TW378765U - Improved structure of the heat dissipation assembly for IC chip sets - Google Patents

Improved structure of the heat dissipation assembly for IC chip sets

Info

Publication number
TW378765U
TW378765U TW87217790U TW87217790U TW378765U TW 378765 U TW378765 U TW 378765U TW 87217790 U TW87217790 U TW 87217790U TW 87217790 U TW87217790 U TW 87217790U TW 378765 U TW378765 U TW 378765U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
improved structure
dissipation assembly
chip sets
chip
Prior art date
Application number
TW87217790U
Other languages
Chinese (zh)
Inventor
Guo-En Liang
Original Assignee
Malico Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Malico Inc filed Critical Malico Inc
Priority to TW87217790U priority Critical patent/TW378765U/en
Publication of TW378765U publication Critical patent/TW378765U/en

Links

TW87217790U 1998-10-28 1998-10-28 Improved structure of the heat dissipation assembly for IC chip sets TW378765U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87217790U TW378765U (en) 1998-10-28 1998-10-28 Improved structure of the heat dissipation assembly for IC chip sets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87217790U TW378765U (en) 1998-10-28 1998-10-28 Improved structure of the heat dissipation assembly for IC chip sets

Publications (1)

Publication Number Publication Date
TW378765U true TW378765U (en) 2000-01-01

Family

ID=21637170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87217790U TW378765U (en) 1998-10-28 1998-10-28 Improved structure of the heat dissipation assembly for IC chip sets

Country Status (1)

Country Link
TW (1) TW378765U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees