TW351855B - Lead frame manufacturing method - Google Patents

Lead frame manufacturing method

Info

Publication number
TW351855B
TW351855B TW086115137A TW86115137A TW351855B TW 351855 B TW351855 B TW 351855B TW 086115137 A TW086115137 A TW 086115137A TW 86115137 A TW86115137 A TW 86115137A TW 351855 B TW351855 B TW 351855B
Authority
TW
Taiwan
Prior art keywords
lead frame
photosensitive film
substrate
frame manufacturing
resultant structure
Prior art date
Application number
TW086115137A
Other languages
Chinese (zh)
Inventor
Wook-Yeol Ryu
Sang-Kyun Lee
Original Assignee
Samsung Aerospace Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019960048124A external-priority patent/KR100243369B1/en
Priority claimed from KR1019960080048A external-priority patent/KR100203331B1/en
Application filed by Samsung Aerospace Ind Ltd filed Critical Samsung Aerospace Ind Ltd
Application granted granted Critical
Publication of TW351855B publication Critical patent/TW351855B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A method for manufacturing a lead frame includes the steps: (a) preheating a substrate and laminating a photosensitive film on each surface of the substrate; (b) exposing and developing the laminated substrate to from a photosensitive film pattern; (c) etching the resultant structure of the step (b) to form a lead frame pattern; (d) removing the photosensitive film pattern; (e) selectively plating layer; (f) performing downsetting and taping steps on the resultant structure of the step (e) in sequence.
TW086115137A 1996-10-24 1997-10-15 Lead frame manufacturing method TW351855B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019960048124A KR100243369B1 (en) 1996-10-24 1996-10-24 Method of continuously manufacturing a lead frame
KR1019960080048A KR100203331B1 (en) 1996-12-31 1996-12-31 Method manufacture of lead frame

Publications (1)

Publication Number Publication Date
TW351855B true TW351855B (en) 1999-02-01

Family

ID=26632224

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115137A TW351855B (en) 1996-10-24 1997-10-15 Lead frame manufacturing method

Country Status (3)

Country Link
JP (1) JPH10135387A (en)
CN (1) CN1123068C (en)
TW (1) TW351855B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406543B (en) * 2005-12-23 2013-08-21 馬維爾西斯班尼亞公司 Method of signal transmission and reception with different sampling frequencies

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114481239B (en) * 2022-04-06 2022-06-24 新恒汇电子股份有限公司 Flexible lead frame preparation process capable of avoiding electroplating of blind holes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406543B (en) * 2005-12-23 2013-08-21 馬維爾西斯班尼亞公司 Method of signal transmission and reception with different sampling frequencies

Also Published As

Publication number Publication date
CN1123068C (en) 2003-10-01
CN1184329A (en) 1998-06-10
JPH10135387A (en) 1998-05-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees