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Priority claimed from JP8791994Aexternal-prioritypatent/JP2749773B2/en
Application filed by Furukawa Electric Co LtdfiledCriticalFurukawa Electric Co Ltd
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Publication of TW324688BpublicationCriticalpatent/TW324688B/en
A method for manufacturing a reflow-plated member, which comprises the following steps: forming a plated layer of Sn or Sn alloy on the surface of a base material, the surface of which is formed of Cu or Cu alloy, by electroplating; and running the base material at a traveling speed equivalent to 80% to 96% of the lowest traveling speed at which the plated layer does not melt when the base material is continuously run for reflowing in a heating furnace at a predetermined temperature.
TW084109267A1994-03-311995-09-05A reflow-plated member and a manufacturing method therefor
TW324688B
(en)
Process for obtaining a metallurgical bond between a metal material, or a composite material having a metal matrix, and a metal casting or a metal-alloy casting
PROCESS FOR MAKING A WELL-ADHESIVE METAL DEPOSITION ON A POLYIMIDE, POLYIMIDE-METAL COMPOSITE MATERIAL THUS OBTAINED AND APPLICATION OF THIS MATERIAL TO THE MANUFACTURE OF MOLDED OBJECTS.