TW347460B - Flat bottom components and flat bottom architecture for fluid and gas systems - Google Patents

Flat bottom components and flat bottom architecture for fluid and gas systems

Info

Publication number
TW347460B
TW347460B TW085108272A TW85108272A TW347460B TW 347460 B TW347460 B TW 347460B TW 085108272 A TW085108272 A TW 085108272A TW 85108272 A TW85108272 A TW 85108272A TW 347460 B TW347460 B TW 347460B
Authority
TW
Taiwan
Prior art keywords
flat bottom
fluid
architecture
gas systems
components
Prior art date
Application number
TW085108272A
Other languages
English (en)
Inventor
M Manofsky William Jr
M Kaczorowski Edward
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW347460B publication Critical patent/TW347460B/zh

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K13/00Other constructional types of cut-off apparatus; Arrangements for cutting-off
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
TW085108272A 1995-11-29 1996-07-09 Flat bottom components and flat bottom architecture for fluid and gas systems TW347460B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56446695A 1995-11-29 1995-11-29

Publications (1)

Publication Number Publication Date
TW347460B true TW347460B (en) 1998-12-11

Family

ID=24254584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085108272A TW347460B (en) 1995-11-29 1996-07-09 Flat bottom components and flat bottom architecture for fluid and gas systems

Country Status (4)

Country Link
EP (1) EP0777259A1 (zh)
JP (1) JPH09184577A (zh)
KR (1) KR970028015A (zh)
TW (1) TW347460B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6394138B1 (en) 1996-10-30 2002-05-28 Unit Instruments, Inc. Manifold system of removable components for distribution of fluids
US6293310B1 (en) 1996-10-30 2001-09-25 Unit Instruments, Inc. Gas panel
US5992463A (en) 1996-10-30 1999-11-30 Unit Instruments, Inc. Gas panel
JP2007078141A (ja) * 2005-09-16 2007-03-29 Ckd Corp 空圧制御機器ユニット
US8307854B1 (en) 2009-05-14 2012-11-13 Vistadeltek, Inc. Fluid delivery substrates for building removable standard fluid delivery sticks
SG176152A1 (en) 2009-06-10 2011-12-29 Vistadeltek Llc Extreme flow rate and/or high temperature fluid delivery substrates

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166976A (ja) * 1985-01-17 1986-07-28 Anelva Corp 表面処理方法
JPS61271836A (ja) * 1985-05-28 1986-12-02 Ulvac Corp ドライエツチング装置
US4612077A (en) * 1985-07-29 1986-09-16 The Perkin-Elmer Corporation Electrode for plasma etching system
ES2058132T3 (es) * 1986-12-19 1994-11-01 Applied Materials Inc Reactor para ataque en plasma intensificado por un campo magnetico.
JPH02101740A (ja) * 1988-10-11 1990-04-13 Anelva Corp プラズマエッチング装置
DE3914065A1 (de) * 1989-04-28 1990-10-31 Leybold Ag Vorrichtung zur durchfuehrung von plasma-aetzverfahren
DE69024719T2 (de) * 1989-08-14 1996-10-02 Applied Materials Inc Gasverteilungssystem und Verfahren zur Benutzung dieses Systems
DE4011933C2 (de) * 1990-04-12 1996-11-21 Balzers Hochvakuum Verfahren zur reaktiven Oberflächenbehandlung eines Werkstückes sowie Behandlungskammer hierfür
US5266153A (en) * 1992-06-16 1993-11-30 National Semiconductor Corp. Gas distribution head for plasma deposition and etch systems
US5589002A (en) * 1994-03-24 1996-12-31 Applied Materials, Inc. Gas distribution plate for semiconductor wafer processing apparatus with means for inhibiting arcing

Also Published As

Publication number Publication date
KR970028015A (ko) 1997-06-24
EP0777259A1 (en) 1997-06-04
JPH09184577A (ja) 1997-07-15

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