TW326562B - The manufacturing processes for butted contact of IC - Google Patents

The manufacturing processes for butted contact of IC

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Publication number
TW326562B
TW326562B TW086109431A TW86109431A TW326562B TW 326562 B TW326562 B TW 326562B TW 086109431 A TW086109431 A TW 086109431A TW 86109431 A TW86109431 A TW 86109431A TW 326562 B TW326562 B TW 326562B
Authority
TW
Taiwan
Prior art keywords
manufacturing processes
contact
substrate surface
butted contact
butted
Prior art date
Application number
TW086109431A
Other languages
Chinese (zh)
Inventor
Jong-Jyh Liaw
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW086109431A priority Critical patent/TW326562B/en
Application granted granted Critical
Publication of TW326562B publication Critical patent/TW326562B/en

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Abstract

A manufacturing processes for butted contact of IC, include the following steps. (a) Form shallow trench isolation, 1st polysilicon layer and transistor on semiconductor substrate; (b) Form a layers dielectric on whole substrate surface; (c) Form contact window of butted contact; (d) Form dielectric on whole substrate surface and inside contact window, and use back etching to form sidewall on each layer edge of contact window; (e) Form 2nd polysilicon layer on whole substrate surface.
TW086109431A 1997-07-04 1997-07-04 The manufacturing processes for butted contact of IC TW326562B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086109431A TW326562B (en) 1997-07-04 1997-07-04 The manufacturing processes for butted contact of IC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086109431A TW326562B (en) 1997-07-04 1997-07-04 The manufacturing processes for butted contact of IC

Publications (1)

Publication Number Publication Date
TW326562B true TW326562B (en) 1998-02-11

Family

ID=58262284

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086109431A TW326562B (en) 1997-07-04 1997-07-04 The manufacturing processes for butted contact of IC

Country Status (1)

Country Link
TW (1) TW326562B (en)

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