TW314483B - - Google Patents

Download PDF

Info

Publication number
TW314483B
TW314483B TW085107471A TW85107471A TW314483B TW 314483 B TW314483 B TW 314483B TW 085107471 A TW085107471 A TW 085107471A TW 85107471 A TW85107471 A TW 85107471A TW 314483 B TW314483 B TW 314483B
Authority
TW
Taiwan
Prior art keywords
light
suction
failure detection
detection device
welding
Prior art date
Application number
TW085107471A
Other languages
English (en)
Chinese (zh)
Original Assignee
Shibuya Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibuya Kogyo Co Ltd filed Critical Shibuya Kogyo Co Ltd
Application granted granted Critical
Publication of TW314483B publication Critical patent/TW314483B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW085107471A 1995-06-30 1996-06-21 TW314483B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18869295A JP4029362B2 (ja) 1995-06-30 1995-06-30 吸着ヘッドの吸着漏れ検知装置

Publications (1)

Publication Number Publication Date
TW314483B true TW314483B (https=) 1997-09-01

Family

ID=16228160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085107471A TW314483B (https=) 1995-06-30 1996-06-21

Country Status (6)

Country Link
US (1) US5742048A (https=)
JP (1) JP4029362B2 (https=)
KR (1) KR100345928B1 (https=)
MY (1) MY114718A (https=)
SG (2) SG78381A1 (https=)
TW (1) TW314483B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1068759A (ja) * 1996-05-31 1998-03-10 Advantest Corp 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法
JP4143788B2 (ja) 1999-08-04 2008-09-03 澁谷工業株式会社 ボールマウント装置及びマウント方法
JP2007201433A (ja) * 2005-12-27 2007-08-09 Nidec-Read Corp 基板保持台
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
CN103801786B (zh) * 2014-01-17 2017-06-20 浙江田中精机股份有限公司 一种直线焊锡机的机械臂机构
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) * 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
CN109154641B (zh) 2016-03-04 2021-09-17 概念集团有限责任公司 具有反射材料增强的真空隔热制品
EP3541722A4 (en) 2016-11-15 2020-07-08 Concept Group LLC MULTIPLE INSULATION ASSEMBLIES
US10823326B2 (en) 2016-11-15 2020-11-03 Concept Group Llc Enhanced vacuum-insulated articles with controlled microporous insulation
JP2020531764A (ja) 2017-08-25 2020-11-05 コンセプト グループ エルエルシー 複合的ジオメトリおよび複合的材料の断熱部品
AU2021200176A1 (en) * 2020-01-28 2021-08-12 Flexopack S.A. Oven skin packaging film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2814934B2 (ja) * 1994-07-26 1998-10-27 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
US5615823A (en) * 1994-07-26 1997-04-01 Matsushita Electric Industrial Co., Ltd. Soldering ball mounting apparatus and method
JP3079921B2 (ja) * 1994-11-28 2000-08-21 松下電器産業株式会社 半田ボールの搭載装置および搭載方法

Also Published As

Publication number Publication date
MY114718A (en) 2002-12-31
KR100345928B1 (ko) 2002-11-07
SG65611A1 (en) 1999-06-22
JPH0918200A (ja) 1997-01-17
JP4029362B2 (ja) 2008-01-09
KR970002276A (ko) 1997-01-24
SG78381A1 (en) 2001-02-20
US5742048A (en) 1998-04-21

Similar Documents

Publication Publication Date Title
TW314483B (https=)
US7911444B2 (en) Input method for surface of interactive display
US9354186B2 (en) X-ray sensor and signal processing assembly for an X-ray computed tomography machine
KR101575286B1 (ko) 부품 실장기용 헤드 어셈블리
TW299535B (https=)
JP2814934B2 (ja) 半田ボールの搭載装置および搭載方法
TW201225628A (en) Duplex scanning apparatus with elastic pressing member disposed between two scan positions
JP2002076031A (ja) 半導体製造装置
JP4616676B2 (ja) カラートナー付着量測定装置
CN110463173A (zh) 读取装置
ITMI991962A1 (it) Apparecchio e procedimento per allineare componenti
CN219097175U (zh) 一种智能型视觉拉线检测器
JPS604877A (ja) 検出装置
CN107113364A (zh) 成像设备
JP3084926B2 (ja) チップの観察装置
CN216160852U (zh) 一种光感应装置与一种储物柜
JPH01106290A (ja) ウェハー枚数計数装置
KR101062251B1 (ko) 엑스레이 검출장치
JPS6333219Y2 (https=)
JPH0756273Y2 (ja) ウエハ検出器
JPS644109Y2 (https=)
JPS5925670Y2 (ja) ラベルプリンタ−におけるラベル位置検出装置
JPH06118520A (ja) 原稿読取装置の原稿サイズ検出センサ
JPH03102956A (ja) 読取装置
WO2016085064A1 (ko) Pcb 위치 감지 장치

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees