經濟部中央標準局貝工消費合作杜印製 • f) ' r': .，·，Printed by Shellfish Consumer Cooperation of the Central Bureau of Standards, Ministry of Economic Affairs • f) 'r':., ·,
i} i J t)(J X 3094twf.doc/006 . „ A7 ___ B7 五、發明説明（/ ) 本發明是有關於一種化學機械硏磨（Chemical-Mechanical Polishing ; CMP) 機台 ，且特別是有關於一種具 有多孔（porous)分送管（dispensing tube)的化學機械硏磨機 台。 在半導體製程技術中，表面平坦化是處理高密度微影 的一項重要技術，因沒有高低落差的平坦表面才能避免曝 光散射，而達成精密的圖案轉移(pattern transfer)。平坦化 技術主要有旋塗式玻璃法(Spin-On Glass ; SOG)與化學機械 硏磨法（CMP)等二種，但在半導體製程技術進入毫微米 (sub-half-imcron)之後，旋塗式玻璃法已無法滿足所需求的 平坦度，所以化學機械硏磨技術是現在唯一能提供超大型 積體電路（Very-Large Scale Integration ;VLSI)，甚至極大型 積體電路(Ultra-Large Scale Integration ; ULSI)製程，“全面 性平坦化(global planarization)”的一種技術。 請同時參照第1A圖與第1B圖，其分別繪示一種習知 化學機械硏磨機台的俯視與側視圖。其中包括：一硏磨台 10(polishing table);—握柄 ll(holder)，用以抓住被硏磨的 晶片12 ; —硏磨墊13(polishing pad)，舖在硏磨台10上； 一管件14(tube)，用以輸送硏漿15(slurry)到硏磨墊13上； —液泵16，用以將硏漿15抽送到管件14中；以及一調節 器17(c〇nditioner)，用以刮平硏磨墊13的表面。當進行化 學機械硏磨時，硏磨台10與握柄11分別沿一定的方向旋 轉，如圖中之箭號18a與18b所示，且握柄11抓住晶片12 的背面19,將晶片12的正面20壓在硏磨墊13上。管件14 3 (請先閱讀背面之注意事項蒋填寫本萸) i .装. 本紙張尺度適用中國國家榇準（CNS)A4说格（210X297公f ) 3094twf.doc/006 A7 B7 經濟部中央標準局貝工消費合作社印繁 五、發明説明（1) 係將液泵16所打進來的硏漿15，持續不斷地供應到硏磨 墊13上。所以’化學機械硏磨程序就是利用硏漿15中的 化學助劑，在晶片12的正面20上產生化學反應’使之形 成一易硏磨層，再配合晶片12在硏磨墊13上藉由硏漿15 中之硏磨粒(abrasive particles)輔助之機械硏磨，將易硏磨 層之凸出部份硏磨’反覆上述化學反應與機械硏磨’即可 形成平坦的表面。基本上’化學機械硏磨技術是利用機械 拋光的原理，配合適當的化學助劑(rea2ent)與硏磨粒’將表 面高低起伏不一的輪廓’ 一倂加以“拋光”的平坦化技術。 上述習知化學機械硏磨機台的缺點在於’管件14輸入 硏漿15於硏磨墊13上的效率太差’而硏漿15又是控制化 學機械硏磨法中關鍵的製程參數，假若硏漿15在硏磨墊13 上的分佈不夠均勻的話，或是流量不夠的話’硏磨率 (polishing rate)會降低。且硏漿15的價格非常昂貴，硏磨 率太低的話，會更浪費硏漿15的用量。 有鑑於此，本發明提供一種化學機械硏磨機台’引進 一種改良的管件結構，其具有多個孔洞(hole)，可以大大增 加硏漿的輸送效率與均勻性，提高硏磨率。以及節省硏漿 的用量，減低製程的花費(cost)，並提高硏磨晶片表面之均 与度及平坦度。 爲完成本發明之目的，提供一種化學機械硏磨機台， 包括一硏磨台，以一方向旋轉。一硏磨墊’設於硏磨台上。 —晶片，置於硏磨墊上，此晶片具有背面與正面，而晶片 的正面與硏磨墊相接觸。一調節器，置於硏磨墊上，用以 4 本紙張尺度適用中國國家栋準（Cns ) A4规格（210X297公釐） ^1 ·- - I I - -1 ---ί I 1 ! - I - I - - !— l^i 0¾ 會 , » (請先閱讀背面之注意事項再填寫本頁) 3094twf.doc/006 A7 B7 五、發明説明（彡） 刮平硏磨墊的表面。一分送管，置於硏磨墊上方，分送管 未與硏磨墊相接觸，而分送管包括分送管柄與分送管面’ 且分送管面上具有多個孔洞，用以輸送硏漿至硏磨墊上， 孔洞的尺寸大小只要比硏漿的顆粒大即可，較佳的是約在 0.4-3mm之間’且孔洞开多狀無任何限制，可爲圓开多、橢圓 形、或是多角形等等。此外，還有一握柄，用以抓住晶片 的背面，將晶片的正面壓在硏磨墊上。以及一液栗，連接 於分送管的分送管柄上，用以將硏漿抽送到分送管中。其 中，順著硏磨台的旋轉方向，上述晶片、調節器與分送管 在硏磨台上的相對位置爲，依照分佈先後順序先是晶片、 再來是調節器，然後是分送管。上述在分送管面上的孔洞， 至少包括第一孔洞與第二孔洞，第一孔洞分佈於分送管面 上接近分送管柄處，而第二孔洞分佈於分送管面上且較第 一孔洞遠離分送管柄處，第二孔洞的直徑大於第一孔洞。 爲完成本發明之目的，提供另一種化學機械硏磨機 台，其具有另一種分送管結構。此分送管結構包括分送管 柄與分送管面兩部分，且分送管面上具有多個孔洞，用以 輸送硏漿至硏磨墊上，孔洞的尺寸大小只要比硏漿的顆粒 大即可，較佳的是約在〇.4-3mm之間，且其形狀無任何限 制，可爲圓形、橢圓形、或是多角形等等。與上述分送管 結構不同的是，在每個孔洞上還包括延伸管的結構，用以 使得硏漿可以有效率且均勻地輸送至硏磨墊上。上述延伸 管與該分送管面之間具有一傾斜角’使得延伸管的側視結 構會往硏磨墊的中心方向傾斜。 5 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） —裝-- 一 * - (請先閱讀背面之注項再填寫本頁)i} i J t) (JX 3094twf.doc / 006. „A7 ___ B7 V. Description of the invention (/) The present invention relates to a chemical-mechanical polishing (CMP) machine, and in particular A chemical mechanical honing machine with a porous dispensing tube. In semiconductor process technology, surface planarization is an important technique for processing high-density lithography, because there is no flat surface with high and low drop In order to avoid exposure scattering and achieve precise pattern transfer, there are two types of planarization techniques: spin-on glass (SOG) and chemical mechanical honing (CMP). After the process technology enters the sub-half-imcron, the spin-on glass method can no longer meet the required flatness, so the chemical mechanical honing technology is now the only one that can provide very large integrated circuits (Very-Large Scale Integration (VLSI), or even Ultra-Large Scale Integration (ULSI) process, a technology of "global planarization". Please also refer to Section 1A And FIG. 1B, which respectively show a top view and a side view of a conventional chemical mechanical honing machine table, which includes: a honing table 10 (polishing table); Honed wafer 12;-honing pad 13 (polishing pad), spread on the honing table 10; a tube 14 (tube) for conveying slurry 15 (slurry) to the honing pad 13;-liquid pump 16 for pumping the honing slurry 15 into the pipe 14; and a regulator 17 for smoothing the surface of the honing pad 13. When the chemical mechanical honing is performed, the honing table 10 and the grip The handle 11 is rotated in a certain direction, as shown by arrows 18a and 18b in the figure, and the handle 11 grasps the back surface 19 of the wafer 12, and presses the front surface 20 of the wafer 12 on the honing pad 13. The tube 14 3 (Please read the notes on the back first to fill in this book) i. Packing. This paper size is applicable to China National Standard (CNS) A4 (210X297 male f) 3094twf.doc / 006 A7 B7 Central Standards Bureau, Ministry of Economic Affairs Consumption cooperatives Yinfan V. Description of the invention (1) The mortar 15 driven by the liquid pump 16 is continuously supplied to the honing pad 13. Therefore, the 'chemical machine The honing process is to use the chemical assistant in the honing slurry 15 to generate a chemical reaction on the front surface 20 of the wafer 12 to form an easy honing layer, and then cooperate with the wafer 12 on the honing pad 13 through the honing slurry 15 Abrasive particles-assisted mechanical honing, honing the protruding part of the easy honing layer 'repeated the above chemical reaction and mechanical honing' can form a flat surface. Basically, the “chemical mechanical honing technology” is a flattening technology that uses the principle of mechanical polishing and “appropriate chemical agents (rea2ent) and honing grains” to undulate the contours of the surface. ” The disadvantage of the above-mentioned conventional chemical mechanical honing machine is that 'the efficiency of the tube 14 to input the slurry 15 to the honing pad 13 is too poor', and the slurry 15 is a key process parameter for controlling the chemical mechanical honing method. If the distribution of the slurry 15 on the honing pad 13 is not uniform, or if the flow rate is not sufficient, the 'polishing rate' will decrease. In addition, the price of the pulp 15 is very expensive. If the honing rate is too low, the amount of the pulp 15 will be wasted. In view of this, the present invention provides a chemical mechanical honing machine table, which introduces an improved pipe structure with multiple holes, which can greatly increase the efficiency and uniformity of the conveying of the slurry and improve the honing rate. It also saves the amount of honing paste, reduces the cost of the manufacturing process, and improves the uniformity and flatness of the honing wafer surface. In order to achieve the purpose of the present invention, a chemical mechanical honing machine table is provided, which includes a honing table and rotates in one direction. A honing pad is provided on the honing table. -A wafer, placed on a honing pad, the wafer having a back and a front side, and the front side of the wafer is in contact with the honing pad. A regulator, placed on the honing pad, for 4 paper sizes applicable to China National Standard (Cns) A4 (210X297 mm) ^ 1 ·--II--1 --- ί I 1!-I- I--! — L ^ i 0¾ Yes, »(Please read the precautions on the back before filling this page) 3094twf.doc / 006 A7 B7 V. Description of the invention (彡) Scraping the surface of the honing pad. A distribution tube is placed above the honing pad. The distribution tube is not in contact with the honing pad, and the distribution tube includes a distribution tube handle and a distribution tube surface, and there are multiple holes on the distribution tube surface. In order to convey the mortar to the honing pad, the size of the holes may be larger than the particles of the mortar. It is preferably about 0.4-3mm ', and there are no restrictions on the shape of the holes. Oval, or polygon, etc. In addition, there is a grip to hold the back of the wafer and press the front of the wafer against the honing pad. And a liquid chestnut, connected to the distribution pipe handle of the distribution pipe, for pumping the pulp to the distribution pipe. Among them, along the rotation direction of the honing table, the relative positions of the wafer, the regulator, and the distribution tube on the honing table are, in accordance with the distribution order, the wafer, the regulator, and the distribution tube. The above holes on the distribution pipe surface include at least a first hole and a second hole. The first holes are distributed on the distribution pipe surface near the distribution pipe handle, and the second holes are distributed on the distribution pipe surface. The first hole is far from the distribution pipe handle, and the diameter of the second hole is larger than the first hole. In order to accomplish the purpose of the present invention, another chemical mechanical honing machine is provided, which has another distribution pipe structure. The distribution pipe structure includes two parts, a distribution pipe handle and a distribution pipe surface, and the distribution pipe surface has a plurality of holes for conveying the mortar to the honing pad. The size of the holes is only larger than the particles of the mortar. That is, it is preferably about 0.4-3 mm, and the shape is not limited, and may be circular, oval, or polygonal. Different from the above-mentioned distribution pipe structure, each hole also includes a structure of an extension pipe, so that the slurry can be efficiently and uniformly transferred to the honing pad. There is an inclination angle 'between the extension tube and the distribution tube surface so that the side view structure of the extension tube will be inclined toward the center of the honing pad. 5 This paper size applies to China National Standard (CNS) A4 (210X297mm) — Packing-1 *-(Please read the note on the back before filling this page)
*1T ί k 經濟部中央標準局員工消費合作社印製 3094twf.doc/006 A7 3094twf.doc/006 A7 經濟部中央標準局員工消費合作社印製 B7 五、發明説明（>) 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下。 圖式之簡單說明： 第1A圖係繪示習知一種化學機械硏磨臺整體結構之 俯視圖； 第1B圖係繪示習知一種化學機械硏磨臺整體結構之 側視圖； 第2A圖係繪示本發明之一較佳實施例，一種化學機械 硏磨機台整體結構之俯視圖； 第2B圖係繪示本發明之一較佳實施例，一種化學機械 硏磨機台整體結構之側視圖； 第3A圖係繪示本發明之一較佳實施例，一種化學機械 硏磨機台中之分送管結構之俯視圖； 第3B圖係繪示本發明之一較佳實施例，一種化學機械 硏磨機台中之分送管結構之側視圖；以及 第4圖係繪示本發明之另一較佳實施例，一種化學機 械硏磨機台中之分送管結構之側視圖。 圖式之標記說明= 10.30 :硏磨台 11.31 :握柄 12.32 ：晶片 13.33 :硏磨墊 14 :管件 6 本紙張尺度通用中國囷家標準（CNS ) A4規格（210X297公釐） •m m ^^^1 I......'"^s, I...... n^— I 1^1 ^1« 0¾ 、T (請^閲讀背面之注意事項再填寫本頁) 3094twf.doc/006 A 7 B7 __ 五、發明説明（e) 15,35,54,63 :硏漿 16.36 :液泵 17.37 :調節器 19.39 :晶片的背面 20.40 :晶片的正面 34,55,65 :分送管 50,60 :管件柄 51，61 :管件面 53a，53b :孔洞 62 :延伸管 實施例 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項存填寫本頁) 本發明的特徵在於，對習知的管件結構作一改良，使 得其具有扁平的管面，且在管面上還具有多個孔洞(hole)。 孔洞的尺寸大小只要比硏漿的顆粒大即可，較佳的是約在 0.4-3mm之間，且其形狀無任何限制，可爲圓形、橢圓形、 或是多角形等等。本發明此種管件結構，可以大大增加硏 漿的輸送效率與均勻性，提高硏磨率。以及節省硏漿的用 量，減低製程的花費(cost)，且提高硏磨晶片表面之均勻度 及平坦度。 請同時參照第2A圖與第2B圖，其係繪示本發明之一 較佳實施例，一種化學機械硏磨機台整體結構之俯視圖與 側視圖。其中包括：一硏磨台30(polishing table); —握柄 31(holder)，用以抓住被硏磨的晶片32 ;—硏磨墊 33(polishingpad)，舖在硏磨台 30 上；一分送管 34(dispensing 7 本紙乐尺度適用中國國家標準（CNS ) A4現格（210X297公釐） 3094twf.doc/006 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（6) tube) ’用以輸送硏漿35(slurry)到硏磨墊33上，其置於硏 磨墊33上方，且未與硏磨墊33相接觸；在分送管34上具 有許多的孔洞34a ’可以使得硏漿35更有效率且均勻地輸 送到硏磨墊33上；一液泵36，用以將硏漿35抽送到分送 管34中’以及一調節器37(conditioner)，置於硏磨塾33上， 用以刮平硏磨墊33的表面，除去硏磨完餘留在硏磨墊33 的雜質，調節器37的材料例如爲硬度較高的鑽石。 當進行化學機械硏磨時，硏磨台30與握柄31分別沿 —定的方向旋轉，如圖中之箭號38a與38b所示，順著硏 磨台33的旋轉方向38a，晶片32、調節器37與分送管34 在硏磨台30上的相對位置例如爲，依照分佈先後順序先是 晶片32、再來是調節器37，然後是分送管34，此爲本發明 的特徵之一’目的用以改進分送管34的輸送效率，讓輸入 的硏漿35能直接被晶片32所利用，然後才經過調節器37 的處理’因此硏漿35不會積存在調節器37上，而能夠節 省硏漿35的使用量。 上述握柄31抓住晶片32的背面39,將晶片32的正面 40壓在硏磨墊33上。分送管34係將液泵36所打進來的硏 漿35，持續不斷地供應到硏磨墊33上。所以，化學機械 硏磨程序就是利用硏漿35中的化學助劑，在晶片32的正 面40上產生化學反應，使之形成一易硏磨層，再配合晶片 32在硏磨墊33上藉由硏漿35中之硏磨粒(abrasive particles) 輔助之機械硏磨，將易硏磨層之凸出部份硏磨；反覆上述 化學反應與機械硏磨，即可形成平坦的表面。若各製程參 8 本紙張尺度適用中國國家標芈（CNS ) A4規格（210X297公釐） ---------¾衣------、耵 » (請先閲讀背面之注意事項再填寫本頁} A7 3 094twf.doc/006 ______B7 五、發明説明（T) 數控制得宜，例如硏漿的均勻性與用量即是關鍵的製程參 數，化學機械硏磨法可以提供被硏磨表面高達94%以上的 平坦度。分送管34結構設計爲本發明的重要特徵，可用以 控制硏漿的均勻性與用量，詳細結構描述如下。 請參照第3A圖與第3B圖，其係繪示在化學機械硏磨 機台中之分送管55結構之俯視圖與側視圖。此分送管55 置於硏磨墊(未顯示)上方，其包括分送管柄50與分送管面 51兩部分，在分送管面51上具有多個孔洞53a或53b，用 以輸送硏漿54至硏磨墊上。其中，硏漿54沿著方向52由 分送管柄50流到分送管面51。孔洞53a或53b的尺寸大小 只要比硏漿54的硏磨顆粒大即可，例如約在〇.4-3mm之 間。且孔洞53a或53b的分佈密度與形狀沒有限制，可以 爲任意幾何圖形，例如圓形、橢圓形、三角形、長方形或 多角形均可。此外，孔洞53a或53b的尺寸大小可以相同， 亦可以不同，舉例來說，孔洞53a的直徑爲D1，其分佈於 分送管面51上接近分送管柄50處。而孔洞53b的直徑爲 D2,分佈於分送管面51上且較孔洞53a遠離分送管柄50， 其直徑D2大於孔洞53a的直徑D1。此種不同孔洞尺寸的 考量(例如D1與D2兩種直徑），是基於流體力學的考慮’ 其需經過一些更精密的計算才能決定。孔洞53a的直徑D1 較小，是因爲接近分送管柄50處的硏漿流速較快，且流量 較大。而孔涧53b的直徑爲D2較大’是因爲接近分送管柄 50處的硏漿流速較慢，且流量較小之故。 接著，請參照第4圖，其係繪示本發明之另一較佳實 9 -n I I I 1^1 n - *^I I —. . 丁 、-'° f - (請先閱讀r面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 本紙張尺度通用中國國家標準（CNS 規格（210X297公釐） 3〇94t、 'f.doc/006 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（公） 施例，一種化學機械硏磨機台中之分送管65結構之側視 圖。其中，分送管65包括分送管柄60與分送管面61兩部 分’硏漿63沿著方向64由分送管柄60流到分送管面61。 且在分送管面61上具有多個延伸管62，用以使得硏漿63 可以有效率且均勻地輸送至硏磨墊(未顯示）上。可以看到 的是，在延伸管62與分送管面61之間具有一傾斜角Θ，例 如爲一鈍角，使得延伸管62的側視結構會往硏磨墊的中心 方向傾斜。 綜上所述，本發明所提出的化學機械硏磨機台，具有 以下的特點： (1) 本發明所提出的分送管55結構，可以大大增加硏漿 的輸送效率與均勻性，提高硏磨率，且提高硏磨晶片表面 之均勻度及平坦度。 (2) 本發明所提出的分送管55結構，可以節省硏漿的用 量’減低製程的花費(cost)。 (3) 本發明還提出另一種的分送管65結構，彈性的搭配 與運用延伸管結構，亦可以達到一樣的功效。 綜上所述’雖然本發明已以二較佳實施例揭露如上， 然其並非用以限定本發明，任何熟習此技藝者，在不脫離 本發明之精神和範圍內，當可作各種之更動與潤飾，因此 本發明之保護範圍當視後附之申請專利範圍所界定者爲 準。 "、、 n I n I n n I I n n I —i I - I 丁 -11 - · - (锖先閱tt.背面之注意事項再填离本頁)'* 1T k Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Printed 3094twf.doc / 006 A7 3094twf.doc / 006 A7 Printed by the Consumers Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Printed B7 V. INTRODUCTION (>) The above and other objects, features, and advantages can be more clearly understood. A preferred embodiment is given below in conjunction with the accompanying drawings for detailed description as follows. Brief description of the drawings: FIG. 1A is a plan view showing the overall structure of a conventional chemical mechanical honing table; FIG. 1B is a side view showing the overall structure of a conventional chemical mechanical honing table; A top view of the overall structure of a chemical mechanical honing machine table is shown in a preferred embodiment of the present invention; FIG. 2B is a side view of the overall structure of a chemical mechanical honing machine table in a preferred embodiment of the present invention; Figure 3A shows a preferred embodiment of the present invention, a top view of a distribution pipe structure in a chemical mechanical honing machine table; Figure 3B shows a preferred embodiment of the present invention, a chemical mechanical honing A side view of the distribution pipe structure in the machine; and FIG. 4 is a side view showing a distribution pipe structure in a chemical mechanical honing machine according to another preferred embodiment of the present invention. Explanation of markings on the drawing = 10.30: Honing table 11.31: Handle 12.32: Wafer 13.33: Honing pad 14: Tube 6 The paper size is in accordance with the Chinese Standard (CNS) A4 (210X297 mm) • mm ^^^ 1 I ...... '" ^ s, I ...... n ^ — I 1 ^ 1 ^ 1 «0¾, T (Please read the notes on the back and fill in this page) 3094twf.doc / 006 A 7 B7 __ V. Description of the invention (e) 15, 35, 54, 63: slurry 16.36: liquid pump 17.37: regulator 19.39: back of the wafer 20.40: front of the wafer 34, 55, 65: distribution tube 50,60: Fitting handles 51, 61: Fitting surfaces 53a, 53b: Holes 62: Extension tube examples Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back and fill in this page) Features of the invention The improvement is that the conventional pipe structure is improved so that it has a flat pipe surface and has multiple holes on the pipe surface. The size of the pores is only required to be larger than the size of the pulp, and it is preferably about 0.4-3mm, and the shape is not limited, and may be circular, oval, or polygonal. The pipe fitting structure of the present invention can greatly increase the efficiency and uniformity of honing slurry and improve honing rate. And save the amount of honing paste, reduce the cost of the process, and improve the uniformity and flatness of the honing wafer surface. Please refer to FIG. 2A and FIG. 2B together, which show a top view and a side view of the overall structure of a chemical mechanical honing machine, which is a preferred embodiment of the present invention. These include: a honing table 30 (polishing table);-a handle 31 (holder) for holding the honed wafer 32;-honing pad 33 (polishing pad), spread on the honing table 30; Distributing tube 34 (dispensing 7 This paper scale is applicable to Chinese National Standards (CNS) A4 is present (210X297 mm) 3094twf.doc / 006 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention (6) tube ) 'It is used to convey the slurry 35 (slurry) to the honing pad 33, which is placed above the honing pad 33 and is not in contact with the honing pad 33; there are many holes 34a in the distribution pipe 34' Make the mortar 35 more efficiently and uniformly delivered to the honing pad 33; a liquid pump 36 for pumping the mortar 35 into the distribution pipe 34 'and a conditioner 37 placed in the honing The honing pad 33 is used to scrape the surface of the honing pad 33 to remove impurities remaining on the honing pad 33 after honing. The material of the adjuster 37 is, for example, a diamond with high hardness. When performing chemical mechanical honing, the honing table 30 and the handle 31 are respectively rotated in a predetermined direction, as shown by arrows 38a and 38b in the figure. Following the rotation direction 38a of the honing table 33, the wafer 32, The relative position of the regulator 37 and the distribution pipe 34 on the honing table 30 is, for example, according to the distribution order, the wafer 32, the regulator 37, and then the distribution pipe 34. This is one of the features of the present invention. 'The purpose is to improve the conveying efficiency of the distribution pipe 34 so that the input slurry 35 can be directly used by the wafer 32 and then processed by the regulator 37'. Therefore, the slurry 35 will not accumulate on the regulator 37, and It is possible to save the use amount of the slurry 35. The grip 31 grasps the back surface 39 of the wafer 32, and presses the front surface 40 of the wafer 32 against the honing pad 33. The distribution pipe 34 continuously supplies the mortar 35 driven by the liquid pump 36 to the honing pad 33. Therefore, the chemical mechanical honing process is to use the chemical assistant in the honing slurry 35 to generate a chemical reaction on the front surface 40 of the wafer 32 to form an easy honing layer, and then cooperate with the wafer 32 on the honing pad 33 by The mechanical honing assisted by the abrasive particles in the slurry 35 hones the protruding portion of the easy honing layer; by repeating the above-mentioned chemical reaction and mechanical honing, a flat surface can be formed. If each process refers to 8 paper sizes, the Chinese national standard (CNS) A4 size (210X297 mm) --------- ¾ clothing ------, 耵 »(Please read the note on the back first Please fill in this page again for the matter} A7 3 094twf.doc / 006 ______B7 V. Description of the invention (T) The number should be controlled properly. For example, the uniformity and amount of the pulp are the key process parameters. The chemical mechanical honing method can provide honing. The flatness of the surface is above 94%. The structural design of the distribution pipe 34 is an important feature of the present invention, which can be used to control the uniformity and dosage of the mortar. The detailed structure is described below. Please refer to Figures 3A and 3B. Top view and side view of the structure of the distribution pipe 55 in the chemical mechanical honing machine table. This distribution pipe 55 is placed above the honing pad (not shown) and includes a distribution pipe handle 50 and a distribution pipe surface 51 In two parts, there are a plurality of holes 53a or 53b on the distribution pipe surface 51 for conveying the mortar 54 to the honing pad. Among them, the mortar 54 flows from the distribution pipe handle 50 to the distribution pipe surface in the direction 52. 51. The size of the holes 53a or 53b may be larger than the honing particles of the pulp 54, for example, about 0.4-3 mm. And the distribution density and shape of the holes 53a or 53b are not limited, and can be any geometric figure, such as circle, oval, triangle, rectangle or polygon. In addition, the size of the holes 53a or 53b can be the same. It can be different. For example, the diameter of the holes 53a is D1, which is distributed on the distribution pipe surface 51 near the distribution pipe handle 50. The diameter of the holes 53b is D2, which is distributed on the distribution pipe surface 51 and is more holes. 53a is far away from the distribution pipe handle 50, and its diameter D2 is larger than the diameter D1 of the hole 53a. The consideration of this different hole size (such as the two diameters of D1 and D2) is based on the consideration of fluid mechanics', which requires some more precise calculations The diameter D1 of the hole 53a is smaller because the slurry flowing near the distribution pipe handle 50 has a faster flow rate and a larger flow rate. The diameter of the hole 53b is larger because the diameter D2 is closer to the distribution pipe handle. The flow rate of the pulp at 50 places is relatively slow and the flow rate is small. Next, please refer to FIG. 4, which shows another preferred embodiment of the present invention 9 -n III 1 ^ 1 n-* ^ II —. Ding,-'° f-(Please read the notes on r side before filling Page) Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Common Paper National Standards (CNS Specifications (210X297 mm) 3094t, 'f.doc / 006 A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economics Explanation of the invention (public) Example, a side view of the structure of a distribution pipe 65 in a chemical mechanical honing machine table. Among them, the distribution pipe 65 includes a distribution pipe handle 60 and a distribution pipe surface 61. Flows from the distribution pipe handle 60 to the distribution pipe surface 61 in the direction 64. Moreover, a plurality of extension pipes 62 are provided on the distribution pipe surface 61, so that the slurry 63 can be efficiently and uniformly transferred to the honing pad (not shown). It can be seen that there is an inclination angle Θ between the extension tube 62 and the distribution tube surface 61, such as an obtuse angle, so that the side view structure of the extension tube 62 will be inclined toward the center of the honing pad. In summary, the chemical mechanical honing machine table proposed by the present invention has the following characteristics: (1) The structure of the distribution pipe 55 proposed by the present invention can greatly increase the efficiency and uniformity of the slurry delivery and improve the Grinding rate, and improve the uniformity and flatness of the honing wafer surface. (2) The structure of the distribution pipe 55 proposed in the present invention can save the amount of pulp and reduce the cost of the process. (3) The present invention also proposes another structure of the distribution pipe 65. The elastic combination and the use of the extension pipe structure can also achieve the same effect. To sum up, 'Although the present invention has been disclosed in the above two preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes without departing from the spirit and scope of the present invention. And retouching, so the scope of protection of the present invention shall be determined by the scope of the attached patent application. " ,, n I n I n n I I n n I —i I-I ding -11-·-(锖 Please read tt. Note on the back before filling out this page) '