TW333743B - The method for producing multi-layers circuit board - Google Patents
The method for producing multi-layers circuit boardInfo
- Publication number
- TW333743B TW333743B TW086104905A TW86104905A TW333743B TW 333743 B TW333743 B TW 333743B TW 086104905 A TW086104905 A TW 086104905A TW 86104905 A TW86104905 A TW 86104905A TW 333743 B TW333743 B TW 333743B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- layer
- foil
- blind hole
- barrier
- Prior art date
Links
Abstract
A producing method for multi-layers circuit board by using sand-blasting to form blind hole, includes: - Form inter-Cu foil wiring on hard board. - Cover insulating layer, and press Cu foil. - Cover barrier, and by the opening that is defined by barrier to proceed etching for Cu foil, to expose portion of insulating layer. - Use barrier as mask, to proceed sand blasting for insulating layer located inside the opening, to remove insulating layer inside the opening, and form blind hole for exposing inter-Cu foil wiring. - Remove barrier layer. - Proceed electroplating, to form electroplating layer stuck on external surface and each blind hole. - Define electroplating layer to form outer-layer Cu foil wiring. - Based on the desiring of circuit board layers, to repeat above steps till forming desiring circuit board layers. Compose a multi-circuit board producing method to connect Cu foil wiring on each layer by vertical blind hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086104905A TW333743B (en) | 1997-04-16 | 1997-04-16 | The method for producing multi-layers circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086104905A TW333743B (en) | 1997-04-16 | 1997-04-16 | The method for producing multi-layers circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
TW333743B true TW333743B (en) | 1998-06-11 |
Family
ID=58262935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086104905A TW333743B (en) | 1997-04-16 | 1997-04-16 | The method for producing multi-layers circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW333743B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10039184B2 (en) | 2016-11-30 | 2018-07-31 | Unimicron Technology Corp. | Circuit board structure and manufacturing method thereof |
-
1997
- 1997-04-16 TW TW086104905A patent/TW333743B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10039184B2 (en) | 2016-11-30 | 2018-07-31 | Unimicron Technology Corp. | Circuit board structure and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6204453B1 (en) | Two signal one power plane circuit board | |
US7353590B2 (en) | Method of forming printed circuit card | |
US5258094A (en) | Method for producing multilayer printed wiring boards | |
EP1194021A3 (en) | Method of producing multilayer printed wiring board and multilayer printed wiring board | |
US5433000A (en) | Manufacturing method for a multilayer wiring board | |
US5733468A (en) | Pattern plating method for fabricating printed circuit boards | |
EP0256778A3 (en) | Multi-layer printed circuit structure | |
JPH1051137A (en) | Method for manufacturing printed wiring board | |
TW333743B (en) | The method for producing multi-layers circuit board | |
TW200723971A (en) | Via hole having fine hole land and method for forming the same | |
JPH02501175A (en) | Manufacturing method of laminated circuit board | |
JP2000269645A (en) | Manufacture of multilayer printed wiring board | |
JP2006294956A (en) | Multilayer printed circuit board and its manufacturing method | |
JP2001189559A (en) | Method of manufacturing built-up printed wiring board | |
US20010004489A1 (en) | Printed circuit boards with solid interconnect and method of producing the same | |
JPH07307564A (en) | Manufacture of wiring board | |
TW200504979A (en) | Method of forming multilayer interconnection structure, and manufacturing method for multilayer wiring boards | |
JP2004518307A (en) | Method of making a wiring having a coarse conductor structure and at least one region with a fine conductor structure | |
KR20180129002A (en) | Method of manufacturing the circuit board | |
JP3991198B2 (en) | Multilayer printed circuit board and manufacturing method thereof | |
JPH06252529A (en) | Manufacture of printed wiring board | |
JP3817291B2 (en) | Printed wiring board | |
JPH1013017A (en) | Manufacture of printed wiring board | |
JP2007288102A (en) | Printed circuit board, multilayer printed circuit board and method for manufacturing the same | |
KR100332516B1 (en) | Method of making blind-via hole in PCB |