TW332911B - A testing device for semiconductor integratd circuit - Google Patents

A testing device for semiconductor integratd circuit

Info

Publication number
TW332911B
TW332911B TW086102032A TW86102032A TW332911B TW 332911 B TW332911 B TW 332911B TW 086102032 A TW086102032 A TW 086102032A TW 86102032 A TW86102032 A TW 86102032A TW 332911 B TW332911 B TW 332911B
Authority
TW
Taiwan
Prior art keywords
tester
semiconductor
testing device
frame
wafer
Prior art date
Application number
TW086102032A
Other languages
English (en)
Inventor
Kazunari Suga
Original Assignee
Adoban Tesuto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adoban Tesuto Kk filed Critical Adoban Tesuto Kk
Application granted granted Critical
Publication of TW332911B publication Critical patent/TW332911B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
TW086102032A 1996-02-27 1997-02-20 A testing device for semiconductor integratd circuit TW332911B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8039758A JPH09232391A (ja) 1996-02-27 1996-02-27 Ｉｃ試験装置

Publications (1)

Publication Number Publication Date
TW332911B true TW332911B (en) 1998-06-01

Family

ID=12561859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086102032A TW332911B (en) 1996-02-27 1997-02-20 A testing device for semiconductor integratd circuit

Country Status (6)

Country Link
US (1) US6184697B1 (zh)
JP (1) JPH09232391A (zh)
KR (1) KR970062717A (zh)
CN (1) CN1164762A (zh)
DE (1) DE19708037C2 (zh)
TW (1) TW332911B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468023B1 (en) * 1998-12-02 2002-10-22 Delta Design, Inc. Apparatus and method for inverting an IC device
US6568286B1 (en) 2000-06-02 2003-05-27 Honeywell International Inc. 3D array of integrated cells for the sampling and detection of air bound chemical and biological species
DE10130977A1 (de) * 2001-06-27 2003-01-16 Infineon Technologies Ag Nadelkarte zum Testen integrierter Schaltungen

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3204272B2 (ja) 1991-12-09 2001-09-04 株式会社アドバンテスト Ｉｃ試験装置のテストヘッドの構造
US5479108A (en) * 1992-11-25 1995-12-26 David Cheng Method and apparatus for handling wafers
KR100291109B1 (ko) * 1993-05-31 2001-06-01 히가시 데쓰로 반도체 웨이퍼의 버언 인 검사기능을 구비한 프로우브 검사 및 리페어장치, 및 반도체 웨이퍼의 버언 인 검사장치
JP2967798B2 (ja) 1993-12-16 1999-10-25 株式会社東京精密 ウエハプローバ

Also Published As

Publication number Publication date
DE19708037C2 (de) 2001-02-08
CN1164762A (zh) 1997-11-12
KR970062717A (ko) 1997-09-12
US6184697B1 (en) 2001-02-06
JPH09232391A (ja) 1997-09-05
DE19708037A1 (de) 1997-08-28

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