TW338184B - The bonding method for improving heat-spreader of package device - Google Patents

The bonding method for improving heat-spreader of package device

Info

Publication number
TW338184B
TW338184B TW084106667A TW84106667A TW338184B TW 338184 B TW338184 B TW 338184B TW 084106667 A TW084106667 A TW 084106667A TW 84106667 A TW84106667 A TW 84106667A TW 338184 B TW338184 B TW 338184B
Authority
TW
Taiwan
Prior art keywords
spreader
heat
bonding method
die paddle
improving heat
Prior art date
Application number
TW084106667A
Other languages
Chinese (zh)
Inventor
xing-sheng Wang
Jian-Dih Jeng
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW084106667A priority Critical patent/TW338184B/en
Application granted granted Critical
Publication of TW338184B publication Critical patent/TW338184B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Die Bonding (AREA)

Abstract

A method for improving heat spreading of semiconductor device, it is especially the bonding method for die paddle of lead frame and heat-spreader, and includes: - Heat-spreader has protruding neck, which is the piece recessed into recess portion. And the depth of recess portion can instead of the depth die paddle of lead frame. - Die paddle has hollow portion. It is by using mold tool to press the hollow portion of die paddle into protruding neck of heat-spreader, then directly bonding the chip on the heat-spreader.
TW084106667A 1995-06-29 1995-06-29 The bonding method for improving heat-spreader of package device TW338184B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW084106667A TW338184B (en) 1995-06-29 1995-06-29 The bonding method for improving heat-spreader of package device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW084106667A TW338184B (en) 1995-06-29 1995-06-29 The bonding method for improving heat-spreader of package device

Publications (1)

Publication Number Publication Date
TW338184B true TW338184B (en) 1998-08-11

Family

ID=58263267

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084106667A TW338184B (en) 1995-06-29 1995-06-29 The bonding method for improving heat-spreader of package device

Country Status (1)

Country Link
TW (1) TW338184B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108493169A (en) * 2018-05-31 2018-09-04 江苏长电科技股份有限公司 Packaging structure without base island frame and process method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108493169A (en) * 2018-05-31 2018-09-04 江苏长电科技股份有限公司 Packaging structure without base island frame and process method thereof

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent