TW333743B - The method for producing multi-layers circuit board - Google Patents

The method for producing multi-layers circuit board

Info

Publication number
TW333743B
TW333743B TW086104905A TW86104905A TW333743B TW 333743 B TW333743 B TW 333743B TW 086104905 A TW086104905 A TW 086104905A TW 86104905 A TW86104905 A TW 86104905A TW 333743 B TW333743 B TW 333743B
Authority
TW
Taiwan
Prior art keywords
circuit board
layer
foil
blind hole
barrier
Prior art date
Application number
TW086104905A
Other languages
Chinese (zh)
Inventor
Ding-Haw Lin
Original Assignee
Compeq Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd
Priority to TW086104905A priority Critical patent/TW333743B/en
Application granted granted Critical
Publication of TW333743B publication Critical patent/TW333743B/en

Links

Abstract

A producing method for multi-layers circuit board by using sand-blasting to form blind hole, includes: - Form inter-Cu foil wiring on hard board. - Cover insulating layer, and press Cu foil. - Cover barrier, and by the opening that is defined by barrier to proceed etching for Cu foil, to expose portion of insulating layer. - Use barrier as mask, to proceed sand blasting for insulating layer located inside the opening, to remove insulating layer inside the opening, and form blind hole for exposing inter-Cu foil wiring. - Remove barrier layer. - Proceed electroplating, to form electroplating layer stuck on external surface and each blind hole. - Define electroplating layer to form outer-layer Cu foil wiring. - Based on the desiring of circuit board layers, to repeat above steps till forming desiring circuit board layers. Compose a multi-circuit board producing method to connect Cu foil wiring on each layer by vertical blind hole.
TW086104905A 1997-04-16 1997-04-16 The method for producing multi-layers circuit board TW333743B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086104905A TW333743B (en) 1997-04-16 1997-04-16 The method for producing multi-layers circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086104905A TW333743B (en) 1997-04-16 1997-04-16 The method for producing multi-layers circuit board

Publications (1)

Publication Number Publication Date
TW333743B true TW333743B (en) 1998-06-11

Family

ID=58262935

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104905A TW333743B (en) 1997-04-16 1997-04-16 The method for producing multi-layers circuit board

Country Status (1)

Country Link
TW (1) TW333743B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10039184B2 (en) 2016-11-30 2018-07-31 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10039184B2 (en) 2016-11-30 2018-07-31 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof

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