TW382141B - Apparatus and method for conditioning leads of integrated circuit components - Google Patents

Abstract

An apparatus for conditioning leads projecting from an integrated circuit molded component package having a top half and a bottom half. The apparatus comprises a bottom block for supporting the top half of the component, a top block for holding the bottom half of the component package thereby clamping the component between the top and bottom blocks, and conditioning tool assemblies moveable along three perpendicular axes for conditioning the leads of the component, while the blocks remain stationary throughtput the conditioning process. The conditioning tool assemblies comprise blades for engaging and oscillating the leads to reestablish lead parallelism, and plates for deforming the leads to reestablish lead coplanarity. A method for lead conditioning using the lead conditioning apparatus of the present invention is also disclosed.

Description

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (1) The present invention relates to an improvement in the installation and method of an electric wire that can be adjusted by the molded assembly of integrated circuit components. A number of devices have been provided and used to correct, straighten, or adjust the conductance from a molded assembly having an integrated chip or component with an upper half and a lower half.

U.S. Patent No. 5,431,197 to Linker et al. Discloses a device and method for correcting and adjusting a small J-shaped wire (SOJ). A SOJ component has a body portion and most of the J-shaped wires with inwardly bent end ends protruding from the body portion. The device for correcting and straightening these wires includes a device having an inlet end and a discharge end. An elongated track and a combined straightening and straightening section along the execution path; an anvil is placed on the track and has a recess for correcting the terminal end of the Soj member wire. It is optional. Between the release and clamping positions; at least one sliding component with a plurality of spaced fingers can be arranged between the wires of the S0j component, is arranged close to the track and can be optionally selected from an origin position And an interval between adjacent wires through a carding process and a correction process that causes the sliding assembly to act in one direction relative to the track and then in the opposite direction, affecting the interaction of all the wires with the correction surface of the anvil And a device for selectively changing the clamping force exerted on the soJ member by the anvil during the correction process. The method of aligning the wires in a straight line includes the following steps: (a) holding the SOJ component between a station block with a bridge front covering the entire row of wires and a track applying pressure on the body portion; (B) moving at least one sliding assembly having a plurality of spaced fingers, the fingers first

(Read the notes on the back before filling in this page}

-4-Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Λ7 '^ _________ Β7 V. Remuneration of Invention (2) ~ ~-The conductors of the S0J component are passed through a carding process, so that the adjacent conductors are mutually Spaced a predetermined distance, and then settled between the ends of each crimped terminal, and (c) a corrective step, including first moving the sliding assembly in a lateral direction relative to the rolling path, so that the sJJ component relative to The rolling track moves, so the J-shaped part will be restricted and forced to reach the correction surface to correct the wires. "

The disadvantage of the device and method of Linker et al. Is that it requires quite a lot of complicated mechanisms and actions, such as a tilted track. A latch is required in the correction cycle to fix the SOJ component to the workbench. At the end of the cycle, it requires An air nozzle is used to drive the corrected soj member from the table. A pair of sliding components can be moved in multiple directions during the correction cycle, and an anvil block can hold the SOJ member. The clamping pressure is required. To be adjusted and changed, it is necessary to use a stack of pressure cylinders when the sliding components perform various actions. Such a complex machine would face high manufacturing and maintenance costs. U.S. Patent No. 53017220, owned by Plummer et al., Discloses a device and method for correcting twisted electrical wires protruding from an integrated circuit chip. This kind of device is used to correct the twist of the electric wires protruding from an integrated circuit chip. The device includes a clamping device to fix the wafer protruding from the electric wires. A comb-shaped element can be inserted into the wires of each wire. At the same time, a device that can deform the wires, and a device that finally shapes the wires, is used to reconstruct the coplanarity of the wires and the angle of the wires relative to the plane of the wafer. The method for correcting the twist of an electric wire includes the following steps: (a) fixing a wafer with the electric wire protruding thereon by a clamping device; (b) applying a paper size to the Chinese National Standard (CNS) A4 Specifications (210 X 25 > 7mm) ----;-© Ί ------, order ------@-----.1 (Please read the precautions on the back first (Fill in this page),-5 V. Inventor A7 Β7 of the Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperative, A7, B7 Invention description (comb elements are inserted between the material line, and the direction parallel to the line is any skew or distortion; ⑷ Transform the wires; 最终 final shape the 4 wires to restore the coplanarity of the wires and the angle of the wires with respect to the plane of the wafer; and ⑷ remove the wafer from the clamping device. It is impossible to effectively restore these wires to the exact parallel shape of the original wires by parallel "combing action" parallel to the direction of the wires. Moreover, the final forming step is also impossible to make these wires Traverse reconstruction of the original precise coplanarity, this is due to a punch angle of 31 4 After the wires have completed the final forming operation, the wires will have a predicted "rebound, reaction." U.S. Patent No. 5,613,531, which is owned by others, discloses a wire assembly device including a wire clamping device and a The wire adjusting tool includes: the clamping device f can hold the integrated circuit element, and a pressing member can press the integrated circuit element against the receiving block. The wire adjusting tool is There are teeth or parts, an upper adjustment plate, and a lower adjustment plate. The adjustment tool first moves toward the wafer in a direction parallel to the wafer plane until the contact foot is located in the gap between the row fork and the upper adjustment plate. Then, the adjustment tool is moved in a direction perpendicular to the previous movement, that is, the half surface of the wafer, 'until the gap between the other parts is aligned under the fixed foot of the contact foot. Then, the adjustment tool starts a The first movement moves the fixed foot into the gap between the other parts. While the adjustment tool continues the first movement, the clamping device performs a first vibration operation to make the contact feet flat with each other. . The adjustment plate moves upward post water straight contact pins of this paper size, Series color correction Choi _

6 via the central standard k- Bureau μ Industrial Cooperative Co., Ltd. 5. Description of the invention (4) The A7 B7 flat end contacts the lower adjustment plate, and only the contact foot remains in the gap between the other parts. The clamping device performs a second vibration operation with a large amplitude vibration operation, and the contact foot is bent upward because the adjustment tool continues the first upward movement and contacts with the lower adjustment plate. After moving a certain distance, the adjustment plate starts to move downward for the second time, which is opposite to the direction of the first movement, until the upper adjustment plate contacts the contact foot without vibrating operation. Then the contact will be bent downward due to the further downward movement of the adjustment tool and the contact with the upper adjustment plate. This is a disadvantage-the integrated circuit component is held by the molded = piece. The upper half is fixed in position. However, since the upper half of the molding assembly is slightly deviated from its lower half after the molding process, it is not necessary to position the wires at a predetermined position. Another disadvantage is that the device circulates through the entire column. The wire holding device and the wire adjustment tool contain continuous interactions with each other. The central holding device performs a vibration operation to adjust the guard to perform upward and downward movements. What is needed is a more complex mechanism and more movable components in order for the clamping device and the adjuster to move relative to each other in different directions and actions. Another disadvantage is that the pressing piece used to press and hold the integrated circuit component can damage the external assembly or even the internal component of the integrated circuit component. This makes it possible '------ 1T ------ 0 ------ (Please read the precautions on the back before filling in this 1) This — an improved decoration' '--- -—— __ j: Components that move forward and backward, this paper size applies to China National Standard (CNS) A4 (210X297 mm)

---I Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (5) Another object of the present invention is to provide—a method for modifying and adjusting, which is miscellaneous> —to make _ wire more accurate adjustment . According to the-concept of the present invention, there is provided a device for adjusting a plurality of wires which are extended from a molded integrated circuit assembly having-an upper half and a lower half; the device; Contains a device that can support the upper half of the molded assembly; a device that can hold the lower half of the molded assembly, and clamp the integrated circuit component between the support device and the holder with greater accuracy -Comparative position between the devices; and-the device can adjust the wires of the integrated circuit element, the adjustment device can move along three vertical axes, and the supporting and holding device remains stationary during the entire wire adjustment cycle; The adjusting device includes a device capable of forcing and vibrating the wires in a side-to-side direction parallel to the sides of the integrated circuit element, and finally rebounding the wires into a predetermined shape. The wires are formed A parallel relationship with each other; a device can deform the wires in a direction perpendicular to the plane of the integrated circuit element until reaching a first coplanar position; a device can cause the wires to be perpendicular to the integrated circuit The plane of the component is deformed in the opposite direction until it reaches a second coplanar position; and a device can deform the wires in the aforementioned direction perpendicular to the plane of the integrated circuit element until it reaches a third coplanar position, so that the Wait for the wire to bounce back into a final coplanar shape. In at least one embodiment of the present invention, the supporting device is formed in a block shape, and a recess is provided on the upper surface thereof to receive the upper half of the molding assembly, and the size of the recess is larger than the molding assembly. The upper half of the piece is slightly larger, so the supporting device can be used to accommodate the upper half of an assembly inside, so that it can be slightly offset from the lower half. This paper size applies to China National Standards (CNS) Α4 specifications (210 ×: 297 mm) Packing-(Please read the precautions on the back before filling out this page) -Ding--β 4 8 Staff Consumption of Central Standards Bureau, Ministry of Economic Affairs Printed by the cooperative Λ.7 ----____ B7 V. Description of the invention (6) ~~ -------- In at least one embodiment of the present invention, the supporting device is supported by a device. '' In at least one embodiment of the present invention, the holding device is formed in a block shape and has a concave portion provided on the lower surface thereof, which can tightly cover the lower half of the molded assembly with a larger precision break. The wires are positioned at a fixed position relative to the wire adjusting device. In at least one embodiment of the present invention, the forcing and vibrating device is formed into a plate shape, and a plurality of conductors having a plurality of blades provided thereon to force the majority of the leads. In at least one embodiment of the present invention, the The device for deforming the wire upwards is plate-shaped and closely abuts the lower surface of the forced vibration plate. The board for making the wire upwards forms a shoulder and can contact the wires during the entire upward deformation process; The size of the plate that deforms the wire upward is the same as the size of the forced vibration plate. In at least one consistent embodiment of the present invention, the device for deforming the conducting wire downward is in a plate shape and abuts against the upper surface of the forcing vibration plate, and the board for deforming the conducting wire downward has a stage groove forming a The shoulders can be in contact with the wires during the downward deformation; wherein the size of the plate that deforms the wires downward is substantially the same as the size of the forced vibration plate. According to a second concept of the present invention, a method for adjusting a plurality of wires is provided, and the wires are extended from a molded integrated circuit assembly having an upper half and a lower half; the method includes the following Steps: The upper half of the molded assembly is supported on a first piece; the lower half of the molded assembly is held by a second piece, and the integrated circuit component is Paper size is applicable to China National Standard (CNS) A4 specification (210X297 male thin) (Please read the note on the back first, and then fill in this page) -----— C3-Packing ------ Order --- -.—-----.—— 1 ^ ------ 9 Λ7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (7) The high precision is clamped between the first and the first A fixed position between the two pieces; providing an adjustment device that can move along three vertical axes, and the support and holding device remain stationary during the entire wire adjustment cycle; and the adjustment device is used to adjust the integrated circuit The component wires; the adjustment process includes the following steps: The edge-to-edge direction is parallel to the integrated circuit components. Side to force and vibrate the wires, and finally make the wires spring back into a predetermined shape even if the wires form a parallel relationship with each other; make the wires perpendicular to the plane of the integrated circuit element The wires are deformed until the wires reach a first coplanar position; the wires are deformed in an opposite direction perpendicular to the plane of the integrated circuit element until the wires reach a second coplanar position; and The wires are deformed in the direction of the plane of the integrated circuit component until the wires reach a third coplanar position, and finally the wires bounce back into a predetermined coplanar shape. In at least one embodiment of the present invention, the method further includes supporting the first piece on a spring to reduce clamping of the integrated circuit element between the first and second pieces. Steps to Power. In at least one embodiment of the present invention, the method further forms a gap between the upper half of the molding assembly and the first block, so that the first block receives the upper half of the integrated circuit assembly. It can deviate from the lower half of the job. Brief description of the drawings: A clear embodiment of the present invention will be described by way of example and in conjunction with the attached drawings; of which: " " FIG. 1 is a wire adjusting machine according to a preferred embodiment of the present invention Exploded view; (Please read the precautions on the back before filling this page) ιφ ^ ------ ΪΤ ----——-----.--.——

Λ7 B7 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (8) The second diagram is a cross-sectional view of the top and bottom block components of the wire adjustment machine of FIG. 1 with an integrated circuit component placed between them . Figure 3 is a partial enlarged view of the top and bottom block components and the integrated circuit component shown in Figure 2; and Figures 4 to 17 are step-by-step schematic diagrams of a wire adjusting machine according to a preferred embodiment of the present invention . Please refer to the drawings in more detail. The same h number throughout some of the drawings represents the same components. Figure 1 shows an exploded view of a wire adjustment device labeled 丨 〇. The wire adjusting device 10 includes a top block 12 and a bottom block 14 which are respectively mounted on a top block device base 16 and a bottom block device base 18. The top block 12 and the bottom block 14 can hold an integrated circuit chip or component 20 therebetween, as shown in FIGS. 2 and 3. The top and bottom block device seats 16, 18 are driven by a number of motors (not shown), which can drive the top and bottom blocks 12, 14 relatively close to or away from each other along a vertical z-axis, and can The top and bottom blocks 12, 14 are driven to rotate 90 clockwise or counterclockwise along a common vertical axis simultaneously. . The lead adjusting device 10 further includes a pair of lead adjusting tool sets 22 and 22 '' having top adjusting plates 24, 24 ,, middle adjusting plates 26, 26, and bottom adjusting plates 28, 28, respectively. The top, middle, and bottom adjustment plates 24, 24, 26,%, 28 and 28 are preferably hard metal plates having approximately the same size. These adjustment tool sets 22, 22 can be moved in two vertical directions, such as the X-axis Y-axis and the Z-axis, during a wire adjustment process. These adjustment tool sets 22 'are also driven by a motor (not shown). One integrated circuit element 20 is provided with a metal electrical lead, designated 30, which protrudes from a quadrangular assembly 32 having an upper half 34 and a lower half 36. —---- ^ — llk '—— (Please read the notes on the back before filling this page) Order 11

Printed by the Central Bureau of Standards, Ministry of Economic Affairs and Consumer Cooperatives, and description of the invention (9) Each electric wire 30 has three sections, that is, a mounting leg 38 extending substantially horizontally, and a middle leg 4 extending substantially vertically. 〇, and a free end 42 'extending substantially horizontally as shown in the third figure. The bottom block 14 is urged by a spring 44. Therefore, the bottom block 14 is normally positioned in an upward position. When an integrated circuit component 20 is placed on the bottom block 14 and the top block 12 moves downward to clamp it there, the bottom block 14 will be pressed and moved to a downward position. The spring against the bottom block mechanism can reduce the clamping force applied to the integrated circuit element 20, and can still effectively hold the integrated circuit element 20 during the entire wire adjustment process. The spring block mechanism can prevent the integrated circuit element 20 from being damaged. It can eliminate the need to adjust the clamping force of the integrated circuit element during the adjustment process. Moreover, the spring against the bottom block mechanism can allow clamping of integrated circuit elements of different assembly thicknesses. A central recessed portion 50 is provided on the top surface of the bottom block 14, and an anvil portion 52 is provided above the four edges of the bottom block 14. The recessed portion 50 can receive the upper half 34 of the molded assembly 32 therein, and the integrated circuit component 20 can be supported on the bottom block 14 in a so-called "dead worm" state. According to a concept of the present invention, the size of the recess 50 is slightly larger than the size of the upper half 34 of the molding assembly 32, and a slight gap or space is formed between the molding assembly 32 and the anvil 52. 54 »This gap 54 allows the integrated circuit element 2 to move slightly within its recessed portion 50 and in the direction of Y when it is supported by the bottom block 14. The bottom surface of the top block 12 is also provided with a center The concave portion 56 and an anvil portion 58 are provided along the bottom edges of the four sides of the top block 12. The inner surface of the anvil portion 58 is inclined at an angle A ° as shown in Fig. 3. The inclined inner surface is close to the paper size of the template. It is applicable to Chinese Family Standards (CNS) Α4 Secretary (210 × _297 male thin) ---- -12-(Read the notes on the back and then fill in (This page) -------: ------ ^ \ Attack ------ 1T ------ Yin Gong A7 B7, Zhengong Consumer Cooperative, Central Standards Bureau, Ministry of Economic Affairs (10) The corresponding oblique outer surface of the lower half 36 of the manufacturing assembly 32. When the top block 丨 is driven downward toward the bottom block 14, the recess 56 can tightly receive the lower half 36 of the molding assembly 32 and hold the integrated circuit component 20. Between the top block 12 and the bottom block 14. An important concept of the present invention is to hold the integrated circuit element 20 by the lower half 36 of the molded assembly 32. Since the positions of the wires 30 are fixed relative to the lower half 36 of the molded assembly 32, the integrated circuit element 20 is held by the lower half 36 of the molded assembly 32, and Not holding the upper half 34 will cause the wires 30 to be positioned more accurately relative to the wire adjustment tool sets 22,22. Another important concept of the present invention is the gap provided between the upper half 34 of the molded assembly 32 and the station portion 52 of the bottom block 14. This is an integrated circuit assembly that allows the lead wire adjusting device 10 to accept and hold the upper and lower halves with relatively slight deviations. Please refer to FIGS. 4 to 17 for a step-by-step operation of the lead adjusting device 10 according to a preferred embodiment of the present invention. The operation of the wire adjusting device can be controlled completely automatically by a microprocessor. At the beginning of operation, an integrated circuit element 20 is transferred from a dish to a precise position where the integrated circuit element 20 can be adjusted to a predetermined center position.积 The integrated circuit element 20 is transferred from the precise position to a lead adjustment position of the lead adjustment device 10. The integrated circuit element 20 is placed on the top of the bottom block 14, so the upper half 34 of the molded assembly 32 faces down and is in a "dead" state. The upper half 34 of the molded assembly 32 is received and supported in the recessed portion 50 of the bottom block 14. It is best to use it in practice: o ^ ------ ΐτ ------ Q (Please read the precautions on the back before filling this page}

13;.;. 1: mvivi ,. Λ7 B7 V. Description of the invention (11 Vacuum system to hold the integrated circuit element 20 and place it on the bottom block 14. When the integrated circuit element 20 is properly positioned at A signal is sent to the bottom block 14 to a cylinder (not shown), which will drive the top block 12 down to face the bottom block 14, as shown by the arrow in Figure 4. When the top block 12 Close to the bottom block 14, the recessed portion 56 and the anvil portion 58 of the top block 12 will abut on the lower half 36 of the molding assembly 32 as described above, and the integrated circuit element 20 is clamped on Between the top and bottom blocks 12, 14 and fix the extended wires 30 at a precise position for adjustment. Then the wire adjustment tool set 22, 22 will face the top and bottom blocks π '14 level Move, as shown by the arrow in Figure 5, so that the protruding wires 30 are respectively positioned in the stepped grooves 46, 46 'provided along the lower edges of the top adjustment plates 24, 24, and the basis. In the preferred embodiment, the top adjustment plates 24, 24, the middle adjustment plates 26, 26, and the bottom adjustment plates 28, 28, etc. are aligned in a precise position by corresponding positioning pins 60, 60 '. In this way, the surfaces facing the top and bottom blocks 12 and 14 can be roughly arranged on the vertical planes. Among these adjustment plates, 26 'are each provided with a blade portion 62, 62, which has a slight inward tilt. The front edge of the blade. The blade portions 62, 62 can also be fixed between them by gaskets for individual cutter elements, or a single-piece integrated cutting edge unit. The blade portions 62, 62 are in the wire adjustment tool Groups 22, 22, which are moved upwards as shown in «Section 6®", can be pressed against the line 30 of the integrated circuit component 20. This resistance will in fact cause any severe deformation on the integrated circuit component 20 The material line causes __ a kind of rough combing and short straight process ", when the adjustment tool set 22, 22, the knife part 仏 62, and the corresponding wire standard wire standards apply the Chinese National Su 7 ^ 5) M regulations rebinding 14 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (12) When the 30 settles, the adjustment tool group 22, 22 will start to vibrate along the Y axis as shown in Figure 7, and Ground sweeps these wires 30. According to a preferred embodiment of the present invention, the adjustment of the set 22, 22 'will first shift from the original displacement of the point at "0" to a point "a" on the positive Y axis, and then to a point at negative γ The "_a" point on the axis is moved to the "b" point on the positive Y axis, and the value of "b" is smaller than "a", and finally moved back to the original position at 0 point. The vibration operation is used to perform the expected rebound action of the wires 30 due to the metal elastic memory. The wires 30 are swept several times beyond their normal parallel position in a direction from the side to the other side, so that the wires 30 finally bounce back to the normal parallel position. At this stage, the wires 30 are in an initially parallel spaced relationship with each other. The proper distance between adjacent wires 30 and the parallelism of these wires are restored and restored. The next step is to reconstruct the coplanarity of these wires. As shown in FIG. 8 'The adjustment tool sets 22, 22 are moved away from the top and bottom blocks 12, 14 a short distance, so the free ends 42 of the wires 30 extending horizontally will be positioned and prepared Follow-up with the adjustment tool group 22, 22, as described below. Referring to FIG. 9, the wire adjustment tool set 22, 22 is now moved upward, so at one point the free ends 42 of the wires 30 will contact the shoulders 64, 64 ′ of the bottom adjustment plates 28, 28 ′. . As the adjustment tool sets 22, 22 continue to move upward, the shoulders 64 of the bottom adjustment plates 28, 28, material will push and rearrange the wires 30 to the first coplanar position. As shown in Figure 10, these adjustment tool sets 22, 22 are moved upwards, so that the free end 42 and the top of the wire 30 can be adjusted at one point. 24, This paper is suitable for financial countries (CNS) ) A4 size (210 '/ 297mm ^ 7 (Please read the precautions on the back before filling this page)

15

Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Contacts 66, 66 'on the shoulders of the invention description (U). When the adjustment tool sets 22, 22, continue to move downward, the shoulders 66, 66 of the top adjustment plates 24, 24, will push and rearrange the wires 30 to a second Coplanar position. Finally, as shown in FIG. 11, the wire adjusting tool sets 22 and 22 are moved upwards, and at one point, the free ends 42 of the wires 30 are brought into contact with the shoulders 64 and 64 ′ of the bottom adjusting plates 28 and 28 ′. . When the adjustment tool sets 22, 22, continue to move upward, the shoulders 64, 64 of the bottom adjustment plates 28, 28, will push and rearrange the wires 30 to a third total. In the planar position, the wires 30 finally bounce back to a final predetermined coplanar position. Similarly, the upward and downward movements are used to eliminate the expected rebound action of the wires 30 due to the metal elastic memory. The wires 30 are swept up and down beyond their normal coplanar plane 'to eventually cause the wires 30 to spring back to the normal coplanar position. At this stage, the coplanarity of the wires 30 can be restored. At this time, the wires 30 are in a normal parallel and coplanar relationship, so the adjustment of the opposite two wires 30 has been completed. ★ According to the above-mentioned preferred processing procedure, the top and bottom blocks 12, 14 remain stationary during all adjustment cycles. This can eliminate the necessity of moving the top and bottom blocks 12 '14 along the directions of the y-axis and the γ-axis, so it can reduce the number of movable members and actuation' to achieve the same adjustment effect. These adjustment tool sets 22 '22, at this time have been quasi-injured and moved back to the original position', that is, each wire 30 is arranged in the step 46, 46 'of the top adjustment plate 24, 24, as in the 12th As shown. Figures 13 and 14 show these adjustment tool sets ^, 22, removed from the top block 12 '14, and provided for these blocks ——sufficient rotation of empty paper scales ) Al-

Λ7 ~: —- ~~~ ——-— B7 _____- 5. Explanation of the invention (M). The top and bottom blocks 12, 14 will rotate 90 clockwise. The other two opposite rows of the cross-section circuit element 20 are positioned to perform the adjustment process as described above. When the remaining two rows of wires are adjusted, the top and bottom blocks 12 and Η will rotate 90 counterclockwise. Return to the initial position, as indicated by the arrow in Figure 15. Please refer to Figure 16. The adjustment tool sets 22, 22 'will be further away from the top and bottom blocks 12, 14' and return to Figure 4 The original position shown. Finally, the top block 12 returns upward, as shown in FIG. Π, and the adjusted integrated circuit component 20 will be removed from the bottom block 14 of the wire adjusting device 10. For example, each of the top adjustment plates 24, 24, and the bottom adjustment plates 28, 28 can be easily removed and replaced or repaired. Similarly, the middle adjustment plate 26, 26 can also be easily replaced with another adjustment plate, which is provided with different cutting edges and different gaps for Yu Yu H wire gauge; ^ '. Circuit wires are forced to handle. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs-Production J Pack-Cantonese first read the precautions on the back before filling out this page) Although the present invention has been disclosed and explained in detail in a preferred embodiment, Please note that there are many other changes and modifications that can be implemented without departing from the scope of the invention. This paper is again applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 17 Λ7 Β7 V. Description of the invention (15) The component numbers are printed in accordance with the Central Consumers Bureau of the Ministry of Economic Affairs Consumer Cooperatives 10 ... wire adjustment device 38. .. install foot 12 ... top block 40 ... mid foot 14 ... bottom block 42 ... free end 16 ... top block device holder 44 ... spring 18 ... bottom block device holder 46,46 '.... Groove 20 ... Integrated circuit element 5 0 ... Central recess 22,22' ... Wire adjustment tool set 52 ... Anvil 24,24 '... Top adjustment plate 54 ... Gap 26,26 '... Middle adjustment plate 56 .... Central recess 28,28' ... Bottom adjustment plate 5 8 ... Stone occupying portion 3 0 ... Guide line 60, 60 '... Positioning pin 32 ... Assembly 62 , 62 '... Blade 34 ... Upper 64,64' ... Shoulder 36 ... Lower 66,66 '... Shoulder (Please read the notes on the back before filling this page) This paper Standards apply to Chinese National Standard (CNS) A4 specifications (210X297 mm) -18-

Claims (1)

Scope of patent application: A8 B8 C8 D8 Printed by the Consumers' Cooperative of Zhongli Bureau of the Ministry of Economic Affairs. L = Device for adjusting most conductors. The conductors are assembled from a molded integrated circuit component with an upper half and a lower half. The device includes: a device for selectively holding the upper half of the aforementioned molded assembly; a device for holding the lower half of the aforementioned molded assembly, which can be clamped with greater accuracy The integrated circuit element between the supporting device and the holding device is in a fixed position; a device for adjusting the lead of the integrated circuit component, the adjusting device can move along three vertical axes, and the supporting and holding device is in A wire is kept stationary during an adjustment cycle; the adjustment device includes a device capable of forcing and vibrating the wires in a side-to-side direction parallel to the side of the integrated circuit element, which finally enables the wires to spring Back to a predetermined shape, the wires are in a parallel relationship with each other; the wires are deformed in a direction perpendicular to the plane of the integrated circuit component until the device reaches a first coplanar position. A device for deforming the wires in the opposite direction perpendicular to the plane of the integrated circuit element until reaching a second coplanar position; deforming the wires in the aforementioned direction perpendicular to the plane of the integrated circuit element until reaching A device in a third coplanar position causes the wires to spring back into a final predetermined coplanar shape. 2. If the device of the scope of patent application is No. 1, wherein the supporting device is in the form of a block, 'the upper surface has a recess to receive the molded assembly, please first page I. This paper size applies to China Standard (CNS) Λ4 specification (210X297 mm) 19 A8 B8 C8 D8 Half of the scope of patent application, the size of the recess is slightly larger than the upper half of the molded assembly, and a supporting mold assembly can be accepted in the supporting device Allow the upper half to deviate slightly from the lower half. 3. The device according to item 2 of the scope of patent application, wherein the holding device is supported by a spring device. 4. For the device according to the scope of patent application, wherein the "holding device is in the shape of a block", the lower surface of the device has a recessed portion that can be tightly covered on the lower half of the σ part of the molding group. Large precision positions the wires in a fixed position relative to the wire adjusting device. 5. For the device under the scope of patent application, the forced and vibrating device is plate-shaped, and most of the blades are set on it to force the majority of the wires. 6. If the oldest device in the scope of the patent application, the device for deforming the wire upward is plate-shaped, and against the lower surface of the forcing and vibration plate, the wire deforming plate is formed-the shoulder can be in the It is in contact with the wires during the upward deformation process; and the size of the plate that deforms the wires upward is substantially equal to the forced and vibrating plate. 7. The device according to item 丨 of the scope of patent application, wherein the device for deforming the wire downward is plate-shaped, and against the upper surface of the forced and vibrating plate, the wire downwardly deforming plate has a first-stage shape The grooves form a shoulder that can contact the wires during the downward deformation process; and the size of the plate that deforms the wires downward is approximately the same as that of the forced and vibrating plate. These wires are from a standard that has a wooden paper and a paper scale that is applicable to China National Standards (CNS) Α4 specifications (210X297 mm) I -I I ---- (Please read the notes of the back © before filling in this Page) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 8. 20 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A8 B8 C8 D8 6. Molded integrated circuit combinations of the half and lower half of the scope of patent application The method includes the following steps: supporting the upper half of the molded assembly on a first piece; holding the lower half of the molded assembly with a second piece, and Greater accuracy of the integrated circuit component Holding a fixed position between the first and second pieces; providing an adjusting device that can move along three vertical axes, and the supporting and holding device remains stationary during a wire adjustment cycle; and The adjusting device adjusts the wires of the integrated circuit element; its adjustment procedure includes the following steps: forcing the vibration of the wires against and vibrating the side-to-side direction parallel to the sides of the integrated circuit element, and finally the Wait for the wires to bounce back into a predetermined shape 'where the wires are in a spaced parallel relationship; deform the wires in a direction perpendicular to the plane of the integrated circuit element' until the wires reach a first coplanar position ; Deform the wires in an opposite direction perpendicular to the plane of the integrated circuit element until the wires reach a second coplanar position: and make the wires in the aforementioned direction perpendicular to the plane of the integrated circuit element Directional deformation 'until the wires reach a third coplanar position, and finally the wires bounce back into a predetermined coplanar shape. 9. The method according to item 8 of the scope of patent application, further comprising: by supporting the first piece on a spring to reduce the application of Chinese National Standards (CNS) A4 regulations at the first standard scale (each one) 210X297 mm) --------- 0 Pack ------ Order ------- (please read it first > Face Cry t Matters I fill out this «) 21 A8 B8 C8 D8 6. The step of applying clamping force to the integrated circuit component between the scope of patent application and the second piece. 10. According to the method in the eighth aspect of the patent application, a gap is provided between the upper half of the molded assembly and the first block, so that the first block can accommodate the integrated circuit assembly. In the upper half, you need to be able to deviate slightly from the lower half. (Please read the note on the back *. Please write down this page first.) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 22 This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm).