TW373261B - Method of processing gate electrode etching integrated circuit - Google Patents

Method of processing gate electrode etching integrated circuit

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Publication number
TW373261B
TW373261B TW087101490A TW87101490A TW373261B TW 373261 B TW373261 B TW 373261B TW 087101490 A TW087101490 A TW 087101490A TW 87101490 A TW87101490 A TW 87101490A TW 373261 B TW373261 B TW 373261B
Authority
TW
Taiwan
Prior art keywords
oxygen
etching
reactive gas
chlorine
gate electrode
Prior art date
Application number
TW087101490A
Other languages
Chinese (zh)
Inventor
Hong-Yuan Tao
jia-xiong Cai
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW087101490A priority Critical patent/TW373261B/en
Application granted granted Critical
Publication of TW373261B publication Critical patent/TW373261B/en

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Abstract

A kind of method of processing gate electrode etching integrated circuit: etching process is classified as the three steps continually as follows: etching bottom part an-reflection layer and hard protection cover, to remove light block and bottom anti-reflective layer, and etch silicon thin film. Wherein etch bottom part anti-reflective layer is with one group of oxygen/hydrogen bromide, or oxygen/nitrogen, or oxygen/chlorine, or oxygen/carbon tetrafluoride, or oxygen/bicarbon hexafluoride as reactive gas, etch hard protection cover is by using one group of chlorine, or carbon tetrafluoride, or bicarbon hexafluoride as reactive gas; to remove light block and bottom anti-reflective layer is by oxygen as reactive gas; etching silicon thin film reactive gas as chlorine bromide and hydrogen bromide. The three etching steps are to be processed within the same etching mouth.
TW087101490A 1998-02-05 1998-02-05 Method of processing gate electrode etching integrated circuit TW373261B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW087101490A TW373261B (en) 1998-02-05 1998-02-05 Method of processing gate electrode etching integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW087101490A TW373261B (en) 1998-02-05 1998-02-05 Method of processing gate electrode etching integrated circuit

Publications (1)

Publication Number Publication Date
TW373261B true TW373261B (en) 1999-11-01

Family

ID=57941699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087101490A TW373261B (en) 1998-02-05 1998-02-05 Method of processing gate electrode etching integrated circuit

Country Status (1)

Country Link
TW (1) TW373261B (en)

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