TW355816B - Drying apparatus and drying method - Google Patents

Drying apparatus and drying method

Info

Publication number
TW355816B
TW355816B TW086115434A TW86115434A TW355816B TW 355816 B TW355816 B TW 355816B TW 086115434 A TW086115434 A TW 086115434A TW 86115434 A TW86115434 A TW 86115434A TW 355816 B TW355816 B TW 355816B
Authority
TW
Taiwan
Prior art keywords
opening
solvent
nozzle
processing groove
displacement device
Prior art date
Application number
TW086115434A
Other languages
English (en)
Chinese (zh)
Inventor
Akinori Matsumoto
Takashi Kuroda
Cozy Ban
Toko Konishi
Naoki Yokoi
Original Assignee
Reoden Semiconductor System Engineering Kk
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reoden Semiconductor System Engineering Kk, Mitsubishi Electric Corp filed Critical Reoden Semiconductor System Engineering Kk
Application granted granted Critical
Publication of TW355816B publication Critical patent/TW355816B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
TW086115434A 1997-04-04 1997-10-20 Drying apparatus and drying method TW355816B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9086598A JPH10284461A (ja) 1997-04-04 1997-04-04 乾燥装置および乾燥方法

Publications (1)

Publication Number Publication Date
TW355816B true TW355816B (en) 1999-04-11

Family

ID=13891460

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115434A TW355816B (en) 1997-04-04 1997-10-20 Drying apparatus and drying method

Country Status (6)

Country Link
US (1) US5996242A (ko)
JP (1) JPH10284461A (ko)
KR (1) KR100272638B1 (ko)
CN (1) CN1195763A (ko)
DE (1) DE19749649C2 (ko)
TW (1) TW355816B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19961533A1 (de) * 1999-12-20 2002-03-28 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
US6519869B2 (en) * 2001-05-15 2003-02-18 United Microelectronics, Corp. Method and apparatus for drying semiconductor wafers
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
KR100447285B1 (ko) * 2002-09-05 2004-09-07 삼성전자주식회사 기판 건조 장치
TWI315388B (en) * 2002-11-28 2009-10-01 Ajinomoto Kk Drum dryer
JP4118194B2 (ja) * 2003-06-02 2008-07-16 横河電機株式会社 洗浄装置
US8596336B2 (en) * 2008-06-03 2013-12-03 Applied Materials, Inc. Substrate support temperature control
JP6681853B2 (ja) * 2017-06-16 2020-04-15 株式会社大気社 塗装乾燥炉
CN109395424B (zh) * 2018-10-30 2020-10-09 焦作中维特品药业股份有限公司 一种聚维酮干燥系统及干燥方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61241927A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 蒸気乾燥装置
US5183067A (en) * 1988-07-08 1993-02-02 Isc Chemicals Limited Cleaning and drying of electronic assemblies
JPH0370134A (ja) * 1989-08-09 1991-03-26 Fujitsu Ltd 溶剤蒸気乾燥装置および乾燥方法
JPH0479223A (ja) * 1990-07-20 1992-03-12 Fujitsu Ltd 蒸気洗浄装置
JP2902222B2 (ja) * 1992-08-24 1999-06-07 東京エレクトロン株式会社 乾燥処理装置
US5535525A (en) * 1994-03-17 1996-07-16 Vlsi Technology, Inc. Vapor/liquid phase separator for an open tank IPA-dryer

Also Published As

Publication number Publication date
US5996242A (en) 1999-12-07
JPH10284461A (ja) 1998-10-23
KR19980079389A (ko) 1998-11-25
DE19749649C2 (de) 2002-09-19
KR100272638B1 (ko) 2001-01-15
DE19749649A1 (de) 1998-10-08
CN1195763A (zh) 1998-10-14

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