TW435826U - Improved heat dissipater for IC device package - Google Patents

Improved heat dissipater for IC device package

Info

Publication number
TW435826U
TW435826U TW87215542U TW87215542U TW435826U TW 435826 U TW435826 U TW 435826U TW 87215542 U TW87215542 U TW 87215542U TW 87215542 U TW87215542 U TW 87215542U TW 435826 U TW435826 U TW 435826U
Authority
TW
Taiwan
Prior art keywords
device package
improved heat
heat dissipater
dissipater
improved
Prior art date
Application number
TW87215542U
Other languages
Chinese (zh)
Inventor
Tzung-Lung Li
Original Assignee
Li Tzung Lung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Li Tzung Lung filed Critical Li Tzung Lung
Priority to TW87215542U priority Critical patent/TW435826U/en
Publication of TW435826U publication Critical patent/TW435826U/en

Links

TW87215542U 1998-09-19 1998-09-19 Improved heat dissipater for IC device package TW435826U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87215542U TW435826U (en) 1998-09-19 1998-09-19 Improved heat dissipater for IC device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87215542U TW435826U (en) 1998-09-19 1998-09-19 Improved heat dissipater for IC device package

Publications (1)

Publication Number Publication Date
TW435826U true TW435826U (en) 2001-05-16

Family

ID=21636265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87215542U TW435826U (en) 1998-09-19 1998-09-19 Improved heat dissipater for IC device package

Country Status (1)

Country Link
TW (1) TW435826U (en)

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