TW374234B - Method for manufacturing a damascene interconnect structure - Google Patents

Method for manufacturing a damascene interconnect structure

Info

Publication number
TW374234B
TW374234B TW087111004A TW87111004A TW374234B TW 374234 B TW374234 B TW 374234B TW 087111004 A TW087111004 A TW 087111004A TW 87111004 A TW87111004 A TW 87111004A TW 374234 B TW374234 B TW 374234B
Authority
TW
Taiwan
Prior art keywords
interconnect structure
damascene interconnect
manufacturing
dielectric
ion implantation
Prior art date
Application number
TW087111004A
Other languages
Chinese (zh)
Inventor
Chung-Shi Liu
Chen-Hua Yu
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW087111004A priority Critical patent/TW374234B/en
Application granted granted Critical
Publication of TW374234B publication Critical patent/TW374234B/en

Links

Abstract

The present invention provides an improved process for manufacturing semiconductor interconnects. The process chiefly uses material selection of a dielectric layer and appropriate ion implantation to increase the etching selectivity of dielectric material, thus a damascene interconnect structure can be obtained without an etch stop layer.
TW087111004A 1998-07-07 1998-07-07 Method for manufacturing a damascene interconnect structure TW374234B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW087111004A TW374234B (en) 1998-07-07 1998-07-07 Method for manufacturing a damascene interconnect structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW087111004A TW374234B (en) 1998-07-07 1998-07-07 Method for manufacturing a damascene interconnect structure

Publications (1)

Publication Number Publication Date
TW374234B true TW374234B (en) 1999-11-11

Family

ID=57941823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087111004A TW374234B (en) 1998-07-07 1998-07-07 Method for manufacturing a damascene interconnect structure

Country Status (1)

Country Link
TW (1) TW374234B (en)

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Legal Events

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