相當大的不便及晶圓運 定力量很小，往往很難避 晶圓運送時安全性及穩定 置時位置的偏差，影響製 發明目的及概述： 本發明的目的為提供 本發明的另一目的為 置，可提供晶圊運送裝置 運送時的安全性及位置準 本發明的再一目的為 的方法及其裝置，可應用 本纸張尺度適用中國國家標準（CNS ) A4現格（210X 297公釐） (請先閲讀背面之注意事項再填其本頁) 五、發明説明（） 送晶圓的運動速度大幅增加。 (請先閱讀背而之'注意事項4"·'5·本頁) 本發明的再一目的為提供一種晶圓運送的方法及其裝 置，以解決傳統晶圓運送裝置晶圓固定性欠佳的問題。 本發明中之晶圓運送方法，其中一種實施方法可包含 以下步驟：首先提供第一型電荷至晶圓上；再提供第二型 電荷至一運送裝置上，第二型電荷與第一型電荷互為相異 型電荷；並以相異電荷之相吸，以固定晶圓於運送裝置上。 本發明中之晶圓運送方法，可運用另外一種感應電荷 的方法加以實施，可包含以下步驟：首先於一運送裝置上 之第一區域提供負電荷、第二區域提供正電荷；接著於一 晶圓相對應於第一區域之區域上感應正電荷、相對應於第 二區域之區域感應上負電荷；再以相異電荷之相吸，以固 定晶圓於運送裝置上。 本發明中之晶圓運送裝置則可包含一第一區域、一第 二區域 '絕緣材質、以及電源供應裝置：第一區域為導體 材質；第二區域同樣為導體材質，第一區域及第二區域組 合成一晶圊承托面；絕緣材質則設置於第一區域與第二區 域間；電源供應裝置用以提供第一區域第一型電荷，並提 供第二區域第二型電荷。 圖式簡箪說明： 第一圖顯示傳統的晶圓運送臂之上視示意圖。 第二a圖顯示本發明。中晶圓運送裝置.，其第一實施例 本紙张尺度適用中國國家標隼（CMS ) Λ4規格（210X 297公犮）Α7 Β7 ^ y // V. Top view of the description of the invention (The second diagram b shows a schematic cross-sectional view of the wafer conveying device in the present invention along the section line 2b-2b of the second diagram a. The third a diagram shows the invention A schematic top view of the wafer conveying device. The third b) shows a schematic cross-sectional view of the wafer conveying device in the present invention along the section line 3b-3b of the third a. The fourth a illustrates the top view of the wafer conveying device in the present invention. The fourth diagram (b) shows a schematic cross-sectional view of the wafer conveying device according to the present invention along the cutting line 4b-4b of the fourth diagram. The fifth diagram (a) shows a schematic top view of the wafer conveying device according to the invention. The fifth diagram (b) A schematic diagram showing the carrying surface of the wafer conveying device in the present invention along the fifth a loading surface line 5b-5b. Its first embodiment, its second embodiment, its second embodiment, its third embodiment, and its third embodiment. The fourth embodiment of the fourth embodiment (please read the precautions on the back before filling out this page) Figure number, description of the hanging photo = installation -------- order ---- I ---- line economy Printed by the Ministry of Intellectual Property Bureau Employee Consumer Cooperative 2b-5b 10 12 20-20b 22-22b 24-24b Section Line Wafer Transport Arm Gas Insulation material in the first area and the second area The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) «A7 B7 V. Description of the invention () The French party sent the Ming Yunfa round seed crystals on 5¾ There is a special an * The round crystal King installed on the French side back Mingfa went on the round crystal on the machine for the mid-range to come The different types of a? The body of each seed should be used in a roundness of the unfavorable species that is often used in the process of manufacturing. The roundness is determined by the crystal circle, and the quasi-crystal is used to set the required position, and the stable exchange room. The speed and speed of the platform are all sufficient for the security requirements. It must not be placed in the middle of the process. Before the crystal is sent, the eye circle is in the crystal or. Or, vibrate, drop, do not avoid, do not avoid the position of the room in the room should be produced instead-the transfer to the transfer to the transfer room over the reaction counter-movement questions are correct {Please read the precautions on the back first Fill out this page again) See the first picture, it is a The top view of the conventional wafer transport arm 10, under the rapid movement during the transport, during acceleration and deceleration, the gravity generated by the weight of the wafer alone cannot stabilize the wafer to the wafer. Above the conveying arm, the traditional wafer conveying arm 10 will use vacuum suction to utilize the numerous small holes on its contact surface with the wafer, as shown by air holes 12 in the figure. After the wafer is placed, To perform a pomegranate operation to reduce the pressure in the air hole 12 and use the force generated by the pressure difference between the air hole 12 and the outside to fix the wafer on the wafer transfer arm 10, and when the wafer is to be unloaded Then, the pressure in the air hole 12 is restored, and then the wafer is placed on the wafer holder in the machine. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) A7 B7 Adsorption method, when the general atmospheric environment is equal to or greater than one atmosphere pressure, it can produce an environment that is extremely low by the current semiconductor manufacturing process It is performed very low, so the force of the machine is extremely low. The traditional wafer conveying arm 10 type, when operating in such a low pressure or vacuum environment, it can only hold the wafer's fixation in a small fixation. Acceleration and deceleration of the force 10 transport process The speed of the lower arm 10 transport is greatly reduced, the manufacturing efficiency is reduced, and because the wafer is fixed and free of wafer displacement, it is easy to cause poor performance problems and also cause Accuracy of Wafer Scheduling "A method of wafer transport. Provides a method for wafer transportation and its good fixation to wafers to improve wafer accuracy. Provide a wafer with good round feet to be transported in a low-pressure or vacuum environment, so that it can be transported. V. Description of the invention () This kind of utilization of pressure difference, that is, the effect of good adsorption and fixation under external pressure, in other words, There are many processes in which the environmental pressure of wafer transfer and transfer is not able to exert a fixed effect using the pressure difference or vacuum adsorption. Therefore, under the dimension of the friction force generated by the gravity of the Jingyuan transport arm 1, it is necessary to transfer The wafer transport arm is the smallest, which makes the wafer transportation quite inconvenient and the wafer transportation setting force is very small. It is often difficult to avoid deviations in the safety and stable position of the wafer during wafer transportation, which affects the purpose and overview of the invention. : The purpose of the present invention is to provide another object of the present invention, which can provide the safety and position of the crystal cymbal transport device when transported. The method and the device according to another object of the present invention can be applied to the paper scale. Chinese National Standard (CNS) A4 is now available (210X 297 mm) (Please read the precautions on the back before filling out this page) 5. Explanation of the invention increase. (Please read "Notes 4" and "5" on this page first) Another object of the present invention is to provide a method and device for wafer transportation to solve the problem of poor wafer fixation of conventional wafer transportation devices. The problem. In the wafer transport method of the present invention, one of the implementation methods may include the following steps: firstly providing a first-type charge to the wafer; and then providing a second-type charge to a transport device, the second-type charge and the first-type charge The charges are different from each other; and the attraction of the different charges is used to fix the wafer on the transport device. The wafer transport method in the present invention may be implemented by using another method of inducing charge, and may include the following steps: firstly providing a negative charge in a first region on a transporting device, and providing a positive charge in a second region; A positive charge is induced in the area corresponding to the first area and a negative charge is induced in the area corresponding to the second area; and then the different charges are attracted to fix the wafer on the transport device. The wafer conveying device in the present invention may include a first region, a second region 'insulation material, and a power supply device: the first region is a conductor material; the second region is also a conductor material, the first region and the second region The regions are combined to form a crystal cymbal support surface; the insulating material is disposed between the first region and the second region; the power supply device is used to provide a first-type charge in the first region and a second-type charge in the second region. Brief description of the drawings: The first figure shows a schematic top view of a conventional wafer transfer arm. The second a diagram shows the present invention. Medium wafer conveying device. Its first embodiment This paper size is applicable to the Chinese National Standard (CMS) Λ4 specification (210X 297 cm)
Α7 Β7 ^ y// 五、發明說明（ 的上視示意圖。 第二b圖顯示本發明中晶圓運送裝置 沿第二a圖截面線2b-2b的截面示意圖。 第三 a圖顯示本發明中晶圓運送裝置 的上視示意圖。 第三b圊顯示本發明中晶圓運送裝置 沿第三a圖截面線3b-3b的截面示意圖。 第四a圖顯示本發明中晶圓運送裝置 的上視示意圖。 第四b圊顯示本發明中晶圓運送裝置 沿第四a圖裁面線4b-4b的截面示意圖。 第五a圖顯示本發明中晶圓運送裝置 的上視示意圖。 第五b圖顯示本發明中晶圓運送裝置 沿第五a圊載面線5b-5b的載面示意圖。 其第一實施例 其第二實施例 其第二實施例 其第三實施例 其第三實施例 其第四實施例 其第四實施例 (請先閱讀背面之注意事項再填寫本頁) 圖號，掛照說明= 裝--------訂----I----線 經濟部智慧財產局員工消費合作社印製 2b-5b 10 12 20-20b 22-22b 24-24b 截面線 晶圓運送臂 氣孔 第一區域 第二區域 絕緣材質 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 五、發明說明（） 25-25a 電源感應裝置 26 晶圓 28-28a 晶圓感應器 30-30b 傾斜導槽區域 32-32a 延伸臂 34a ' 34c 平面 34b 、 34d 缺口 36-36b 表面絕緣材質 38 間隙 40 晶圓承座 A7 B7 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 發明詳細說明： 本發明中提供一種晶圓運送的方法及其裝置，利用提 供晶圓與晶圓運送裝置的相異型靜電電荷、以及相異型電 荷產生吸力的特性，可提供晶圓運送裝置對晶圓良好的固 定性，並且其固定性不會受環境壓力的影響，可應用於一 般壓力、低壓或是真空的環境之中，使晶圓運送裝置運動 的速度不會受到限制’以增加運送時的穩定性及安全性’ 避免晶圓於移動過程中所產生的位置偏移。 參見第二a圖所示，為本發明中之晶圓運送裝置第一 實施例的上視示意圖，晶圓運送裝置可包含第一區域20、 第二區域22、絕緣材質24、以及電源供應裝置25。第一 區域20及第二區域22均為導體材質，兩者組合成一晶圓 "--------訂-----I---線 本紙張尺度適用中國國家標準（CNS)A4規格（210x 297公釐） 經濟部智慧財產局員工消費合作社印製 A7 _B7_ 五、發明說明（） 承托面；絕緣材質24設置於第一區域20與第二區域24之 間；而電源供應裝置2 5則用以提供第一型電荷至第一區域 20，並提供第二型電荷至第二區域22。 參見第二b圖所示’即為本發明中之晶圓運送裝置第 一實施例的側視示意圖，本發明中的晶圓運送方法的實施 方式之一，即是先由第一區域20提供第一型電荷至晶圓26 上；同時提供第二型電荷至運送裝置的第二區域22上，並 使第二型電荷與第一型電荷互為相異型電荷；因此便可以 相異電荷之相吸，以固定晶圚2 6於運送裝置上。 以圖中顯示例而言，即是使電源供應裝置 2 5產生靜 電電荷至第一區域20及第二區域22中，而第一型電荷可 為圖中所示的負電荷，第二型電荷則為正電荷。 參見第二a圊所示·晶圓運送裝置並可包含一晶圓感 應器28，以感測晶圓26之載入，晶圓感應器28可使用一 般常應用的電容式感測器，利用晶圓26放置時產生的電容 效應，即可感測晶圓26之載入；晶圓感應器28亦可使用 其他型式的感測器，例如光學感測器等。 進一步的，晶圓運送裝置亦可加入一具有絕緣特性的 傾斜導槽區域30，設置於晶圓運送裝置與晶圓26接觸區 域之週圍，防止第一區域20與外界形成電性接觸，如第二 b圖中所示，以使晶圓26於裝置時能藉由傾斜導槽區域30 的導引，準確的載入晶圓運送裝置中欲放置晶圓26的位 置，減少放置位置的偏差。晶圓運送裝置並可包含一延伸 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝.I I I I I I —訂.— — — — 111· A7 A7 五 、發明說明（ 臂32以固定第一區域20及第二區域22，卄谏名拟 w 並透過對延伸臂 32的驅動來控制晶圓運送裝置的運動^ 以第二a圖及第二b圖中的實施例而言，即是使晶 26以其背面與運送裝置相接觸，運送裝置即由下方裝$晶 圓26。第一區域20及第二區域22結合成為—圓形承托面， 圓形承托面兩側呈削去之平面34a，並於圓形承托面前方 具有一缺口 34b，以利於當降下晶圓運送裝置以將晶圓26 卸下時，可使晶圓頂座（lifter)透過兩側之平面34a及缺口 34b，順利的將晶圓26承起。當晶圓卸栽時，藉由吩去第 一區域20及第二區域22的電荷，可消除運送裝置上之第 二蜇電荷及消除晶® 26之第一型電荷，以將晶圓26自運 送裝置卸載，使晶圓頂座將晶圓2 6承起》 在第一實施例中，第一區域20係與晶圓26呈電性相 接，如第二b圖所示，以提供第一变電荷（本例中為負電荷） 至晶圆26上’第二區域22則與晶圓相隔離，晶圓運送裝 置以第二型電荷及晶圓上之第一变電荷之相吸力，固定a 卸26於晶圓運送裝置之上。而第一區域20即位於相對Z 圓26之邊緣區域’第二區域22則位於相對於晶圓26之中 央部分區域’如第二a圈所示。並可如第二b圖所示，加 入一表面絕緣材質36於第二區域22之上。藉由第一區域 2〇及第二區域22間相對高度的調整’可保持晶圓26與表 面絕緣材質36間維持一極小的間隙38，而不會使兩者相 接觸。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公蜚） , ί 裝--------tl---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 A7 ___B7_-_ 五、發明說明（） 而在本發明的第二實施例中，則可變更晶圓運送裝置 裝卸晶圓26的方向，如第三b圖中的示意圊，而使用相似 的系統設計，如第三a圖中所示。在第三b圖中’晶圓2 6 係以其正面之邊緣區域與晶圓運送裝置相接觸，即晶圓運 送裝置由上方裝卸晶圓。以此種設計方式而言，晶圓26是 由上方放下至其下方的晶圓承座40之上，因此可免除使用 晶圓頂座的額外步驟，並簡化系統的設計。藉由第一區域 20及第二區域22間相對高度的調整，可保持晶圓26的正 面與表面絕緣材質3 6間維持一極小的間隙3 8，而不會使 兩者相接觸，可避免接觸晶圓26正面的元件區，以消除表 面元件區因接觸而遭到破壞的危險。 同樣的，在此第二實施例中，第一區域20係與晶圓26 呈電性相接，如第三b圖所示，以提供第一型電荷（本例中 為負電荷）至晶圓26上，第二區域22則與晶圓相隔離，晶 圓運送裝置以第二型電荷（本例中為正電荷）、以及晶圓26 上之第一型電荷的相吸力，固定晶圚 26於晶圚運送裝置 上。第一區域20即位於相對晶圓26之邊緣區域，第二區 域22則位於相對於晶圓26之中央部分區域，如第三a圊 所示。並可如第三bffl所示，加入一表面絕緣材質36於第 二區域22之上。 上述的第一及第二實施例中，係以由第一區域20提 供電荷的方式，來產生第二區域22與晶圓26間的相吸作 用，以形成固定效果。而本發明的另一種實施方式，則可 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） - ί裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 _._B7_ 五、發明說明（） 利用感應電荷的方式，來達成固定的目的。 參見第四 a圊所示，為本發明之第三實施例的上視示 意圖，第一區域20a位於相對晶圊26之一半圓區域，第二 區域22a則位於相對晶圓26之另一半®區域。參見第四b 圖所示，即為本發明中之晶圓運送裝置第三實施例中，沿 裁面線4b的側視示意圊，第一區域20a與第二區域22a之 間具有絕緣材質24a，第一區域20a與第二區域22a的表 面處則有一表面絕緣材質36a。本發明中的晶圓運送方法 的另一實施方式，即是先於運送裝置上之第一區域20a提 供負電荷、第二區域20b提供正電荷；並於晶圓26相對應 於第一區域20a之區域上感應正電荷、相對應於第二區域 22a之區域感應上負電荷；再以相異型電荷之相吸，以固 定晶圓26於運送裝置上。 以第四a圖中之顯示例而言，即是使電源供應裝置25a 產生靜電電荷至第一區域20及第二區域22中，以提供所 需的負電荷及正電荷。同樣的，晶圓運送裝置並可包含一 晶圓感應器2 8 a，以感測晶圓2 6之載入；晶圊運送裝置亦 可加入一具絕緣性質的傾斜導槽區域30，設置於晶圓運送 裝置與晶圓26接觸區域之週圍，如第四b圖中所示，以導 引並載入晶圓26;並可包含一延伸臂32a以固定第一區域 20及第二區域22，以透過對延伸臂32a的堪動來控制晶圓 運送裝置的運動。 以第四a圊及第四b圊中的實施例而言，即是使晶園 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) '策--------訂---------線 經濟部智慧財產局員工消費合作社印製 A7 B7_ 五、發明說明（） 26以其背面與運送裝置相接觸，運送裝置即由下方裝卸晶 圓26。第一區域20a及第二區域22a結合成為一圓形承托 面，兩側呈削去之平面 34c，並於圊形承托面前方具有一 缺口 34d，以利於晶圓頂座.透過兩側之平面34c及缺口 34d， 順利的將晶圓2 6承起。當晶圓卸載時，藉由除去第一區域 20及第二區域22的電荷，可消除運送裝置上之電荷及晶 圓上的感應電荷，以將晶圓自運送裝置卸載，使晶圓頂座 將晶圓2 6承起。 而在本發明的第四實施例中，則可變更晶圓運送裝置 裝卸晶圓26的方向，如第五b圚中的示意圖，而其系統設 計則可變更為如第五a圖中所示，第一區域20b位於相對 於晶圓2 6的邊緣區域，第二區域2 2 b則位於相對於晶圊2 6 的中央區域，第一區域2 0b與第二區域2 2b之間有一絕緣 材質24b，第一區域20b及第二區域22b之表面則有一絕 緣材質36b，如第五b圖所示。晶圓26係以其正面之邊緣 區域與晶圓運送裝置中絕緣的傾斜導槽區域30b之内緣相 接觸，即晶圓運送裝置由上方裝卸晶圓。以此種設計方式 而言，晶圓26是由上方放下至晶圓承座40之上，因此可 免除使用晶圓頂座的額外步驟，簡化系統的設計。並藉由 傾斜導槽區域3 0b與第一區域20b及第二區域22b間相對 高度的調整，可保持晶圓26的正面與表面絕緣材質36b間 維持一極小的間隙3 8，而不會使兩者相接觸，可避免因與 晶圓2 6正面的元件區相接觸，以消除表面的元件區因接觸 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公笼） (請先閱讀背面之注意事現再填寫本頁) 襄--------訂·--------線 I , A7 ____B7__ 五、發明說明（） 遭到破壞的危險，並同於第四a圖及第四b圊中的第三實 施例，第四實施同樣利用感應電荷的原理，來產生異性電 荷相吸以固定晶圓的效果。 本發明中提供一種晶圓運送的方法及其裝置，利用靜 電電荷相吸來提供晶圓運送裝置對晶圓良好的固定性，而 不會受到環境壓力的影響，可應用於一般壓力、低壓或是 真空的環境之中，使晶圊運送的安全性及位置的準確性增 加，並可大幅增加晶圓運送裝置運動時的速度，提昇製程 的效率及良率。 本發明以一較佳實施例說明如上，僅用於藉以幫助了 解本發明之實施，非用以限定本發明之精神，而熟悉此領 域技藝者於領悟本發明之精神後，在不脫離本發明之精神 範圍内，當可作些許更動澗飾及等同之變化替換，其專利 保護範圍當視後附之申請專利範圍及其等同領域而定。 (請先閱讀背面之注意事項再填寫本頁) .裝 -----訂----------^ 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Α7 Β7 ^ y // V. Top view of the description of the invention (The second diagram b shows a schematic cross-sectional view of the wafer conveying device in the present invention along the section line 2b-2b of the second diagram a. The third a diagram shows the invention A schematic top view of the wafer conveying device. The third b) shows a schematic cross-sectional view of the wafer conveying device in the present invention along the section line 3b-3b of the third a. The fourth a illustrates the top view of the wafer conveying device in the present invention. The fourth diagram (b) shows a schematic cross-sectional view of the wafer conveying device according to the present invention along the cutting line 4b-4b of the fourth diagram. The fifth diagram (a) shows a schematic top view of the wafer conveying device according to the invention. The fifth diagram (b) A schematic diagram showing the carrying surface of the wafer conveying device in the present invention along the fifth a loading surface line 5b-5b. Its first embodiment, its second embodiment, its second embodiment, its third embodiment, and its third embodiment. The fourth embodiment of the fourth embodiment (please read the precautions on the back before filling out this page) Figure number, description of the hanging photo = installation -------- order ---- I ---- line economy Printed by the Ministry of Intellectual Property Bureau Employee Consumer Cooperative 2b-5b 10 12 20-20b 22-22b 24-24b Section Line Wafer Transport Arm Gas Insulation material in the first area and the second area The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 5. Description of the invention (25-25a) Power induction device 26 Wafer 28-28a Wafer sensor 30 -30b Inclined guide groove area 32-32a Extension arm 34a '34c Plane 34b, 34d Notch 36-36b Surface insulation material 38 Clearance 40 Wafer socket A7 B7 (Please read the precautions on the back before filling this page) Wisdom of the Ministry of Economy Detailed description of the invention printed by the employee's consumer cooperative of the property bureau: The present invention provides a method and a device for wafer transportation, which utilize the characteristics of providing electrostatic charges of different types between the wafer and the wafer conveying device, and the attraction of the different types of charges, which can Provide the wafer transport device with good fixation to the wafer, and its fixation will not be affected by the environmental pressure. It can be applied to the general pressure, low pressure or vacuum environment, so that the speed of the wafer transport device will not move. Restricted 'to increase stability and safety during transport' to avoid positional shifts during wafer movement. See Figure 2a This is a schematic top view of the first embodiment of the wafer transfer device in the present invention. The wafer transfer device may include a first region 20, a second region 22, an insulating material 24, and a power supply device 25. The first region 20 and The second area 22 is made of conductive material, and the two are combined into a wafer. "-------- Order ----- I --- The paper size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210x 297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7_ V. Description of the invention () Supporting surface; insulating material 24 is provided between the first area 20 and the second area 24; and the power supply device 25 is Used to provide a first type charge to the first region 20 and a second type charge to the second region 22. Referring to FIG. 2b, 'is a schematic side view of the first embodiment of the wafer conveying device in the present invention, and one of the embodiments of the wafer conveying method in the present invention is first provided by the first area 20 The first type charge is provided to the wafer 26; at the same time, the second type charge is provided to the second region 22 of the transport device, and the second type charge and the first type charge are different from each other; therefore, the different charges can be different. Attract each other to fix the crystal cymbals 26 on the transport device. Taking the example shown in the figure, that is to cause the power supply device 25 to generate electrostatic charges into the first region 20 and the second region 22, and the first type charge can be the negative charge shown in the figure and the second type charge Is a positive charge. See the second a). The wafer conveying device may include a wafer sensor 28 to sense the loading of the wafer 26. The wafer sensor 28 may use a capacitive sensor commonly used and utilize The capacitive effect generated when the wafer 26 is placed can sense the loading of the wafer 26; the wafer sensor 28 can also use other types of sensors, such as optical sensors. Further, the wafer conveyance device may also include an inclined guide groove region 30 having insulation characteristics, which is arranged around the contact area between the wafer conveyance device and the wafer 26 to prevent the first area 20 from making electrical contact with the outside world. As shown in FIG. 2b, the wafer 26 can be accurately loaded into the wafer conveying device at the position where the wafer 26 is to be placed by the inclined guide groove area 30 when the device is in the device, thereby reducing the deviation of the placement position. The wafer conveying device can include an extended paper size applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page). IIIIII —Order. — — — — 111 · A7 A7 V. Description of the invention (The arm 32 is used to fix the first region 20 and the second region 22, which is pseudo-named w and controls the movement of the wafer conveying device by driving the extension arm 32. ^ Second a In the embodiment shown in FIG. 2 and the second b, the wafer 26 is in contact with the transport device with its back surface, and the transport device is loaded with the wafer 26 from below. The first region 20 and the second region 22 are combined into − A circular support surface, the two sides of the circular support surface are cut off planes 34a, and a notch 34b is provided in front of the circular support surface, so that when the wafer transport device is lowered to remove the wafer 26, The wafer lifter can pass through the planes 34a and the notches 34b on both sides to smoothly carry the wafer 26. When the wafer is unloaded, the charges in the first region 20 and the second region 22 are removed by phenotype. , Can eliminate the second tritium charge on the transport device and the first type charge of the crystal 26, The wafer 26 is unloaded from the transport device, so that the wafer top seat can carry the wafer 26. In the first embodiment, the first area 20 is electrically connected to the wafer 26, as shown in the second figure b. In order to provide the first variable charge (negative charge in this example) to the wafer 26, the second region 22 is isolated from the wafer, and the wafer transfer device uses the second type charge and the first change on the wafer. The phase attraction of the electric charges fixes a 26 to the wafer transport device. The first area 20 is located at the edge area relative to the Z circle 26, and the second area 22 is located at the central part area relative to the wafer 26. It is shown in circle a. A surface insulation material 36 can be added to the second area 22 as shown in the second b. By adjusting the relative height between the first area 20 and the second area 22, it can be maintained. A very small gap 38 is maintained between the wafer 26 and the surface insulating material 36 without contacting the two. This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 cm), ί --- ----- tl --------- line (Please read the precautions on the back before filling out this page) Employees of the Intellectual Property Bureau of the Ministry of Economy Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed A7 ___ B7 _-_ V. Description of the invention () In the second embodiment of the present invention, the direction of loading and unloading the wafer 26 by the wafer transport device can be changed. Schematic diagram in b, and a similar system design is used, as shown in diagram 3a. In diagram 3b, 'wafer 2 6 is in contact with the wafer transport device with its front edge area, ie The wafer transfer device loads and unloads wafers from above. In this design, the wafer 26 is lowered from above to above the wafer holder 40, so the extra step of using the wafer top seat can be eliminated, and Simplify system design. By adjusting the relative height between the first region 20 and the second region 22, a very small gap 3 8 can be maintained between the front surface of the wafer 26 and the surface insulation material 36, without causing the two to contact, which can be avoided The component areas on the front side of the wafer 26 are contacted to eliminate the risk of surface component areas being damaged by contact. Similarly, in this second embodiment, the first region 20 is electrically connected to the wafer 26, as shown in FIG. 3b, to provide a first type charge (negative charge in this example) to the crystal. On the circle 26, the second region 22 is isolated from the wafer, and the wafer transport device fixes the crystal with the attraction of the second type charge (positive charge in this example) and the first type charge on the wafer 26. 26 on the crystal chandelier. The first region 20 is located at an edge region opposite to the wafer 26, and the second region 22 is located at a central portion region opposite to the wafer 26, as shown in the third a 圊. As shown in the third bffl, a surface insulation material 36 is added on the second area 22. In the above-mentioned first and second embodiments, the attracting effect between the second region 22 and the wafer 26 is generated in such a manner that the first region 20 provides a charge to form a fixed effect. According to another embodiment of the present invention, the Chinese paper standard (CNS) A4 (210 X 297 mm) can be applied to this paper size. -Line (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _._ B7_ V. Description of the invention () Use the method of induced charge to achieve a fixed purpose. Referring to the fourth a), which is a schematic top view of the third embodiment of the present invention, the first region 20a is located in a semicircular region opposite to the wafer 26, and the second region 22a is located in the other half of the wafer 26 region . Referring to FIG. 4b, which is a side view of the third embodiment of the wafer conveying device in the present invention, along the cutting line 4b, there is an insulating material 24a between the first region 20a and the second region 22a. The surface of the first region 20a and the second region 22a has a surface insulating material 36a. In another embodiment of the wafer transport method of the present invention, a negative charge is provided before the first region 20a and a positive charge is provided at the second region 20b on the transport device; and the wafer 26 corresponds to the first region 20a. A positive charge is induced in the area corresponding to the second area 22a, and a negative charge is induced in the area corresponding to the second area 22a. Then, the attracting of the different charges is used to fix the wafer 26 on the transport device. In the example shown in the fourth a, the power supply device 25a generates electrostatic charges into the first region 20 and the second region 22 to provide the required negative and positive charges. Similarly, the wafer transport device may include a wafer sensor 2 8 a to sense the loading of the wafer 26; the wafer transport device may also include an inclined guide groove region 30 having an insulation property and disposed in the Around the contact area between the wafer transfer device and the wafer 26, as shown in the fourth figure b, to guide and load the wafer 26; and may include an extension arm 32a to fix the first region 20 and the second region 22 In order to control the movement of the wafer conveying device through the movement of the extension arm 32a. For the example in the fourth a 圊 and the fourth b 圊, the paper size of Jingyuan applies the Chinese National Standard (CNS) A4 (210 X 297 mm) (please read the precautions on the back first) (Fill in this page) 'Strategy -------- Order --------- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7_ 5. Description of the invention () 26 with its back and transportation device When contacted, the conveying device loads and unloads the wafer 26 from below. The first region 20a and the second region 22a are combined into a circular supporting surface, and the two sides are cut off planes 34c, and a notch 34d is formed in front of the 圊 -shaped supporting surface to facilitate the wafer top seat. The plane 34c and the notch 34d smoothly carry the wafer 26. When the wafer is unloaded, the charges on the transport device and the induced charges on the wafer can be eliminated by removing the charges on the first region 20 and the second region 22, so as to unload the wafer from the transport device and make the wafer top seat. Hold wafer 2 6. In the fourth embodiment of the present invention, the direction of loading and unloading the wafer 26 by the wafer conveying device can be changed, as shown in the schematic diagram in the fifth b), and the system design can be changed as shown in the fifth a The first region 20b is located in an edge region relative to the wafer 26, and the second region 2b is located in a central region relative to the wafer 26, and there is an insulating material between the first region 20b and the second region 2b. 24b, the surface of the first region 20b and the second region 22b has an insulating material 36b, as shown in the fifth b figure. The wafer 26 is in contact with the inner edge of the insulated slanted guide groove region 30b in the wafer transfer device with its front edge region, that is, the wafer transfer device loads and unloads the wafer from above. In this design mode, the wafer 26 is lowered from above onto the wafer holder 40, so the extra steps of using the wafer top seat can be eliminated and the system design can be simplified. And by adjusting the relative height between the inclined guide groove region 3 0b and the first region 20b and the second region 22b, a very small gap 3 8 can be maintained between the front surface of the wafer 26 and the surface insulation material 36b without causing The contact between the two can avoid contact with the component area on the front side of the wafer 26, so as to eliminate the surface component area due to contact. This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 male cage) (please first Read the notes on the back and fill in this page now) Xiang -------- Order · -------- Line I, A7 ____B7__ 5. Description of the invention () Danger of damage, and the same In the third embodiment shown in the fourth a and the fourth b), the fourth implementation also uses the principle of induced charge to generate the effect of attracting the opposite charges to fix the wafer. The present invention provides a method and a device for wafer transportation. The electrostatic charge phase attraction is used to provide the wafer transportation device with a good fixation to the wafer without being affected by the environmental pressure. It can be applied to general pressure, low pressure or It is in a vacuum environment, which increases the security and position accuracy of the wafer transport, and can greatly increase the speed of the wafer transport device when it is moving, improving the efficiency and yield of the process. The present invention is described above with a preferred embodiment, and is only used to help understand the implementation of the present invention, and is not intended to limit the spirit of the present invention. Those skilled in the art will not depart from the present invention after understanding the spirit of the present invention. Within the scope of the spirit, when some minor changes and equivalent changes can be made, the scope of patent protection shall depend on the scope of the attached patent application and its equivalent fields. (Please read the precautions on the back before filling out this page). Packing ----- Order ------------ ^ Printed on paper standards of the Ministry of Economic Affairs and Intellectual Property Bureau's Consumer Cooperatives, this paper applies Chinese national standards ( CNS) A4 size (210 X 297 mm)