TW367156U - Internal devices and electronic devices - Google Patents

Internal devices and electronic devices

Info

Publication number
TW367156U
TW367156U TW087200044U TW87200044U TW367156U TW 367156 U TW367156 U TW 367156U TW 087200044 U TW087200044 U TW 087200044U TW 87200044 U TW87200044 U TW 87200044U TW 367156 U TW367156 U TW 367156U
Authority
TW
Taiwan
Prior art keywords
devices
internal
electronic
electronic devices
internal devices
Prior art date
Application number
TW087200044U
Other languages
English (en)
Inventor
Yasuhide Kitaoka
Original Assignee
Teac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teac Corp filed Critical Teac Corp
Publication of TW367156U publication Critical patent/TW367156U/zh

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW087200044U 1996-07-12 1997-07-08 Internal devices and electronic devices TW367156U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08183847A JP3099740B2 (ja) 1996-07-12 1996-07-12 内蔵装置及び電子装置

Publications (1)

Publication Number Publication Date
TW367156U true TW367156U (en) 1999-08-11

Family

ID=16142882

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087200044U TW367156U (en) 1996-07-12 1997-07-08 Internal devices and electronic devices

Country Status (3)

Country Link
US (1) US5956227A (zh)
JP (1) JP3099740B2 (zh)
TW (1) TW367156U (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4015754B2 (ja) * 1998-06-23 2007-11-28 株式会社東芝 冷却装置および冷却装置を有する電子機器
US6473297B1 (en) * 1999-04-23 2002-10-29 Inclose Design, Inc. Memory storage device docking adapted having a laterally mounted fan
US8181043B1 (en) 1999-05-11 2012-05-15 Cyber Switching, Inc. Methods and apparatus for improved remotely switchable power supply
US6496366B1 (en) * 1999-10-26 2002-12-17 Rackable Systems, Llc High density computer equipment storage system
US6850408B1 (en) 1999-10-26 2005-02-01 Rackable Systems, Inc. High density computer equipment storage systems
US6667891B2 (en) 2000-02-18 2003-12-23 Rackable Systems, Inc. Computer chassis for dual offset opposing main boards
US6491298B1 (en) * 2000-06-27 2002-12-10 Igt Thermal management system for a gaming machine
US6525933B2 (en) * 2001-01-31 2003-02-25 Hewlett-Packard Company Computer peripheral mounting bracket
JP2002261476A (ja) * 2001-02-28 2002-09-13 Toshiba Corp 冷却モジュールの接地構造及び方法並びに該構造を有する電子機器
US6804123B1 (en) * 2003-04-01 2004-10-12 King Young Technology Co., Ltd. Computer mainframe with superposed architecture
US7508663B2 (en) * 2003-12-29 2009-03-24 Rackable Systems, Inc. Computer rack cooling system with variable airflow impedance
US20050213292A1 (en) * 2004-03-24 2005-09-29 Yin-Hung Chen Internal arrangement of computer case
US7123477B2 (en) * 2004-03-31 2006-10-17 Rackable Systems, Inc. Computer rack cooling system
JP4700471B2 (ja) * 2005-10-25 2011-06-15 株式会社リコー 情報処理装置、及びその製造方法
US7626815B2 (en) * 2005-11-14 2009-12-01 Nvidia Corporation Drive bay heat exchanger
US8282492B2 (en) * 2006-11-08 2012-10-09 Wms Gaming Inc. Gaming machine ventilation system
JP5086047B2 (ja) * 2007-12-07 2012-11-28 株式会社日立製作所 受信装置
US7843685B2 (en) * 2008-04-22 2010-11-30 International Business Machines Corporation Duct system for high power adapter cards
US9426932B2 (en) 2013-03-13 2016-08-23 Silicon Graphics International Corp. Server with heat pipe cooling
US9612920B2 (en) 2013-03-15 2017-04-04 Silicon Graphics International Corp. Hierarchical system manager rollback
JP5688867B1 (ja) 2014-06-11 2015-03-25 トタニ技研工業株式会社 製袋機
JP6892613B1 (ja) * 2019-12-17 2021-06-23 富士通クライアントコンピューティング株式会社 電子機器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754397A (en) * 1985-02-15 1988-06-28 Tandem Computers Incorporated Fault tolerant modular subsystems for computers
US5440450A (en) * 1990-09-14 1995-08-08 Next, Inc. Housing cooling system
JPH04195793A (ja) * 1990-11-26 1992-07-15 Ricoh Co Ltd 光ディスク装置
JP3008559B2 (ja) * 1991-05-31 2000-02-14 ソニー株式会社 光ディスク装置

Also Published As

Publication number Publication date
JP3099740B2 (ja) 2000-10-16
JPH1031535A (ja) 1998-02-03
US5956227A (en) 1999-09-21

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