A7 312824 B7 五、發明説明（f) (請先聞讀背面之注意事項再填寫本頁) 本發明係為一種硬式TAB封裝方法·為構成一種可 降低封裝作業複雜度及可提昇作業效率之TAB包裝型式 之稹體霉路的封裝方法。 按現今 T A B (TAPE AUTOMATED BONDING)稹體罨路封 裝型式，為一種可形成較SMT封裝更窄的接腳間距 (PITCH) (約在〇 . 2 5〜0 . 3 mm )之稹體霣路外包 裝型態•期令播體霉路之封裝體稹大幅縮小者•然以習知 之TAB封裝方式上，即有製程過於複雜、作業緩慢與良 率低之各項缺點，現概略說明其製程如下。 如第二A〜J_所示，為在第二A画中，首先為進行 一"單面乾膜線路形成~之步驟，此步驟為在附著有銅箔 (71)之軟板（70)上覆蓋乾膜（7 ?)，然後於第 二B圔之"填充膠蝕銅作線路〃之歩驟•為在該軟板（7 〇)之中央之凹孔内填入〃填充膠（7 3) 〃以供適當的 支撐作用下，再對該未被乾膜（72)覆蓋的位置進行下 方飼箔（71)的蝕刻，以使銅箔（71)轉變為線路者 ，其次，為如第二C圜所示，去除覆蓋在外表面之乾膜（ 經濟部中央橾準扃貝工消费合作社印裝 7 2)，而在第二D圜之〃壓合聚醯氨膜〃之步驟中.則 對該已形成線路之銅箔進行覆蓋聚醯氨膜（7 4)，以使 銅箔（7 1 )完全包覆於内，其次•則為如第二E_之壓 合一蝕刻膜（7 5 )(乾膜），以供進行如第二F圔之對 前述聚醯氨膜（7 4 )外露的部份蝕刻，以形成可與内層 銅箔（7 1 )迴路連通之接點（供做為後網結合錫球之用 -3- 本紙張尺度通用中國國家標隼（CNS ) A4現格（210X 297公釐） 經濟部中央揉準局貞工消费合作社印製 A7 B7 五、發明説明（v) )•在第二G圖中•為去除前述蝕刻膜（7 5)及去除填 充於該底層之軟板（70)中央的填充膠（73) •並同 時進行濺鍍形成如圜面中央朝下延伸之凸點（7 7)(供 焊接晶片接黠之用）•之後•為如第二Η圔所示•於底面 外_附加一補強板（76)(硬板）•以補強整個結構強 度後，再進行如第二I、】_之進行植入晶片（80)、 灌膠形成覆蓋於晶片外圍之保護膠（90)以及於上表面 各外露的銅箔位S進行焊接錫球（9 1) •據以形成ΤΑ Β封裝作業者》 然以上述傳統製程觀之，有著如下各項缺點： ⑴製程實施較為困難、良率不佳：在第二Α〜G圔之製程中 ，均僅以位在底面之軟板（7 0)做為基板•此舉•在操 作上即較為困難而不易實施•更由於其整個製程亦較為複 雜之故•更導致製程良率不佳" ⑵作業速度緩慢 > 製程效率不彰：為以濺鍍方式形成凸黠之 型態•製程速度較為緩慢，且濺鍍機台昂霣•機具成本投 資較高。 ⑶於製作完成後更須附加一補強板做為支撐·導致作業複雜 度增加。 ⑷附加之補強板與線路距離較遠•封裝電性較差》 ⑸無法形成細線路的效果：僅使用乾膜蝕刻網箔的線路形成 方式*無法提供極細線路的高密度效果•使得包裝密度受 到相當限制》 -4- 本紙张尺度適用中國國家標準（CNS ) Λ4現格（2丨0 X 297公釐） (請先閲讀背面之注意事項再填寫本頁) -裝· 訂 312824 A7 __B7_ 五、發明説明（〉） 故基於前述習知TAB封裝之為在軟板上操作困難、 良率不佳、濺鍍作業緩慢缺乏效率以及補強板材料耗用量 過大等缺失下•本發明人欲提供一種解決此等問題的改番 方案。 亦即，本發明之主要目的在於提供一種硬式TAB封 裝方法•為提供一種於作業期間均有銅片支撐而解決製程 作業之不便外，凸黠為採用較具效率之霉鍍方式直接形成 •另於製程中使用直接壓合薄金®板之方式*可解決習知 製程於後續再額外附加補強板之複雜度•再者•形成線路 之方式亦為運用罨鍍形成霉鍍層的方·式進行•亦使得線路 可達到極細線寬的高密度效果•據以形成一種具有製程效 率佳、無需濺鍍作業、製程寅施較為簡便與可獲得細線路 效果之硬式TAB封裝方法者》 本發明之次一目的在於提供一種硬式TAB封裝方法 ，其封裝步驟依序為以單面線路鍍鎳網、選擇性鍍鎳金、 壓合絕縁層及薄金臑板、去除乾膜、填膠壓膜蝕網作綠漆 、去膜除膠、植晶片、灌膠與植球等作業搛以完成者》 經濟部中央揉準扃貝工消费合作社印簟 (請先閲讀背面之注意事項再填寫本頁) 本發明之又一目的在於提供一種硬式TAB封裝方法 *其中該單面線路鍍鎳銅之步驟中·為在一銅片上覆乾膜 與進行電鍍鎳、銅材料形成突起之線路電鍍層•此電鍍形 成線路之方式•可獲得極細的線寬效果•有著提高線路密 度之播極效果。 本發明之另一目的在於提供一種硬式TAB封裝方法 -5 -本紙張尺度適用中國國家標準（CNS ) Λ4現格（210X297公釐） A7 B7 五、發明説明（p •其中該選擇性鍍鎳金之步驟•亦為以覆乾膜與形成可供 與晶片焊接之電鍍凸點•此舉•可免除傳統製程之濺鍍形 成凸點的作業速度過度緩慢與機具投資過大的缺黠》 為使霣審査委員能進一步瞭解本發明之方法，特徵 及其他目的•玆附以圔式詳細說明如后： (一） ·圖式部份： 第一A〜I圔：係本發明之製法流程示意_。 第二A〜J_:係傳統製程之製法流程示意圔》 (二） ·圜號部份： (請先閲讀背面之注意事項再填寫本頁) 裝· 經濟部中央標準局貝工消费合作社印製 ·( 1 〇 )銅片 (112)缺口 (1 3 )電鍍凸點 (3 0 )薄金屬板 (5 0 )綠漆 (6 1 )保護膠 (7 0 )軟板 (7 2 )乾膜 (7 4 )聚醯氨膜 (7 6 )補強板 (9 0 )保護膠 (11) ( 1 1 1 )乾膜 (1 2〉電鍍層 (2 0 )絕緣層 (4 0 )膠料 (6 0 )晶片 (6 2〉錫球 (7 1 )銅箔 (7 3 )填充膠 (7 5 )乾膜 (8 0 )晶片 (7 7 )凸點 如第一A〜I圓所示，為本發明之封裝流程剖面示葸 圓•依序為以一單面乾膜線路鍍鎳銅之步驟、一選擇性鍍 鎳金作凸點之步驟、一壓合絕緣層及薄金颺板之步驟、一 -6 _ 訂 本紙张尺度適用中國國家標準（CNS ) Λ4規格（2丨0〆297公釐） A7 312824 B7 五、發明説明（t) (請先閱讀背面之注意事項再填寫本頁) 去除乾膜之步驟、一填膠壓膜蝕銅作綠漆之步驟、一去膜 除膠之步驟、一安裝晶片之步驟、一灌膠之步驟以及一植 錫球等步驟所組成*其中，在第一A圔之單面乾膜線路鍍 鎳銅的步驟中，為在一銅片（1 0)上進行覆蓋乾膜（1 1)，並在未被乾膜（11)覆蓋的位霤依序進行電鍍形 成電鍍鎳與電鍍銅所S合而成之霣鍍層（12)，此霉鍍 層（12)形成後•即為線路部份，其次，為在第一B圔 之#選擇性鍍鎳金作凸黠〃的步驟中，為在上、下表面覆 蓋另一乾膜（111)，而僅在接近頂面的中央位置形成 缺匚1(112)，此時，即可對該缺□ (112)位置進 行電鍍鎳及電鍍金之步驟，而該缺□( 1 1 2)位置形成 電鍍凸點（13)，其次，在第一 C圜之〃去除乾膜〃之 步驟中，則為去除第_B_之兩層乾膜（11) (111 經濟部中央標準局只工消费合作社印製 )，而僅留下前述之銅片（1 0〉、電鍍履（1 2 )以及 電鍍凸點（1 3)等構造，在第一D·之〃壓合絕縁層與 壓合薄金屬板〃之步驟中，為在中央位匾留下空孔•而外 圍位置依序壓合一絕緣層（2 0)(可為樹脂材料）以及 一薄金屬板（30) /厚度可設為約在0.5mm)，藉 此壓合步驟後•即直接賦予其適當的支撐力.在第一 E圍 之~填膠壓膜蝕銅作綠漆"之步驟中•為在該第一 D圈之 凹孔内填入膠料（40)，以保護胲電鍍凸點（131/) 不致受損，於填膠完成後|則進行.越刻去除該原位在底層 之銅片（10)部份•而僅留下電鍍層（12〉部位而已 -7 - 本紙張尺度適用中國國家標準（CNS ) Λ4規格（2.10X297公釐） 經濟部中央揉準局負工消费合作社印装 A7 B7 五、發明説明（知） •並於適當處上綠漆（50)以防止氧化》在第一 F圜之 ~去膜除膠#之步驟中•為去除前述填入之膠料（40) 而使得中央位置呈中空狀態•後辑之第一G〜I··為類 似於傳統方式•依序進行安裝晶片（60)、灌膠形成覆 蓋在外圈之保護膠（6 1)以及植入錫球（62)等步驟 •據以完成整個封裝流程。 在前述第一A圔之形成單面線路之步驟中•為使用銅 片乾膜電鍍方式形成線路者，即可獲得極細與高密度線路 的效果•此製程即較傳統蝕刻方式優異*而第一 B圜之選 擇性鍍鎳金而形成鼋鍍凸點之電鍍步驟中•僅以霉鍍方式 即可形成電鍍凸點•不僅可有效地解決傳統濺鍍形成金颺 凸點之作業複雜度及作業速度緩慢的缺點•更無需額外機 具輔助作業的不便性，相較之下•當較之具進步性，在第 一 D園中為採用一次直接壓合薄金鼸板（3 0)而免除傳 統製程於最後之步驟再予附加補強板之不便性，當有較為 準確與較為簡便之優點，且此薄金屬板（30)更以極薄 的絕緣層（20)與線路電鍍層（12)相互隔開，其間 距離相當接近•更有提高封裝電性之效果（以薄金屬板視 為接地層時），誠為一確具改良進步性之TAB封裝方法 者。 經以前述說明可知*可歸納具有如下各項優黠： ⑴可製出細線路：線路為運用銅片上電鍍形成線路電鍍層· 可獲致精準、穩定的線路與達到細線寬的效果，可符合高 本紙張尺度適用中國國家標芈（CNS ) Λ4規格（2丨0X297公釐） (請先閲讀背面之注意事項再填寫本頁) •裝· 訂 A7 B7 五、發明説明（7) 密度之要求》 ⑵於作業期間以為銅片支撐•作業較為簡便：無傳統軟板上 作業之不便性。 ⑶金屬凸點形成方式簡便迅速：亦為使用電鍍方式形成*無 需額外機具的投資費用•且無傳統濺鍍作業之耗時與不便 現象》 ⑷在前段步驟即採用壓合形成薄金屬板，較為精準、簡便： 解決傳統於薄膜作業完成後另額外附加補強板之不便性。 ⑸壓合薄金屬板為提供較佳的封裝電性：壓合之薄金羼板為 與線路相當接近•具有良好的訊號隔離及提昇霉性的效果 (請先閱讀背面之注意Ϋ項再填寫本頁) -裝· 訂 經濟部中央標準局貝工消費合作社印衷 本紙浪尺度適用中囷國家標準（CNS ) A4現格（210X297公釐）A7 312824 B7 5. Description of the invention (f) (please read the precautions on the back and then fill in this page) The present invention is a hard TAB packaging method. To form a TAB that can reduce the complexity of packaging operations and improve the efficiency of operations The packaging method of the packaging mold. According to the current TAB (TAPE AUTOMATED BONDING) package package type, it is a package package that can form a narrower pin pitch (PITCH) (about 0.2 5 ~ 0.3 mm) than the SMT package. Packaging type • Those who expect the package body of the broadcast mold to shrink significantly • However, with the conventional TAB packaging method, there are various shortcomings of the process that is too complicated, the operation is slow and the yield is low. The process is outlined below. . As shown in the second A ~ J_, in the second A picture, the first step is to perform a " single-sided dry film circuit formation step. This step is to attach a copper foil (71) to the flexible board (70) ) Covered with dry film (7?), And then fill the second B "with" filling the copper with copper as a wiring step ". To fill the concave hole in the center of the flexible board (70) with the filler (7 3) 〃With proper support, etch the lower feeding foil (71) at the position not covered by the dry film (72) to turn the copper foil (71) into a circuit, followed by, In order to remove the dry film covering the outer surface as shown in the second C circle (printed by the Central Ministry of Economic Affairs, Shellfish Consumer Co., Ltd. 7 2), and in the second D circle, the step of "pressing the polyimide film" Medium. Then cover the copper foil of the formed circuit with a polyimide film (7 4) so that the copper foil (7 1) is completely covered inside, followed by the second E_ such as press-fit etching Membrane (7 5) (dry film) for etching the exposed part of the aforementioned polyimide film (7 4) as in the second F, to form a connection that can communicate with the inner copper foil (7 1) circuit Point (for the back net For the use of solder balls -3- This paper standard is universal Chinese National Standard Falcon (CNS) A4 cash (210X 297 mm) A7 B7 printed by the Zhengong Consumer Cooperative of the Central Bureau of Economic Development of the Ministry of Economic Affairs V. Description of invention (v)) • In the second G drawing • To remove the aforementioned etching film (75) and the filler (73) filled in the center of the flexible board (70) at the bottom layer • Simultaneously sputter to form the center of the surface extending downward The bumps (7 7) (for soldering wafer connection) • Afterwards • As shown in the second Η 圔 • Outside the bottom surface _ additional a reinforcing plate (76) (hard board) • After reinforcing the entire structure strength , And then proceed to implant the wafer (80) as shown in the second I,] _, encapsulate the protective glue (90) covering the periphery of the wafer, and solder the solder balls (9 1) on the exposed copper foil positions S on the upper surface ) • According to the formation of ΤΑ Β packaging operators "However, according to the above traditional process view, it has the following shortcomings: (1) The process is more difficult to implement and the yield is not good: In the second process of A ~ G, only The flexible board (70) on the bottom is used as the base board. • This action is more difficult and difficult to implement in operation. Because of the complexity of the entire process, it also leads to poor process yield " ⑵ slow operation speed > process efficiency is not good: to form a convex shape by sputtering method • the process speed is relatively slow, and sputtering Machine Ang • The equipment cost is relatively high. (3) After the production is completed, a reinforcing plate must be added as a support, resulting in increased complexity of the operation. ⑷The distance between the additional reinforcement board and the circuit is far • The electrical properties of the package are poor》 ⑸The effect of failure to form a thin circuit: the circuit formation method using only dry film etching mesh foil * Cannot provide the high density effect of extremely fine circuit "Restrictions" -4- This paper scale is applicable to the Chinese National Standard (CNS) Λ4 present grid (2 丨 0 X 297 mm) (please read the precautions on the back and then fill out this page) -installed and ordered 312824 A7 __B7_ V. Invention Description (>) Therefore, based on the above-mentioned conventional TAB package, it is difficult to operate on a flexible board, poor yield, slow sputtering operation, lack of efficiency, and excessive consumption of reinforcing board materials. The inventors want to provide a solution Modification plan for these issues. That is, the main purpose of the present invention is to provide a rigid TAB packaging method. In order to provide a copper sheet support during the operation to solve the inconvenience of the process operation, the protrusions are formed directly by the more efficient mold plating method. The method of directly pressing the thin gold® plate in the process * can solve the complexity of the conventional process of adding additional reinforcing plates in the follow-up. Furthermore, the method of forming the circuit is also the method of forming the mold coating by using the plating. • It also enables the circuit to achieve a high-density effect with extremely thin line widths • Based on this, a hard TAB packaging method with excellent process efficiency, no sputtering operation, relatively simple process implementation and thin circuit effect can be obtained. One purpose is to provide a rigid TAB packaging method, the packaging steps are: single-sided circuit nickel-plated mesh, selective nickel-plated gold, lamination insulation layer and thin gold plate, removal of dry film, filling adhesive film corrosion The net works of green paint, stripping and degumming, chip implantation, potting, and ball placement are all completed. "Ministry of Economic Affairs, Central Ministry of Industry, Pui Pongong Consumer Cooperative Ink (please read the note on the back first Please fill in this page again.) Another object of the present invention is to provide a rigid TAB packaging method * in which the single-sided circuit nickel-copper plating step is to form a bump on a copper sheet and perform electroplating nickel and copper materials to form protrusions Circuit electroplating layer • The method of electroplating to form a circuit • A very thin line width effect can be obtained • A sowing effect of increasing the circuit density. Another object of the present invention is to provide a rigid TAB packaging method-5-This paper scale is applicable to the Chinese National Standard (CNS) Λ4 present grid (210X297mm) A7 B7 5. Description of the invention (p • where the selective nickel-plated gold The steps are also to cover the dry film and form the electroplated bumps that can be welded to the wafer. This action can avoid the excessively slow operation speed of the traditional process of sputtering to form the bumps and the lack of excessive investment in equipment. " The reviewing committee can further understand the method, features and other purposes of the present invention. The detailed description is attached as follows: (1) · Part of the drawing: The first A ~ I is the schematic diagram of the manufacturing process of the present invention. The second A ~ J_: Sketch of the manufacturing process of the traditional process "(2) · Number part: (Please read the precautions on the back before filling out this page) Outfit · Printed by Beigong Consumer Cooperative of Central Bureau of Standards, Ministry of Economic Affairs (1 〇) Copper sheet (112) Notch (1 3) Electroplating bumps (3 0) Thin metal plate (5 0) Green paint (6 1) Protective glue (7 0) Soft board (7 2) Dry film ( 7 4) Polyamide film (7 6) Reinforcement board (9 0) Protective glue (11) (1 1 1) Dry film (1 2> Electroplating (2 0) Insulating layer (4 0) Adhesive (6 0) Wafer (6 2> Tin ball (7 1) Copper foil (7 3) Filling glue (7 5) Dry film (8 0) Wafer (7 7) The bumps are shown as the first A ~ I circle, which is a cross-sectional view of the packaging process of the present invention. The sequence is a step of plating nickel copper on a single-sided dry film circuit, and a step of selectively nickel gold plating as bumps 、 One step of laminating insulation layer and thin gold lifting board, one _ _ The size of the paper is applicable to China National Standard (CNS) Λ4 specification (2 丨 0〆297mm) A7 312824 B7 V. Description of invention (t) (Please read the precautions on the back before filling this page) Steps of removing the dry film, a step of filling and pressing the film to etch copper to make green paint, a step of removing the film and removing the glue, a step of installing the chip, a potting It consists of steps and a step of planting tin balls. * Among them, in the step of nickel-copper plating on the single-sided dry film circuit of the first A-chip, the dry film (11) is covered on a copper sheet (10), And in order not to be covered by the dry film (11), electroplating is carried out in order to form a galvanized coating layer (12) formed by the combination of electroplated nickel and electroplated copper. After the mold coating layer (12) is formed, it is the circuit part. Secondly, In order to cover the upper and lower surfaces with another dry film (111) in the first B 圔 之 #selective nickel-plated gold as a convex step, the defect 1 (112) is formed only near the center of the top surface ), At this time, the steps of nickel plating and gold electroplating can be performed on the missing (112) position, and the plating bumps (13) are formed on the missing (1 1 2) position, followed by the first C circle 〃Dry film removal step is to remove the two layers of _B_ dry film (11) (111 printed by the Central Standards Bureau of the Ministry of Economic Affairs, only printed by the Consumer Cooperative), leaving only the aforementioned copper sheet (1 0 〉, Electroplating shoes (1 2) and electroplating bumps (1 3) and other structures, in the first D · the step of pressing the insulating layer and pressing the thin metal plate〃, leaving a blank for the central plaque Hole • The outer peripheral position is sequentially laminated with an insulating layer (20) (can be a resin material) and a thin metal plate (30) / thickness can be set to about 0.5mm), so that after the pressing step Give it proper supporting force. In the first E-circle ~ the step of filling and pressing the film to etch copper to make green paint " Steps • To fill the concave hole of the first D-ring with glue (40) to protect Gypsum plating The point (131 /) will not be damaged, and it will be done after the glue filling is completed. Remove the part of the copper sheet (10) in situ on the bottom layer and leave only the electroplated layer (12> part -7-this The paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (2.10X297mm) Printed by the Ministry of Economic Affairs Central Bureau of Accreditation Consumer Cooperatives A7 B7 5. Description of the invention (knowledge) • Apply green paint (50) to the appropriate place "Preventing oxidation" in the first F 圜 之 ～ 脱膜 除 胶 # step • To remove the previously filled glue (40) so that the central position is hollow • The first G ~ I in the latter part is similar In the traditional way, the steps of installing the chip (60), filling the protective glue (61) covering the outer ring and implanting the solder ball (62), etc. are carried out in sequence. According to this, the whole packaging process is completed. In the first step of forming a single-sided circuit in the first A image, if you use copper sheet dry film plating to form the circuit, you can obtain the effect of extremely fine and high-density circuit. This process is superior to the traditional etching method * and the first In the electroplating step of the selective nickel plating of B-Won to form the bumps for electroplating • Only the mildew plating method can form the electroplating bumps • Not only can it effectively solve the complexity and operation of the traditional sputtering to form the gold bumps The shortcomings of slow speed • No need for additional tools to assist inconvenience, in comparison • When it is more progressive, in the first D park, the first time directly presses the thin gold ram board (30) to avoid the traditional The inconvenience of adding a reinforcement board at the last step of the process, when it has the advantages of more accuracy and simplicity, and this thin metal plate (30) is further intersected by a very thin insulating layer (20) and a circuit plating layer (12) Separated, the distance between them is quite close • It has the effect of improving the electrical performance of the package (when the thin metal plate is used as the ground layer), it is indeed a TAB packaging method that has indeed improved and advanced. It can be seen from the foregoing description that * can be summarized as having the following advantages: (1) thin circuits can be produced: the circuit is formed by using electroplating on the copper sheet to form the electroplated layer of the circuit. It can obtain accurate and stable circuits and achieve the effect of thin line width, which can meet the high This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (2 丨 0X297mm) (please read the precautions on the back before filling out this page) • Binding · Order A7 B7 5. Invention Instructions (7) Density Requirements " ⑵During the operation, the copper sheet was supported. The operation is relatively simple: there is no inconvenience of the operation on the traditional flexible board. (3) The metal bump formation method is simple and rapid: it is also formed by electroplating * no additional equipment investment cost is required • and there is no time-consuming and inconvenient phenomenon of traditional sputtering operation. ⑷ In the previous step, the pressure is used to form a thin metal plate, which is more Accurate and simple: Solve the inconvenience of traditionally adding additional reinforcing plates after the film operation is completed. ⑸Laminated thin metal plate to provide better package electrical properties: The laminated thin gold plate is very close to the circuit. • Has good signal isolation and improves the moldy effect (please read the note Ϋ item on the back before filling in This page)-Binding · Bookmarked by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, the paper standard is applicable to the China National Standard (CNS) A4 (210X297mm)