TW369700B - Intrachip power distribution package and method for semiconductors - Google Patents
Intrachip power distribution package and method for semiconductorsInfo
- Publication number
- TW369700B TW369700B TW087102634A TW87102634A TW369700B TW 369700 B TW369700 B TW 369700B TW 087102634 A TW087102634 A TW 087102634A TW 87102634 A TW87102634 A TW 87102634A TW 369700 B TW369700 B TW 369700B
- Authority
- TW
- Taiwan
- Prior art keywords
- power
- intermediate node
- node
- supply
- intrachip
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
An integrated circuit has a supply node for supplying power to at least one intermediate node coupled to circuitry for receiving power. Rather than transmit power from the supply node to the intermediate node by means of a power bus formed as part of the chip interconnect structure, power us supplied to an external wire which is coupled from the supply to the intermediate node. Other than as connected to the supply node and intermediate node, the wire is electrically isolated from the die. This structure and method for making the semiconductor package allow power to be distributed within a semiconductor chip without sacrificing valuable chip space and without requiring a special lead frame for distributing the power within the semiconductor chip.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/805,391 US5838072A (en) | 1997-02-24 | 1997-02-24 | Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes |
Publications (1)
Publication Number | Publication Date |
---|---|
TW369700B true TW369700B (en) | 1999-09-11 |
Family
ID=25191441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087102634A TW369700B (en) | 1997-02-24 | 1998-02-24 | Intrachip power distribution package and method for semiconductors |
Country Status (2)
Country | Link |
---|---|
US (1) | US5838072A (en) |
TW (1) | TW369700B (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1092857A (en) * | 1996-09-10 | 1998-04-10 | Mitsubishi Electric Corp | Semiconductor package |
US6097098A (en) * | 1997-02-14 | 2000-08-01 | Micron Technology, Inc. | Die interconnections using intermediate connection elements secured to the die face |
FR2769131B1 (en) * | 1997-09-29 | 1999-12-24 | St Microelectronics Sa | SEMICONDUCTOR DEVICE HAVING TWO GROUND CONNECTION POINTS CONNECTED TO A GROUND CONNECTION LEG AND METHOD FOR TESTING SUCH A DEVICE |
US6351040B1 (en) | 1998-01-22 | 2002-02-26 | Micron Technology, Inc. | Method and apparatus for implementing selected functionality on an integrated circuit device |
US6169331B1 (en) | 1998-08-28 | 2001-01-02 | Micron Technology, Inc. | Apparatus for electrically coupling bond pads of a microelectronic device |
JP2001024150A (en) * | 1999-07-06 | 2001-01-26 | Sony Corp | Semiconductor device |
US6392428B1 (en) * | 1999-11-16 | 2002-05-21 | Eaglestone Partners I, Llc | Wafer level interposer |
US6483043B1 (en) | 2000-05-19 | 2002-11-19 | Eaglestone Partners I, Llc | Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip |
US6529081B1 (en) | 2000-06-08 | 2003-03-04 | Zeta, Division Of Sierra Tech Inc. | Method of operating a solid state power amplifying device |
AU2001268597A1 (en) * | 2000-07-06 | 2002-01-21 | Zeta, A Division Of Sierratech, Inc. | A solid state power amplifying device |
US6537831B1 (en) * | 2000-07-31 | 2003-03-25 | Eaglestone Partners I, Llc | Method for selecting components for a matched set using a multi wafer interposer |
US6812048B1 (en) | 2000-07-31 | 2004-11-02 | Eaglestone Partners I, Llc | Method for manufacturing a wafer-interposer assembly |
US6538337B2 (en) * | 2000-08-17 | 2003-03-25 | Samsung Electronics Co., Ltd. | Ball grid array package for providing constant internal voltage via a PCB substrate routing configuration |
US6815712B1 (en) | 2000-10-02 | 2004-11-09 | Eaglestone Partners I, Llc | Method for selecting components for a matched set from a wafer-interposer assembly |
US6686657B1 (en) | 2000-11-07 | 2004-02-03 | Eaglestone Partners I, Llc | Interposer for improved handling of semiconductor wafers and method of use of same |
US20020078401A1 (en) * | 2000-12-15 | 2002-06-20 | Fry Michael Andrew | Test coverage analysis system |
US6529022B2 (en) | 2000-12-15 | 2003-03-04 | Eaglestone Pareners I, Llc | Wafer testing interposer for a conventional package |
US20020076854A1 (en) * | 2000-12-15 | 2002-06-20 | Pierce John L. | System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates |
US6524885B2 (en) * | 2000-12-15 | 2003-02-25 | Eaglestone Partners I, Llc | Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques |
US6673653B2 (en) * | 2001-02-23 | 2004-01-06 | Eaglestone Partners I, Llc | Wafer-interposer using a ceramic substrate |
US6608390B2 (en) | 2001-11-13 | 2003-08-19 | Kulicke & Soffa Investments, Inc. | Wirebonded semiconductor package structure and method of manufacture |
US6770982B1 (en) | 2002-01-16 | 2004-08-03 | Marvell International, Ltd. | Semiconductor device power distribution system and method |
US8258616B1 (en) | 2002-01-16 | 2012-09-04 | Marvell International Ltd. | Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads |
US6861762B1 (en) * | 2002-05-01 | 2005-03-01 | Marvell Semiconductor Israel Ltd. | Flip chip with novel power and ground arrangement |
TW582100B (en) * | 2002-05-30 | 2004-04-01 | Fujitsu Ltd | Semiconductor device having a heat spreader exposed from a seal resin |
US7157790B2 (en) * | 2002-07-31 | 2007-01-02 | Microchip Technology Inc. | Single die stitch bonding |
US7326594B2 (en) * | 2002-07-31 | 2008-02-05 | Microchip Technology Incorporated | Connecting a plurality of bond pads and/or inner leads with a single bond wire |
US20050230850A1 (en) * | 2004-04-20 | 2005-10-20 | Taggart Brian C | Microelectronic assembly having a redistribution conductor over a microelectronic die |
US7737553B2 (en) * | 2004-10-06 | 2010-06-15 | Panasonic Corporation | Semiconductor device |
JP2010087403A (en) * | 2008-10-02 | 2010-04-15 | Elpida Memory Inc | Semiconductor device |
JP2010192680A (en) * | 2009-02-18 | 2010-09-02 | Elpida Memory Inc | Semiconductor device |
US8448118B2 (en) | 2011-02-22 | 2013-05-21 | International Business Machines Corporation | Determining intra-die wirebond pad placement locations in integrated circuit |
US9196598B1 (en) | 2014-06-12 | 2015-11-24 | Freescale Semiconductor, Inc. | Semiconductor device having power distribution using bond wires |
US10217717B2 (en) * | 2015-11-18 | 2019-02-26 | Stmicroelectronics (Rousset) Sas | Distribution of electronic circuit power supply potentials |
US9721928B1 (en) | 2016-04-28 | 2017-08-01 | Nxp Usa, Inc. | Integrated circuit package having two substrates |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5276352A (en) * | 1990-11-15 | 1994-01-04 | Kabushiki Kaisha Toshiba | Resin sealed semiconductor device having power source by-pass connecting line |
US5172471A (en) * | 1991-06-21 | 1992-12-22 | Vlsi Technology, Inc. | Method of providing power to an integrated circuit |
KR940006187Y1 (en) * | 1991-10-15 | 1994-09-10 | 금성일렉트론 주식회사 | Semiconductor device |
US5170312A (en) * | 1991-11-04 | 1992-12-08 | Motorola, Inc. | Protection circuit on a lead of a power device |
FR2701153B1 (en) * | 1993-02-02 | 1995-04-07 | Matra Marconi Space France | Semiconductor memory component and module. |
JPH07130788A (en) * | 1993-09-09 | 1995-05-19 | Mitsubishi Electric Corp | Semiconductor integrated circuit device |
US5686764A (en) * | 1996-03-20 | 1997-11-11 | Lsi Logic Corporation | Flip chip package with reduced number of package layers |
US5723906A (en) * | 1996-06-07 | 1998-03-03 | Hewlett-Packard Company | High-density wirebond chip interconnect for multi-chip modules |
-
1997
- 1997-02-24 US US08/805,391 patent/US5838072A/en not_active Expired - Lifetime
-
1998
- 1998-02-24 TW TW087102634A patent/TW369700B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5838072A (en) | 1998-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |