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Application filed by Microjet Technology Co LtdfiledCriticalMicrojet Technology Co Ltd
Priority to TW086114713ApriorityCriticalpatent/TW335506B/en
Application grantedgrantedCritical
Publication of TW335506BpublicationCriticalpatent/TW335506B/en
The first layer has a circuit pattern on wafer. Then, to form a related pattern for process at second layer. It is used for alignment process with transparent film.
TW086114713A1997-10-071997-10-07Pattern process alignment
TW335506B
(en)