TW328176B - Fabrication method of capacitor for DRAM - Google Patents

Fabrication method of capacitor for DRAM

Info

Publication number
TW328176B
TW328176B TW084103727A TW84103727A TW328176B TW 328176 B TW328176 B TW 328176B TW 084103727 A TW084103727 A TW 084103727A TW 84103727 A TW84103727 A TW 84103727A TW 328176 B TW328176 B TW 328176B
Authority
TW
Taiwan
Prior art keywords
forming
layer
capacitor
conducting layer
side electrode
Prior art date
Application number
TW084103727A
Other languages
Chinese (zh)
Inventor
Yeun-Ding Horng
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW084103727A priority Critical patent/TW328176B/en
Application granted granted Critical
Publication of TW328176B publication Critical patent/TW328176B/en

Links

Landscapes

  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A fabrication method of capacitor for DRAM applied to a substrate with MOS transistors includes a. forming a protecting layer on the substrate with a contact plug to expose the drain or the source area b. forming the first conducting layer on the protecting layer connected to the drain/soure area through the contact plug c. forming plural shielding islands on the first conducting layer d. forming an insulating layer on the part of the first conducting layer not covered by the shielding islands e. forming spacer on the side of the shielding islands f. etching the insulator to be plural slots g. removing the spacer and the shielding islands h. etching the first conducting layer to form plural columns i. removing the insulating layer j. define the first conducting layer to form the bottom-side electrode of the capacitor k. forming a dielectric layer on the bottom-side electrode l. forming the second conducting layer to form the top-side electrode of the capacitor.
TW084103727A 1995-04-15 1995-04-15 Fabrication method of capacitor for DRAM TW328176B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW084103727A TW328176B (en) 1995-04-15 1995-04-15 Fabrication method of capacitor for DRAM

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW084103727A TW328176B (en) 1995-04-15 1995-04-15 Fabrication method of capacitor for DRAM

Publications (1)

Publication Number Publication Date
TW328176B true TW328176B (en) 1998-03-11

Family

ID=58262415

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084103727A TW328176B (en) 1995-04-15 1995-04-15 Fabrication method of capacitor for DRAM

Country Status (1)

Country Link
TW (1) TW328176B (en)

Similar Documents

Publication Publication Date Title
TW359868B (en) DRAM capacitors and production process therefor
KR940002940A (en) Method of forming semiconductor connection device
EP0202477A3 (en) Method of forming an electrical short circuit between adjoining regions in an insulated gate semiconductor device
TW328176B (en) Fabrication method of capacitor for DRAM
JPS6430272A (en) Thin film transistor
TW364205B (en) Method for producing DRAM capacitor
KR940012614A (en) Highly Integrated Semiconductor Junction Device and Manufacturing Method Thereof
TW346672B (en) Method for fabricating a semiconductor memory cell in a DRAM
TW375790B (en) Process for fabricating crown capacitor for DRAM
KR960009113B1 (en) Method for forming node electrode of capacitor
JPS54143076A (en) Semiconductor device and its manufacture
KR870001655A (en) Manufacturing Method of Semiconductor Device
TW239234B (en) Process of DRAM
TW258834B (en) Process of capacitor for DRAM cell
TW278238B (en) Fabrication method of DRAM stacked capacitor
TW279264B (en) Fabrication method of capacitor for DRAM cell
KR0133261B1 (en) Capacitor fabrication method for semiconductor memory
KR0124486B1 (en) Making method of semiconductor device having self-aligned contact
TW368752B (en) Manufacturing method for semiconductor capacitor and electrode board thereof
TW262587B (en) Process for capacitor structure of DRAM
KR980006331A (en) Capacitor Formation Method for Semiconductor Device
TW332913B (en) The process for double-layer crown capacitor
KR970008813B1 (en) Capacitor for semiconductor memory device and manufacturing method thereof
TW269056B (en) Fabricating method for DRAM
KR970018574A (en) Manufacturing Method of Semiconductor Device