TW385918U - Improved structure for heat radiator of IC chip - Google Patents

Improved structure for heat radiator of IC chip

Info

Publication number
TW385918U
TW385918U TW87207755U TW87207755U TW385918U TW 385918 U TW385918 U TW 385918U TW 87207755 U TW87207755 U TW 87207755U TW 87207755 U TW87207755 U TW 87207755U TW 385918 U TW385918 U TW 385918U
Authority
TW
Taiwan
Prior art keywords
chip
heat radiator
improved structure
radiator
improved
Prior art date
Application number
TW87207755U
Other languages
Chinese (zh)
Inventor
Tzung-Lung Li
Original Assignee
Li Tzung Lung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Li Tzung Lung filed Critical Li Tzung Lung
Priority to TW87207755U priority Critical patent/TW385918U/en
Publication of TW385918U publication Critical patent/TW385918U/en

Links

TW87207755U 1998-05-19 1998-05-19 Improved structure for heat radiator of IC chip TW385918U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87207755U TW385918U (en) 1998-05-19 1998-05-19 Improved structure for heat radiator of IC chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87207755U TW385918U (en) 1998-05-19 1998-05-19 Improved structure for heat radiator of IC chip

Publications (1)

Publication Number Publication Date
TW385918U true TW385918U (en) 2000-03-21

Family

ID=21633919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87207755U TW385918U (en) 1998-05-19 1998-05-19 Improved structure for heat radiator of IC chip

Country Status (1)

Country Link
TW (1) TW385918U (en)

Similar Documents

Publication Publication Date Title
TW477437U (en) Assembled-type CPU heat sink
TW407753U (en) Improvement of heat dissipating structure for CPU
TW392869U (en) Heat sink for chips
TW385918U (en) Improved structure for heat radiator of IC chip
TW378765U (en) Improved structure of the heat dissipation assembly for IC chip sets
TW425053U (en) Improved structure of IC heat dissipater
TW367056U (en) Heat dissipating structure for chip
TW386647U (en) Structure for conducting heat for semiconductor chip
TW381738U (en) Improvement of chip heat radiation structure
TW398650U (en) Radiator structure for chip
KR970052869U (en) Heat sink for semiconductor IC
TW407754U (en) Heat dissipating device of power IC
TW389339U (en) Chip radiator structure
TW483544U (en) Heat sink for microprocessor chip
TW389326U (en) Improved clip for chip radiator
TW377937U (en) Improvement of positioning structure for heat dissipating fin of Integrated circuit
TW438208U (en) Fastening structure for integrated circuit heat sink
TW435826U (en) Improved heat dissipater for IC device package
TW322204U (en) Heat sink clasping structure of IC
TW437999U (en) Improved structure of heat sink for CPU
TW378791U (en) Heat sink structure for chips
KR970052868U (en) Heat sink for semiconductor IC
TW388520U (en) Improved structure of heat sink for computer component
TW395452U (en) Improvement of pad structure for dissipating heat
TW377855U (en) Structure improvement for heat radiator of computer

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees