TW368466B - Method for manufacturing plastic film - Google Patents

Method for manufacturing plastic film

Info

Publication number
TW368466B
TW368466B TW087109366A TW87109366A TW368466B TW 368466 B TW368466 B TW 368466B TW 087109366 A TW087109366 A TW 087109366A TW 87109366 A TW87109366 A TW 87109366A TW 368466 B TW368466 B TW 368466B
Authority
TW
Taiwan
Prior art keywords
plastic film
punching
manufacturing plastic
discharge
electrodes
Prior art date
Application number
TW087109366A
Other languages
English (en)
Inventor
Kazunari Takagi
Original Assignee
Kazunari Takagi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kazunari Takagi filed Critical Kazunari Takagi
Application granted granted Critical
Publication of TW368466B publication Critical patent/TW368466B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
    • B26F1/28—Perforating by non-mechanical means, e.g. by fluid jet by electrical discharges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/10—Surface shaping of articles, e.g. embossing; Apparatus therefor by electric discharge treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/041—By heating or cooling
    • Y10T83/0414—At localized area [e.g., line of separation]

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
TW087109366A 1997-08-05 1998-06-12 Method for manufacturing plastic film TW368466B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22309397A JP4004596B2 (ja) 1997-08-05 1997-08-05 プラスチックフィルムの製造方法

Publications (1)

Publication Number Publication Date
TW368466B true TW368466B (en) 1999-09-01

Family

ID=16792732

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087109366A TW368466B (en) 1997-08-05 1998-06-12 Method for manufacturing plastic film

Country Status (10)

Country Link
US (1) US6348675B1 (zh)
EP (1) EP1001869B1 (zh)
JP (1) JP4004596B2 (zh)
KR (1) KR100282019B1 (zh)
CN (1) CN1075977C (zh)
AU (1) AU755497B2 (zh)
CA (1) CA2301668A1 (zh)
DE (1) DE69804806T2 (zh)
TW (1) TW368466B (zh)
WO (1) WO1999007530A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1147385C (zh) * 1999-03-29 2004-04-28 财团法人工业技术研究院 利用电弧加工薄膜细孔的装置与方法
EP1744860B1 (en) * 2004-04-01 2012-02-01 PicoDrill SA Manufacturing and use of microperforated substrates
US8389903B2 (en) * 2007-11-09 2013-03-05 Picodrill Sa Electrothermal focussing for the production of micro-structured substrates
CN102271881B (zh) * 2008-12-02 2015-04-29 皮可钻机公司 将结构引入衬底中的方法
DE102010025966B4 (de) 2010-07-02 2012-03-08 Schott Ag Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
DE102010025967B4 (de) 2010-07-02 2015-12-10 Schott Ag Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
DE102010025968B4 (de) * 2010-07-02 2016-06-02 Schott Ag Erzeugung von Mikrolöchern
DE102010025969A1 (de) 2010-07-02 2012-01-05 Schott Ag Locherzeugung mit Mehrfach-Elektroden
EP2564996A1 (en) * 2011-08-31 2013-03-06 Asahi Glass Company, Limited A method of generating a hole or recess or well in an electrically insulating or semiconducting substrate
ES2657606T3 (es) * 2013-09-12 2018-03-06 Agie Charmilles Sa Método y aparato para mecanizado por electroerosión de una pieza
NO342507B1 (en) 2017-03-29 2018-06-04 Condalign As A method for forming av body comprising at least one through-going passage

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2678373A (en) * 1951-02-10 1954-05-11 John W Meaker Method and apparatus for electrically perforating dielectric sheet materials
US3622751A (en) * 1969-06-12 1971-11-23 Cons Paper Bahamas Ltd Method and apparatus for electrically perforating sheet or web material
US4447709A (en) * 1976-05-25 1984-05-08 Olin Corporation Method for electrically perforating dielectric webs
DE2833527A1 (de) * 1977-08-05 1979-02-15 Molins Ltd Vorrichtung zum perforieren einer materialbahn
JPS5441339A (en) * 1977-09-07 1979-04-02 Ajinomoto Kk Quality control method and apparatus of feed stock dough for producing food
DE2802315C2 (de) * 1978-01-20 1987-02-05 Hauni-Werke Körber & Co KG, 2050 Hamburg Vorrichtung zum Perforieren von Bahnen aus Umhüllungsmaterial für Zigaretten oder andere stabförmige Rauchartikel und Verwendung der Vorrichtung
DE3016622A1 (de) * 1980-04-30 1981-11-19 Softal Elektronik Erik Blumenfeld Kg, 2000 Hamburg Verfahren und vorrichtung zur herstellung von perforiertem papier
JPH0783999B2 (ja) * 1992-04-07 1995-09-13 栄電子工業株式会社 基板材料の小径穴加工方法

Also Published As

Publication number Publication date
JP4004596B2 (ja) 2007-11-07
EP1001869B1 (en) 2002-04-10
AU8638698A (en) 1999-03-01
JPH1148198A (ja) 1999-02-23
EP1001869A1 (en) 2000-05-24
KR19990023195A (ko) 1999-03-25
DE69804806D1 (de) 2002-05-16
DE69804806T2 (de) 2002-11-14
US6348675B1 (en) 2002-02-19
CN1075977C (zh) 2001-12-12
KR100282019B1 (ko) 2001-02-15
AU755497B2 (en) 2002-12-12
CA2301668A1 (en) 1999-02-18
WO1999007530A1 (en) 1999-02-18
CN1207340A (zh) 1999-02-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees