TW388028B - Manufacturing and assembling method for an integrated circuit card, and card obtained thereby - Google Patents

Description

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Revised page of Chinese specification of No.841〇8 " Patent Application No. 7 (January 88) V. Description of the invention (obtained from the adhesive bonding pressure of the four-type conductive rubber foot, in which the contact of the integrated circuit is provided with an elevated portion In this modified example, it is preferred that the anisotropic adhesive be polymerized before the step of implementing the electrical connection, and that it and the protective resin be polymerized at the same time. The following description and reference to the drawings are all based on non-limiting examples. Explanation, it will make it obvious how the present invention is implemented. Brief description of the drawings FIG. 1 and FIG. 2 respectively represent a cut-out integrated circuit branch, a cross-sectional view, and a diagram of the negative obtained according to the present invention; FIG. Figure 4A / and 4B show a cutaway perspective view of a raised section at a conductor track ^; and; Figure 5 shows in detail Jizhao circuit is a partial cross-sectional view of the preferred inverted wafer mounting method for anisotropic conductive storms. Explanation of component symbols 1 card holder; 2 metal contact pads; 3 upper surface; 4. integrated circuit; 5 cavity; 6 bevel Side wall; This paper size applies to Chinese National Standard (CNS) A4 specification (210X29? Mm) I --.------- clothing ------. I1T ^ ------ C. (Read the precautions on the back before you fill in this page.) B7 printed by the Consumers' Cooperative of the Central Bureau of Quasi-Economic Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (1) The present invention does not disclose a method for manufacturing and combining electronic cards. A green card holder, the holder provides a cavity for accommodating a product, and a metal contact pad is provided on one surface to electrically connect to the integrated circuit contacts. The invention also discloses an electronic card obtained by the method. The integrated circuit (or chip) inserted in the cavity of the bracket can be an electronic body or a microprocessor with a surface area larger than that of a simple memory. The method used to obtain the electronic chip card is, for example, in this As described in European Patent Ep 0021 gw Bι in the name of the Special Applicant (PHF 85.533), a printed circuit is used, which is deposited in a place roughly composed of epoxy resin, Plexiglas, polyurethane, or polyester Manufacture of bracket foil. Use of molded lead frame It is also well known that the bracket foil or lead frame bears the external metal contact pads on one surface of the card; the other surface of the card is used as a bracket for the electronic chip, which is electrically connected to the external connection via the foil or lead frame. Point. The material used for molding the lead frame and the material of the bracket is an insulating material, so that the external contacts and internal connections of the electronic chip are electrically insulated from each other. The chip card combination includes the following steps: 1. Staff of the Central Bureau of Standards, Ministry of Economic Affairs Printed by consumer cooperatives-integrated circuit chips (chips) are glued to the inner surface of the foil or lead frame;-electrical connections are obtained to connect the chip contacts to external metal contacts (connected by wires);-to protect Resin to protect the chip and connection;-Cut off the electronic module so that it is formed to be separated from the bracket foil or lead frame; and-4-This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) Central of the Ministry of Economy Printed by the Zhuhai Bureau Shellfish Consumer Cooperative A7 B7 _ ---------— -----——--" " " " " " '-5. Description of the invention ( 2) Module It is placed and glued in a card holder made of synthetic resin material (usually PVC (polylactide), ABS, or polycarbonate). The card holder has been reserved with a receiving space (cavity) and supported by it. The edge of the integrated circuit (chip) to accommodate the module. The cavity is obtained by injection molding, or grinding. With this method, the protection of electronic chips and connections is usually delicate because the thickness of the protection must be perfectly controlled so that it can be inserted into the cavity of a card holder with a depth of less than 650 microns (jwm). The electronic module is also inserted into the card very finely, and the tolerance of the flatness and the lateral position is required to be small, so as to avoid the problem of actually cooperating with the use of the card reader or being accommodated in the cavity. On the other hand, the adhesion of electronic modules must be effective in order to meet the requirements of twist and bend tests. Finally, the method must use foils or lead frames that account for a large portion of the total cost of the finished product. The IL of the present invention is beneficial to reduce the manufacturing and combination processing of integrated circuit cards. Another object of the present invention is to save the formation of the foil or lead frame-in the surface of the foil or lead frame- The outer metal contact pads of the card are supported, while the other surface supports the integrated circuit. Yet another object of the present invention is to eliminate mechanical positioning restrictions on external metal contact pads on the card. The above-mentioned disadvantages of conventional technology improve or mitigate and achieve the object of the present invention. According to the method described in the opening paragraph of this article, it is characterized by including the following step-forging (molded interconnecting device) technology to apply electrical conductor tracks, which are- ---- ^ ---; --------- "Installation-(Please read the notes on the back before filling in this tribute) Order Λ Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A 7 B7 V. Description of the invention (3) ^ Provide all of the metal contact pads arranged on the bottom and side walls of the cavity, and each connected to the surface of the bracket containing the cavity;-the implementation of the electrical connection, the interconnection space The contacts of the integrated circuit located in the cavity and the conductor track at the bottom of the cavity; and-the cavity is filled with a protective resin, which is then polymerized. Therefore, the integrated circuit package on a flexible card is Obtained by reducing the number of relatively simple operations in a sequence, the card's package is standardized in its metal contact pad position and size. In the embodiment of the method, the step of applying the electrical conductor track is based on lining according to the desired track structure. Printing (pad p.dnt_ing) Hi and catalyst, and then applied by autocatilysis jSH. Preferably, the card holder obtains its cavity by injection molding technology, and it may include a cavity in the position designed for the end of the conductor track Elevation at the bottom. In order to place the integrated circuit in the cavity, the base of the integrated circuit and the bottom of the cavity can be glued, and then the wire rod is connected to each contact and conductor of the integrated circuit. Between the rail ends in order to obtain an electrical connection. However, a better way to achieve this is to 'use a flip-chip mounting technique: In the first modification, it is known that the connection is in the contact area The predetermined position is obtained by welding or conductive adhesive; and for this purpose, the integrated circuit contact provides a conductive elevated portion, usually as the end of the opposite conductor track. The preferred embodiment uses an inverted chip mounting technology To establish the electrical connection of the integrated circuit, the connection is anisotropic in the form of pre-formed foil or paste-6- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) '~ IΓ-- -^ ---- A Pack-(Please read the precautions on the back before filling this page)

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Revised page of Chinese specification of No.841〇8 " Patent Application No. 7 (January 88) V. Description of the invention (obtained from the adhesive bonding pressure of the four-type conductive rubber foot, in which the contact of the integrated circuit is provided with an elevated portion In this modified example, it is preferred that the anisotropic adhesive be polymerized before the step of implementing the electrical connection, and that it and the protective resin be polymerized at the same time. The following description and reference to the drawings are all based on non-limiting examples. Explanation, it will make it obvious how the present invention is implemented. Brief description of the drawings FIG. 1 and FIG. 2 respectively represent a cut-out integrated circuit branch, a cross-sectional view, and a diagram of the negative obtained according to the present invention; FIG. Figure 4A / and 4B show a cutaway perspective view of a raised section at a conductor track ^; and; Figure 5 shows in detail Jizhao circuit is a partial cross-sectional view of the preferred inverted wafer mounting method for anisotropic conductive storms. Explanation of component symbols 1 card holder; 2 metal contact pads; 3 upper surface; 4. integrated circuit; 5 cavity; 6 bevel Side wall; This paper size applies to Chinese National Standard (CNS) A4 specification (210X29? Mm) I --.------- clothing ------. I1T ^ ------ C. (Read the precautions on the back before you fill in this page) The revised page of the Chinese manual for the patent application No. 84108997 printed by the Employees' Cooperatives of the Central Government Bureau of the Ministry of Economic Affairs (January 88) 5. Description of the invention (phase 7 bottom; 8 , 9 Conductive track; 11 Adhesive layer; 12 Welding conductor wire 13 Protective resin; 31 One or several layers of adhesive; 32 One layer of copper; 33 One layer of tin or nickel; ^ 1 I--1 I! II ------ = = .....— ^ 1 / ^ I -II • V (Please hear first? #Notes on the back really fill in the consumer cooperation of the Central Hazel Associate Bureau of the Ministry of Economic Affairs. Printed by the society High spherical protrusions; contacts, surface purification layer; particles; glue; particles. Figures 1 and 2 show the effective part of the integrated circuit card, which shows the metal contact pads designed to match the card reader probe The card holder 1 includes the contact pad 2 with a standard size and position on the upper surface 3 of the card. At least a part of the metal contact pad is electrically connected to the integrated circuit ( Chip), the integrated circuit is shown in the thickness of the card body or card holder 1. In order to implement the method according to the present invention, the holder 1 includes a cavity 5 having a side wall 6 with an inclined surface as shown in the figure. And the bottom 7 is designed to accommodate the integrated circuit chip 4 and the conductive track 8 (also referred to as a metal plated circuit); the conductive track and the contact pad form an electrical connection, and extend from the surface of the card body 3 to other = The bottom 7 of the cavity at f of the free end 9 is matched by the cavity -7a-41 42 51 52 55 56 57 ir. The degree is applicable to the Chinese National Standard (CNS) A4 specification (210X29 ·?) ) The Central Bureau of Standards of the Ministry of Economic Affairs, another work and consumer cooperation Du printed A7 B7 • " *. V. Description of the invention (5) 5 'side wall of the plant. The cavity 5 must have a depth of less than 650 microns (Λιιη) in order to reserve a sufficient thickness of synthetic resin at the bottom of the card to avoid breakage at the bottom of the card and protect the electronic chip. Various processing methods can be used to fix a rail 8 made of substantially copper on a bracket 1, which is preferably injection molded from a thermoplastic material such as or polycarbonate to obtain its empty space. Some of these comparisons will be described further below. The best processing method 0 can also be selected from several processing methods to obtain the electrical connection between the integrated circuit contacts arranged in the cavity and the conductor track at the bottom of the cavity. The conventional method shown in FIG. 1 is that the base of the integrated circuit 4 is usually mounted on the bottom of the cavity 5 with epoxy resin glue which can be combined with the adhesive layer 11, and then the contacts and conductors of the integrated circuit 4 The track ends 9 are connected to a conductor wire 2 made of, for example, gold or aluminum. Various installations and wire bonding processes of integrated circuits well known to those skilled in the art are described in most public publications, among which patents FR 2 439 438, FR 2 548 857, EP 0 116 148, FR 2 520541. In this installation method, when the nickel-plated base of the integrated circuit forms a ground (ground) end, its configuration is such that one end of the track occupies the central part of the bottom of the cavity (not shown), and the metal-plated base Conductive glue is used to adhere to it. For example, the glue is filled with silver to 70% of its amount. ^ The glue operation can be performed using standard glue and equipment (KS, ESSEC type or other) used in the semiconductor industry. The mounting method shown in FIG. 1, in which the integrated circuit has all the contacts including the ground contacts on one or the same surface (the upper surface of FIG. 1). Although gold or aluminum wires can be used for interconnections with conductor wires, gold wires are preferred because of the welding speed (sonic heat welding for welding gold wires is 3 to 4 times faster than aluminum wires). This operation is in the installation method. -8-This paper size is applicable to China National Standard (CNS) A4 specification (210X297mm), — ^ -------- (pack — I (Please read the note on the back first) (Please fill in this page again)

A A7 B7 Printed by the Central Government Bureau of the Ministry of Economic Affairs, Consumers Cooperatives, V. Invention description (6 ▲ Fine 'because' it must preheat the synthetic resin stent. Because it is not expected that the preheating will exceed the glass transition temperature of the synthetic resin stent. i — temperature) Tg (deformation risk), which is preferably made using a material having a high content (polycarbonate, ABS, ABS_PVC compound, or abs polycarbonate compound). After the wafer is mounted and glued, the filling of the cavity 5 can be performed by a simple potting process in which 3 drops of resin are deposited in the S cavity 5. To obtain a flat outer surface, it is preferable to use a resin having a very low viscosity, for example, a resin such as Reference No. 931-1 manufactured by ABLESTICK Corporation, USA. The resin must have high ionic purity and good resistance to water in order to effectively protect the wafer during the weather test of the wafer. After the resin is applied in the cavity, it polymerizes, which forms the final step of the manufacturing and mounting method according to the present invention. i A non-planar 3-dimension surface with a preferred method for applying a conductor track 8 to the bracket i includes: hot foil embossing of adhesive tracks (hot f0il embossing);-pad printing Later, metal plating is performed by automatic catalysis; and-lithography by laser hologram. Among the three methods, the first two methods are widely known and proven to be economical, but their Tracks cannot be provided for high resolution. Where high resolution is needed ', the third method can be used because it is more accurate. During the injection molding of the stent 1, the pad printing and lithography technology and the raised portion on the conductor track end 9 provided on the bottom of the cavity are compatible. (Please read the notes on the back before filling out this page)

, 1T 9 A7 A7 Printed by the Central Laboratories of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, B7 5. Description of the invention (7) Patent No. EP 〇 〇ϋ · 347, can be embossed (or embossed) by hot foil Examples to illustrate. (12 to 70 microns km) thick metal rail structure relative to the card holder is provided in the cavity shape area designed for this purpose to provide a thermal processing of about 2 seconds', that is, the shape of the inclined wall is preferred, and the pressure is applied at 80 / Square centimeter (N / mm2), the temperature is about 200 ° C. For this purpose, the foil for heat embossing, including the track structure, has the structure shown in FIG. 3: —or several layers of glue, which can be reactivated by heat 31 (usually a phenol adhesive), and has 1 to 4 > um A layer of copper 32, which is quite ductile, with a thickness between 12 and 35 >um; and possibly a layer of rhenium or nickel 33, which has a thickness of several m. The non-embossed web part can then be removed by a roller work station with adhesive tape. During the lining printing process, with a 2 second thermal processing process, the palladium (pd) can be printed on the walls and bottom of the cavity and on the surface 3 of the latter according to the pattern required for the metal track structure to be generated at this position. Paint on the card holder 1. The print quality is good because the width of the conductor track and the space between the tracks can achieve an accuracy of about 50λm. The lacquer of the meeting will form a catalyst, and it is deposited on the support 1 in place, and then heated to 100 ° C. Then, metal plating is obtained by automatic catalysis. The latter operation is well known and has been tested for a long time: copper (nickel) is completely deposited on the stent 1 where the catalyst is located. The thickness of the deposited copper is between 1 and 10 μm. The main advantage of this electrochemical metal plating method is that thousands to tens of thousands of cards can be simultaneously immersed in the same bath for several hours to process. If the pattern of the conductor track of the 2-cavity 5 needs to be more accurate, a more expensive photographic lithographic printing method can be used as described above. This technology includes flat surface gold (please read the precautions on the back before filling this page). The paper size of the paper is remotely used by the Chinese state. RΤνΤΤΤΠΓΤΓΓ -10- * Public 7 29 Printed by A7 B7 V. Description of the invention (8) It is a customary photolithography technique in which metal plating is transferred to inclined surface metal plating. In this case, it is the wall and bottom of cavity 5 and its surroundings in the middle of bracket surface 3. For this purpose, a focusing technique via a 3D (three-dimensional space) mask, or laser holography has been developed, which includes orbital images in a three-dimensional space on a surface that is consistent with the surface of the cavity. This makes it possible to obtain polymerisation of the lacquer uniquely in the area on the surface of the cavity. The routine'semi-additive process can be used to implement the orbit. This method is currently used in major developed countries, and includes a synthetic resin stent treatment for improving the adhesion of the deposited metal, preferably copper, followed by the use of a resist mask to grow the electrical contact layer on the stent. After exposure, the masks and layers 6 around the contacts are eliminated. Therefore, this method uses 3D masking or laser technology (produced by holography) to make metal plating on non-planar supports, and provides 5 〇 Jum degree resolution. With the various metal plating methods described above, the electrical contacts are no longer supported by foils or lead frames of conventional technology ', but by the card holder itself. In addition, the operation of penetrating the insulating material to provide through holes and establishing contacts is no longer required. Except for the conventional mounting technology shown in FIG. 1, the placement of ground contacts on the surface of an integrated circuit that is the same as other contacts is a 'increasing situation. The preferred technology described below is an inverted chip mounting method. For this purpose, the end 9 of the conductor track 8 may include a raised portion, and the structure in which the addition structure is in contact with the mating wafer is symmetrical (relative to a plane). This elevation is shown in Fig. 4 A 芩 4 B.-preferably obtained during the molding of the card holder i: its shape may be cylindrical as shown in 41 of Fig. 4 or a circle as shown in Fig. 4B The shape of the spherical projection 42 is increased to several tens. Metal plating 41 or 42 and rails of the elevated part 41 or 41 Μ—-: ---- ^ ---- (pack— (Please read the precautions on the back before filling this page) '1Τ Λ ,.

B7 V. Description of the invention (9) Dao 8 can be used in the above-mentioned lining printing or lithography to realize the real family. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) Heightening section, which is made by electroplating (which means the fine positioning operation of integrated circuit after manufacturing) and made of Jin Ge Copper, or welding gold nuggets with a conventional thermosonic gold welding unit. Several methods can be used for installation, including fixed wafer-to-buy-two (tWO-buy-two) interconnections of the wafer elevations and conductor tracks in order to establish good electrical contacts: the wafers are rapidly heated in combination with pressure, which causes each pair to increase The upper parts are stiffened together; or alternatively, the applied pressure is combined with a 60 kHz (仟 Hz) ultrasonic vibration induced by the punch supporting the wafer (welding conductor wires has long been known). The third connection method uses a conductive adhesive, for example, an epoxy resin adhesive with 70% silver 'is first deposited in the form of calibration droplets on the elevated portion at the end of the conductor track' or immersed in the elevated portion It is deposited in the glue groove on the elevated part of the module. This conventional technique is not described or explained in order to make the description short. This technique is also described in patent applications WO 92/133 19 and WO 92/13320. Insulating glue can also be used, which means that the deposition need not be performed entirely on the metal elevation provided on the component metal plating. In this case, a drop of insulating glue is deposited on the bottom of the cavity before the component is provided. During the pre-polymerization of the glue, pressure is required on the component to obtain a good ohmic contact. f! > shows a preferred inverted chip mounting technique, although this technique is more difficult than shown in the previous paragraph. The work provided in this article for the elevation of the wafer contacts is indispensable. Preferably, the end 9 of the conductor channel on the bottom of the cavity 5 may still include a raised portion which preferably has a cylindrical shape (41 shown in FIG. 4A). ~ ___ -12- Standard for this paper-like home (CNS> Α4 · (210X297mm) Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 ________ B7 V. Description of the invention (1〇) The glue used is a special orientation Anisotropic conductive adhesive, which has long been used on the surface installation of special passive components. This type of adhesive contains low concentration of conductive particles. The particles are elastically deformable and have a diameter of ^ to the detent claw, which is compressed between two contacts. Provides conductivity from time to time, however, the glue is still insulated where there are no contacts. As long as the viewpoint of conductivity, the square metal plating with 100 ^ m sides and 100Alm spacing can be used for compatibility (especially when metal is glued) The particle density exhibited by plating—in fact, there must be several particles present instead of only a single one, which is theoretically sufficient to obtain good contact.), And at the same time avoid the danger of short circuits between conductor tracks. The glue can currently be difficult to foil (US 3 'M company, manufactured by Hitachi, Japan), or used in the form of paste (made by American AIT and ZYMET, or German LCD Microelectronics). Ultraviolet (UV) curing Can also be used. For the implementation of the present invention, an anisotropic adhesive in the form of a paste is better than a foil. Note that when the contact technology is used, 'it will be found that the compromise lies in the establishment of good conductivity at each point layer of the wafer and between the tracks. The short circuit caused by the particle agglomeration is eliminated. The size of the contacts is used as an equal limit. This compromise is easier to obtain in proportion because the particle concentration can be increased while reducing its size. However, the smaller size must be made available in the cavity. The good flatness of the track end group is obtained on the bottom 7 (and the flatness of the integrated circuit contacts can also be obtained). Another element that helps to eliminate shorts between tracks is accuracy. The correct positioning of the integrated circuit during gluing is obtained: the good accuracy in these two aspects makes the track ends narrower, so increasing the interval between the tracks reduces the possibility of short circuits. The connection formed by anisotropic glue. The integrated power shown _______- 13- This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) ^-: -------- 「「 Equipment-factory (please first Read the notes on the back and fill in this page) Order 383028 A7 _ B7 V. Description of the invention (11) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 4 with contacts 5 1 and a surface passivation layer between the contacts 5 2 ; The bottom 7 of the cavity of the card holder 1 provides a rail end 9 ′, which does not include a raised portion in this case. In the bonding method combining a certain pressure, conductive particles such as 55 have become stuck in the adhesive 5 6, And then it is compressed between the pairs of contacts 9 and 51. Other particles such as 5 7 are located outside the contacts and do not form any conductive effect. During the bonding operation, the integrated circuit is pre-positioned so that its metal plated gasket (Contact) Align approximately to the end of the track (with or without elevation). _Drops of anisotropic glue are deposited on the bottom of the cavity, and then the integrated circuit is placed and dust is deposited on the glue. Subsequent polymerisation of the glue is carried out in an oven, or in a U V system (if u v curing resin). As described above with reference to FIG. 1, the cavity 5 is then filled (not shown) with a simple pot roast operation. The simplification of this operation makes it possible to use this system which fills several cavities at the same time, thus producing a high throughput per unit. The resin used is preferably a resin with high ionic purity, which provides good moisture absorption resistance, and effectively protects the integrated circuit chip during card bending and twisting. Attention should be paid to making the glue and protective resin from the adhesive wafer compatible with each other and having the same polymerization mode (heat or UV), so that they can perform the wafer gluing and filling operations with the same device. Then, the operation sequence is as follows: Glue the chip; Fill the cavity with a glue equip_t grease dispenser to fill the cavity; t-pack the tree: the glue of the body and the packaging resin polymerize at the same time In this case, the matter is discussed: anisotropy: before being applied to the bottom of the cavity " 4e, a single piece of equipment can be implemented as a whole, assembly operations.

This paper 1 is suitable for use in China (CNSy Eight Regulations # · (2IQX297mm) — I --- ^ ---- II (Please read the precautions on the back before filling this page) Order T.

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Claims (1)

No. 84 1 〇8 " Patent No. 7 Chinese patent application patent application amendment (January 88) 88028 B8 C8 D8 VI. Patent application scope L A method for the manufacture and combination of electronic cards, the card contains An electrical insulating card holder; the holder provides a cavity for accommodating an integrated circuit, and a metal contact-point pad on a surface is electrically connected to the contact of the integrated circuit, which is characterized by including the following steps:- Electrical conductor tracks are applied with MID (Molded Interconnect Assembly) technology streets, all of which are provided against the bottom and side walls of the cavity, and each is connected to, and the surface of the bracket containing the cavity is configured with One of the metal contact pads;-the implementation of the electrical connection 'which interconnects the integrated circuit axe points located in the cavity and the conductor track at the bottom of the cavity; and-with a subsequently polymerized protective resin The method for filling and filling the cavity β 2 according to the first item of the scope of the patent application, wherein the step of applying the gas conductor track is to provide the track of the glue activated by heat under pressure and heat. Hot foil belongs to travel law (h〇t f〇il emb〇ssillg method)) 0 3 ". According to the method of manufacturing and combination of the j-th patent of Patent No. 1¾, the method of manufacturing and combining, wherein the step of applying i the electrical conductor track is based on the required structure of the track. The central government's quasi-branch staff of the Ministry of Economic Affairs applied the catalyst to the pad-coated printing method to apply the catalyst, followed by metal bonding via automatic catalysis. 4. According to the method for manufacturing and assembling the first patented patent park, wherein the step of applying the electrical conductor track is to use laser holographic 3 degree space photolithography to print ‘. 5 'According to the claim, the patent Hongyuandi's one of the items I to 4 is manufactured and assembled. The paper size of the paper is remotely used. The national standard for household furniture (CNS) A4ii: (' 210X297 ^) No. 84 1 〇8 " Chinese Patent Application No. 7 for patent application. Amended version of the patent park (January 88) is 88028 B8 C8 D8. 6. Patent application scope L A method for the manufacture and combination of electronic cards. The card contains an electrically insulated card holder. ; The bracket provides a cavity for accommodating an integrated circuit, and a metal contact-point pad on one surface is electrically connected to the contact of the integrated circuit, which is characterized by including the following steps: Interconnect device j)-technology street to apply electrical conductor tracks, all of which are provided by the bottom and side walls of the cavity, and the metal contact pads are arranged on the surface of the bracket connected to and containing the cavity One;-the implementation of the electrical connection 'which interconnects the integrated circuit axe points located in the cavity and the conductor track at the bottom of the cavity; and-the cavity is filled with a subsequently polymerized protective resin β 2 The method of manufacturing and combining according to item 1 of the scope of patent application, The step of applying the gas-receiving conductor track is to provide a track of glue activated by heat to glue and stick under pressure and heat (the hot foil is a method of travel (h〇tfoil emb〇ssillg method)) 0 3 ". According to the method of manufacturing and assembling item j of patent No. 1¾, the method of applying i, the step of applying the electric conductor track, is printed by the Consumers ’Cooperative of the Central Provincial Bureau of the Ministry of Economic Affairs according to the required structure of the track. A pad printing method is used to apply the catalyst, followed by metal bonding via autocatalysis. 4. According to the method for manufacturing and assembling the first patented patent park, wherein the step of applying the electrical conductor track is to use laser holographic 3 degree space photolithography to print ‘. 5 'According to the claim, the patent Hongyuandi made any one of the items I to 4 in the manufacturing and combination of the original paper size and remote use of the national standard (CNS) A4ii: (' 210X297 ^) ABCD 383028 6. Application The scope of the patent 'where the electrical connection is obtained is that the base of the ceremonial circuit uses a conductive or non-conductive adhesive to conceal the bottom of the wei, and then the solder is welded, and the conductor is placed between the conductors of the integrated circuit. Guide wire. According to any one of the claims in the patent application, the card holder uses the injection molding technique to obtain its cavity, and 2 includes a year at the bottom of the cavity for the conductor track. Elevation in the end position. 11-7-According to the patent application for Fanyuan! To any of 4 items _ manufacturing methods and combinations, in which the step of obtaining electrical connection is a flip chip integrated circuit installation method, the connection is connected in a defined position with a connection, an insulating glue, or Obtained with conductive glue, the contacts of the rubber circuit provide a raised portion. & According to any one of the patent application Fanyuan items i to 4 _ method of making and combining 'where the step of obtaining the electrical connection is a flip chip integrated circuit grabbing technology' the connection is preformed The anisotropic conductive adhesive in the form of a chip or paste is obtained by gluing under pressure, and the contacts of the integrated circuit are not added. According to the application and combination of the eighth item in the application, the subject, the subject, the method, the method, the method, the method, the method, the method, the method, the method, the method, the method, the the anisotropic conductive material, the polymer is prepolymerized before the step of obtaining the electrical connection, and Finally, the polymerization and the protective resin travel simultaneously. ϊΰ " 7 types of electronic integrated circuit cards, 'which can be obtained by applying any one of the items 1 to 9 of the patent scope. r '..... -2-This paper size adopts Chinese National Standard (CNS) A4 (210X297mm) Μ—ΙΊ nnn I— I— n ^ ^ n I n I —Mm KI un * ^ 1 n (Please read the notes on the back before filling out this page) Printed by the Central Government Bureau of the Ministry of Economic Affairs