TW335506B - Pattern process alignment - Google Patents
Pattern process alignmentInfo
- Publication number
- TW335506B TW335506B TW086114713A TW86114713A TW335506B TW 335506 B TW335506 B TW 335506B TW 086114713 A TW086114713 A TW 086114713A TW 86114713 A TW86114713 A TW 86114713A TW 335506 B TW335506 B TW 335506B
- Authority
- TW
- Taiwan
- Prior art keywords
- pattern process
- process alignment
- alignment
- pattern
- layer
- Prior art date
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The first layer has a circuit pattern on wafer. Then, to form a related pattern for process at second layer. It is used for alignment process with transparent film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086114713A TW335506B (en) | 1997-10-07 | 1997-10-07 | Pattern process alignment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086114713A TW335506B (en) | 1997-10-07 | 1997-10-07 | Pattern process alignment |
Publications (1)
Publication Number | Publication Date |
---|---|
TW335506B true TW335506B (en) | 1998-07-01 |
Family
ID=58263063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086114713A TW335506B (en) | 1997-10-07 | 1997-10-07 | Pattern process alignment |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW335506B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6245248B1 (en) * | 1998-11-02 | 2001-06-12 | Dbtel Incorporated | Method of aligning a nozzle plate with a mask |
-
1997
- 1997-10-07 TW TW086114713A patent/TW335506B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6245248B1 (en) * | 1998-11-02 | 2001-06-12 | Dbtel Incorporated | Method of aligning a nozzle plate with a mask |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |