Α7 Β7 經濟部中央梂隼局貝工消费合作社印装 五、發明説明（ 《發明之範圍》 本發明係有關於晶片電阻器者。 《發明之背景》 如第6圖所示，一般的傳統晶片電阻器，包括有陶瓷或 玻璃等製成㈣緣基板1G卜在絕緣基板1()1上以濺射技術 或蒸著技術形成鎳-鉻(Ni-Cr)薄膜的電阻體105及在電阻體 1〇5兩端以銅-鎳(Cu_Ni)薄膜形成的電極（圖中省略）。以電 極而言最好使用低電阻金屬之銅，但為了使其具有耐候 性’故以使用鎳合金為主。電阻體1〇5的表面以樹脂保護膜 106被覆後’為了以軟焊錫109焊接於電路基板s，在絕緣基 板101之兩端面與底面亦以鎳-鉻(Ni_Cr)薄膜為介面設置以 銅(CU)薄膜或鋼-鎳(Cu_Ni)薄膜形成的電極（圖中省略），這 些電極全體被糾Ni)鍵膜_皮覆後，在該錄⑽鐘膜上施 以軟焊錫焊接。 晶片電阻器之可靠性，與其電阻體如何安定的密著於 絕緣基板上關係甚大。關於此點，如上揭以真空著膜厚.度 為400娜〜700郷的鎳-鉻(Ni_Cr)等金屬薄膜可與陶瓷密 著’同時對於獲得-般使用_Ω〜1ΜΩ電阻值，練绰有 餘。 . 以晶片且器的用途而言’舉例說可當做檢出流於電 腦硬碟中的電流㈣貞荷電阻。而為儘量減少檢出值的誤 差，並儘量提高可以檢出的電流值，須要有在】25im1><20 醒尺寸的基板上形成電阻值0.02Ω〜1〇Ώ，額定容許功率 0.1W以上之低電阻高功率性能者。另外尚有減小電阻溢度 本紙張尺度速用中國固家標準（CNS,) Α4規格（210X297公釐） (請先閱讀背面之注意專項再填寫本頁) " 經濟部令夬橾準局男工消費合作社印製 A7 B7 五、發明説明（>) 係數的要求時，可當做電阻體 減低電阻值’唯有增加厚度體=用金屬則有所限制，為了 然而如上揭之傳統晶片電阻器，若欲 積電阻體時，為了獲得厚膜，會有：⑴鑛膜m法沈 =薄膜所用的錄等的壽命縮短，須要經;更t:: 之情形’故工業上的大量生產實有困難。又電阻 發^，雖然有功率之限制，上揭的傳統晶片電 設有特別的散熱方法。 部未 《發明之總論》 爰此’本發明的第-目的，乃在提供適於大量生 :?電；:曰曰片電阻器。其第二目的為提供遠較傳統晶片電阻 器之谷許功率為高的晶片電阻器。 為了達成上揭目的’本發明人超越了從來「電阻體應 該以真空著膜」之固定觀定，而以鍍覆技術形成電阻體。 、亦即，本發明的晶片電阻器，係搭載於電路基板上而 連接’同時產生設定電阻值，其特徵為包括絕緣基板，.在 絕緣基板上以薄臈形成的接合層，及在接合層上鍍覆的電阻 體.。 依本發明’在絕緣基板與電阻體之間有薄膜接合層，故電 阻艎可強力密著於絕緣基板。而且電阻體本身係以鍍覆方式形 成，故為了減小電阻值，可容易的增加厚度，且亦能從可施鍍 的種種金屬中選擇所適合的材質。因此為了減小電阻溫度係 數，以選用鎳-磷(Ni-P)等鎳合金做為電阻體為較適宜。又因有 薄膜接合層的存在，絕緣基板在選擇上有氧化鋁、氮化鋁、氮 化矽等陶瓷材質外，尚可在銅與鋁等優良散熱性之金屬表面施 私紙張尺度速用中國國家梂準（CNS ) A4規格（210X297公釐）Α7 Β7 Printed by the Central Government Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative Co., Ltd. 5. Description of Invention ("Scope of Invention" This invention relates to chip resistors. "Background of Invention" As shown in Fig. 6, a general conventional chip The resistor includes a resistor body 105 made of ceramic or glass, and a resistor substrate 105 formed of a nickel-chromium (Ni-Cr) film on the insulating substrate 1 () 1 by sputtering or evaporation. An electrode formed with a copper-nickel (Cu_Ni) thin film at both ends (not shown). For the electrode, it is best to use copper with a low resistance metal, but in order to make it weather-resistant, nickel-based alloys are mainly used. The surface of the resistor 105 is covered with a resin protective film 106. In order to be soldered to the circuit substrate s with a solder 109, both ends and bottom surfaces of the insulating substrate 101 are also provided with a nickel-chromium (Ni_Cr) film as an interface with copper. (CU) film or steel-nickel (Cu_Ni) film electrodes (omitted in the figure), these electrodes are all covered with Ni) key film_, and then soft soldered on the recording bell film. The reliability of a chip resistor has a lot to do with how the resistor is securely attached to the insulating substrate. In this regard, the thickness of the vacuum coating film as described above. The metal film such as nickel-chromium (Ni_Cr) with a degree of 400 nanometers to 700 可 can be adhered to the ceramics. At the same time, to obtain-generally use _Ω ~ 1MΩ resistance value, practice More than enough. For the purpose of the chip maker, for example, it can be used to detect the current flowing through a computer hard disk and the resistance. In order to minimize the error of the detected value and increase the detectable current value as much as possible, it is necessary to form a resistance value of 0.02Ω ~ 100.02 on a substrate with a size of 25im1 > < 20 and a rated allowable power of 0.1W or more Those with low resistance and high power performance. In addition, there is still a reduction of resistance overflow. This paper standard uses the Chinese solid standard (CNS,) Α4 specification (210X297 mm) (please read the special note on the back before filling this page) " Order of the Ministry of Economic Affairs A7 B7 printed by male consumer cooperatives V. Explanation of the invention (>) When the coefficient is required, it can be used as a resistor to reduce the resistance value. 'Only increase the thickness of the body = use of metal is limited, in order to uncover the traditional chip resistance as above In order to obtain a thick film when the resistor is to be accumulated, there will be: the reduction of the life of the ytterbium film m method Shen = the film used in the thin film, etc., need to go through; more t :: the situation 'so industrial mass production Difficulties. The resistors also have a special heat dissipation method, although there are power limitations. Bu Wei "General Discussion of Invention" The first object of the present invention is to provide chip resistors suitable for mass production. Its second purpose is to provide chip resistors with much higher power than conventional chip resistors. In order to achieve the purpose of the disclosure, the inventors have surpassed the fixed concept of "resistors should be vacuum-coated" and formed resistors by plating technology. That is, the chip resistor of the present invention is mounted on a circuit substrate and is connected to generate a set resistance value at the same time, which is characterized in that it includes an insulating substrate, a bonding layer formed by a thin layer on the insulating substrate, and a bonding layer. Plated resistors .. According to the present invention, there is a thin film bonding layer between the insulating substrate and the resistor, so that the resistor can be strongly adhered to the insulating substrate. In addition, the resistor itself is formed by plating, so in order to reduce the resistance value, the thickness can be easily increased, and a suitable material can be selected from various metals that can be plated. Therefore, in order to reduce the resistance temperature coefficient, it is more suitable to use nickel alloys such as nickel-phosphorus (Ni-P) as the resistor. In addition, due to the existence of a thin film bonding layer, in addition to the selection of ceramic materials such as alumina, aluminum nitride, and silicon nitride, the insulation substrate can also be applied to metal surfaces with excellent heat dissipation properties such as copper and aluminum. National Standard (CNS) A4 (210X297 mm)
A7 __— _B7 五、發明説明（3 ) 加氧化矽等絕緣薄膜等。 本發明的電阻器，亦含有從接合層延長至電路基板之連接 4刀，而其連接部分的接合層表面，鍵覆著與電阻艎相連之高 導熱性薄膜。依此構成，電阻體所發出之熱可經高導熱性薄骐 傳達於電路基板側而迅速發散。高導熱性薄棋較佳的是由銅㈣ 或銅合金形成。而因銅之耐軟焊錫性較差，以鎳(Ni)膜被覆之 更佳。 對應於前揭連接部分的接合層，不限於僅有一層者，具有 二層以上者亦可。尤其將可與絕緣基板強力接著之鎳-鉻(Ni-Cr) 合金當倣第一層，而在其上將可與鎳-鉻(Ni-Cr)強力接著且 與電阻體亦可強力接著的銅(Cu)賴_鎳(CuNi)合金做為第 二層’亦為適宜的措施。 經濟部中央標準局負工消費合作社印製 {請先閲讀背面之注意事項再填寫本頁〕 訂. 再者，本發明電阻器亦有在其電阻體的兩端設置一對 電極，而在此一對電極之間設一與該對電極分離的島狀電 極，使其與電阻體相連接。依此構成，通過電阻體兩端電 極間的電流在途中經過島狀電極。因島狀電極為比電阻體 具有較低電阻的導體，在其部分的發熱量較之電阻體的發 熱量微J/知可以忽略。因此發熱部分實質上被島狀電極分 割，而在各部分發生的熱藉鄰近的電極迅速發散。此外這 些電極本身為了減低其電阻，並加速散熱起見，最好 覆電阻體之前’先將其錢覆於接合層之上。 為了進一步瞭解本發明之特徵及技術内容，請參閱以 ^關本發明之詳細說明與關，然祕關式係僅供參 說明用，而並非用來對本發明做任何限制者，有關之 5A7 __— _B7 V. Description of the invention (3) Add insulating film such as silicon oxide. The resistor of the present invention also includes a four-knife connection extending from the bonding layer to the circuit board, and the surface of the bonding layer of the connection portion is keyed with a highly thermally conductive film connected to the resistor 艎. With this configuration, the heat generated by the resistor can be transmitted to the circuit board side via the thin sheet with high thermal conductivity and quickly dissipated. The thin chess piece with high thermal conductivity is preferably formed of copper rhenium or a copper alloy. Because copper has poor solder resistance, it is better to cover it with a nickel (Ni) film. The bonding layer corresponding to the front-removed connection portion is not limited to one layer, and may have two or more layers. In particular, the nickel-chromium (Ni-Cr) alloy that can be strongly bonded to the insulating substrate is regarded as the first layer, and the nickel-chromium (Ni-Cr) alloy can be strongly bonded to the nickel-chromium (Ni-Cr) and the resistor can also be strongly bonded to it. Copper (Cu) and nickel (CuNi) alloy as the second layer is also a suitable measure. Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives {Please read the precautions on the back before filling out this page] Order. Furthermore, the resistor of the present invention also has a pair of electrodes at both ends of the resistor, and here An island-shaped electrode separated from the pair of electrodes is arranged between the pair of electrodes, so as to be connected with the resistor. With this configuration, a current passing between the electrodes at both ends of the resistor passes through the island-shaped electrode on the way. Since the island-shaped electrode is a conductor having a lower resistance than the resistor, the amount of heat generated by the island electrode is slightly smaller than that of the resistor. Therefore, the heat generating portion is substantially divided by the island-shaped electrode, and the heat generated in each portion is rapidly dissipated by the adjacent electrode. In addition, in order to reduce the resistance of the electrodes themselves and accelerate the heat dissipation, it is better to coat the resistors with the money before the resistors are coated. In order to further understand the features and technical contents of the present invention, please refer to the detailed description and related of the present invention. However, the secret type is for reference only, and is not intended to limit the present invention in any way.
A7 B7 五、發明説明（t ) 《圊示之簡單說明》 第1圖為本發明晶片電阻器在具體實施例中其中間體 的重要部分剖面圊； 第2圖為本發明晶片電阻器在具體實施例中其中間體 的平面圖； 第3圖為本發明晶片電阻器在具體實施例中說明其電 阻值調整方法之平面圖； 第4圖為本發明晶片電阻器在具體實施例中之平面 圖， 第5圖為本發明晶片電阻器在具體實施例中表示其搭 載於電路基板上狀態的剖面圖； 第6圖為傳統晶片電阻器的剖面圖；及 第7圖為本發明晶片電阻器電阻變化率測定結果的曲 線圖。 《圊示中元件名稱與符號對照》 經濟部中央標準局男工消费合作社印製 6，106 :保護膜 7:高導熱性皮膜 8，108 : Ni 皮膜 91，92，109 :軟焊錫 {請先閱讀背面之注意事項再填寫本頁) 1，101 :絕緣基板 21，22,31，32 :接合層 41，42,43 :電極 5,501 :電阻體 S :電路基板 《較佳具體實施例之詳細描述》 茲參照所附圖面詳細描述本發明的具體實施例。第 圖本發明晶片電阻器在具體實施例中重要部分的剖面圖 第2圖為其平面圖。 本紙張尺度速用中國國家標準（CNS〉A4規格（210 X 297公釐） A7 ________B7____ 五、發明説明（Γ) 電阻器10包括：由氧化鋁陶瓷形成的絕緣基板丨；在 絕緣基板1表面所設之鎳-鉻(Ni-Cr)第一接合層21:在其上 所形成銅-鎳(Cu-Ni)的第二接合層22;在其上兩端與中央 以4〜30卿之厚度鑛覆之銅(Cu)電極41，42,43 ;及覆蓋於 第一接合層22與電極41，42,43上以3〜20卿之厚度鑛覆 有鎳-磷(Ni-P)的電阻體5。電極及電阻體的厚度端看目的 電阻值如何而適當設定。各接合層以濺射、蒸著、離子塗 佈等薄膜技術來形成’但第一接合層可僅為鉻(Cr)。又， 第二接合層可僅為銅(Cu)或錄(Ni)。兩端電極41，43雖然與 外部電路導通連接，但中央島狀電極42則藉電阻體5連 接，電氣上為孤立。 經濟部中央橾準局貝工消費合作社印製 電阻器10,因電阻體5係由鍍覆方法以充分的厚度形 成的錄-鱗(Ni-P)所成’故其電阻低而且電阻溫度係數亦 小。又在電極41，43間施加電壓時，電流如箭頭方向通過 島狀電極42。由於島狀電極42乃由銅(Cu)所做成的導體， 在其部分的發熱量較電阻體5的發熱量小得可以忽略。因 此成為在島狀電極42部分沒有發熱部分的構造，而發熱部 分實質上被島狀電極分割’各部分所發生的並熱藉由鄰近 的電極迅速發散》只有各電極間的電阻體部分51才實質上 有電阻體的作用。 電阻器10的電阻值之調整’一般係以雷射整飾法將電 阻體溶解去除之。本例中只將電阻體5的中央部分52與接 合層21,22的相對應部分同時熔解去除，而得以如第3囷 所示’在調整電阻時分割電阻體。由此連同島狀電極42的 經濟部中央梯準局貝工消费合作社印繁 A7 ____ _ BT___ 五、發明説明（& ) 分割’一併合計電阻體被分割成4分，而達成發熱部分的 分散化。電阻調整後，為防止機械性的損傷，如第4圖所 示’在電阻體5表面塗佈環氧樹脂6並將其硬化◊但是因 為必需與電路基板保持電氣導通，故將對應於兩端電極 41，43的表面予以露出Q通常電阻器1〇並非一貫性的單獨 製造’在此階段，係在大型絕緣基板上以多數個部分同時 形成薄膜’經鍍覆後’於此階段以雷射劃線切割法在大型 基板上劃溝而沿著凹溝個別分割。 其久如第5圖所不’為了在電路基板S表面裳置電阻 器〗〇’在絕緣基板1之側面設置錄-鉻(Ni_Cr)薄膜的第一接 合層31 ’於其上設置銅(Cu)薄膜的第二接合層32。然後在 第二接合層上及露出的電阻體5上，依順序以筒狀鍍覆18 〜30仰丨厚之銅(Cu)薄膜7，3〜7揶厚之鎳(Ni)薄膜8及3 娜以上厚之軟焊錫薄膜91。電阻器10的製造於焉完成。 電阻器10係以軟焊錫92連接於電路基板S以供使 用。鎳(Ni)薄膜8在電阻器ι〇以軟焊錫焊接於電路基板s 時成為防止軟焊錫92與銅(CU)薄膜7互相反應之隔離層。 使用中電阻體所發之熱經過高導熱銅(Cu)電極41，43及銅 (Cu)薄膜7而迅速發散於電路基板s側。因此與上揭發熱 部分之分散相辅相成故可防止電阻體的劣化。傳統上125 _X 2.0 mm基板尺寸的電阻器，其額定容許功率僅能到 0.1W，但依本例之構成，使用相同的基板尺寸，容許功率 可達0.25W。 膏施例 8 速用中關家標準、（CNS ) ( 21DX297公釐) {請先閱讀背面之，注意事項再填寫本頁}A7 B7 V. Description of the invention (t) "Simple description of indication" Figure 1 is a cross section of the important part of the intermediate of the chip resistor of the present invention in a specific embodiment; Figure 2 is a detailed description of the chip resistor of the present invention. The plan view of the intermediate in the embodiment; FIG. 3 is a plan view illustrating the method of adjusting the resistance value of the chip resistor of the present invention in a specific embodiment; FIG. 4 is a plan view of the chip resistor of the present invention in a specific embodiment; FIG. 5 is a cross-sectional view showing a chip resistor of the present invention mounted on a circuit substrate in a specific embodiment; FIG. 6 is a cross-sectional view of a conventional chip resistor; and FIG. 7 is a resistance change rate of a chip resistor of the present invention Graph of measurement results. "Comparison of Component Names and Symbols in Display" Printed by Male Worker Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 6,106: Protective film 7: High thermal conductivity film 8,108: Ni film 91, 92, 109: Soft solder {please first Read the notes on the back and fill in this page again) 1,101: Insulating substrates 21, 22, 31, 32: Bonding layers 41, 42, 43: Electrodes 5,501: Resistors S: Circuit substrates "Detailed description of preferred embodiments 》 Specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. Fig. 2 is a sectional view of an important part of a chip resistor of the present invention in a specific embodiment. Fig. 2 is a plan view. Chinese paper standard for quick use of this paper (CNS> A4 specification (210 X 297 mm) A7 ________B7____ V. Description of the invention (Γ) The resistor 10 includes: an insulating substrate made of alumina ceramics; A first nickel-chromium (Ni-Cr) bonding layer 21 is provided: a second bonding layer 22 of copper-nickel (Cu-Ni) formed thereon; a thickness of 4 to 30 mm is formed at both ends and the center thereof. Mineral-coated copper (Cu) electrodes 41, 42, 43; and resistors covering the first bonding layer 22 and the electrodes 41, 42, 43 with a thickness of 3 to 20 Å, which are coated with nickel-phosphorus (Ni-P) Body 5. The thickness ends of the electrodes and resistors are appropriately set depending on the target resistance value. Each bonding layer is formed by thin film technologies such as sputtering, evaporation, and ion coating. However, the first bonding layer may be only chromium (Cr) In addition, the second bonding layer may be only copper (Cu) or copper (Ni). Although the two ends of the electrodes 41 and 43 are electrically connected to the external circuit, the central island electrode 42 is connected by the resistor 5 and is electrically isolated. . The resistor 10 is printed by the Central Laboratories of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, because the resistor 5 is made of Ni-P formed by plating with sufficient thickness. Therefore, the resistance is low and the temperature coefficient of resistance is small. When a voltage is applied between the electrodes 41 and 43, the current passes through the island-shaped electrode 42 in the direction of the arrow. Since the island-shaped electrode 42 is a conductor made of copper (Cu), The calorific value of this part is negligibly smaller than the calorific value of the resistor 5. Therefore, it has a structure in which the island-shaped electrode 42 has no heat-generating portion, and the heat-generating portion is substantially divided by the island-shaped electrode. Quickly diverge from adjacent electrodes "Only the resistor body portion 51 between the electrodes can substantially function as a resistor body. The adjustment of the resistance value of the resistor 10 is generally based on the laser trimming method to dissolve and remove the resistor body. In the example, only the central portion 52 of the resistor body 5 and the corresponding portions of the bonding layers 21 and 22 are melted and removed simultaneously, so that the resistor body can be divided when adjusting the resistance as shown in FIG. Printed A7 ____ _ BT___ by the Central Laboratories of the Ministry of Economic Affairs ____ _ BT___ 5. Description of the Invention (&) Dividing the resistor is divided into 4 points in total to achieve the decentralization of the heating part. Resistance adjustment In order to prevent mechanical damage, as shown in FIG. 4 'apply epoxy resin 6 on the surface of the resistor 5 and harden it. However, since it is necessary to maintain electrical continuity with the circuit board, it will correspond to both ends of the electrode 41, The surface of 43 is exposed. Normally, the resistor 10 is not consistent and manufactured separately. At this stage, a large number of parts are simultaneously formed into a thin film on a large insulating substrate. After plating, laser cutting is performed at this stage. It is necessary to draw grooves on large substrates and divide them individually along the grooves. It is as long as shown in Fig. 5 'to place a resistor on the surface of the circuit substrate S.' 〇 'is provided on the side of the insulating substrate 1-chromium (Ni_Cr) The first bonding layer 31 ′ of the thin film is provided thereon with the second bonding layer 32 of a copper (Cu) thin film. Then, on the second bonding layer and on the exposed resistor body 5, 18 to 30 layers of copper (Cu) films 7, 3 to 7 揶 thick nickel (Ni) films 8 and 3 are sequentially plated in a cylindrical shape. The soft solder film 91 having a thickness of Na or more. The manufacturing of the resistor 10 is completed at 焉. The resistor 10 is connected to the circuit board S with a solder 92 for use. The nickel (Ni) film 8 becomes an isolation layer that prevents the solder 92 and the copper (CU) film 7 from reacting with each other when the resistor ι is soldered to the circuit substrate s with solder. The heat generated by the resistor in use passes through the highly thermally conductive copper (Cu) electrodes 41, 43 and the copper (Cu) film 7 and is quickly dissipated to the circuit board s side. Therefore, it complements the dispersion of the heat-generating part of the upper layer and prevents the deterioration of the resistor. Traditionally, the 125_X 2.0 mm substrate size resistor has a rated allowable power of only 0.1W, but according to the configuration of this example, the same substrate size is used, and the allowable power can reach 0.25W. Cream Example 8 Quick-Use Zhongguanjia Standard, (CNS) (21DX297 mm) {Please read the back first, and note this page before filling in this page}
如第1至5圖所示構造的電阻器， 板1上厚度0 · 4咖’電流方向長度2 〇咖方二: =:的電阻器，器5的厚度為1〇 的厚度，銅(Cu)薄膜7的厚度為^。，， 將廷些電阻器10個放入溫度7〇七 ^ 、 0.158V的額定直流電壓，反覆％分鐘通電分鐘3 = 到定其電阻值的變化。將測定結果平均二 時間的_曲線表示於第7 。由該曲線圖可獲悉本例的 電阻器其電阻體殆無劣化情形。 本發明的晶片電阻器，如上揭描述，電阻小而有優異 的散熱f生，故使用於高於同尺寸傳統電阻器甚大的功率 時，其電阻亦不致於劣化。由是極為適合於例如電腦硬碟 中大電流檢出之用途。 所須聲明者’本發明在上揭實施例中所描述内容，若 熟習於有關此方面技藝之人士，可能對其做各種形式與内 容的變更’但未能脫離附錄的本發明申請專利事項之範圍 與精神時’應認為涵蓋於本發明之範圍内。 -t----------__ (錡先¾讀背面之Vi意事碩再填寫本頁) •-β 經濟部中央梯準局貝工消費合作社印装 本紙乐尺度速用中國國家榡準（CNS ) Α4規格（210Χ297公釐）The resistor constructed as shown in Figures 1 to 5 has a thickness of 0.4 Å on the board 1 and a current direction length of 2 Å on the second side: =: A resistor with a thickness of 10 on the side of copper 5 ) The thickness of the film 7 is ^. , Put 10 resistors into the rated DC voltage of 707 ^, 0.158V, and repeat the% minutes for 3 minutes to determine the change of its resistance value. The _ curve of the average time of the measurement results is shown in Fig. 7. It can be seen from the graph that the resistor of this example has no deterioration of its resistor body. As described above, the chip resistor of the present invention has a small resistance and excellent heat dissipation. Therefore, when the chip resistor is used at a higher power than a conventional resistor of the same size, its resistance will not be deteriorated. It is very suitable for applications such as high current detection in computer hard disks. It must be stated that 'the content described in the above disclosed embodiments of the present invention may be changed in various forms and contents by those who are familiar with the technology in this regard', but it cannot be separated from the appendix of the patent application of the present invention. The scope and spirit should be considered to be within the scope of the present invention. -t ----------__ (锜 Read the Vi Masters on the back and then fill out this page) • -β Printed paper, paper, scale, and scale in China, Central Government of the Ministry of Economic Affairs National Standard (CNS) Α4 Specification (210 × 297 mm)