TW379365B - Probe-test method and prober - Google Patents
Probe-test method and prober Download PDFInfo
- Publication number
- TW379365B TW379365B TW087111063A TW87111063A TW379365B TW 379365 B TW379365 B TW 379365B TW 087111063 A TW087111063 A TW 087111063A TW 87111063 A TW87111063 A TW 87111063A TW 379365 B TW379365 B TW 379365B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- mounting table
- distance
- aforementioned
- terminal
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
本發明所屬之技術領域 本發明係有關於一種探針測試方法及探針袭置。更詳 細而呂，係有關於-種測定被檢查體之電氣特性之探針測 ，及探針裝置。該裝置之典型例為測定形成在半導體 曰曰圓（以下，稱為晶圓）上之積體電路s(以下， 的電氣特性之探針裝置’但，本發明並不限定,，, 乃有關於探針測試為可存之種種的電子組件、電子機器用 之探針裝置。 ° 習知技藝 將IC晶片作成對稱之習知的探針裝置例表示在第6圖 -亥探針裝置1 〇具備收納在卡匣c内之 取出並搬送之裝貨室u，從該裝貨室_搬送之= 受檢查之探測器室12，控制該探測器室12及裝貨室〗1之控 制器13 ’以及兼有操作該控制器13之操作盤的顯示裝置14 在上述裝貨室11，於旋轉軸裝，著從卡匣C内搬送晶 圓W用之小失子。該小失子i 5在水平方向伸縮之同時由 於可作正逆旋轉，乃可使卡匣c内之晶圓…每次丨 J並搬送至探測器室12。在小夾子15之近傍，有配設前置 調整晶圓W用之副卡盤16。該副卡盤16乃從小夾子15受取 晶圓W，而在0方向正逆旋轉，並以晶圓w之定向平面作 為基準而作對晶圓w前置調整。 在上述探針器室12，設有載置晶圓貨之載置台（main chuck)17、調整裝置20及探針卡。該載置台17，依χ，γ 五、發明説明（2 ) 同時，由所内藏之 工作台（18’ 19)可在χ、γ方向移動 驅動機可移動於Ζ及0方向。 該調整裝置20，具備具有攝影晶圓W之第丨攝影裝置 (CCD攝影機等）21之調整電橋22，該調替電橋如有欲在 Υ方向經復移動用之1對的引導軌道23、以及附設在引導 軌23與載置台17之第2攝影裝置(未圖示，ccd攝影機等、 在該探針卡之上面，設有測試頭（未圖示），兩者介著 連接環（未圖示）作電氣性連接。從測試器輸出之測試信號 ，介著測試頭、連接環、及探針卡之探針端子（㈣^啦傳 送至1c晶片之電極s，同時，從1C晶片所輸出之測試結果 的信號’以相逆之經路傳回至測試器。該測試器就以該測 試結果之信號為根基，而測定1(:晶片之電氣特性。 於檢查晶圓W之場合，在裝貨室u，小夾子15 EC沒取出1月晶圓w。當晶圓w搬送至探測器化之間， 於Μ卡盤16作别置調整之後，就移今至探測器室12内之載 置台17。調整電橋22移動在載置台17之上方，而晶圓腎 動至其第1攝影裝置21之下方，第成影裝置21及載置台η 侧之第2攝影裝置，就協同動作進行載置台17上之晶圓W 的調整。其後’載置台17在每次檢查時就移動於X、Υ方 向’而將晶圓W作指示傳送。載置台Π上昇於Ζ方向，而 將探針端子接觸於晶圓w之後，載置㈢更過度㈣於z 方向而將探針端子以電氣性接觸於形成在晶圓W上之IC 曰曰片之電極75檢查該IC晶片之電氣特性。於晶 A7 B7 五、發明説明（3 ) ' 8英叶之晶圓W之場合，如在第7(a)圊所示，由於栽置二^ 被過度驅動，使載置於載置台之晶圓 位置上昇至實線之位置的狀態下，晶圓該圖實線所示 幾乎不傾斜而為水平狀態。此時，探針卡24之探針端子Μ 乃被彈力從該圖（a)之-點假想線的位置抬高至實線之位 置，而其針端就從粗線之起點s移動至終點E。、:以:平面性， 觀看該狀態，即如該圖_(b)之斜線箭頭所示探針端子之 前端的移動距離為起點S至終點E，但，探針端子之前端. 乃在1C晶片之電極端腳p内，因此，探針端子24八乃維持 與電極端部之接觸。若晶圓尺寸增大，例如，為12英忖， 即，不僅晶圓尺寸加大，而IC晶片亦作超微細加工，並且 ，電極端腳間之節距亦變為狹窄。由於此，探針長之探針 端子數就增加，例如，達到約2〇〇〇針。在過度驅動時，從 全探針端子24A作用於載置台17之荷重就變大，例如，變 為十幾Kg〜20Kg。晶圓W經過度驅動，而從第8(a)圖之一 點假想線的位置上昇至實線之位置由於上述荷重使支 撐載置台17之轴（未圖示）f曲，而晶_如該圖之__ 示，例如，約傾斜20〜3〇/zm。由於該傾斜’晶圓w就自 本來之上昇位置向外側傾斜。此時，探針端子24八之探針 端子的前端乃因彈性從該圖（a)之一點假想線之位置抬高 至實線之位置，而比第7圖所示之場合移動較長距離（以第 8(b)圖之斜線的箭頭）。此時之探針端子的前端，雖其起 點s與於第7圖所示之場合為同一位置’但，其終，即 如第8(b)圖所示，乃達到電極端腳p之外的位置，而有探 本紙張尺度it财國國家標準（CNS )八4聽·（ 210X297公釐） (請先閲讀背面之注意事項存填寫本 •等 經濟部中央標準局貝工消費合作社印製 • I —^1 -6- 五、發明説明（4 針端子之前端從電極端腳p備出之虞。若備出，即， 針端子24A就不能傳送測試信號至電極端腳p，而 之信賴度受損。 — 本發明之目的 、因鐘於上述課題，本發明乃欲提供探針端子破實能與 被檢查雜之電極制，而可進行高信賴度（可録)之檢查 的探針測試方法及探針袭置，為目的。 訂 又，本發明係欲提供將載置被檢查體之載置.台向著探 針端子上昇，而將被檢查體接觸於探針端子之時，由從探 針端子s之接觸壓力而使該載置台傾斜。由於該傾斜，乃 使刚述探針端子與前述被檢查體之電極5的接觸位置移動 。依據各種資訊預測該移動之距離（以下，稱為「移動距 離」），再予修正，使探針端子確實能與被檢查體之電極 接觸，而可進行高信賴度之檢查的探針測試方法及探針裝 置，為目的。 又’本發明係欲提供將載置台正確於X，Y及Z方向作 過度驅動之探針測試方法及探針裝置，為目的。 經濟部中央標準局員工消費合作社印製 解決課題之本發明的探針測試方法及探針裝置 依照本發明之第丨觀點，提供探針測試方法。 其具有將被檢查體載置在於X、Y、Z及<9方向為移動 可能之載置台；於固定在該載置台之上方位置的探針端子 s ’將該載置台作位置對正；將該載置台向該探針端子上 昇而使被檢查體接觸於探針端子；以及檢查該被檢查體之 電氣特性的工程s之探針測試方法上，將該載置台向著探 -7- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 五'、發明説明（5 A7 B7 經濟部中央樣準局員工消費合作社印製 针端子上昇’使被檢查體接觸於探針端子而言，載置在該 載置台之β衾被檢查體與該探針端子接觸之時，由於該載置 台會傾斜，是故，乃依據所定之資料預測該探針端子所應 接觸之該載置台上的位置，於X、γ及ζ方向之移動距離； 並欲予減少該所預測之移動距離，而演算修正距離以期修 正最少於該載置台之X、γ及ζ方向的一個位置、及以該修. 正距離為根基’而決定奴使該載置台所予上昇之位置的工 程，為其特徵。 又，依照本發明之第2觀點提供探針測試方法，其係 在依照上述第1觀點之探針測試方法上，再具備判定於該 移動距離及前述修正距離中最少有一種的距離是否適宜， 為其特徵。 又，依照本發明之第3觀點提供探針測試方法，其係 在依照上述第1觀點之探針測試方法上，該所定之資料乃 含有對該載置台有關之資料（s)，對該被檢查體有關之資 料（s)，以及對該探針端子有關之資_(s)，為其特徵。 又，依照本發明之第4觀點提供探針測試方法，其係 具備將被檢查體載置在於X、Y、Z及0方向為移動可能之 載置台；而對固定在該載置台之上方位置的探針端子S， 將該載置台作位置對正；並將該載置台向探針端子上昇， 而將被檢查體接觸於探針端子；以及檢查該被檢查體之電 氣特性的各工程之探針測試方法上，對於將該載置台向探 針端子上昇’使被檢查體接觸於探針端子而言，尚具有於 載置在該載置台之該被檢查體接觸於探針端子之時，由於 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨0X297公釐） (請先閲讀背釕之注意事項再填寫本頁} -裝· 訂 線TECHNICAL FIELD The present invention relates to a probe testing method and probe placement. More detailed and detailed, it is about a probe measurement for measuring the electrical characteristics of the object under inspection, and a probe device. A typical example of this device is a probe device for measuring the integrated circuit s (hereinafter, the electrical characteristics) formed on a semiconductor circle (hereinafter, referred to as a wafer). However, the present invention is not limited to this. Various types of electronic components and probe devices for electronic devices that can be stored in the probe test are shown in Fig. 6-Example of a conventional probe device in which the IC chip is made symmetrical. There is a loading room u taken out and transported in the cassette c, and from this loading room _ transported = inspected detector room 12, the controller 13 that controls the detector room 12 and the loading room 1 'And a display device 14 which also operates an operation panel of the controller 13 is mounted in the loading chamber 11 on a rotating shaft, and is used for transporting a wafer W from a cassette C. The small lost carrier i 5 Because it can be rotated in the forward and reverse directions while being horizontally retracted, the wafers in the cassette c can be transported to the detector chamber 12 each time. Near the small clip 15, there is a front adjustment crystal. Sub-chuck 16 for circle W. This sub-chuck 16 receives wafer W from small clamp 15 and rotates in the positive and negative directions in the direction of 0. The wafer w is pre-adjusted with the orientation plane of the wafer w as a reference. The prober chamber 12 is provided with a main chuck 17 on which the wafer goods are placed, an adjustment device 20 and a probe card. The mounting table 17, according to χ, γ V. Description of the invention (2) At the same time, the built-in worktable (18 '19) can be moved in the χ and γ directions, and the driver can be moved in the Z and 0 directions. The adjusting device 20, equipped with an adjustment bridge 22 having a first photographing device (CCD camera, etc.) 21 of the photographic wafer W, and a pair of guide rails 23 for the alternate bridge to be repeatedly moved in the Υ direction, and attached A second imaging device (not shown, ccd camera, etc.) on the guide rail 23 and the mounting table 17 is provided with a test head (not shown) on the probe card, and a connection ring (not shown) is provided between the two. ) For electrical connection. The test signal output from the tester is transmitted through the test head, connection ring, and probe terminals of the probe card (㈣ ^ 啦 to the electrode s of the 1c chip, and at the same time, the output from the 1C chip The signal of the test result is passed back to the tester through the inverse path. The tester ends with the test result. The signal of the result is the basis, and the measurement of 1 (: the electrical characteristics of the wafer. In the case of inspecting the wafer W, in the loading room u, the small clip 15 EC does not take out the wafer w in January. When the wafer w is transferred to the detector After the adjustment, after the M chuck 16 is adjusted separately, it is moved to the mounting table 17 in the detector chamber 12. The adjustment bridge 22 is moved above the mounting table 17 and the wafer kidney moves to its first photograph. Below the device 21, the second imaging device 21 and the second imaging device on the mounting table η coordinate the adjustment of the wafer W on the mounting table 17. Then, the 'mounting table 17 moves at each inspection X, Υ direction 'and convey the wafer W as an instruction. The mounting table Π is raised in the Z direction, and after the probe terminal is brought into contact with the wafer w, the mounting ㈣ is more excessively placed in the z direction and the probe terminal is electrically connected. An electrode 75 which is sexually brought into contact with an IC chip formed on the wafer W is checked for electrical characteristics of the IC chip. In the case of crystal A7 B7 V. Description of the invention (3) '8-inch wafer W, as shown in Section 7 (a) (ii), because the placement 2 is driven excessively, the wafer placed on the mounting table is overdriven. In a state where the circle position is raised to the position of the solid line, the wafer shown in the solid line of the figure is hardly inclined and is horizontal. At this time, the probe terminal M of the probe card 24 is raised by the elastic force from the position of the imaginary line at the point (a) in the figure to the position of the solid line, and the needle end moves from the start point s to the end point of the thick line. E. : View the state as: planarity, that is, the moving distance of the front end of the probe terminal as shown by the slanted arrow in the figure _ (b) is the starting point S to the end E, but the front end of the probe terminal. It is on the 1C chip In the electrode terminal pin p, the probe terminal 248 is maintained in contact with the electrode end portion. If the wafer size increases, for example, it is 12 inches, that is, not only the wafer size increases, but the IC wafer is also ultra-fine processed, and the pitch between the electrode terminals becomes narrow. Due to this, the number of probe terminals with a longer probe length increases, for example, to about 2,000 pins. In the case of excessive driving, the load applied to the mounting table 17 from the full probe terminal 24A becomes large, for example, it is more than ten kilograms to 20 kilograms. The wafer W is driven by degrees, and rises from the position of the imaginary line to the position of the solid line at one point in FIG. 8 (a). As a result of the above load, the axis (not shown) of the supporting table 17 is curved, and Figure __ shows, for example, about 20 to 30 / zm tilt. Due to this inclination, the wafer w is inclined outward from the original rising position. At this time, the front end of the probe terminal of the probe terminal 24 is raised from the position of the imaginary line at one point in the figure to the position of the solid line due to elasticity, and has moved a longer distance than that shown in FIG. 7. (Indicated by the arrow in the oblique line in Figure 8 (b)). The front end of the probe terminal at this time, although the starting point s is the same position as in the case shown in Fig. 7, but the end, as shown in Fig. 8 (b), reaches beyond the electrode terminal p. The paper size is based on the paper standard. It is a national standard (CNS) of the country. It is 8 to 4 (210X297 mm) (Please read the precautions on the back and fill out this. • Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative. • I — ^ 1 -6- V. Description of the invention (the front end of the 4-pin terminal may be prepared from the electrode terminal p. If it is prepared, that is, the pin terminal 24A cannot transmit the test signal to the electrode terminal p, and Reliability is impaired. — The purpose of the present invention is due to the above-mentioned problems. The present invention is intended to provide a probe terminal that can be broken and an electrode system that can be inspected, and can perform high-reliability (recordable) inspection. The purpose of the present invention is to provide a method for placing a test object on a probe terminal while the test object is in contact with the probe terminal. The mounting table is tilted by the contact pressure from the probe terminal s. Because of the tilt, The contact position of the probe terminal and the electrode 5 of the object to be inspected has just been described. The distance of the movement (hereinafter referred to as "moving distance") is predicted based on various information, and then corrected so that the probe terminal can indeed be inspected. The purpose is to provide a probe test method and probe device capable of performing high-reliability inspection by contacting the electrodes of the body. The present invention also intends to provide a probe that excessively drives the mounting table in the X, Y, and Z directions. The test method and the probe device are for the purpose. The probe test method and the probe device of the present invention printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs to solve the problem provide a probe test method according to the first aspect of the present invention. The object to be inspected is placed on a mounting table in which directions X, Y, Z, and < 9 are possible for movement; a probe terminal s' fixed at a position above the mounting table is used to align the mounting table; The mounting table is raised toward the probe terminal so that the object to be contacted with the probe terminal; and the probe test method of the project s for inspecting the electrical characteristics of the object, the mounting table is directed toward the probe -7- Paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm). Fifth, the description of invention (5 A7 B7 The printed pin terminal of the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs printed needle terminal rises) to make the test object contact the probe terminal. In other words, when the β 衾 test object placed on the mounting table is in contact with the probe terminal, the mounting table may be tilted, so the mounting table to which the probe terminal should be contacted is predicted based on predetermined data. And the movement distances in the X, γ, and ζ directions; and to reduce the predicted movement distance, and calculate the correction distance in order to correct a position that is at least less than the X, γ, and ζ directions of the mounting table, and This repair is based on the feature that the positive distance is the basis and determines the position to which the mounting table is raised. In addition, a probe test method is provided according to the second aspect of the present invention, which is based on the first aspect described above. The probe test method is further characterized by determining whether a distance of at least one of the moving distance and the aforementioned correction distance is appropriate. In addition, a probe test method according to the third aspect of the present invention is provided in the probe test method according to the first aspect described above, and the predetermined data includes data (s) related to the mounting table, and The information (s) related to the inspection body and the information (s) related to the probe terminals are its characteristics. According to a fourth aspect of the present invention, a probe test method is provided. The probe testing method includes a mounting table on which the test object is placed in the X, Y, Z, and 0 directions, and is movable. The probe terminal S, the position of the mounting table is aligned; the mounting table is raised toward the probe terminal, and the test object is brought into contact with the probe terminal; In the probe test method, when the mounting table is raised toward the probe terminal and the test object is brought into contact with the probe terminal, there is still a time when the test object placed on the mounting table is in contact with the probe terminal. As this paper size applies Chinese National Standard (CNS) A4 specification (2 丨 0X297 mm) (Please read the precautions for back ruthenium before filling this page}
• In I 1 I · A7 B7 經濟部中央標隼局貝工消費合作社印製• In I 1 I · A7 B7 Printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs
Z 五、發明説明（6 ) 該載置台之傾斜，乃依據所定之資料預測該探針端子所應 接觸的該載置台上之位置’於X、Y及z方向之移動距離； 並欲予減少該所預測之移動距離，乃演算修正距離以最少 修正在該載置台之X、Y及Z方向之中的任一位置；同時， 考慮該修正距離而決定該載置台之上昇位置，以及已分為 多數步驟而將該載置台上昇至上述所決定之位焉的工程， 為其特徵。 又’依照本發明之第5觀點提供探針測試方法，其係 於依照上述第4觀點之探針測試方法上，尚具備判定前述 移動距離及前述修正距離之中’最少有一距離是否為適宜 ’為其特徵。 又，依照本發明之第6觀點提供探針測試方法，其係 在依照上述第4觀點之探針測試方法上，該載置台之上昇 於X方向、Y方向及Z方向之每一方向，最少以—個步驟而 依序實施’為其特徵。 又，依照本發明之第7觀點提#探針裝置。其在具備 探測器室·，固定在該探測器室上部之探針端子s;配置在 該探針端子s之下方，並且，載置被檢查體而於χ、Y' 及Θ方肖為移動可能之載置台；卩及將該探針端子3與該 破檢查體作位置對正，而控制該載置台之上昇使該被檢查 體接觸於該探針端子s的控制該載置台之移動用的^器 之探針裝置而言，該控制器係用於控制該載置台之上昇： 使該被檢查體接觸於該探針端子s之系統上，尚具有：載 置在該載置台之該被檢查體接觸於該探針端子之時，由於 ----------^------、玎一------線 (請先閲讀背*'之注項再填寫本頁}Z V. Description of the invention (6) The inclination of the mounting platform is based on the predetermined data to predict the movement distance of the position on the mounting platform that the probe terminal should contact in the X, Y, and z directions; and it is intended to reduce The predicted moving distance is calculated by correcting the distance to at least correct any one of the X, Y, and Z directions of the mounting platform; at the same time, considering the correction distance to determine the rising position of the mounting platform, and the divided position The process of raising the mounting table to the position determined as described above for many steps is characteristic. It also provides a probe test method according to the fifth aspect of the present invention, which is based on the probe test method according to the fourth aspect, and has a method for determining whether at least one of the moving distance and the correction distance is appropriate. For its characteristics. In addition, according to a sixth aspect of the present invention, a probe test method is provided. In the probe test method according to the fourth aspect, the mounting table is raised in each of the X direction, the Y direction, and the Z direction, at least. It is characterized by one step and sequential implementation. The #probe device is provided according to the seventh aspect of the present invention. It includes a detector chamber, a probe terminal s fixed on the upper part of the detector chamber; it is arranged below the probe terminal s, and the object to be inspected is placed to move between χ, Y ', and Θ. Possible mounting table; and aligning the probe terminal 3 with the broken inspection body, and controlling the ascent of the mounting table to bring the object under inspection to the probe terminal s to control the movement of the mounting table As for the probe device of the electronic device, the controller is used to control the ascent of the mounting table: the system for contacting the object to be inspected with the probe terminal s also has: When the object under inspection comes into contact with the probe terminal, due to the ---------- ^ ------, the first ------ line (please read the note on the back * 'first) Fill out this page again}
五、發明説明（7 ) 該载置台之傾斜，乃依據所定之資料預測該探針端子所應 接觸之該被檢查體之位置於X、γ及Z方向之移動距離；並 欲予減少該所預測之移動距離，乃演算修正距離以期最少 亦修正於該載置台之X、Y及z方向之一個位置；以及考慮 該修正距離而決定該載置台之上昇位置的系統，為其特徵 〇 .- V ' ·' 又，依照本發明之第8觀點提供探針裝置。其在依照 上述第7觀點之探針裝置上，該系統具備記憶以有關該載 置台之資料與有關上述被檢查體之資料及有關該探針端子 之資料的記憶體；依據記憶在該記憶體之資料s，而求出 該移動距離之第1演算裝置（operati〇n unit);以該第}演算 裝置之演算結果為根據，而為減少論移動距離乃求出修正 距離以最少亦修正該載置台之x、丫及2方向中之一個位置 的第2演算裝置；以及判定於該第丨演算 該第2演算製置之演算結果中最少有一演算結果 宜之判定裝置’為其特徵。 又，依照本發明之第9觀點提供探針裝置，其在依照 上述第7觀點之探針裝置上，該控制器尚具備判定於該第’γ 演算裝置之演算結果及該第2演算裝置之演算結果中最少 有-演算結果是否為適宜之判定裝置，為其特徵。 又，依照本發明之第1〇觀點提供探針裝置，其在具備 才木測器至，固定在該探針器室上部之探針端子s ;配置在 該探針端子s之下方，並且，載置被檢 查體用而於X、γ、 Z及Θ方向為移動可能之載置台；以及將該探針端子績該 X297公釐） 訂 線 I紙張尺度適用中國規格(2丨; 10- 經濟部中央標準局員工消費合作社印聚 A7 _______B7 五、發明説明（8 ) ' ~~ - 被檢查體作位置對正，並控制該載置台之上昇使該被檢查 體接觸於該探針端子S的用於控制該載置台之移動的控制 器之探針裝置上，該控制器乃用於控制該載置台之上昇而 使该被檢查體接觸於該探針端子s，而其具有當載置在該 載置台之該被檢查體接觸於該探針端子之時，由於該載置 台會傾斜，75依據所定之資料預測該探針端子華接觸之. 該被檢查體上之位置’於方向之移動距離；而欲 予減少該所預測之移動距離，乃演算修正距離以修正最少 於該裁置台之X、Y及Z方向中的一個位置；以及考慮該修 正距離以決定使該載置台上昇之位置，並且，區分為多數 步驟將該載置台上昇至上述所決定之位置的系統，為其特 徵。 又，依照本發明之第11觀點提供探針裝置，其係在依 照上述第10觀點之探針裝置上，該載置台之上昇於χ方向 'Υ方向及Ζ方向之每一方向，最少亦以一個步驟依序實 施，為其特徵。 又，依照本發明之第12觀點提供探針裝置，其係在依 照上述第10觀點之探針裝置上，該控制器再具備記憶有關 該載置台之資料與有關上述被檢查體之資料及有關該探針 端子之資料的記憶體；依據記憶在該記憶體之各資料而求 出该移動距離之第1演算裝置；以該第1演算裝置之演算結 果為根基，欲予減少該移動距離乃求出修正距離，以修正 最少於該載置台之X、Υ及Ζ方向中之—個位置的第2演算 裝置；以及判定於該第1演算裝置之演算結果，及該第2演 ----------^ — (請先閲讀背面之注t-事項再填寫本頁) 訂 • II - III 1^ · • m · 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -11 - 經濟部中央標準局員工消費合作社印製 A7 ---------____ 五、發明説明（9 ) ' —' 算裝置之廣算結果中，其最少有一個演算結果是否為適宜 之判定裝置，為其特徵。 本發明之實施態樣 以下’根據第1圖〜第5圊之實施態樣，若與習知為同 一或相當之部份就附加同一符號（號碼）作本發明之說明。 本實施態樣之探針裝置，除控制器13之外，即％習知之探. 針裝置為準之構成。本’實施例之探針裂置1〇如第6圖所示 ’具有裝貨室11及探測器室12。在裝貨室n内配設小炎子 15及副卡盤16。卡SC内之晶a]W由小夾子15以各】片搬 送之。晶圓W於搬送之間，在副卡盤16上作前置調整。在 探測器室12内，配設於2、0方向移動可能之載置台17、 X工作台18、Y工作台19及調整裝置2〇。在控制器。之控 下置。17在Χ、γ、ζ、9方向移動，並與調整裝置 20協同動作而將載置台17上之晶圓，整於探針端子s(未 圖示）之後，該載置台向著探針裝置上昇，使被檢查體接 觸於探針端子。該被檢查體接觸於探針端子之工程，能以 上昇載置台而使被檢查體接觸成接近於探針端子之工程， 及然後，將該載置台作過度驅動之工程的2工程實施。各 探針端子接觸於形成在晶圓w上之IC晶片s的電極s，並檢 查該被檢查體之電氣特性。 當過度驅動載置台之時，載置在該載置台之該被檢查 體就接觸於该探針端子，而從該探針端子對該载置么之一 部份加上接觸壓力。由該接觸壓力而使支撐該載置台之軸 弯曲，乃使該載置台傾斜。因該傾斜而使前述探針端子所 本紙張尺度適用中國國豕標準（CNS ) A4規格^ ( 210 X 297公羞) ' -------- 12- — — — — — — I I I 裝 I I I I 訂I 線 (請先閱讀背面之注#-事項再填寫本頁} 五、發明説明（10 應接觸之前述載置台上的位置，就偏向於又、^及2方向β 本實施例之控制器13，係具備預測該偏離距離並記憶修正 上所必要之各種資訊的記憶裝置。如在第丨圖所示，晶圓 W之參數s(以下，稱為「晶圓資訊」）及探針卡以之參數4 以下’僅稱為「卡資訊」）等之資料，就記憶在第"己憶裝 置131(例：RAM)。控制探針裝置用之程式及載在台^之, 參數s(以下，稱為「載查台資訊」）等之資料，就記憶在 第2記憶裝置132(例：ROM)。中央演算處理裝置（以下， 稱為「CPU」）133將讀出記憶在第丨記憶裝置131及第2記 憶裝置132之各資訊並進行所定之演算，而輸出依據指令 信號之演算結果。 經濟部中央標準局員工消費合作社印製 I-- (請先閱讀f.面之注t事項再填寫本頁)V. Description of the invention (7) The inclination of the mounting table is based on the predetermined data to predict the movement distance of the position of the object to be inspected which the probe terminal should contact in the X, γ and Z directions; The predicted moving distance is calculated by correcting the distance so as to also at least correct a position in the X, Y, and z directions of the mounting platform; and the system that determines the ascending position of the mounting platform in consideration of the correction distance, which is a feature of it. V '.' Further, according to an eighth aspect of the present invention, a probe device is provided. In the probe device according to the above-mentioned seventh aspect, the system is provided with a memory that stores data about the mounting table, information about the object under examination, and data about the probe terminal; according to the memory in the memory Data s, and the first calculation device (operati ON unit) to obtain the moving distance; based on the calculation results of the first} calculation device, and to reduce the moving distance is to find the correction distance to minimize the correction The second calculation device on one of the x, y, and 2 directions of the mounting table; and at least one determination device that judges that the calculation result of the second calculation system is at least one of the calculation results is suitable. In addition, according to a ninth aspect of the present invention, a probe device is provided. In the probe device according to the seventh aspect, the controller further includes a calculation result determined by the 'γ calculation device and a calculation result of the second calculation device. The least of the calculation results is whether or not the calculation result is a suitable judging device. According to a tenth aspect of the present invention, a probe device is provided, which comprises a probe terminal s fixed to an upper portion of the prober chamber, and is disposed below the probe terminal s, Mounting table for placing the object under inspection in X, γ, Z, and Θ directions; and the probe terminal is X297 mm. The size of the paper for the guideline I applies Chinese specifications (2 丨; 10- Economy Ministry of Standards and Standards Bureau Consumers 'Co-operative Printing Association A7 _______B7 V. Description of the Invention (8)' ~~-The subject is aligned with the position, and the rising of the mounting table is controlled so that the subject touches the probe terminal S. On the probe device of a controller for controlling the movement of the mounting table, the controller is used to control the ascending of the mounting table so that the object to be inspected contacts the probe terminal s, and it has When the test object of the mounting table contacts the probe terminal, because the mounting table will tilt, 75 is predicted to contact the probe terminal Hua according to the predetermined data. The position of the test object is 'moved in the direction' Distance; and want to reduce the predicted movement The distance is calculated by correcting the distance to correct at least one of the X, Y, and Z directions of the placement table; and considering the correction distance to determine the position to raise the placement table, and dividing the placement table into a majority of steps The system for ascending to the position determined as described above is characterized in that, according to the eleventh aspect of the present invention, a probe device is provided, which is on the probe device according to the tenth aspect, and the mounting table is raised in the χ direction. Each direction of the 'Υ direction and the Z direction is implemented in at least one step in sequence, which is characteristic. In addition, a probe device according to a twelfth aspect of the present invention is provided, which is based on the probe device according to the tenth aspect described above. In the above, the controller is further provided with a memory for storing the information about the mounting table, the information about the above-mentioned subject and the information about the probe terminal; and determining the moving distance based on the data stored in the memory. First calculation device: Based on the calculation result of the first calculation device, if you want to reduce the moving distance, you need to find a correction distance to correct the X, Υ, and Z squares that are at least less than the mounting table. Middle—a second calculation device at one position; and the calculation result of the first calculation device, and the second calculation ---------- ^ — (Please read the note t-item on the back first (Fill in this page again) Order • II-III 1 ^ · • m · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -11-Printed by A7, Consumers Cooperative of Central Standards Bureau, Ministry of Economic Affairs- --------____ V. Description of the invention (9) '—' Among the wide calculation results of the calculation device, at least one of the calculation results is a suitable determination device, which is a feature of the invention. In the following, according to the embodiment of Fig. 1 to 5), if it is the same or equivalent to the conventional part, the same symbol (number) is added to explain the present invention. In addition to the controller 13, the probe device of this aspect is a conventional probe device. As shown in Fig. 6, the probe split 10 of this embodiment has a loading chamber 11 and a detector chamber 12. A small flame 15 and a sub-chuck 16 are arranged in the loading room n. The crystals a] W in the card SC are carried by the small clip 15 in pieces. The wafer W is pre-adjusted on the sub-chuck 16 between transfers. In the detector chamber 12, a mounting table 17, an X table 18, a Y table 19, and an adjustment device 20, which are movable in the directions of 2 and 0, are disposed. In the controller. The control is placed under. 17 moves in the directions of X, γ, ζ, and 9 and cooperates with the adjustment device 20 to form the wafer on the mounting table 17 into the probe terminal s (not shown), and then the mounting table rises toward the probe device. , Touch the test object to the probe terminal. The process of contacting the test object with the probe terminal can be performed by raising the mounting table to bring the test object close to the probe terminal, and then performing 2 processes of the process of excessively driving the mounting table. Each probe terminal is in contact with the electrode s of the IC wafer s formed on the wafer w, and the electrical characteristics of the subject are checked. When the mounting table is excessively driven, the object to be inspected placed on the mounting table contacts the probe terminal, and a contact pressure is applied to a part of the mounting table from the probe terminal. Bending the shaft supporting the mounting table by the contact pressure causes the mounting table to tilt. Due to this inclination, the paper size of the aforementioned probe terminal applies to the Chinese National Standard (CNS) A4 specification ^ (210 X 297 mm) '-------- 12- — — — — — — III IIII Order I line (please read the Note #-Matters on the back before filling out this page) V. Description of the invention (10 The position on the aforementioned mounting table that should be touched is biased towards the directions ^ and 2 β Control of this embodiment The device 13 is provided with a memory device that predicts the deviation distance and memorizes various information necessary for correction. As shown in FIG. 丨, the parameter s of the wafer W (hereinafter, referred to as "wafer information") and a probe Cards with parameters 4 and below 'only referred to as "card information") and other data are stored in the "Qiyi device 131 (eg: RAM). The program used to control the probe device and the parameters stored in the station, parameters s (hereinafter, referred to as "loading station information") is stored in the second memory device 132 (eg, ROM). The central processing unit (hereinafter, referred to as "CPU") 133 reads and stores the information in Each piece of information of the first and second memory devices 131 and 132 performs a predetermined calculation, and outputs the information according to the instruction The results of the calculation. Ministry of Economic Affairs Bureau of Standards employees consumer cooperatives printed I-- (Read f. Note t matter the surface and then fill the page)
、1T 線 第Π己憶裝置131具有記憶晶圓資訊用之晶圓資訊記憶 部131A ’及記憶卡資訊用之卡資訊記憶部ΐ3ΐβ。第2記憶 裝置132具有記憶載置台資訊用之載置台f訊記憶部132八 ’以及記憶有關探針方法之程式或控制用程式等之程式資 訊的程式記憶路咖。咖133具气以第以憶裝置m之 載置台資訊與晶圓資訊及卡資訊為根基，而於過度驅動時 對每-晶片算出修正載置台1WX、YAZ方向之位置的修 正距離之第1，寅算裝置133八’以該演算裝置133A之演算結 果為根基而算出過度驅動量之第2演算裝置i33B，以該演 算裝置133B之凟算結果為根據而判定過度驅動量是否為 適且之判疋裝置133c，以及控制褒置⑴D。於該控制裝 置133D之控制下’第！、第2演算裝置⑴a、133B及判定 裝置133C就運作。The 1T line No. ii memory device 131 has a wafer information storage section 131A 'for storing wafer information and a card information storage section ΐ3ΐβ for memory card information. The second memory device 132 includes a mounting table f-signal storage section 132 for storing the mounting table information, and a program memory for storing program information such as a program related to a probe method or a control program. Based on the information of the mounting table information, wafer information, and card information of the memory device m, Ka 133 Qi is the first to calculate the correction distance for correcting the position of the mounting table in the directions of 1WX and YAZ for each chip when it is overdriven. A second calculation device i33B that calculates the overdrive amount based on the calculation result of the calculation device 133A, and determines whether the overdrive amount is appropriate based on the calculation result of the calculation device 133B. The device 133c, and the control device D. Under the control of the control device 133D '! The second calculation devices ⑴a and 133B and the determination device 133C operate.
五、 發明説明（11 中 央 襟 準 局 貝 工 消 費 合 作 杜 印 製 上述修正距離於過度驅動時，由於載置台會傾斜，因 此，前述探針端子所應接觸之前述載置台上的位置，就對 應於X、Y及Z方向所偏離之距離，而能決定使該偏離之距 離減少。 在上述控制器13，如第1圖所示，分別連接輪入裝置( 例如，鍵盤等）25及顯示装置14。從輸入裝置25雜輸入各 種檢查上所必要之資料(例：晶圓資訊、卡資訊及載置台 資訊）至上述控制器13,而該輸入資料乃由顯示裝置14 = 確認。在該控制器13連接驅動載置台17用之驅動機構％。 該驅動機構26，就驅動載置台17及調整裝置2〇等。 上述晶圓資訊，例如，含有晶片之配置、各晶片之尺 寸其重〜位置、電極端腳數、電極端聊之面積、電極端 腳間之節距等的參數。上述卡資訊，例如，含有探針端子 之，數(針數)及其配置、探針端子之材質及物性，其端子 壓等之參數。上述載置台資訊，例如，含有載置台】7之旋 轉軸的機械性域、載置台17之外徑等的參數。 參照第2圖、第3圖，可說明本發明之探針方法的實施 態樣。 在探測時載置台17就上昇於2方向，晶圓w於第2圖 一點假想線位置與探針端子24A接觸或接近。然後，晶 W就從-點假想線位置過度驅動至上方，而從探針^ 24A加接觸壓於晶，上。該接㈣乃偏重於晶圓w上之 一部份所外加之偏荷重。由於該偏荷重而使支«置台Π 之軸發生ί貝斜’而如第2圖之實線所示，晶圓w就從水平 裝 訂 線 之圓子V. Description of the Invention (11) The above-mentioned correction distance is printed by the Central Laboratories and Consumers' Cooperative Department. When the above-mentioned correction distance is excessively driven, the mounting table will tilt, so the position on the aforementioned mounting table to which the probe terminal should contact corresponds to In the X, Y, and Z directions, the distance can be determined to reduce the deviation. The controller 13 is connected to a wheel-in device (for example, a keyboard, etc.) 25 and a display device, as shown in FIG. 1. 14. Input necessary data (such as wafer information, card information, and mounting table information) from the input device 25 to the controller 13 above, and the input data is confirmed by the display device 14 = in this control Device 13 is connected to a driving mechanism for driving the mounting table 17. The driving mechanism 26 drives the mounting table 17 and the adjusting device 20, etc. The above-mentioned wafer information includes, for example, the arrangement of the wafers, the size of each wafer, and the weight of the wafers. , The number of electrode terminals, the area of the electrode terminals, the pitch between the electrode terminals, etc. The above card information, for example, contains the number of probe terminals (number of pins) and its configuration, the probe terminals Material, physical properties, terminal pressure, etc. The above-mentioned mounting table information includes, for example, parameters including the mechanical domain of the rotation axis of the mounting table] 7 and the outer diameter of the mounting table 17. Refer to Figures 2 and 3 It can explain the implementation of the probe method of the present invention. During the detection, the mounting table 17 is raised in two directions, and the wafer w is in contact with or close to the probe terminal 24A at a point imaginary line position in FIG. 2. Then, the crystal W It is driven excessively from the position of the -point imaginary line to the top, and the contact pressure is applied from the probe ^ 24A to the wafer. The connection is biased to the partial load imposed on a part of the wafer w. Because of the partial load When the axis of the supporting plate Π is tilted, and as shown by the solid line in FIG. 2, the wafer w starts from the horizontal binding line.
本紙張尺度賴巾國國家樣準( 210x297vJF -14-The size of this paper is national standard (210x297vJF -14-
DJ DJ 經濟部中央標準局貝工消費合作杜印製 五、發明説明（12 ) 位置向外側傾斜。探針端子24A之端子前端乃從第2圖之 起點S向以該圖之箭頭八所示之方向偏離（移動卜 在本發明，為修正該有關之移動，控制器13就算出將 載置台π移動至X、MZ方向之修正距離。如第2圖所示 ，載置晶靠之載置台17 ’就向該圓之箭頭B方向移動上 述修正距離。“料，晶®W就如同保持水私原狀上· ::而探針端子s之端丰前端5乃如該圖之箭頭c所示垂直 才口间其結果，探針端子s之端子前端s乃如第3圖之粗實 線所示’與晶圓㈣水平上昇之場合，描,钱乎不改變之 軌道移動。該結果，如在第则Μ，料前端之終點e 留住在電極端„内，而探針端子2从確實與電極端脚p接 觸’乃可確實進行晶片之檢查。 修正上述載置台17之移動距離時，由於載置台17不能 同時起動至Χ、ΥΗ方向，或同時停止，是故，在χ、Υ 及Ζ方向之移動開始上會產生時間性之延遲。因此，載置 台Π於修正上不能正確沿著理想軌導移動。其原因為，χ 工作台18、Υ工作台19間之重量相異、探針端子24Α與各IC 晶片之每一接觸的移動距離之相異，甚至，χ、y方向及z 方向之移動分純之相異等存在之故。魅台向各方向移 動之時，與每—方向之時間偏差愈大，即，載置台η就愈 偏離理想軌道愈大，乃較難正確控制載置台17之移動。 欲予正綠控制載置台17之移動，在本發明乃將過度 驅動載置台17之距離分割為多數Ν，而在各分割之區間 每一距離，即以階段性過度驅動載置台17。例如，在 本紙張从適用中關^準（CNS) Α4規格（ - t 的 第4 ^------ΐτ-------ii (請先閱讀背面之注元事項再填寫本頁) -15- 五、 發明説明（η ) 經 濟 部 中 央 標 準 員 工 消 費 合 作 社 印 製 Γ示之箭頭假定為載置台17移動於χ、γ方向之理想軌 、。X工作台18，γ工作台19沿著理想執道，欲將載置台P 從起點s至終點E，以1次作移動之場合，即，載置台17有 通過之可能性的軌道’乃在第4A圖之斜線領域内。但是 ，如在第4B圖所示，從起點8至終點E分成2等分之場合， 載置台17有可能通過之軌道，就_於第侧㈣線領. 域内因此，載置台17徒理想軌道偏離之可能性的領域為 以1次移動之場合的一半。再如在第忙圖所示，從起點S 至終點E之距離作4等分之場合，载置⑽從理想軌道偏 離之可能性的領域’就成為分為2次移動之場合的一半。 由於此，於過度驅動時，將載置台17修正在χ、γ及 方向之距離欲作移動，即如上述，載置台17不—定會沿著 修正軌道（理想軌道）移動。在本發明之探測技冑，由於將 載置台17區分為多數次’以階段性作移動，是故載置台 17可接近於理想軌道作移動。載置㈢於過度驅動時，= 近於理想軌道移動，而探針端子24Α確實移動於電極端腳 内，乃能進行更高信賴度之檢查。又，在現實上，載置 17以分成為約4次作過度驅動為宜。 將本發明之探測方法與探針裝置之動作共用作說明 欲檢查之前，從輸人褒置25輸人晶圓資訊及卡資 至控制器13而該輸入資料於顯示裝置14作確認。輸入資 就登錄記憶於第以憶裝置131。由於載置台資訊為固定只 料之故，乃事先登錄，記憶於第2記憶裝置132。晶圓W在 裝貨室内作前置調整之後，就供給至探測器室12内之載置 裝 台 料資 頁 訂 線 本紙張尺度適用中國國家榡準（CNS ) 4械^_ ( 2WX297公着） -16- 五、 發明説明（Η ) 經濟部中央標準局貝工消費合作社印袋 台17上。於探測器室内，由調整裝置使晶圓w對著探針端 子作調整。然後，就依序檢查形成在晶圓w上之各晶片的 電氣特性。 於依序檢查形成在晶圓W上之各晶片的電氣特性之時 ，CPU 133乃從第2記憶裝置132依序讀出有關本發明之探 測方法的程式。 ：· 例如，最好依照第$圖之流程圖，載置台17應考量修 正距離而作過度驅動。在第5圖，首先，決定在晶圓冒上 最初應檢查之1C晶片之位置，即，探針端子24八最初應接 觸之位置（S1)。其以後之接觸位置就依照指示傳送之順序 而在CPU 133依序決定之。 接著，CPU 133，就從第1記憶裝置131讀出晶圓資訊 及卡資訊。第1演算裝置133A乃依據接觸位置，晶圓w及 探針端子24A的尺寸’而計算接觸面積（S2)。 第1演算裝置13 3 A以該等之資料為根基，而計算探針 端子24A於接觸時所發生之偏荷重（S3)。 CPU 133，從第2記憶裝置132讀出載置台資訊。第！ 演算裝置13 3 A以上述所計算之偏荷重為根基，計算於過 度驅動時之X ' Y及Z方向所偏離之距離（S4)。 第2演算裝置13 3 B就計算為減少上述移動距離，而修 正該載置台17之X、Y及Z方向之位置的修正距離（S5)。 判定裝置133C，就判定該移動距離及/或修正距離 是否位於安全圈（S6)。判定是否位於安全圈之一方法上可 採用判定該移動距離及/或該修正距離是否位於所定之範 請 閲 讀 背 之 注DJ DJ Printed by Shellfish Consumer Cooperation of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (12) The position is inclined outward. The tip of the terminal of the probe terminal 24A is deviated from the starting point S in FIG. 2 to the direction shown by arrow VIII in the figure (movement is in the present invention. In order to correct the relevant movement, the controller 13 calculates the placement stage π Move to the correction distance in the X and MZ directions. As shown in Figure 2, the mounting table 17 'on which the crystal is placed moves the correction distance in the direction of the arrow B of the circle. "Material, Crystal® W is like maintaining water private In the original state ::: The tip end 5 of the probe terminal s is vertical as shown by the arrow c in the figure. As a result, the tip end s of the probe terminal s is shown by the thick solid line in FIG. 3 'When the level of the wafer is rising, the orbit moves without change. As a result, as in the rule M, the end point e of the material front end stays in the electrode end, and the probe terminal 2 The electrode terminal pin p is in contact with the wafer, so that the wafer can be checked. When the moving distance of the mounting table 17 is corrected, the mounting table 17 cannot be started in the X, Y directions or stopped at the same time. There will be a time delay in the beginning of the movement of the direction. Therefore, the stage It is impossible to move along the ideal track guide directly. The reason is that the weights of the χ table 18 and the Υ table 19 are different, the moving distance of each contact between the probe terminal 24A and each IC chip is different, and even , Χ, y, and z-direction movements are purely different. When the charm table moves in each direction, the greater the time deviation from each direction, that is, the more the mounting platform η deviates from the ideal orbit It is difficult to control the movement of the mounting table 17 correctly. To control the movement of the mounting table 17 positively, in the present invention, the distance of the excessively driven mounting table 17 is divided into a plurality of N, and each distance is in each divided interval. , That is, the stage 17 is driven excessively in stages. For example, in this paper, the standard (CNS) Α4 specification (-t of the fourth ^ ------ ΐτ ------- ii ( Please read the note on the back before filling in this page.) -15- 5. Description of the Invention (η) The arrow printed by Γ, printed by the Central Standard Staff Consumer Cooperative of the Ministry of Economic Affairs, is assumed to be the ideal orbit of the stage 17 moving in the χ and γ directions. X workbench 18 and γ workbench 19 follow the ideal, When the stage P moves once from the starting point s to the ending point E, that is, the orbit 'that the mounting stage 17 has the possibility of passing is within the slanted area of FIG. 4A. However, as shown in FIG. 4B, When the E is divided into two equal parts from the starting point 8 to the ending point, the track on which the mounting table 17 may pass is located on the side of the stern line. Therefore, the area where the mounting table 17 may deviate from the ideal track is once. Half of the occasion of the movement. As shown in the busy chart, when the distance from the starting point S to the ending point E is divided into four equal parts, the area where the possibility of deviation from the ideal track is placed is divided into two movements. Because of this, during overdrive, the mounting table 17 is corrected to move in the distances of χ, γ, and directions. That is, as described above, the mounting table 17 may not move along the correction track (ideal track). . In the detection technique of the present invention, since the mounting table 17 is divided into a plurality of times' and moved in stages, the mounting table 17 can be moved close to an ideal track. When the mounting ㈢ is driven excessively, it moves close to the ideal track, and the probe terminal 24A does move within the electrode terminal, which enables inspection with higher reliability. Also, in reality, it is advisable to place the drive 17 for about four times and overdrive. The detection method of the present invention and the operation of the probe device are used together for explanation. Before checking, the wafer information and card data are input from the input device 25 to the controller 13 and the input data is confirmed on the display device 14. After entering the information, the memory is registered in the first memory device 131. Since the mounting table information is fixed, it is registered in advance and stored in the second storage device 132. After the wafer W is pre-adjusted in the loading room, it is supplied to the loading table in the detector room 12. The material page is aligned. The paper size is applicable to China National Standards (CNS) 4 machine ^ _ (2WX297) ) -16- V. Description of the invention (Η) On the printing bag stand 17 of the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. In the detector chamber, the adjustment device is used to adjust the wafer w against the probe terminal. Then, the electrical characteristics of each wafer formed on the wafer w are sequentially inspected. When sequentially inspecting the electrical characteristics of each of the wafers formed on the wafer W, the CPU 133 sequentially reads a program related to the detection method of the present invention from the second memory device 132. : For example, it is best to follow the flow chart in Figure $. The mounting table 17 should be driven excessively in consideration of the correction distance. In FIG. 5, first, the position of the 1C wafer to be inspected on the wafer first, that is, the position at which the probe terminal 248 should initially contact (S1) is determined. The subsequent contact positions are sequentially determined by the CPU 133 in accordance with the order of instruction transmission. Next, the CPU 133 reads wafer information and card information from the first memory device 131. The first calculation device 133A calculates the contact area based on the contact position, the wafer w, and the size of the probe terminal 24A '(S2). The first calculation device 13 3 A calculates the partial load occurring when the probe terminal 24A is in contact based on the information (S3). The CPU 133 reads the mounting table information from the second storage device 132. Number! The calculation device 13 3 A calculates the distance deviated from the X ′ Y and Z directions during overdrive based on the above-calculated partial load (S4). The second calculation device 13 3 B calculates a correction distance to correct the position in the X, Y, and Z directions of the mounting table 17 to reduce the above-mentioned moving distance (S5). The judging device 133C judges whether the moving distance and / or the correction distance are located in the safety circle (S6). To determine whether it is located in one of the safety circles, it can be used to determine whether the moving distance and / or the correction distance is within a predetermined range.
I 裝 訂 線 本紙張尺度適用中國國家樣準（CNS ) A4規格（21〇X：297公釐） -17- 五、 經濟部中央標準局貝工消費合作社印製 發明説明（15 ) 圍内的方法。若不位於安全圈’就回復至S4，反覆作s4 〜S6使該移動距離及/或該修正距離位於安全圈内為止 。於該反覆之過程，可採用作檢測，修正當初所輸入之各 種-貝訊。當該移動距離及/或該修正距離位於安全圈内時 ，就依據該修正距離決定前述載置台上昇之位置（S7)。 於控制器13之控制下，該載置台上昇至於务7所決定 之位置，而載置在該載皇台之晶圓W的電極就接觸於探針 端子（S8)。該有關之移動，能分成事先所決定之次數（例 如，4次）實施。對於配置在晶圓…上之任何場所的晶片， 探針端子24A亦確實接觸於該電極端極P(第3圖），而喊實 檢查各晶片之電氣特性。 以該等步驟計算修正距離，並說明具體例 各種資訊，計算下述之基本參數。 ① 每一探針端子之接觸壓 ② 測定上述①之接觸壓時的過度驅動距離 ③ 全端子數 I ④ 於全探針端子之中接觸於1C晶片 之電極的探針端子之比率 ⑤ 探針使用時之過度驅動距離 依據上述p(gr) Ζ( μ. m) n(本） a(%) 〇D(" m) 定義該等參數後，就依下式（1)求出接觸時之加重I Gutter The size of this paper is applicable to China National Standard (CNS) A4 (21 ×: 297 mm) -17- V. Method printed within the scope of the invention description (15) printed by the Bayer Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs . If it is not located in the safety circle, it returns to S4, and repeats s4 to S6 to make the moving distance and / or the correction distance be within the safety circle. In this iterative process, it can be used for testing to modify the various types of Beixun that were entered at the beginning. When the moving distance and / or the correction distance are within the safety circle, the position where the aforementioned mounting platform is raised is determined according to the correction distance (S7). Under the control of the controller 13, the mounting table is raised to the position determined by the task 7, and the electrode of the wafer W mounted on the mounting table contacts the probe terminal (S8). The related movement can be performed in a predetermined number of times (for example, 4 times). For the wafers arranged on any place on the wafer, the probe terminal 24A is indeed in contact with the electrode terminal P (Fig. 3), and the electrical characteristics of each wafer are checked. Use these steps to calculate the correction distance, and explain the specific examples and information, and calculate the following basic parameters. ① Contact pressure of each probe terminal ② Measure the excessive driving distance at the contact pressure of ① above ③ Number of full terminals I ④ Proportion of probe terminals that touch the electrode of 1C chip among all probe terminals ⑤ Use of probe The excessive driving distance at this time is based on the above-mentioned p (gr) Z (μ. M) n (this) a (%) 〇D (" m) After defining these parameters, the following formula (1) is used to determine the contact time. Aggravate
W W(kgf)=n X (P/1000) X (〇D/Z) X (a/10Q) 〇 ) 但是，在第9圖所示，於載置台上的5點外加加重M(kgf) 時，即’在各別之位置上發生歪變（應變）。該歪變以向量 私紙張尺度適用中國國家橾準（CNS〉A4規格（210 X 297公釐） I---------装------ir—-----.^ C请先聞讀背面之注意事項再填寫本育) -18- 五、發明説明（10 ) 一·' —-— A(x’y，z)……E(x，y，z)表示。該等乃使用專用之治具 在各台之探測器作測定。 在第9A圖之斜線部份上有加上加重（M(k仰之任意點 上的歪變向量N(X，y，z)，其與歪變向量A(x y z)、& 、C(x，y，z)之間，下式可成立，即 = + v.,；WW (kgf) = n X (P / 1000) X (〇D / Z) X (a / 10Q) 〇) However, as shown in Fig. 9, when M (kgf) is added at 5 points on the mounting table , That is, 'distortion (strain) occurs at various locations. This distortion applies the Chinese private standard (CNS> A4 specification (210 X 297 mm)) to the vector private paper scale. I ----------------------------- ^ C Please read the notes on the back before filling in this education.) -18- V. Description of the invention (10) A · '—-— A (x'y, z) …… E (x, y, z) means . These are measured using a dedicated jig on each detector. In the part of the diagonal line in FIG. 9A, there is added a distortion vector N (X, y, z) at any point of M (k), which is equal to the distortion vector A (xyz), &, C ( x, y, z), the following formula can be established, that is, = + v.,;
於此，咖為參數·，而向量乃表示於任意位置（第9A ^斜—線部份）之向量。即，該式係參照第犯圖而表示， :¾係表示在¢-¾乘以參數3(0<3<1)倍之向量及 在（C-4乘以參數1(0<1<1)倍之向量的合成向量。 由於此，於上述任意點之歪變向量N，得以下式p)求 出。 = 5(5 - 2) + /(C - . (〇< 5 <1 >0< / <1) (2 ) 其為有加重M(kgf)時之歪變距離，因此，使用於上述 (1)式所求之於接觸時所發生的加重w，而探針端子在所 接觸之位置的歪變距離σ，得以下式（3)求出。 ^ = ~HB-A) + t{C-A) + A} (3) 經濟部中央標準局員工消費合作杜印製 對於其他部份亦同樣可求出。 如上述所說明，依據本實施態樣，晶圓w之口經雖加 大，而設在探針卡24之探針端子數增加，對於過度驅動時 之探針端子的端子前端之位置偏差，亦可對各晶圓，每一 1C晶片作修正。特別是’由於上述偏加重而使載置台傾斜 所生之探針端子的端子前端之位置偏差亦可修正。其結果 本紙張尺度適财國财轉（⑽）〜祕（2丨qx297公幻 -19- 五、 發明説明（17 ，可綠實檢查各1C晶片之電氣特性。 又，依據本實施態樣，由於將過度驅動距離分割為4 ’而將載置台17分為4次作階段性之移動，乃能使載置台i 7 接近於理想軌道作移動。因之，於形成在晶圓界上之冗晶 片的各電極端腳與探針端子24A能更確實作電氣性接觸。 即，載置台17被過度驅動於χ、丫及2方向之時，將載置台， 17之移動方向分解為各_方向，而使載置台！ 7依序以階段 性分別移動於各分解方向，因此，載置台17於又、γ方向 及z方向上的移動分解能等雖有差異，但載置台17亦能 圓滑’正確被過度驅動。 本發明對於上述實施態樣並無任何限制。只要是，於 探測時’將探針端子之端子前端的位置偏差，根據各種資 訊作計算，修正而作過度驅動之探測方法，就包含在本發 明。 特別是，由上述偏加重使載置台傾斜，而探針端子之 端子前端的位置會偏差之場合，只号是不僅將載置台㈣ 度驅動在Z方向，而因應上述傾斜並依據各種資訊，不僅 對Z方向同時亦對χ、γ方向之過度驅動距離，作計算、修 正的過度驅動之探測方法，就包含在本發明。 y 於本發明之上述實施態樣上，被檢查體為形成在半導 體晶圓上之1C晶片。但是，其他實施態樣亦可採用。即， 依探針端子可作其電氣特性之檢查的任何電子零組件，均 可作為本發明之探針方法及探針裝置之被檢查體。 二 在本發明之上述實施態樣，探針端子方面乃採用探針 本紙張尺度適财關家2 裝 訂 中 央 標 準 局 員 合 作 社 印 裝 -20- 經 央 榡 準 局 員 工 消 費 人 h 社 印 製 A7 -____ B7 五、發明説明（18 ) ~ -- 端子，但是，其他實施態樣亦可採用。例如，撞擊狀之端 子等種種的端子可予採用。 在本發明之上述實施態樣上，將載置台向著探針端子 上昇，使被檢查體接觸於探針端子之工程，可由上昇載置 台而使被檢查體接觸或接近於探針端子之工程，及其後， 將該載置台作過度驅動之工程的2工程實施。但表他 實施態樣亦可採用。例如，在被檢查體與探針端子之間， 使其能確保所定之接觸狀態，而亦能以丨步驟使載置台向 著探針端子上昇。 在本發明之上述實施態樣，探針端子s所應接觸之載 置台上的位置’對X、丫及2方向預測移動距離之資料方面 ’乃採用有關該載置台之資料⑴，與有關該被檢查體之 資料⑷及有關該探針端子之資料⑷。該等資料乃使用明 細書中之式（1)、（2)及（3)，而採用為預測上述距離上最適 宜之資料。但是，其他實施態樣亦可採用。即，在上述距 離之預測上’並不限定於該等之方十，而能預測上述距離 之任-方法均可採用。由於此，上述資料能適宜選擇預測 上述距離用之方法上所必要之資料。 於本發明之該修正距離，以該移動距離為零之數值為 宜。但是，該修正距離不一定將該移動距離為零之數值亦 可以。該修正距離只要使探針端子s確實接觸於被檢查體 之各電極s，而能將該移動距離減少之數值就可以。 在本發明之上述實施態樣，係向著考慮該修正距離所 決定之位置上昇該載置台。但是，其他實施形態亦可採用 本紙張尺度適用中國-----Here, coffee is the parameter ·, and the vector is a vector expressed at an arbitrary position (the 9A ^ oblique-line part). That is, the formula is expressed with reference to the first graph,: ¾ represents a vector multiplied by 3 (0 < 3 < 1) of the parameter ¢ -¾ and multiplied by the parameter 1 (0 < 1 < 1 in (C-4) ) Is a composite vector of vectors. Because of this, the distortion vector N at any of the above points is obtained by the following formula p). = 5 (5-2) + / (C-. (〇 < 5 < 1 > 0 < / &1; 1) (2) It is the distortion distance when the weight M (kgf) is increased. Therefore, use In the above formula (1), the aggravation w caused by the contact is obtained, and the distortion distance σ of the probe terminal at the contacted position is obtained by the following formula (3). ^ = ~ HB-A) + t {CA) + A} (3) Consumption cooperation printing by employees of the Central Bureau of Standards of the Ministry of Economic Affairs can also be obtained for other parts. As explained above, according to this embodiment, although the diameter of the wafer w is increased, the number of probe terminals provided on the probe card 24 is increased, and for the positional deviation of the terminal tip of the probe terminal when the drive is excessively driven, It is also possible to modify each wafer and every 1C wafer. In particular, the positional deviation of the terminal tip of the probe terminal caused by the tilting of the mounting table due to the above-mentioned misalignment can also be corrected. As a result, the paper size of the paper is suitable for wealth transfer (财) ~ Secret (2 丨 qx297 Ghost-19-19) 5. Description of the invention (17, the electrical characteristics of each 1C chip can be checked in green. According to this implementation aspect, Because the excessive driving distance is divided into 4 'and the stage 17 is divided into four stages for staged movement, the stage i 7 can be moved close to the ideal track. Therefore, the redundant formation on the wafer boundary Each electrode terminal of the wafer can make more accurate electrical contact with the probe terminal 24A. That is, when the mounting table 17 is excessively driven in the χ, γ, and 2 directions, the moving direction of the mounting table 17 is decomposed into _ directions. , And make the stage! 7 move sequentially in each decomposition direction in sequence, therefore, the movement of the stage 17 in the γ, γ, and z directions is different, but the stage 17 can also be smooth 'correct It is excessively driven. The present invention does not have any restrictions on the above embodiments. As long as the position deviation of the front end of the probe terminal during detection is calculated based on various information and corrected, it is an over-driving detection method. Included in this post In particular, when the mounting table is tilted due to the above-mentioned bias, and the position of the tip of the terminal of the probe terminal may deviate, the only reason is to not only drive the mounting table ㈣ in the Z direction, but to respond to the above tilt and according to various information, The overdriving detection method that calculates and corrects not only the excessive driving distance in the Z direction but also the χ and γ directions is included in the present invention. Y In the above embodiment of the present invention, the object to be inspected is formed in 1C wafer on a semiconductor wafer. However, other implementations can also be used. That is, any electronic component that can be inspected for its electrical characteristics according to the probe terminal can be used as the probe method and probe device of the present invention. In the above-mentioned embodiment of the present invention, the probe terminals are made of probes. The paper size is suitable for housekeeping. 2 Binding printed by the Central Standard Bureau member cooperative. A7 -____ B7 printed by the agency V. Description of the invention (18) ~-Terminals, but other implementations can also be used. For example, various terminals such as impact terminals In the above-mentioned embodiment of the present invention, in the process of raising the mounting table toward the probe terminal and bringing the object into contact with the probe terminal, the object can be brought into contact with or close to the probe by raising the mounting table. The project of the terminal and the second project of the project of excessively driving the mounting table are implemented. However, other implementations can also be used. For example, between the test object and the probe terminal, it can ensure the predetermined In the contact state, it is also possible to raise the mounting table toward the probe terminal in a step. In the above-mentioned embodiment of the present invention, the position on the mounting table to which the probe terminal s should contact is predicted in the X, Y, and 2 directions. In terms of the data of the moving distance, the information about the mounting table, the information about the object under inspection, and the information about the probe terminal are used. These data are based on the formulae (1), (2), and (3) in the list, and are used to predict the most appropriate distances over the above distances. However, other aspects of implementation are also possible. That is, the prediction of the above-mentioned distance is not limited to these formulas, and any method that can predict the above-mentioned distance can be adopted. Because of this, the above-mentioned data can be appropriately selected by the method necessary for predicting the above-mentioned distance. In the present invention, the correction distance is preferably a value where the moving distance is zero. However, the correction distance may not necessarily be a value where the moving distance is zero. The correction distance may be a value that can reduce the moving distance by making the probe terminal s surely contact each electrode s of the subject. In the above aspect of the present invention, the mounting table is raised toward a position determined in consideration of the correction distance. However, other implementation forms can also be adopted. This paper scale is applicable to China ----
i 五、發明説明（19 ) 。例如’將該載置台上昇至考慮該修正距離而當期所決定 之位置之後，再依據該修正距離修正載置台之位置的實施 態樣亦可採用。 於本發明，對於該偏差距離及該修正距離之中，其最 少為-個距離是否為適宜之判定，乃對求出該等距離用所 以U«科㈣適宜之判定㈣樣，或族等距離由 於載置台之移動，是否爲修正可能之範圍内的判定之態樣 等，能以種種之態樣實施之。 於本發明，將前述載置台在x、Y及ζ方向之每—方向 ，最少以—個步驟作上昇之工程，能以種種之態樣實施之 。例如，該工程由X、ΜΖ方向之任何方向開始亦可以。 又’該工程，在x、Y5tz方向之任一方向的所定值置，將 載置台上昇之後，亦能在其他方向之所定位置，將載置么 依序作上昇之態樣實施之。又，該卫程，在x、γ及八戈°zi 5. Description of Invention (19). For example, after the mounting table is raised to a position determined in the current period in consideration of the correction distance, an embodiment in which the position of the mounting table is corrected based on the correction distance may also be adopted. In the present invention, for the deviation distance and the correction distance, at least one of the distances is suitable for determining whether or not the distance is suitable, which is used to obtain such distances. Due to the movement of the mounting table, it can be implemented in various ways, such as whether it is a form of judgment within a range where correction is possible. In the present invention, at least one step of the aforementioned mounting stage in each of the x, Y, and ζ directions is used for the ascending project, which can be implemented in various ways. For example, the project may start in any of the X and MZ directions. Also, the project can be carried out in a certain position in the x and Y5tz directions, and the mounting platform can be raised at a predetermined position in other directions. In addition, this guard is at x, γ, and Pago °° z
Y 訂Y order
之各方向有必要將載置台以i步驟實施上昇之後在X 線 及/或Z之各方向有必要以第2步驟實施上昇之態樣亦 實施之。 在本發明之控制器上的前述系統，能使用電路構成作 其構成，或使用以軟體控制下之微處理器作其構成亦可以 其所有關連之特徵及變更，對於該技術領域之有關業 者應可意想得到。因此，本發明乃立足於更廣潤之觀點上 ，而並不限定於於此之特定之詳細以及所開示之代表性的 實她例上。由於此，在所添附之本發明申請專利範圍所定 本紙張尺度作財鞞（CNS )?4^d.x297公着- -22- 經濟部中央標準局貝工消費合作社印製 五、發明説明（2〇 ) 義之廣泛發明概念以及其均等物之解釋及範圍上，並不偏 離其原意而能作種種之變更。 圖式之簡單說明 所添附之圖面係與明細書之一部份相關連，並且亦構 成為其-部份，而圖示本發明之最適宜的實施例。該圖面 由於上述所記述之-般性記述’及在以下所記述之最適宜. 之實施例有關之詳細說相，可資助於本發明之說明。 第1圖係表示構成本發明之探針裝置的控制器之方塊 圖； 第2圖係說明使用在第1圖所示之控制器的本發明之載 置台的修正量之說明圖； 第3A圖係使用在第丨圖所示之控制器實施本發明之 探針方法之場合，載置台與探針端子之位置關係作部份性 擴大之概念圖； 第3B圖係表示電極端部與端子前端之移動關係的說 明圖； ° 第4A、B ' c圖係分別表示載置台之理想軌道，與從 理想軌道有位置偏差之軌道領域之關係圖； 第5圖係表示使用在第〗圖所示之控制器，修正載置台 之移動距離時的流程圖； 第6圖係表示破開習知之探針裝置之一部份的透視圖 第7A圖係表示使用於增加端子數之前的探針卡 之探測法（關連技術）上，將載置台與探針端子之關係作部In each of the directions, it is necessary to carry out the ascending of the mounting table in the i-step, and in the X-ray and / or Z in each of the directions, it is necessary to perform the ascending in the second step. The aforementioned system on the controller of the present invention can use a circuit configuration as its configuration, or use a microprocessor under software control as its configuration, and its related characteristics and changes can also be made. Can be expected. Therefore, the present invention is based on a broader point of view, and is not limited to the specific details and representative examples disclosed herein. For this reason, the paper size specified in the appended patent application scope of the present invention is used as a financial instrument (CNS)? 4 ^ d.x297 Publication--22- Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 2) The broad invention concept of meaning and the interpretation and scope of its equivalents can be changed in various ways without departing from its original intent. Brief description of the drawings The attached drawings are related to a part of the detail book and also constitute a part thereof, and illustrate the most suitable embodiment of the present invention. This drawing is due to the general description described above and the most suitable description described below. The detailed description of the embodiment can be subsidized in the description of the present invention. Fig. 1 is a block diagram showing a controller constituting the probe device of the present invention; Fig. 2 is an explanatory diagram showing a correction amount of the mounting table of the present invention using the controller shown in Fig. 1; Fig. 3A When the controller shown in Figure 丨 is used to implement the probe method of the present invention, the positional relationship between the mounting stage and the probe terminal is partially enlarged; Figure 3B shows the electrode end and the terminal front end. Illustrative diagram of the movement relationship; ° Figures 4A and B'c are the relationship diagrams of the ideal track of the mounting platform and the track area with position deviation from the ideal track, respectively; Figure 5 shows the use of The controller is a flowchart for correcting the moving distance of the mounting table. Fig. 6 is a perspective view showing a part of the conventional probe device, and Fig. 7A is a diagram showing a probe card used before increasing the number of terminals. In the detection method (connected technology), the relationship between the mounting table and the probe terminal is used as a part
請 先 閱 态· 之 注Please read the state notes first
I 奢 訂I luxury booking
五、發明説明（21 ) 經濟部中央標準局員工消費合作社印製 A7 份性擴大的概念圖； 第7B圖係表示在第7A圖之狀態上，電極端腳與探針 端子之位置關係的說明圖； 第8 A圖係表示使用增加探針端子數之探針卡的探測 方法（關連技術）上，將載置台與探針端子之關係作部份性 擴大之概念圊； 、· · 第8B圖係表示在第8A圖之狀態上，電極端腳與探針 端子之位置關係的說明圖； 第9A圖係說明在載置台加上荷重之場合，所發生之 移動距離； 第9B圖係說明歪變向量用。 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨0X297公釐） -24- 五 、發明説明（22 ) A7 B7 元件標號對照 n..探針裝置 11…裝貨室 12…探測器室 U…控制器 Μ…顯示裝置 15 _. ·小央_子 16.. . gij 卡盤（sub chuck) 17…載置台（main chuck) 18···Χ工作台 19_.·Υ工作台 20…調整裝置（機構） 21.. .第1攝影裝置 22…調整電橋 23.. .引導軌道 24.. .探針卡 24A·.·探針端子 25…輸入裝置 2 6…驅動機構 131…第1記憶裝置^ 131A.···晶圓資訊記愧部 131B...卡資訊記憶部 132…第2記憶裝置 132A···載置台資訊記憶部 132B.··程式記憶部 133··.中央演算處理裝置(CPU) 133A...第1演算裝置 133B...第2演算裝置 133C...判定裝置 133D...控制裝置 ^-------ST—-----線 f靖先閲讀背1之注意事！？再填寫本頁} 經濟部中央標準局員工消費合作社印製 -25- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）V. Description of the invention (21) Conceptual drawing of A7 enlarged by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs; Figure 7B shows the positional relationship between the electrode pins and the probe terminals in the state shown in Figure 7A Figure; Figure 8A shows the concept of partially expanding the relationship between the mounting stage and the probe terminals on the detection method (connection technology) using a probe card with an increased number of probe terminals; 第 · 8B The diagram is an explanatory diagram showing the positional relationship between the electrode pin and the probe terminal in the state of FIG. 8A; the diagram of FIG. 9A is a diagram illustrating the moving distance when a load is added to the mounting table; and the diagram of FIG. 9B is an explanation Distortion vector used. This paper size is applicable to Chinese National Standard (CNS) A4 specification (2 丨 0X297 mm) -24- V. Description of the invention (22) A7 B7 Component number comparison n .. Probe device 11 ... Loading room 12 ... Detector room U ... controller M ... display device 15 _. · 小 央 _ 子 16... Gij chuck (sub chuck) 17 ... mounting table (main chuck) 18 ... X table 19_. Table 20 ... Adjustment device (mechanism) 21. .. 1st photographing device 22 ... adjustment bridge 23... Guide rail 24... Probe card 24A... Probe terminal 25 ... input device 2 6. Drive mechanism 131... 1 memory device 131A ... wafer information shame section 131B ... card information memory section 132 ... second memory device 132A ... placement table information memory section 132B ... program memory section 133 ... center Calculation processing device (CPU) 133A ... First calculation device 133B ... Second calculation device 133C ... Decision device 133D ... Control device ^ ------- ST ------- line f Jing first read the note of back 1! ? Refill this page} Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs -25- This paper size applies to China National Standard (CNS) A4 (210X297 mm)
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20247697A JP3423979B2 (en) | 1997-07-11 | 1997-07-11 | Probe method and probe device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW379365B true TW379365B (en) | 2000-01-11 |
Family
ID=16458155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087111063A TW379365B (en) | 1997-07-11 | 1998-07-08 | Probe-test method and prober |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6297656B1 (en) |
| JP (1) | JP3423979B2 (en) |
| KR (1) | KR100445931B1 (en) |
| TW (1) | TW379365B (en) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4223640B2 (en) | 1999-09-14 | 2009-02-12 | 東京エレクトロン株式会社 | Probe method and probe system |
| US7009415B2 (en) | 1999-10-06 | 2006-03-07 | Tokyo Electron Limited | Probing method and probing apparatus |
| JP2001110857A (en) | 1999-10-06 | 2001-04-20 | Tokyo Electron Ltd | Probing method and device |
| JP4218816B2 (en) | 2000-02-15 | 2009-02-04 | 東京エレクトロン株式会社 | Needle load measuring method, inspection method and inspection apparatus |
| DE10039336C2 (en) * | 2000-08-04 | 2003-12-11 | Infineon Technologies Ag | Method for testing semiconductor circuits and test device for carrying out the method |
| US6861859B1 (en) * | 2001-10-22 | 2005-03-01 | Electroglas, Inc. | Testing circuits on substrates |
| DE10227332A1 (en) * | 2002-06-19 | 2004-01-15 | Akt Electron Beam Technology Gmbh | Control device with improved test properties |
| JP4357813B2 (en) * | 2002-08-23 | 2009-11-04 | 東京エレクトロン株式会社 | Probe apparatus and probe method |
| US7026832B2 (en) * | 2002-10-28 | 2006-04-11 | Dainippon Screen Mfg. Co., Ltd. | Probe mark reading device and probe mark reading method |
| DE10253717B4 (en) * | 2002-11-18 | 2011-05-19 | Applied Materials Gmbh | Device for contacting for the test of at least one test object, test system and method for testing test objects |
| US7202682B2 (en) * | 2002-12-20 | 2007-04-10 | Formfactor, Inc. | Composite motion probing |
| JP2005150224A (en) * | 2003-11-12 | 2005-06-09 | Nec Electronics Corp | Semiconductor testing apparatus using probe information and testing method |
| US6833717B1 (en) * | 2004-02-12 | 2004-12-21 | Applied Materials, Inc. | Electron beam test system with integrated substrate transfer module |
| US7319335B2 (en) | 2004-02-12 | 2008-01-15 | Applied Materials, Inc. | Configurable prober for TFT LCD array testing |
| US20060038554A1 (en) * | 2004-02-12 | 2006-02-23 | Applied Materials, Inc. | Electron beam test system stage |
| US7355418B2 (en) * | 2004-02-12 | 2008-04-08 | Applied Materials, Inc. | Configurable prober for TFT LCD array test |
| US7218127B2 (en) * | 2004-02-18 | 2007-05-15 | Formfactor, Inc. | Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component |
| US7535238B2 (en) * | 2005-04-29 | 2009-05-19 | Applied Materials, Inc. | In-line electron beam test system |
| TWI323788B (en) * | 2006-03-14 | 2010-04-21 | Applied Materials Inc | Method to reduce cross talk in a multi column e-beam test system |
| US7602199B2 (en) | 2006-05-31 | 2009-10-13 | Applied Materials, Inc. | Mini-prober for TFT-LCD testing |
| US7786742B2 (en) | 2006-05-31 | 2010-08-31 | Applied Materials, Inc. | Prober for electronic device testing on large area substrates |
| JP5071131B2 (en) * | 2008-01-31 | 2012-11-14 | 東京エレクトロン株式会社 | Probe device |
| JP2009135503A (en) * | 2008-12-03 | 2009-06-18 | Yokogawa Electric Corp | Stage elevating device |
| KR101090333B1 (en) * | 2009-06-03 | 2011-12-07 | 주식회사 쎄믹스 | Wafer probe station being capable of active chuck tilting control and control method thereof |
| JP5529605B2 (en) * | 2010-03-26 | 2014-06-25 | 東京エレクトロン株式会社 | Wafer chuck tilt correction method and probe apparatus |
| JP5384412B2 (en) | 2010-03-31 | 2014-01-08 | 日置電機株式会社 | Inspection apparatus and inspection method |
| KR102317023B1 (en) | 2014-08-14 | 2021-10-26 | 삼성전자주식회사 | semiconductor device, method and apparatus for manufacturing the same |
| JP6783185B2 (en) * | 2017-05-15 | 2020-11-11 | 東京エレクトロン株式会社 | Inspection equipment |
| CN113640557B (en) * | 2021-08-11 | 2022-12-23 | 山东大学 | System and method for automatically adjusting height of needle insertion |
| WO2023106150A1 (en) | 2021-12-08 | 2023-06-15 | 東京エレクトロン株式会社 | Inspection method, correction amount calculation method, and inspection device |
| CN118033387B (en) * | 2024-04-15 | 2024-06-25 | 无锡伟测半导体科技有限公司 | Integrated circuit chip detection equipment |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63108738A (en) | 1986-10-27 | 1988-05-13 | Mitsubishi Electric Corp | Wafer prober |
| JPS6465848A (en) * | 1987-09-04 | 1989-03-13 | Canon Kk | Alignment |
| JP3208734B2 (en) * | 1990-08-20 | 2001-09-17 | 東京エレクトロン株式会社 | Probe device |
| JP2939657B2 (en) * | 1990-11-30 | 1999-08-25 | 東京エレクトロン株式会社 | Probe inspection device |
| JPH05273237A (en) | 1992-03-26 | 1993-10-22 | Tokyo Electron Yamanashi Kk | Probe card |
| JP3219844B2 (en) * | 1992-06-01 | 2001-10-15 | 東京エレクトロン株式会社 | Probe device |
| US5777485A (en) * | 1995-03-20 | 1998-07-07 | Tokyo Electron Limited | Probe method and apparatus with improved probe contact |
| US5773987A (en) * | 1996-02-26 | 1998-06-30 | Motorola, Inc. | Method for probing a semiconductor wafer using a motor controlled scrub process |
| US5872458A (en) * | 1996-07-08 | 1999-02-16 | Motorola, Inc. | Method for electrically contacting semiconductor devices in trays and test contactor useful therefor |
| JP3639887B2 (en) * | 1997-01-30 | 2005-04-20 | 東京エレクトロン株式会社 | Inspection method and inspection apparatus |
-
1997
- 1997-07-11 JP JP20247697A patent/JP3423979B2/en not_active Expired - Lifetime
-
1998
- 1998-07-02 US US09/110,073 patent/US6297656B1/en not_active Expired - Lifetime
- 1998-07-08 TW TW087111063A patent/TW379365B/en not_active IP Right Cessation
- 1998-07-09 KR KR10-1998-0027614A patent/KR100445931B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US6297656B1 (en) | 2001-10-02 |
| JPH1130651A (en) | 1999-02-02 |
| KR19990013727A (en) | 1999-02-25 |
| JP3423979B2 (en) | 2003-07-07 |
| KR100445931B1 (en) | 2004-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW379365B (en) | Probe-test method and prober | |
| TW471087B (en) | Probing method and probing apparatus | |
| US7009415B2 (en) | Probing method and probing apparatus | |
| KR100602450B1 (en) | Apparatus for testing of flexible printed circuit board | |
| TW396475B (en) | Probe method and apparataus | |
| TW201007172A (en) | Probe apparatus and method for correcting contact position | |
| US8493083B2 (en) | Test apparatus, test method and computer readable medium | |
| TW552620B (en) | Apparatus for measuring properties of probe card and its probing method | |
| JP2008243861A (en) | Inspection apparatus and method | |
| JP2004152916A (en) | Inspecting device and inspecting method of semiconductor device | |
| KR20040018165A (en) | Probe apparatus | |
| TW201245739A (en) | Method for thermal stabilization of probe card and inspection device | |
| TW200947576A (en) | Inspection method and program recording medium recording the inspection method | |
| JP2003168707A (en) | Probe device | |
| JP2005228788A (en) | Method of aligning wafer with probe card, probe inspecting method, and probe inspection device | |
| JP4391738B2 (en) | Method for collecting probe contact position, method for correcting probe contact position, and method for eliminating contact error between probe devices | |
| TW200912324A (en) | Probe system | |
| US7019549B2 (en) | Apparatus and method for electrical contact testing of substrates | |
| JP3828299B2 (en) | Z-axis height setting apparatus and method in wafer test system | |
| KR100977328B1 (en) | Aligning method of needles of prober system | |
| TW463281B (en) | Probing method and probing system | |
| JP2010038651A (en) | Probe card, element testing device, and element test method | |
| TWI321656B (en) | ||
| TW200952106A (en) | Test system | |
| JP3191790B2 (en) | Handler with search function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MK4A | Expiration of patent term of an invention patent |