TW309657B - - Google Patents
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- TW309657B TW309657B TW085112087A TW85112087A TW309657B TW 309657 B TW309657 B TW 309657B TW 085112087 A TW085112087 A TW 085112087A TW 85112087 A TW85112087 A TW 85112087A TW 309657 B TW309657 B TW 309657B
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Description
經濟部中央標莩局員工消費合作杜印裝 309657 A7 B7 五、發明説明(1 ) 【發明之詳細說明】 本發明係有關同時進行複數位元之資料的多位元型半 導體記億體。 【以往技術】 具有DRAM (動態型隨機存取記憶體)等之半導體 記億體數位系統之中,爲提升資料傳送速度,施以如下之 特色。 第1之特色係令半導體記憶體呈多位元型。多位元( X 2n)型之半導體記億體係一般呈可同時進行2η( η爲 自然數)位元之資料輸出入地加以構成。 第2之特色係同步於自CPU (中央處理器)输出之 高頻外部時脈,進行資料之輸出入動作。如此時脈同步型 之半導體記憶體(SDRAM、RDRAM等)中,令外 部時脈頻率變得愈高,可令連續之資料高速输出入之故, 可提高資料傳送速度。 第3之特色係於1個之半導體記億體(記憶體晶片) 內設置複數之區庫。複數之區庫係具有相互同一之要素, 此等各複數區庫可獨立進行資料輸出動作地加以構成。 由此,可縮短至存取於最初之資料之時間,提高資料 傳送速度。 圖3係顯示以往之半導體記憶體之晶片佈局的概略。 此半導體記億體係具備上述三個特色。 於1個記憶晶片1 0上,配置4個區庫1 1 _ 0〜 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公釐) , 一斗一 ——II - ; ! - - ΛΙ( I —l·* < nn 士--- - (請先閲讀背面之注意事項再填寫本頁)Ministry of Economic Affairs, Central Standardization Bureau, Consumer Cooperative Du Printing 309657 A7 B7 V. Description of the invention (1) [Detailed description of the invention] The present invention relates to a multi-bit semiconductor memory with multiple-digit data. [Conventional Technology] In the semiconductor memory digital system with DRAM (Dynamic Random Access Memory), etc., in order to increase the data transfer speed, the following features are applied. The first feature is that the semiconductor memory is multi-bit type. The multi-bit (X 2n) semiconductor billion system is generally composed of 2η (η is a natural number) data input and output at the same time. The second feature is that it synchronizes the high-frequency external clock output from the CPU (Central Processing Unit) to input and output data. In such a clock-synchronized semiconductor memory (SDRAM, RDRAM, etc.), the higher the external clock frequency, the higher the continuous data output and the higher the data transfer speed. The third feature is that a plurality of banks are installed in one semiconductor memory (memory chip). The plural district libraries have the same elements, and each of the plural district libraries can be constructed by independently outputting data. Thus, the time to access the original data can be shortened, and the data transmission speed can be improved. FIG. 3 is a schematic diagram showing the chip layout of the conventional semiconductor memory. This semiconductor billion system has the above three characteristics. On one memory chip 10, configure 4 zone libraries 1 1 _ 0 ~ This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 mm), one bucket-II-;!--ΛΙ ( I —l · * < nn taxi ----(please read the notes on the back before filling this page)
、1T 309657 b7 309657 b7 經濟部中央櫺率局員工消費合作社印製 五'發明説明(2 ) 1 1 — 3。各區庫1 1 — 〇〜1 1一3中’形成記億格陣 列、記憶陣列控制器,且形成行解碼器、列解碼器、D Q 緩衝器(稱區庫之輸出入部之緩衝器)等之周邊電路。 又,於1個記憶晶片1 0上,配置資料輸出入範圍 1 2。於資料輸出入範圍L 2中’同時進行複數之輸出入 電路(I/O )、例如16位元(2位元組)之資料輸 出入時,形成1 6個輸出入電路。 於區庫1 1 — 0〜1 1 一 3間,配置資料匯流排1 3 。童料匯流排1 3係呈區庫1 1 一 0〜1 1 — 3和資料输 出入範圍12間的資料路徑。資料匯流排13係呈例如同 時進行1 6位元(2位元組)之資料輸出入時,進行1 6 位元之資料傳送之構成。 上述之半導體記億體之資料的輸出入動作,如以下加 以進行。 首先’由4個區庫11一〇〜11一3中選擇1個之 區庫。被選擇之1個區庫中,根據位址信號進行記億格之 存取動作’自選擇2 n位元(例如1 6位元(2位元組) )之資料的1個區庫加以輸出。 此2"位元之資料係經由資料匯流排1 3 ,引導至資 料輸出入範圍1 2 ’且自資料輸出入範圍1 2輸出至半導 體記億體(記憶晶片)外部。 【發明欲解決之課題】 上述半導體記憶體中,必須加以檢討之處,係在於佔 本紙倀尺度適财目®巧導(CNS ) Λ4現格(210X 297公聲) -------,---γ'*衣------、玎-------f (請先閱讀背面之注意事項再填寫本頁) -I"- 3〇9657 A7 ------- B7 五、發明説明(3 ) 據1個記億晶片上之全範圍的資料匯流排i 3之範圍的比 例。即,令資料匯流排1 3之範圍儘可能變小,可達晶片 面積縮小。 但是’隨著同時增加進行輸出入之位元數,資料匯流 排之範圍則增大。 即,以往令半導體記憶體之構成,隨著由1 6位元型 (X16)— 32 位元型(x32)— 64 位元(X64 )’向多位元型轉移,晶片面積範圍則會有增大之缺點。 v/本發明係解決上述缺點而成者,該目的係於多位元型 、一時脈同步型、區庫型之半導體記億體中,無需增大晶片 1積,便可提高資料傳送速度。 【爲解決課題之手段】 爲達上述目的’本發明之半導體記億體係具備記憶晶 片,和配置於前述記憶晶片上的複數區庫。前述各複數之 區庫,係相互獨立,進行複數位元之資料的讀取動作或複 數位元之資料寫入動作。 經濟部中央慄準局員工消资合作社印焚, 1T 309657 b7 309657 b7 Printed by the Employee Consumer Cooperative of the Central Bureau of Economic Development of the Ministry of Economic Affairs Five'Instructions for Invention (2) 1 1 — 3 Each zone library 1 1-〇 ~ 1 1 to 3 forms a memory array controller, a memory array controller, and forms a row decoder, a column decoder, a DQ buffer (called a buffer in the input and output section of the zone library), etc. Peripheral circuit. In addition, on one memory chip 10, the configuration data input and output range is 12. When data input / output circuits (I / O), such as 16-bit (2-byte) data are input and output simultaneously in the data input / output range L2, 16 input / output circuits are formed. In the district library 1 1-0 ~ 1 1 to 3, configure the data bus 1 3. The child material bus 13 is a data path between the district library 1 1 1 0 ~ 1 1 — 3 and the data input / output range 12. The data bus 13 is configured such that when 16-bit (2-byte) data is input and output at the same time, 16-bit data is transmitted. The input and output operations of the above-mentioned semiconductor memory data are performed as follows. First, select one of the four district libraries 11-10 to 11-3. In the selected one area library, perform the access operation with 100 million grids according to the address signal '. Select and output the 2 n-bit (for example, 16 bit (2 byte)) data from one area library . This 2 " bit data is directed to the data input / output range 1 2 ’through the data bus 1 3 and is output from the data input / output range 12 to the outside of the semiconductor memory (memory chip). [Problems to be solved by the invention] The above-mentioned semiconductor memory must be reviewed because it occupies the standard size of the paper and is suitable for financial projects® (CNS) Λ4 present (210X 297 public voices) , --- γ '* clothing ------, 玎 ------- f (please read the precautions on the back before filling this page) -I "-3〇9657 A7 ----- -B7 V. Description of the invention (3) According to the ratio of the full range of data bus i 3 on 1 billion chip. That is, the range of the data bus 13 is made as small as possible, and the chip area can be reduced. However, as the number of bits that are input and output is increased at the same time, the range of the data bus increases. That is, in the past, the structure of semiconductor memory has shifted from 16-bit type (X16)-32-bit type (x32)-64-bit (X64) 'to multi-bit type, the chip area range will be Increase the disadvantages. v / The present invention is to solve the above shortcomings. The purpose is in a multi-bit type, one-clock synchronous type, and block-type semiconductor memory, without increasing the chip volume, can increase the data transfer speed. [Means for Solving the Problem] In order to achieve the above object, the semiconductor memory system of the present invention includes a memory wafer and a plurality of banks arranged on the memory wafer. Each of the foregoing plural bank is independent of each other, and performs the reading operation of the plural digit data or the writing operation of the plural digit data. Printing and Burning of the Cooperative Society for Employee Capital Consumption of the Central Lizhun Bureau of the Ministry of Economic Affairs
Hi m r »I— 1 m in n In ——^ϋ I HI 一 —r. /J-', (請先閱讀背面之注意事項再填寫本頁) 前述各複數之區庫係具有複數之中區庫。前述各中區 塊係具有自記億格陣列構成之2個小區塊,和配置於前述 2個之小區塊間的感測放大器,和配置於前述記憶格陣列 上之字元線,資料線及列選擇線。前述各中區塊係’配置 於前述列選擇線及前述資料線對延長之列方向。前述各小 區塊係配置於前述列方向。 前述各複數之區庫係配置於前述列方向之2個端部中 本紙張尺度適用中國國家標準(CNS ) Λ4規格(2ΙΟΧ2()7公« ) A7 B7 309657 五、發明説明(4 ) 的一方,具有連接於前述列選擇線至少一個之列解碼器。 前述各複數之區庫係配置於前述字元線延長之列方向 之2個端部中的一方,於前述各中區庫一個個地設置’具 有連接於前述字元線之列解碼器。 前述各複數之區庫係配置於前述列方向之2個端部中 之他方的 DQ緩衝器。 前述各複數之區塊係配置於前述行方向之2個端部中 之他方,具有控制前述複數位元之資料之讀取動作或前述 複數位元之資料寫入動作的格陣列控制器。 本發明之半導體記憶體係具備配置於前述記憶晶片上 ,爲執行前述複數位元之資料輸出入的資料输出入範圍, 和於前述複數之區庫共通設置,向前述行方向延長’呈前 述複數之區庫和前述資料輸出入範圍間之前述複數位元資 料之路徑的資料匯流排。 前述各複數之區庫係具備配置於構成各前述區塊之前 述2個小區塊間,延長於前述行方向,連接於前述感測放 大器的局部D Q線對,和於前述中區塊上延長於前述列方 向,連接前述區塊D Q線對和前述緩衝器的整體D Q線對 〇 本發明之半導體記億體係具備記憶體,和配置於前述 記億晶片上的複數主區庫。前述各複數之主區庫,係自複 數之副區庫所構成。前述各複數之副區塊,係相互獨立進 行複數位元之資料的讀取或複數位元之資料的寫入。 前述各副區庫係具有複數之中區塊。前述各中區塊係 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公釐) ~ " ---Λ---*----^.,i衣------訂------飞 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局Μ工消f合作社印製 經濟部中央標準局,Μ工消費合作社印焚 ^^9657 A7 B7 _________ 五、發明説明(5 ) 具有自記億陣列構成之2個小區塊’和配置於前述2個小 區塊間之感測放大器,和配置於前述記憶陣列上的字元線 、資料線及列選擇線。前述各中區塊係配置於前述列選擇 線及前述資料對所延長之列方向。前述各小區塊係配置於 前述列方向。 前述各複數之副區庫係配置於前述列方向之2個端部 中的一方,連接於前述列選擇線至少一個列解碼器。 前述各複數之副區庫,係具有配置於前述字元線延長 之行方向之2個端部中之一方,於前述各中區塊各設置一 個,連接於前述字元線之行解碼器。 前述各複數之副區庫係具備配置於前述列方向之2個 端部中之另一方的D Q緩衝器》 前述各複數之副區庫係具備配置於前述行方向之2個 端部中之另一方,控制前述複數位元之資料讀取動作或前 述位元之資料之寫入動作的格陣列控制器。 本發明之半導體記億體,係具有配置於前述記億晶片 上,爲執行前述複數位元之資料輸出入的資料輸出入範圍 ,和共通設置構成前述複數之主區塊的所有副區庫中2個 以上之副區庫,延長於前述行方向,前述副區庫和前述資 料輸出入範圍間之前述複數位元之資料路徑所成複數資料 匯流排。 前述各複數之副區庫係具備配置於構成各前述中區塊 之前述2個小區塊間,延長於前述行方向,連接於前述感 測放大器的局部D Q線對,和於前述中區塊上延長於前述 本纸张尺度適用中國國家標準(CNS ) Λ4現格(210X297公釐) ---Λ---^----^士衣------訂— (請先閱讀背面之注意事項再填寫本頁) - 經濟部中央標隼局貝工消费合作社印11 本紙張尺度適用中囤國家標準(CNS ) Λ4規格(210Χ297公缝) A7 B7 五、發明説明(6 )Hi mr »I— 1 m in n In —— ^ ϋ I HI 一 —r. / J- ', (please read the precautions on the back before filling in this page) The above-mentioned plural district library system has plural middle districts Library. The aforementioned middle blocks are composed of two small blocks composed of a self-recorded billion grid array, a sense amplifier arranged between the two small blocks, and character lines, data lines and rows arranged on the memory grid array Select the line. The aforementioned middle blocks are arranged in the row direction in which the row selection line and the data line pair extend. The small blocks are arranged in the column direction. The aforementioned plural district libraries are arranged at the two ends in the aforementioned column direction. The paper standard is applicable to the Chinese National Standard (CNS) Λ4 specification (2ΙΟΧ2 () 7 公 «) A7 B7 309657 V. The invention description (4) , With a column decoder connected to at least one of the aforementioned column selection lines. The plurality of bank areas are arranged at one of the two end portions of the word line in the extending column direction, and are arranged one by one in each of the center bank areas. The column decoder is connected to the word line. Each of the plural bank is arranged in the other DQ buffer in the two ends in the row direction. Each of the plural blocks is arranged at the other of the two end portions in the row direction, and has a grid array controller that controls the reading operation of the plural bit data or the writing operation of the plural bit data. The semiconductor memory system of the present invention is equipped with a data input / output range configured on the memory chip to perform data input / output of the complex number, and is set in common with the bank of the complex number, extending in the row direction to be the complex The data bus of the path of the aforementioned complex digital data between the library and the aforementioned data input / output range. The plurality of district libraries are provided between the two small blocks constituting each of the blocks, extending in the row direction, connected to the local DQ line pair of the sense amplifier, and extending on the middle block In the column direction, the entire DQ line pair connecting the block DQ line pair and the buffer is provided. The semiconductor billion memory system of the present invention includes a memory and a plurality of main area libraries arranged on the billion memory chip. Each of the aforementioned plural primary area libraries is composed of plural secondary area libraries. Each of the aforementioned plural sub-blocks performs reading of plural-digit data or writing of plural-digit data independently of each other. Each of the aforementioned sub-regional reservoir systems has a plurality of middle blocks. The aforementioned middle blocks are the paper standards applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 mm) ~ " --- Λ --- * ---- ^., Iyi ------ order ------ Fei (please read the precautions on the back before filling this page) Printed by the Central Standards Bureau of the Ministry of Economic Affairs, printed by the Central Standards Bureau of the Ministry of Economic Affairs, printed by the Consumers Cooperative of the Ministry of Economics ^^ 9657 A7 B7 _________ 5. Description of the invention (5) Two small blocks composed of a self-recording array and a sense amplifier arranged between the two small blocks, and character lines, data lines and row selection lines arranged on the memory array . The aforementioned middle blocks are arranged in the row direction in which the row selection line and the data pair extend. The small blocks are arranged in the column direction. Each of the plural sub-region libraries is arranged at one of the two ends in the column direction, and is connected to at least one column decoder of the column selection line. Each of the plural sub-region libraries has one of two end portions arranged in the row direction of the extended word line, one for each middle block, and connected to the row decoder of the word line. Each of the plural sub-region libraries is equipped with the other DQ buffer arranged in the two ends of the column direction. The aforementioned plural sub-region libraries are equipped with the other one arranged in the two ends of the row direction. On the other hand, a grid array controller that controls the reading operation of the aforementioned complex bit data or the writing operation of the aforementioned bit data. The semiconductor memory device of the present invention has a data input / output range configured on the aforementioned memory chip to perform the data input / output of the plural digits, and is set in common in all the sub-region libraries constituting the plural main block More than two sub-zone libraries extend in the aforementioned row direction, and a complex data bus is formed by the aforementioned plural-digit data path between the aforementioned sub-zone library and the aforementioned data input / output range. The plural sub-region libraries are provided between the two small blocks constituting each of the middle blocks, extending in the row direction, connected to the local DQ line pair of the sense amplifier, and on the middle block Extend the size of the paper mentioned above and apply to the Chinese National Standard (CNS) Λ4 present grid (210X297mm) --- Λ --- ^ ---- ^ Shiyi ------ order- (please read the back page first Matters needing attention and then fill out this page)-Printed by the Central Standard Falcon Bureau Beigong Consumer Cooperative of the Ministry of Economic Affairs 11 This paper scale is applicable to the China National Standard (CNS) Λ4 specifications (210Χ297 male seams) A7 B7 V. Invention description (6)
列方向,連接前述區塊D Q線對和前述緩衝器的整體D Q 線對。 具備本發明之測試電路的半導體記億體係具有自複數 之區塊構成之記憶格陣列,和於前述複數之區塊中η (η 係2以上之自然數)之區塊內的記億格,同時地寫入η位 元之資料的區塊寫入手段,和預先保持寫入前述η之區塊 的前述η位元資料的暫存器》 本發明之測試電路係具備於測試模式時中,於前述記 憶格陣列之記億格,同時寫入保持於前述暫存器的前述η 位元資料,且經由爲讀取前述記億格之前述η位元之資料 的測試模式寫入•讀取手段,和保持於前述暫存器之前述 η位元之資料和前述測試模式寫入•讀取手段,比較自前 述記憶格讀取之前述η位元資料,根據此比較結果,判定 前述半導體記億體之良窳,輸出顯示該良窳結果之1位元 資料的比較手段’和令自前述比較手段輸出之前述1位元 之資料,爲輸出至前述半導體記億體之外部的測試用输出 電路。 本發明之測試電路係具備保持顯示前述比較手段之前 述比較結果的η位元資料的閂鎖手段,和前述良窳結果爲 不良時,令前述閂鎖手段之η位元之資料,順序供予前述 測試用輸出電路的切換手段者。 具備本發明之測試電路之半導體記憶體係同時進行η 位元之資料輸出入的η位元型之半導體記億體,前述半導 體記億體係於通常動作模式時,具有使用之η個輸出墊片 -Ί — ! Λ-----------士民-I - I I I T I — --'·"、\έ (請先閱讀背面之注意事項再填寫本頁) 經濟部中失標準局員工消費合作社印^ A7 B7 五、發明説明(7 ) ’本發明之測試電路之測試用輸出電路係連接於前述η個 輸出墊片中之一個輸出墊片。 本發明之資料傳送系統係具有延長於列方向加以配置 之複數區塊,各區塊係自配置呈矩陣狀之複數開關所構成 之2個開關陣列,和鄰接於前述2個開關陣列之行方向之 2個端部中之一側加以配置,選擇前述2個之開關陣列之 行的行解碼器,和配置於前述2個開關陣列間,延長於前 述行方向之局部DQ線,和連接於各開關陣列之複數開關 ,令資料引導至前述局部D Q線之資料線所構成。 又,本發明之資料傳送系統係具有於前述區塊上’於 前述列方向延長配置,一端則連接於前述局部DQ線的整 體DQ,和鄰接於前述複數區塊之前述列方向的2個端部 中之一方加以配置,選擇前述複數區塊之開關陣列之列的 列解碼器,和鄰接於前述複數區塊之前述列方向的2個端 部中之另一方加以配置,連接於前述整體DQ線之另一 端,執行資料輸出入之資料輸出入電路。 【發明之實施形態】 以下,參照圖面,對於本發明之半導體記憶體及該測 試電路、以及資料傳送系統的詳細說明。 圖1係顯示本發明之第1參考例之半導體記憶體之晶 片佈局。圖2係詳細顯示圖1之一個區庫內之佈局。 此參考例中,對於可同時輸出入1 6位元資料之1 6 位元型(X 1 6 )之半導體記億體加以說明* 本紙張尺度適州中國國家標丰(CNS ) Λ4現格(210X;W公釐) ~/ϋ - Λ---,丨丨弋衣—I (請先閱讀背面之注意事項再填寫本頁) 訂--- 經濟部中央標卒局負工消费合作社印製 309657 ΑΊ Β7 五、發明説明(8 ) 於一個記億晶片10上’配置4個區庫11_0〜 1 1 — 3。各區庫1 1 一 〇〜1 3中’形成記億格陣 列C A L、C A R,§億格陣列控制器C A c ’且.行解碼 ^ R D、列解碼器CD0、CD1 ’ DQ緩衝器(稱區庫 客輸出入部緩衝器)D 〇等之周邊電路。 1個區庫內之記億格陣列係分爲4個中區塊BLa , BLb ,BLc ,BLd。又,各中區塊係分爲2個小 區塊CAL,CAR。因此,1個區庫內之記憶格陣列係 由8個區塊構成。 行解碼器RD係於各4個之宁專塊BLa ,BLb, B L c ,B L d中,各設置1個。行解碼器RD係根據行 位址信號,選擇2個小區塊CAL、CAR中之任一個, 且自選擇1個之區塊中的複數行選擇1個行(字元線1 7 )0 列解碼器CD0,CD1係於1個區庫內設置2個。 列解碼器C D 〇,C D 1係根據各列位址信號,選擇4個 中區塊BLa ,BLb ,BLc ,BLd之記億格陣列的 一個或複數列。 即’經由列解碼器CD0,CD1選擇所定之列選擇 線1 5~〇,1 5 — 1時,連接於該所定列選擇線1 5 — 〇 ’ 1 5 — 1之列選擇開關1 6則呈開啓狀態,1個資料 線1 4之資料或複數之資料線對1 4之資料則經由感測 放大器S A及資料線對(以下稱此資料線對爲d Q線對 ’與資料線對1 4加以區別),導入D Q緩衝器D Q。 本紙張尺度適州中國國家標隼(CNS) Λ4現格(210χ297公麋) 一/卜 I. - 11 -I I - fcf I— I ΙΊ 士衣- . I (請先閱讀背面之注意事項再填寫本頁) 訂--- A7 B7 經濟部中央標準局負工消費合作社印裝 五、 發明説明(9 ) 1 1 本參 考例 中 ,1 個 列 解 碼 器 選 擇 2 個 列 地 加 以 構 成 0 1 I 此 時 ,存 在2 個 列解 碼 器 之 故 白 各 中 區 塊 B L a » 1 1 1 B L b , B L C ,B L d * 輸 出 入 4 位 元 之 資 料 0 即 * 白 1 I 請 1 I 1 個 區庫 ,輸 出 入1 6 位 元 ( 2 位 元 組 ) 之 資 料 0 此 1 6 先 閱 1 I 1 位 元 組之 資料 係 通過 資 料 匯 流 排 1 3 1 進 行 至 區 庫 1 1 一 背 ιέ Γ | 之 1 0 11 -3 中 之一 個 9 和 資 料 輸 出 入 範 圍 1 2 間 〇 注 意 Γ 章 1 感測 放大 器 S A 及 列 選 擇 開 關 1 6 係 於 記 憶 格 陣 列 之 項 再 1 填 一1 各 中 區塊 B L a ,B L b > B L C B L d 中 配 置 於 記 寫 '4- 頁 1 億 格 陣列 之小 區 塊C A L C A R 間 0 1 行解 碼器 R D和 D Q 緩 衝 器 D Q 係 將 記 億 格 陣 列 1 1 C A L, C A R 挾於 中 央 相 互 對 向 地 加 以 配 置 〇 列 解 碼 1 1 器 C D0 係配 置 4個 中 區 塊 B L a B L b B L C B 訂 1 1 L d 的方 向, 即 配置 於 列 方 向 ( 資 料 線 對 或 列 選 擇 線 延 長 1 I 之 方 向) 之2 個 端部 中 之 —- 側 列 解 碼 器 C D 0 係 配 置 於 1 1 1 該 2 個端 部中 的 另一 方 0 1 1 格陣 列控 制 器C A C 係 鄰 接 於 列 解 碼 器 R D 加 以 配 置 1 0 格 陣列 控制 器 C A C 係 進 行 區 庫 內 之 資 料 輸 出 入 動 作 之 1 1 控 制 0 1 I 於D Q緩 衝 器D Q 後 ) — 般 而 > 配 置 爲 選 擇 區 庫 之 1 I 區 庫 選擇 器S E L。 1 1 Λ 資料 係經 由 資料 線 對 1 4 感 測 放 大 器 S A 及 列 選 擇 1 1 開 關 16 後, 引 導至 D Q 線 對 1 8 〇 D Q 線 對 1 8 係 於 記 1 1 憶 格 陣列 之各 中 區塊 B L a » B L b » B L C t B L d 中 1 1 » 配 置於 記億 格 陣列 之 小 塊 C A L C A R 間 〇 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -IX - 303657 A7 B7 經濟部中央標準局員工消费合作社印袈 五、 發明説明 (10 ) 1 | 因此 » 資料 係 經 由 D Q 線 對 1 8 » 正交於 配 置記 億格 1 I 陣 列 之4 個 中區 塊 B L a > B L b 1 B L c , B L d 的方 1 1 向 即向 行 方向 C 字 元 線 所 延 長 之 方 向 )移動 後 ,經 由 /-—V 1 I 請 1 1 D Q 緩衝 器 D Q > 區 庫 输 出 閱 1 I 讀 1 ( 共有 於 4個 區 庫 之 資 料 匯 流 排 1 3 係配置 於 區庫 11 背 面 Γ | 之 1 — 0 ,1 1 -1 和 區 塊 1 1 — 2 1 1 —3間 記億 格陣 注 意 之 事 1 列 中區 塊 B L a > B L b • B L < ? ,B L d 所配 置之 項 再 1 I 方 向 ,即 延 長於 列 方 向 〇 資 料 匯 流 排 1 3係呈 區 庫1 1 - 填 % 本 I 0 11 — 3和 資 料 輸 出 入 範 圍 1 2 間 之資料 輸 出入 路徑 頁 1 1 者 0 1 1 本參 考 例中 » 係 以 1 6 位 元 ( 2 位 元組) 之 資料 輸出 1 | 入 可 同時 進 行加 以 構 成 者 9 訂 1 資料 輸 入範 圍 1 2 中 Μ 同 時 進 行 1 6位 元 (2 位元 1 1 I 組 ) 之資 料 輸出 入 形 成 1 6 個 之 輸 出 入電路 ( I / 0 ) 1 1 1 、 J 上述 之 半導 體 記 憶 體 之 資 料 输 出 入 動作係 如 下地 加以 1 進 行 〇 1 I 首先 經由 區 庫 選 擇 器 S E L » 由 4個之 區 庫1 1 - 1 I 0 11 — 3中 選 擇 — 個 區 庫 〇 選 擇 之 1個區 庫 中, 根據 1 J 位 址 信號 進 行記 億 格· 之 存 取 動作 〇 1 1 資料 之 输出 ( 讀 取 ) 時 t 2 n位元 '例如1 6 位元( 1 1 2 位 元組 ) )之 資 料 則 經 由 D Q 線 對 1 8 -自 該 選擇 之1 1 1 個 區 庫輸 出 *自 區 庫 輸 出 之 2 【元資料係經由突 F料匯流 1 1 排 1 3, 引 導至 資 料 輸 出 入 範 圍 1 2 1 且.自資 料 輸出 入範 1 1 本紙張尺度適用中國國家標隼(CNS ) A4规格(210X297公釐) -β - A7 B7 經濟部中央標準局員工消費合作社印製 五、 發明説明 (11 ) 1 | 圍 1 2 輸 出 至 半 導 體 記 億 體 ( 記 億 晶 片 ) 外 部 0 1 1 資 料 之 輸 入 ( 寫 入 ) 時 » 2 n位元 (例如. L 3位元 ( 1 1 2 位 元 組 ) ) 之 資 料 則 經 由 資 料 輸 出 入 範 圍 1 2 、資 料 匯 1 I 流 排 1 3 » 輸 入 至 該 選 擇 之 1 個 區 庫 〇 輸 入 至 該 選擇 之 1 請 閱 1 I 個 區 庫 的 2 "位元之資料係經由D Q線 L 8及感測放大器 讀 背 面 \ \ I S A 9 記 憶 於 記 億 格 陣 列 之 記 憶 格 〇 之 注 意 1 !* | V 上 述 之 半 導 體 記 億 體 之 晶 片 佈 局 中 > 有 以 下 之缺 點 〇 事 項 1 | 第 之資 填 1 I 共 有 於 4 個 區 庫 1 1 0 1 1 3 料 匯 寫 本 装 流 排 1 3 係 貫 通 記 億 晶 片 1 0 之 中 央 部 加 以 配 置 ,延 長 於 頁 1 1 列 方 向 ( 資 料 線 對 或 列 選 擇 線 所 延 長 之 方 向 ) 0 此時 半 1 1 導 體 記 憶 體 之 位 元 型 即 比 例 於 同 時 進 行 輸 出 入 位元 數 1 | 資 料 匯 流 排 1 3 之 條 數 則 增 加 增 大 資 料 匯 流 排 13 之 範 訂 1 圍 9 1 1 I 例 如 > 1 6 位 元 型 ( X 1 6 ) 之 半 導 體 記 億 體時 資 1 1 I 料 匯 流 排 1 3 係 需 傳 送 1 6 位 元 分 之 資 料 數 的 配 線, 同 樣 1 1 地 3 2 位 元 型 ( X 3 2 ) 之 半 導 體 記 億 體 時 資料 匯 流 1 排 1 3 係 需 傳 送 3 2 位 元 分 之 資 料 數 的 配 線 0 1 1 第 2 » 配 置 於 各 區 庫 內 之 中 區 塊 B L a B L d 的 1 I D Q 線 對 1 8 9 係 僅 配 置 於 記 億 格 陣 列 之 小 區 塊 C A L % 1 | C A R 間 9 僅 延 長 於 方 向 ( 字 元 線 所 延 長 之 方 向) P 此 1 1 時 » 比 例 於 白 一 個 中 區 塊 輸 出 之 位 元 數 增 加 D Q線 對 1 1 1 8 之 條 數 t 增 大 D Q 線 對 1 8 之 範 圍 〇 1 1 例 如 » 於 1 個 之 中 區 塊 中 y 進 行 4 位 元 之 賫 料輸 出 入 1 1 時 D Q 線對1 8係需可傳送4位元分之資料數的配線 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨0X297公釐) 經濟部中央標準局員工消費合作.杜印製 A7 B7 _ 五、發明説明(12 ) ,同樣地,於1個之中區塊中,進行8位元之資料輸出入 時,DQ線對18係需可傳送8位元分之資料數的配線 〇 第3 ,於區庫內,於行方向之2個端部之一方,配置 行解碼器RD,於另一方配置DQ緩衝器DQ。此時,列 解碼器C D 0係於區庫內*配置於列方向之2個端部的一 方,列解碼器C D 1係配置於該2個端部之另一方。 又,格陣列控制器CAC係跨過4個中區塊BLa , BLb ,BLc ,BLd地,配置於行方向之2個端部的 一方。 因此,列解碼器R D和格陣列控制器C A C係共同配In the column direction, the block D Q line pair and the overall D Q line pair of the buffer are connected. The semiconductor billion system with the test circuit of the present invention has a memory cell array composed of plural blocks, and a billion cell in a block of η (η is a natural number of 2 or more) among the aforementioned plural blocks, Block writing means for writing n-bit data at the same time, and a register for holding the aforementioned n-bit data written in the aforementioned n-block in advance "The test circuit of the present invention is provided in the test mode, Simultaneously write the n-bit data held in the register in the memory cell array, and write / read through the test mode for reading the n-bit data of the memory cell Means, and the n-bit data held in the temporary memory and the test mode writing / reading means, compare the n-bit data read from the memory cell, and determine the semiconductor memory based on the comparison result "Yi-Yi-Yang", a 1-bit data comparison method that displays the result of the "Yi-Yu" and the 1-bit data output from the above-mentioned comparison method are output for testing to the outside of the semiconductor memoryCircuit. The test circuit of the present invention is provided with a latch means for holding the n-bit data showing the comparison result of the comparison means, and when the good result is bad, the n-bit data of the latch means is provided in order The switching means of the aforementioned test output circuit. The semiconductor memory system with the test circuit of the present invention is an η-bit type semiconductor memory device that simultaneously outputs and imports η-bit data. The aforementioned semiconductor memory system has η output pads used in the normal operation mode- Ί —! Λ ----------- Shimin-I-IIITI —-'· " 、 \ έ (Please read the precautions on the back before filling out this page) Employee of Loss of Standards Bureau, Ministry of Economic Affairs Printed by the consumer cooperative ^ A7 B7 5. Description of the invention (7) 'The test output circuit of the test circuit of the present invention is connected to one of the n output pads. The data transmission system of the present invention has a plurality of blocks that are extended in the column direction and each block is self-arranged with two switch arrays composed of a matrix of plural switches, and a row direction adjacent to the aforementioned two switch arrays One of the two ends is arranged to select the row decoder for the row of the two switch arrays, and the local DQ line arranged between the two switch arrays, extending in the row direction, and connected to each The plural switches of the switch array make the data lead to the data lines of the aforementioned local DQ lines. In addition, the data transmission system of the present invention has an extended arrangement in the row direction on the block, one end is connected to the entire DQ of the local DQ line, and two ends in the row direction adjacent to the complex block One of the two parts is arranged to select the column decoder of the row of the switch array of the complex block, and the other of the two ends adjacent to the row direction of the complex block is arranged to be connected to the overall DQ At the other end of the line, data input and output circuits that perform data input and output are executed. [Embodiment of the Invention] Hereinafter, the semiconductor memory of the present invention, the test circuit, and the data transmission system will be described in detail with reference to the drawings. Fig. 1 shows a wafer layout of the semiconductor memory of the first reference example of the present invention. Figure 2 shows in detail the layout in a district library of Figure 1. In this reference example, a 16-bit (X 1 6) semiconductor memory that can output 16-bit data at the same time will be explained. * The paper size is suitable for China National Standard (CNS) Λ4 present format ( 210X; W mm) ~ / ϋ-Λ ---, 丨 丨 Yiyi—I (please read the precautions on the back and then fill out this page) Order --- Printed by the Ministry of Economic Affairs Central Standardization Bureau Unemployment Consumer Cooperative 309657 ΑΊ Β7 V. Description of the invention (8) On one billion chip 10, 4 area libraries 11_0 ~ 1 1-3 are arranged. Each zone library 1 1 10 ~ 13 in the formation of 100 million grid array CAL, CAR, § billion grid array controller CA c 'and. Row decoding ^ RD, column decoder CD0, CD1' DQ buffer (called area Kuker I / O buffer) D 〇 and other peripheral circuits. The 100 million grid array in one district library is divided into 4 middle blocks BLa, BLb, BLc, BLd. In addition, each middle block system is divided into two small blocks CAL and CAR. Therefore, the memory cell array in one bank consists of 8 blocks. The line decoder RD is set in each of the four Ning special blocks BLa, BLb, B L c and B L d, and one is set for each. The row decoder RD selects any one of the two small blocks CAL and CAR according to the row address signal, and selects one row (character line 1 7) from the plural rows in the selected one block (character line 1 7) 0 column decoding CD0 and CD1 are installed in one zone library. The column decoders C D 〇, C D 1 select one or a plurality of columns of four hundred million grid arrays of four middle blocks BLa, BLb, BLc, and BLd according to the address signals of each column. That is, when the selected column selection line 15 ~ 〇, 1 5-1 is selected via the column decoders CD0, CD1, the column selection switch 16 connected to the specified column selection line 1 5-〇 '1 5-1 shows In the open state, the data of 1 data line 1 4 or the data of multiple data line pairs 1 4 pass through the sense amplifier SA and the data line pair (hereinafter referred to as this data line pair d Q line pair 'and data line pair 1 4 To distinguish), import DQ buffer DQ. The size of this paper is suitable for China National Standard Falcon (CNS) Λ4 present grid (210 × 297 male elk) I / Bu I.-11 -II-fcf I— I ΙΊ Shishi-. I (Please read the precautions on the back before filling in This page) Order --- A7 B7 Printed by the Consumer Labor Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (9) 1 1 In this reference example, one column decoder selects two columns to form 0 1 I this At this time, there are 2 column decoders, so each of the middle blocks BL a »1 1 1 BL b, BLC, BL d * 4-bit data input and output 0 ie * white 1 I please 1 I 1 block library, Exporting and importing 16-bit (2-byte) data 0 This 1 6 first-read 1 I 1-byte data is transferred to the repository through the data bus 1 3 1 1 1 Γ έ | of 1 0 One of 11 -3 9 and the data input / output range 1 2 〇 Note Γ Chapter 1 Sense amplifier SA and column selection switch 1 6 series Add 1 to the entry of the memory grid array 1 and each of the blocks BL a, BL b > BLCBL d is placed between the small blocks CALCAR of the 4-page 100 million grid array 0 1 row decoder RD and DQ The buffer DQ will record a 100 million grid array 1 1 CAL, CAR is placed in the center to face each other. Column decoding 1 1 device C D0 is configured with 4 middle blocks BL a BL b BLCB set the direction of 1 1 L d , That is, one of the two ends arranged in the column direction (the direction in which the data line pair or column selection line extends 1 I)-the side column decoder CD 0 is arranged in the other of the two ends 1 1 1 0 1 1 The grid array controller CAC is adjacent to the column decoder RD and is configured. 1 0 The grid array controller CAC performs the data input and output operations in the bank 1 1 Control 0 1 I after the DQ buffer DQ)-Normal While > is configured as Select the zone library 1 I zone library selector SEL. 1 1 Λ The data is guided to the DQ line pair 1 8 through the data line pair 1 4 The sense amplifier SA and the row selection 1 1 Switch 16, the DQ line pair 1 8 is in each block of the memory cell array BL a »BL b» BLC t BL d 1 1 »Arranged in the small CALCAR space of the 100 million grid array 〇1 1 This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -IX-303657 A7 B7 Employee's Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, Employee Cooperative V. Description of the invention (10) 1 | Therefore »The data is via the DQ line pair 1 8» Orthogonal to the 4 middle blocks BL a of the 1 billion array > BL b 1 BL c, BL d side 1 1 moves in the direction of the row direction C character line extending), via / -— V 1 I please 1 1 DQ buffer DQ > Area library output Reading 1 I Reading 1 (the data bus in all 4 districts 1 3 is located on the back of district 11 Γ | No. 1 — 0, 1 1 -1 and block 1 1 — 2 1 1 — 3 Note about the 100 million grid array. The block BL a > BL b • BL <? The item is in the 1 I direction, that is, extended in the row direction. The data bus 1 3 is presented as a library 1 1-fill in the% I 0 11-3 and the data input and output range 1 2 data input and output path page 1 1 of 0 1 1 In this reference example »It is a 16-bit (2-byte) data output 1 | The input can be configured at the same time 9 Order 1 Data input range 1 2 In the M simultaneous 16-bit (2 bit Element 1 1 I group) data input and output to form 16 I / O circuits (I / 0) 1 1 1, J The above-mentioned semiconductor memory data input and output operations are performed as follows: 1 I first pass the area Library selector SEL »Choose from 4 district libraries 1 1-1 I 0 11 — 3 — one library , According to the 1 J address signal, the access operation is recorded in billions of squares. 〇1 1 Data output (reading) t 2 n bits' For example, 16 bits (112 bytes)) Via DQ line pair 1 8-from the selected 1 1 1 zone library output * 2 from the zone library output [metadata is directed to the data input and output range 1 2 1 and 1 1 through row 1 3 . From the data input into the standard 1 1 This paper scale is applicable to the Chinese National Standard Falcon (CNS) A4 specification (210X297 mm) -β-A7 B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of Invention (11) 1 | Circumstance 1 2 When outputting to the semiconductor memory (billion memory chip) 0 1 1 Data input (writing) »2 n bits (eg. L 3 bits (1 12 bytes)) Through data input / output range 1 2, data sink 1 I stream row 1 3 »Input to the 1 selected library ○ Input to 1 selected library Please read 2 " of 1 I library The data of the element is read through the DQ line L 8 and the back of the sense amplifier \ \ ISA 9 Attention to the memory cell of the memory cell array. 1 | * | V The above-mentioned semiconductor chip memory chip layout> has the following Disadvantages 〇 Matters 1 | The first information is filled in 1 I There are 4 districts 1 1 0 1 1 3 Material assembler assembly row 1 3 It is arranged through the central part of the 100 million chip 1 0, extended on page 1 1 Row direction (the direction in which the data line pair or row selection line extends) 0 At this time, half 1 1 The bit type of the conductor memory is proportional to the number of simultaneous input and output bits 1 | The number of data bus 1 3 increases Increase the range of the data bus 13 1 range 9 1 1 I For example > 16-bit (X 16) semiconductor memory time 1 1 I The data bus 1 3 needs to send 16 bits The wiring of the number of divided data is also the same as 1 1 ground 3 2 bit type (X 3 2) The data bus of the semiconductor memory unit 1 row 1 3 is the wiring that needs to transmit 3 2 bit data 0 1 1 2nd »1 in the block BL a BL d located in each zone library The IDQ line pair 1 8 9 is only arranged in the small block CAL% 1 of the mega-array. The CAR 9 is only extended in the direction (the direction in which the character line is extended) P this 1 1 when »Proportion in the white one block The number of bits output increases the number of DQ line pairs 1 1 1 8 t Increases the range of DQ line pairs 1 8 〇1 1 For example »In a middle block of y, 4 bits of raw material input and output 1 At 1 o'clock, the DQ wire pair 1 8 series requires wiring that can transmit 4 digits of data. 1 1 This paper standard is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 0X297mm) Employee consumption cooperation of the Central Standards Bureau of the Ministry of Economic Affairs. Du printed A7 B7 _ V. Description of the invention (12) Similarly, when 8-bit data is input and output in a middle block, the DQ line pair 18 series needs to be able to transmit 8-bit points The number of data lines 3 billion, in the interior area, one of the two end portions in the row direction, the row decoder arranged RD, arranged on the other DQ buffer DQ. At this time, the column decoder CD 0 is arranged in one of the two ends in the column direction in the bank, and the column decoder CD 1 is arranged in the other of the two ends. In addition, the grid array controller CAC is arranged across one of the two end portions in the row direction across the four middle blocks BLa, BLb, BLc, and BLd. Therefore, the column decoder R D and the grid array controller CAC are co-located
V 置於行方向之2個端部的一方之故,構成行解碼器RD及 格陣列控制器C A C的元件配置或配線等則會複雜。 圖3係顯示本發明之第2參考例之半導體記憶體之晶 片佈局。圖4係詳細顯示圖3之1個區庫內的佈局。 此參考例中,對於可同時输出入3 2位元資料之3 2 位元型(X 3 2 )之半導體記億體進行說明》 於一個記億晶片1 0上,配置4個區庫1 1 — 0〜 1 1 — 3。各區庫1 1 — 0〜1 1 — 3中,形成記億格陣 列C A L、C A R,記億格陣列控制器C A C,且行解碼 器RD、列解碼器CDO、CD1 ,DQ緩衝器(稱區庫 之输出入部緩衝器)DQ等之周邊電路。 1個區庫內之記憶格陣列係分爲4個中區塊B L a , BLb ,BLc ,BLd。又,各中區塊係分爲2個小區 本紙張尺度適用中國國家標率(CNS ) Λ4規格(210X 297公釐) ~ -* / L - II— - I Λί ^^1 tli 0 - I - —4 I- -- i - - ! - -- » ! I 戈 *T (請先閱讀背面之注意事項再填寫本I ) 咖657 A7 B7 五、發明説明(u) 塊CAL,CAR。因此,1個區庫內之記億格陣列係由 8個區塊構成。 行解碼器RD·係於各4個之中區塊BLa ,BLb ’ BLc ,BLd中,各設置1個*行解碼器RD係根據行 位址信號,選擇2個小區塊CAL、CAR中之任一個’ 且自選擇1個之區塊中的複數行選擇1個行(字元線1 7 )° 列解碼器CD 〇〜CD 3係於1個區庫內設置4個° 列解碼器C D 0〜C D 3係根據各列位址信號’選擇4個 中區塊BLa ,BLb,BLc ,BLd之記億格陣列的 —個或複數列。 即,經由列解碼器CD 0〜CD 3選擇所定之列選擇 線15 — 0,15 — 1時,連接於該所定列選擇線15 — 0〜15 — 3之列選擇開關16則呈開啓狀態,1個資料 線對14之資料或複數之資料線對14之資料則經由感測 放大器S A及資料線對(以下稱此資料線對爲D Q線對 ,與資料線對14加以區別),導入DQ緩衝器DQ。 經濟部中央標準局員工消費合作社印裝 \/本參考例中,1個列解碼器選擇2個列地加以構成。 此時,存在4個列解碼器之故,自各中區塊B L a , BLb ,BLc ,BLd ,輸出入8位元之資料。即,自 1個區庫,輸出入3 2位元(4位元組)之資料。此3 2 位元組之資料係通過資料匯流排1 3,進行至區庫1 1 -0〜1 1 — 3中之一個,和資料输出入範圍12間。 感測放大器S A及列選擇開關1 6係於記憶格陣列之 ~ /b ~ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 經濟部中央標準局員工消費合作社印製 A 7 B7 五、發明説明(14) 各中區塊BLa ,BLb,BLc ,BLd中,配置於記 憶格陣列之小區塊CAL,CAR間。 行解碼器R D和D Q緩衝器D Q係將記憶格陣列 CAL,CAR挾於中央,相互對向地加以配置。列解碼 器CDO係配置4個中區塊BLa ,BLb,BLc , B L_ d的方向,即配置於列方向(資料線對或列選擇線延 長之方向)之2個端部中之一側,列解碼器CDO係配置 於該2個端部中的另一方。 格陣列控制器C A C係鄰接於列解碼器R D加以配置 。格陣列控制器C A C係進行區庫內之資料輸出入動作之 控制。 於D Q緩衝器D Q後,一般而言,配置爲選擇區庫之 區庫選擇器SEL。 資料係經由資料線對14、感測放大器SA及列選擇 開關1 6後,引導至DQ線對1 8。DQ線對1 8係於記 億格陣列之各中區塊BLa ,BLb,BLc,BLd 中,配置於記憶格陣列之小區塊C A L、C A R間。 因此,資料係經由DQ線對1 8,正交於配置記億格 陣列之4個中區塊BLa ,BLb ,BLc ,BLd的方 向’即向行方向(字元線所延長之方向)移動後,經由 DQ緩衝器DQ,自區庫輸出。 有於4個區庫之資料匯流排1 3係配置於區庫1 1 —0,11 — 1和區塊11 一2,11-3間,記億格陣 列之中區塊BLa ,BLb,BLc ,BLd所配置之方 本紙張尺度適用中國國家標準(CNS ) A4現格(2丨0><297公釐) -η-· 7 装 n 訂 (請先閱讀背面之注意事項再填寫本頁) A7 經濟部中央標準局員工消f合作枉印^ B7 五、 發明説明 (15 ) 1 向 即 延 長 於 列 方 向 〇 資 料 匯 流 排 1 3 係 呈 區 庫 1 1 — 0 1 1 0 1 1 3 和 資 料 输 出 入 範 圍 1 2 間 之 資 料 輸 出 入 路 徑 者 1 1 | 本 參 考 例 中 » 令 3 2 位 元 型 之 半 導 體 記 憶 體 爲 > 刖 提 之 /-—S 請 先 閲 1 1 I 故 y 資 料 匯 流 排 1 3 係 以 3 2 位 元 ( 4 位 元 組 ) 之 資 料 輸 讀 背 1 \ I 出 入 可 同 時 進 行 地 加 以 構 成 者 9 之 1 I Γ 意 I 資 料 输 入 範 圍 1 2 中 » 爲 同 時 進 行 3 2 位 元 ( 4 位 元 事 項 1 I 組 ) 之 資 料 輸 出 入 » 形 成 3 2 個 之 輸 出 入 電 路 ( I / 0 ) 再 填 寫 本 —^4 Ά 0 頁 1 I V, 上 述 之 半 導 體 ruZ· 記 憶 體 之 資 料 輸 出 入 動 作 係 如 下 地 加 以 1 I 進 行 0 1 I 首 先 、 經 由 區 庫 選 擇 器 S E L 由 4 個 之 區 庫 1 1 — 1 訂 1 0 1 1 一 3 中 選 擇 — 個 區 庫 0 選 擇 之 1 個 區 庫 中 根 據 1 1 位 址 信 號 進 行 記 億 格 之 存 取 動 作 〇 1 1 資 料 之 輸 出 ( 讀 取 ) 時 > 2 η位元 (例如ί 2 !位元 〔 1 1 4 位 元 組 ) ) 之 資 料 則 經 由 D Q 線 對 1 8 白 該 選 擇 之 1 一、 Γ 個 區 庫 輸 出 0 白 區 庫 輸 出 之 2 η 位 元 資 料 係 經 由 資 料 匯 流 1 I 排 1 3 » 引 導 至 資 料 輸 出 入 範 圍 1 2 1 且 白 資 料 輸 出 入 範 1 I 圍 1 2 輸 出 至 半 導 體 FU2. 記 憶 體 肢 ( 記 億 晶 片 ) 外 部 0 1 1 1 資 料 之 輸 入 ( 寫 入 ) 時 1 2 η位元 〔例如2 2 !位元< 1 1 4 位 元 組 ) ) 之 資 料 則 經 由 資 料 輸 出 入 範 圍 1 2 資 料 匯 1 1 流 排 1 3 I 輸 入 至 該 選 擇 之 1 個 區 庫 0 輸 入 至 該 選 擇 之 1 1 1 個 區 庫 的 2 n位元之資料係經由D Q線] ε 丨及感測放大器 1 1 S A » 記 億 於 記 憶 格 陣 列 之 記 憶 格 〇 1 1 本紙悵尺度適用中國國家標準(CNS ) A4規格(210X 297公綠)Since V is placed at one of the two ends in the row direction, the arrangement and wiring of the components constituting the row decoder RD and the grid array controller CAC are complicated. Fig. 3 shows a wafer layout of a semiconductor memory according to a second reference example of the present invention. Figure 4 shows in detail the layout in the one-zone library of Figure 3. In this reference example, a 32-bit (X 3 2) semiconductor memory device capable of simultaneously outputting 32-bit data will be explained. On a memory chip 10, 4 area libraries 1 1 are arranged. — 0〜 1 1 — 3. In each zone library 1 1 — 0 to 1 1 — 3, a scalar grid array CAL, CAR, a scalar grid array controller CAC, and row decoders RD, column decoders CDO, CD1, DQ buffer (called a zone library) are formed I / O buffer) DQ and other peripheral circuits. The memory grid array in one district library is divided into 4 middle blocks B La, BLb, BLc, BLd. In addition, each middle block is divided into 2 small areas. The paper scale is applicable to the Chinese National Standard Rate (CNS) Λ4 specification (210X 297 mm) ~-* / L-II—-I Λί ^^ 1 tli 0-I- —4 I--i--!--»! I Ge * T (Please read the precautions on the back before filling in this I) Coffee 657 A7 B7 V. Description of invention (u) Block CAL, CAR. Therefore, the 100 million grid array in a district library is composed of 8 blocks. The row decoder RD is set in each of the four middle blocks BLa, BLb 'BLc, BLd, and each one is set. * The row decoder RD selects any of the two small blocks CAL and CAR based on the row address signal One 'and one row (character line 1 7) is selected from the plural rows in the block of one selection ° Column decoder CD 〇 ~ CD 3 is set in a block of 4 ° Column decoder CD 0 ~ CD 3 is to select one or a plurality of columns of four hundred million grid arrays of four middle blocks BLa, BLb, BLc, and BLd according to the address signals of each column. That is, when the predetermined column selection lines 15-0, 15-1 are selected via the column decoders CD 0 ~ CD 3, the column selection switch 16 connected to the predetermined column selection lines 15-0 ~ 15-3 is turned on, The data of one data line pair 14 or the data of multiple data line pairs 14 is passed through the sense amplifier SA and the data line pair (hereinafter referred to as this data line pair is a DQ line pair, which is different from the data line pair 14), and imported into DQ Buffer DQ. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs \ / In this reference example, one column decoder is selected to constitute two columns. At this time, because there are 4 column decoders, 8 bits of data are output from the middle blocks B La, BLb, BLc, BLd. That is, from one zone library, 32-bit (4-byte) data is output. This 32-byte data is passed through the data bus 13 to one of the district libraries 1 1-0 ~ 1 1-3, and the data is exported to and input from 12 rooms. The sense amplifier SA and the row selection switch 16 are in the memory cell array ~ / b ~ (please read the precautions on the back and then fill out this page) This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm ) A 7 B7 printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (14) In the middle blocks BLa, BLb, BLc and BLd, they are arranged between the small blocks CAL and CAR of the memory grid array. The row decoders R D and D Q buffers D Q place the memory cell arrays CAL and CAR in the center and configure them to face each other. The column decoder CDO is arranged in the direction of the four middle blocks BLa, BLb, BLc, B L_d, that is, it is arranged on one of the two ends of the column direction (the direction in which the data line pair or column selection line extends), The column decoder CDO is arranged at the other of the two ends. The grid array controller CAC is arranged adjacent to the column decoder Rd. The grid array controller CAC controls the data input and output in the library. After the DQ buffer DQ, generally speaking, it is configured to select the bank selector SEL of the bank. The data is directed to DQ line pair 18 through data line pair 14, sense amplifier SA and column selection switch 16. The DQ line pair 18 is located in the middle blocks BLa, BLb, BLc, and BLd of the memory grid array, and is arranged between the small blocks CAL and CAR of the memory grid array. Therefore, the data is shifted to the row direction (the direction in which the character line extends) through the DQ line pair 18, which is orthogonal to the direction of the four middle blocks BLa, BLb, BLc, and BLd of the megapixel array. , Via DQ buffer DQ, output from the zone library. The data bus 13 in the 4 district libraries is arranged between the district library 1 1-0, 11-1 and the block 11-2, 11-3, and the blocks BLa, BLb, BLc in the billion grid array , The square paper size configured by BLd is applicable to the Chinese National Standard (CNS) A4 (2 丨 0> < 297mm) -η- · 7 pack n order (please read the precautions on the back before filling this page ) A7 Ministry of Economic Affairs Central Standards Bureau employee elimination cooperation ^ B7 V. Description of the invention (15) 1 has been extended in the direction of the row 〇 data bus 1 3 is the district library 1 1 — 0 1 1 0 1 1 3 and Data input / output range 1 2 Data input / output path 1 1 | In this reference example »Let the 32-bit semiconductor memory be > 刖 提 的 / -— S Please read 1 1 I Therefore y data Bus 1 3 is based on 32-bit (4-byte) data input and read back 1 \ I access can be formed simultaneously by the 1 of 9 I Γ meaning I data input range 1 2 middle »same Perform 3 2 bit (4 bit items 1 I group) data input / output »Form 3 2 input / output circuits (I / 0) and fill in this — ^ 4 Ά 0 page 1 IV, the above semiconductor ruZ · memory The data input / output action of the volume is as follows: 1 I for 0 1 I First, choose from 4 district libraries 1 1-1 order 1 0 1 1-3 through district library selector SEL-choose one of the district banks 0 In a bank, according to the 1 1 address signal, the access operation is recorded in billions of grids. When the data is output (read)> 2 η bits (for example, ί 2! Bit [1 1 4 bytes )) The data through the DQ line pair 1 8 the selected 1 1. Γ block output 0 0 block output 2 η bit data is through the data bus 1 I row 1 3 »leads to the data input and output range 1 2 1 and white data output input range 1 I range 1 2 output to semiconductor FU2 . Memory limb (100 million chip) External 0 1 1 1 When data is input (written) 1 2 η bit (for example 2 2! Bit < 1 1 4 byte)) The data is output through the data Input range 1 2 Data sink 1 1 Stream bank 1 3 I Input to the selected 1 bank 0 2 N-bit data input to the selected 1 1 1 bank is via DQ line] ε 丨 和 感Test Amplifier 1 1 SA »Memory cell in memory cell array 〇1 1 The scale of this paper is applicable to China National Standard (CNS) A4 specification (210X 297 public green)
It 經濟部中央榡隼局員工消f合作社印t 3_57 Λ7 B7 五、發明説明(16 ) 上述之半導體記億體之晶片佈局中,有和圖2及圖3 所示第1參考例之半導體記憶體之晶片佈局同樣的缺點。 即,第1 ,半導體記憶體之位元型,即比例於同時進 行輸出入位元數,資料匯流排1 3之條數則增加,增大資 料匯流排1 3之範圍。第2 ’比例於各區庫之中區塊輸出 之位元數,增加DQ線對1 8之條數,增大DQ線對1 8 之範圍。第3 ,列解碼器R D和格陣列控制器 C A C係 共同配置於行方向之2個端部的一方之故,構成行解碼器 R D及格陣列控制器C A C的元件配置或配線等則會複雜 〇 本參考例係更且於各列方向之2個之端部中,配置2 個之列解碼器之故,構成列解碼器C D 0〜CD 3的元件 配置或配線等則會複雜。 ^^圖5係概略顯示圖1及圖2之第1參考例之半導體記 憶體區庫位置和資料匯流排之位置。 記億晶片10上之範圍係主要由區庫11—0〜11 一 3及資料輸出入範圍(I/O) 12所占據。資料输出 入範圍1 2係鄰接記億晶片1 0之4個邊之一個,即鄰接 於列方向之2個邊中之一個加以配置。 區庫內之記憶格陣列係由配置於列方向之複數小區塊 構成,且經由2個小區塊構成1個中區塊。 於各小區塊內,配置於延長於行方向之字元線,和延 長於列方向(配置小區塊之方向)之資料線及列選擇線。 D Q線對1 8係於2個小區塊間,延長於行方向。2 I :1 --- !| 4— - . - nr -—-I I -- n (請先閱讀背面之注意事項再填寫本頁) 旬--- 本紙张尺度適用中國國家標準(CNS ) Λ4現格(210X2*^公釐) -叫- 經濟部中央標準局員工消费合作杜印t A7 B7 五、發明説明(π ) 個小區塊間之D Q線對1 8係僅存在可傳送4位元資料之 數。 /料匯流排13係配置於區庫1 1 — 〇,1 1 — 1和 區庫1 1 — 2 ,1 1 一 3間,延長於列方向。資料匯流排 1 3係令1 6位元(2位元組)之資料可傳送地加以構成 〇 圖6係顯示圖1及圖2之第1參考例之半導體記憶格 之晶片佈局的變形例。圖7係詳細顯示圖6之半導體記億 體之晶片佈局。It Printed by the Ministry of Economy, Central Falcon Bureau Employee Association 3_57 Λ7 B7 V. Description of the invention (16) The above-mentioned semiconductor memory chip layout has the semiconductor memory of the first reference example shown in FIGS. 2 and 3. The same disadvantages of chip layout. That is, first, the bit type of semiconductor memory, which is proportional to the number of simultaneous input and output bits, the number of data buses 13 increases, increasing the range of data buses 13. The second 2 'ratio is the number of bits output by the blocks in each zone library, increasing the number of DQ line pairs 18 and increasing the range of DQ line pairs 18. Third, the column decoder RD and the grid array controller CAC are arranged together at one of the two ends in the row direction, so the arrangement and wiring of elements constituting the row decoder RD and the grid array controller CAC are complicated. In the reference example, two column decoders are arranged at the two ends of each column direction, so the arrangement and wiring of the elements constituting the column decoders CD 0 to CD 3 are complicated. ^^ FIG. 5 is a schematic diagram showing the position of the semiconductor memory bank and the position of the data bus in the first reference example of FIG. 1 and FIG. 2. The range on the billion chip 10 is mainly occupied by the library 11-0 ~ 11-3 and the data input / output range (I / O) 12. The data input / output range 12 is one of the four edges adjacent to the billion chip 10, that is, one of the two edges adjacent to the column direction. The memory cell array in the bank is composed of a plurality of small blocks arranged in the column direction, and a middle block is formed by two small blocks. Within each small block, it is arranged in a character line extending in the row direction, and a data line and a column selection line extending in the column direction (the direction in which the small blocks are arranged). The D Q line pair 18 is tied between two small blocks, extending in the row direction. 2 I: 1 ---! | 4—-.-Nr -—- II-n (Please read the precautions on the back before filling out this page) Xun --- This paper scale is applicable to China National Standard (CNS) Λ4 Cash (210X2 * ^ mm)-Called-Ministry of Economic Affairs Central Standards Bureau employee consumption cooperation Du Yin t A7 B7 V. Description of invention (π) DQ line pairs between small blocks 1 8 series only exists to transmit 4 bits The number of data. / Material bus 13 is arranged in the zone library 1 1-0, 1 1-1 and zone library 1 1-2, 1 1-3, extended in the column direction. Data bus 13 is a system in which 16-bit (2-byte) data can be transmitted and constituted. FIG. 6 is a modification of the chip layout of the semiconductor memory cell of the first reference example in FIGS. 1 and 2. FIG. 7 shows in detail the layout of the semiconductor memory chip of FIG. 6.
Xy7此晶片佈局係較圖1及圖2之晶片佈局,在於以下之 點上有所不同。 第1 ,令1個區庫(主區庫)自2個副區塊構成。 即,主區庫1 1 — 0係自副區庫1 1 — 0 — #0 , 1 1 — 0_#1所構成,主區庫1 1 — 1係自副區庫1 1 -1— #0 ,11 — 1— #1所構成,主區庫11 — 2係 自副區庫1 1 — 2 — #0,1 1 一 2-#1所構成,主區 庫 1 1 — 3 係自副區庫 1 1 — 3 — #0 ,1 1 — 3-#1 所構成。 副區庫11 — 0 — #0 ,11 — 0 - #1係經由區庫 選擇電路,同時加以選擇。副區庫1 1 — 0 - #0 ,1 1 —0 - # 1被選擇之時’殘留之區庫則不選擇。同樣地’ 例如副區庫1 1 — 1 一 #0 ,1 1_1一 #1被選擇之時 ,殘留之區庫則不選擇。 又,經由4個副區庫1 1 — 〇 — #0 ’ 1 1 — 1 一 本紙張尺度適用中國國家標隼(CNS ) A4規格(210X 297公釐) ~ ...... » 1 —^ϋ ft W— I —^ilk (請先閲讀背面之注意事項再填寫本頁) 訂--- _β57 A7 Β7 經濟部中央標準局只工消f合作社印製 五、 發明説明 (18 — — -------~ | # 0 > 1 1 一 2 — # 0 ) 1 1 — 3 一 # 0 構 成 1 個 群 » 經 1 I 由 4 個 副 區 庫 1 1 一 0 — # 1 I 1 1 — 1 — # 1 1 1 — 1 1 2 — # 1 > 1 1 一 3 一 # 1 構 成 1 個 群 0 1 1 即 y 於 副 區 庫 1 1 — 0 — # 0 1 1 1 — 1 — # 0 » 1 ----V 請 1 1 1 — 2 一 # 0 > 1 1 — 3 一 # 0 之 群 中 同 時 進 行 8 位 元 閱 讀 背 1 面 Γ 1 之 資 料 之 輸 出 入 ♦ 於 副 區 庫 1 1 — 0 一 # 1 » 1 1 — 1 之 注 1 # 1 > 1 1 一 2 — # 1 » 1 1 — 3 一 # 1 之 群 中 同 時 進 事 項 1 1 行 8 位 元 之 資 料 之 輸 出 入 〇 再 填 寫 本 1 Ί. 第 2 於 1 個 副 區 庫 中 進 行 8 位 元 ( 1 位 元 組 ) 之 頁 、Sw- 1 1 資 料 輸 出 入 地 構 成 〇 1 1 副 區 庫 之 佈 局 係 與 圖 1 及 圖 2 之 區 庫 佈 局 比 較 時 列 1 1 解 碼 器 C D 則 在 於 只 有 1 個 爲 其 不 同 之 處 〇 因 爲 本 例 時 1 訂 ί 於 1 個 副 區 庫 中 爲 進 行 8 位 元 之 資 料 之 輸 出 » 列 解 碼 ! 1 器 C D 係 存 在 — 個 即 可 0 但 是 列 解 碼 器 C D 係 與 圖 1 及 1 1 I 圖 2 之 半 導 體 記 憶 體 同 樣 地 * 選 擇 2 個 列 於 記 憶 格 陣 列 1 I 之 各 中 區 塊 B L a » B L b » B L C » B L d 中 > 執 行 2 1 I 位 元 之 資 料 之 輸 出 入 0 册 1 I 副 區 庫 內 之 記 憶 格 陣 列 C A L 、 C A R 列 解 碼 器 1 1 I R D D Q 線 對 1 8 及 D Q 緩 衝 器 D Q 之 佈 局 係 與 圖 1 及 1 1 圖 2 之 半 導 體 記 億 體 區 庫 內 之 佈 局 相 同 〇 1 第 3 資 料 輸 出 入 電 路 ( I / 0 ) 1 2 a 1 2 b 係 1 1 於 記 億 晶 片 1 0 之 中 央 部 中 1 於 行 方 向 變 長 地 加 以 配 置 9 1 1 資 料 匯 流 排 1 3 a 係於副區庫1 1 -0 一 -# 0 1 1 1 1 1 — # 0 1 1 — 2 — # 0 9 1 1 — 3 — # 0 之 群 中 配 ______^ 1 1 本紙浪尺度適用中國國家標準(CNS ) Λ4現格(210X297公緩) f -二/ 經濟部中央標準局員工消费合作社印褽 A7 ______B7 五、發明説明(19 ) 置於資料輸出入電路1 2 a之兩側,資料匯流排1 3 b係 於副區庫 11-0 — #1 ,11 — 1— #1 ,11 — 2 — #1 ’ 11 — 3 - #1之群中,配置於資料输出入電路 1 2 b之兩側。 資料匯流排1 3 a、1 3b係於各副區庫間,延長於 列方向,連接於記憶晶片1 〇之中央部資料部的資料輸出 入電路12a、12b。資料匯流排13a、13b係可 傳送各8位元之資料地加以構成》 於如此之晶片佈局之半導體記憶體中,例如選擇副區 庫 11 — 〇-#〇,1 1 — 〇-#1 時,於副區庫 1 ΙΟ _# 0 和資料輸出入電路 1 2 a 間 ,經由資料匯流排 1 3 a ’進行8位元資料之收受,於副區庫1 1 — 〇_ # 1和資料输出入電路1 2 b間,經由資料匯流排1 3 b ’進行8位元資料之收受。 ^3 8係顯示圖1及圖2之第1參考例之半導體記億格 之晶片佈局的變形例。圖9係詳細顯示圖8之半導體記憶 體之晶片佈局。 此晶片佈局係較圖1及圖2之晶片佈局,在於以下之 點上有所不同。 第1 ’令1個區庫(主區庫)自2個副區塊構成。 即,主區庫1 1 一 0係自副區庫1 1 — 0 — #0 , 1 1-0 — #1所構成,主區庫1 1_1係自副區庫1 1 —1— #0,所構成,主區庫11 — 2係 自副區庫1 1 — 2 — #0,1 1-2-#1所構成,主區 本紙張尺度適用中國國家標华(CNS ) Α4規格(210X297公釐) I ! ---ί - IV— ---^-*衣 II . I I- …! I . - —^1 (請先閱讀背面之注意事項再填寫本頁) -2^·- 309657 a? B7 經濟部中央標準局員工消资合作让印製 五、發明説明(20 ) 庫 1 1 — 3 係自副區庫 1 1 一 3 — #0,1 1 — 3-#1 所構成。 副區庫1 1 — 〇 — #〇 ’ 1 i-o-ti係經由區庫 選擇電路,同時加以選擇。副區庫1 1 — 〇 — #〇,1 1 —0 — # 1被選擇之時’殘留之區庫則不選擇。同樣地, 例如副區庫1 1 — 1 一 #〇 ’ 1 i — l— #1被選擇之時 ,殘留之區庫則不選擇。 又,經由4個副區庫11 一 ,11一1 一 #0,11-2 — #0 ’ 11 — 3 〜構成 1 個群,經 由 4 個副區庫 11 一 0 — #1 ’ #1 ,11 一 2 — #1 ,11-3 — #1 構成 1 個群。即,於副區庫11一0—#〇,11一1-#0, 1 1 — 2 — #0 ,1 1-3 — # ◦之群中,同時進行8位 元之資料之輸出入,於副區庫1 1 — 0 — #1 ,1 1 一 1 —#1 ,11-2 — #1 ,11_3~#1 之群中,同時 進行8位元之資料之輸出入。 第2,於1個副區庫中,進行8位元(1位元組)之 資料輸出入地構成。 副區庫之佈局係與圖1及圖2之區庫佈局比較時,列 解碼器C D則在於只有1個爲其不同之處。因爲,本例時 ,於1個副區庫中,爲進行8位元之資料之輸出,列解碼 器CD係存在一個即可。但是,列解碼器CD係與圖1及 圖2之半導體記憶體同樣地,選擇2個列,於記億格陣列 之各中區塊 BLa ,BLb ,BLc ,BLd中’執打 (請先閱讀背面之泣意事項存填寫本\®〇 灯 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公釐)_ 13 經濟部中央標準局員工消f合作杜印製 A7 __B7 _____ 五、發明説明(21 ) 2位元之資料之輸出入。 副區庫內之記憶格陣列C A L、C A R、列解碼器 RD、DQ線對18及DQ緩衝器DQ之佈局係與圖1及 圖2之半導體記憶體區庫內之佈局相同。 第3,資料匯流排1 3 a係於副區庫1 1 — 0 - 〇 ,11- 1-#〇,11-2-#0,11-3-#〇 之 群中,向列方向延長地加以配置,資料匯流排1 3 b 係 於虽!I 區庫 11 — 〇 — #1 ,11 — 1— #1 ’ 11_2 — #1 ’ 11 — 3 — #1之群中,向列方向延長地加以配置 〇 即,資料匯流排1 3 a係於副區庫間,自配置於列方 向之端部的資料輸出入電路1 2 a向列方向延長,資料匯 流排1 3 b係於副區庫間,自配置於列方向之端部的資料 輸出入電路1 2 b向列方向延長。 又’資料匯流排1 3 a 、1 3 b係可傳送各8位元之 資料地加以構成》 於如此之晶片佈局之半導體記憶體中,例如選擇副區 庫 1 1 — 0 — #〇,1 1 — 〇 - #1 時,於副區庫 1 Ι ο— #0 和資料輪出入電路 i 2 a 間 ,經由資料匯流排 1 3 a ,進行8位元資料之收受’於副區庫1 1 — 〇 — # 1和資料輸出入電路1 2 b間,經由資料匯流排1 3 b ,進行8位元資料之收受。 • 1 〇係顯示本發明之第1實施例之半導體記憶體之 晶片佈局。圖1 1係詳細顯示圖1 0之一個區庫內之佈局 本紙張尺度適财晒家標华(CNS ) Λ4現格(2U)'X公康)' — ' -21}.- (請先閱讀背面之注意事項再填寫本頁) " 訂 A7 B7 309657 五、發明説明(22 ) 此實施例中,對於可同時輸出入1 6位元資料之i 6 位元型(X 1 6 )'之半導體記憶體加以說明。 於一個記億晶片1〇上’配置4個區庫1 1〜 1 1 — 3。各區庫1 1 一 〇〜1工―3中’形成記億格陣 列CAL、CAR,記億格陣列控制器CAC,且行解碼 器RD、列解碼器CD〇、CD1 ,DQ緩衝器(稱區庫 之輸出入部緩衝器)DQ等之周邊電路。 1個區庫內之記憶格陣列係分爲4個中區塊B L a ’ BLb ,BLc ,BLd。又’各中區塊係分爲2個小區 塊CAL,CAR。因此’ 1個區庫內之記憶格陣列係由 8個區塊構成。 行解碼器RD係於各4個之中區塊BLa ’ BLb ’ BLc ,BLd中,各設置1個。行解碼器RD係根據行 位址信號,選擇2個小區塊CAL、CAR中之任一個’ 且自選擇1個之區塊中的複數行選擇1個行(字元線1 7 )° 記億格陣列之小區塊之選擇係於2條之字元線1 9 a 、1 9 b之任一方,施加高電壓加以進行。例如於字元線 1 9 a施加高電壓時,開關2 0 a則呈開啓狀態,選擇小 區塊CAL。此時,於字元線19b施加低電壓之故,開 關2 0 b則呈關閉狀態,小區塊C A R係非選擇。 列解碼器CD0,CD1係於1個區庫內設置2個。 列解碼器C D 0,C D 1係根據各列位址信號,選擇1個 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X2W公釐)_ -- n ,/1 —ί - --·- - J*κ 1 - «:— - - -__I m T -J戈-a (请先閱讀背面之注意事項再填寫本頁) 經濟部卞失榡準扃貞工消费合作社印繁 A7 B7 經濟部中央橾準局員工消费合作社印取 五、 發明説明(23 ) 1 或 複數之 4個 中 區 塊 B L a ,B L b ,B L C * B L d 1 1 1 如 ,經 由 列 解 碼 器 C D 1 » 選 xsg 擇 列選 擇 線 1 5 和 1 1 1 連 接於該 列選 擇 線 1 5 之 2 個 列 選 擇 開 關1 6 則 呈 開 啓 狀 先 閱 1 1 態 。然後 ,自 連 接 於 該 2 個 列 選 擇 開 關 16 之 2 個 資 料 線 背 ιέ 1 1 1 對 14, 2位 元 之 資 料 則 經 由 感 測 放 大 器S A 及 列 選 fjm 择 開 之 注 1 意 1 關 16, 輸出 至 資 料 線 對 ( 以 下 f 令 此 資料 線 對 稱 局 部 事 .項 1 I 再 1 D Q線對 ,與 資 料 線 對 1 4 加 以 區 別 ) 18 a 〇 填 寫 本 裳 I 本實 施例 中 » 1 個 列 解 碼 器 則 選 擇 2個 列 地 加 以 構 成 a 1 1 〇 此時因 存在 2 個 列 解 碼 器 之 故 9 白 各 中區 塊 B L a 9 B 1 [ L b ,B L c B L d » 輸 出 4 位 元 之 資料 〇 即 白 1 個 1 I 區 庫,輸 出入 1 6 位 元 ( 2 位 元 組 ) 之 資料 〇 1 訂 1 感測 放大 器 S A 及 列 選 擇 開 關 1 6 係於 記 憶 格 陣 列 之 1 1 I 各 中區塊 B L a ’ B L b B L ( : B L d中 配置於 1 1 記 億格陣 列之 小 區 塊 C A L C A R 間。 1 1 列解 碼器 R D 和 格 陣 列 控 制 器 C A C係 令 記 憶 格 陣 列 f C A L, C A R 挾 於 中 央 相 互 對 向 地 加以 配 置 〇 即 列 1 1 解 碼器R D係 於 配 置 4 個 之 中 區 塊 B L a , B L b 1 I B L c * B L d 的 方 向 即 配 置 於 行 方 向( 字 元 線 1 7 9 1 I 1 9 a , 19 b 延 長 之 方 向 ) 之 2 個 端 部中 的 一 方 側 格 1 1 陣 列控制 器C A C 係 配 置 於 該 2 個 之 端 部中 之 另 一 側 〇 1 1 格陣 列控 制 器 C A C 係 進 行 區 庫 內 之資 料 輸 出 入 動 作 1 1 的 控制。 1 1 列解 碼器 C D 0 t C D 1 係 於 配 置 4個 之 中 區 塊 1 1 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) f ~ 2b - A7 B7 309657 五、發明説明(24) BLa ,BLb ,BLc ,BLd的方向,即配置於列方 向(資料線對或列選擇線延長之方向)之2個端部中的一 方側》 (請先閱讀背面之注意事項再填寫本頁) 2個列解碼器CD 0,CD 1係將負責各列解碼器 C D 0,C D 1之記億格陣列之列加以2分地,配置於行 方向。 DQ緩衝器DQ係配於列方向(資料線對或列選擇線 延長之方向)之2個端部中的另一方側》即,CD 1和 DQ緩衝器DQ係令記億格陣列CAL,CAR挾於中央 ,相互對向地加以配置。 於D Q緩衝器D Q之後,一般而言,配置選擇區庫之 區庫選擇器SEL » 資料係經由資料線對1 4、感測放大器SA及列選擇 開關16之後,引導至局部DQ線對18a »局部DQ線 對18a係於記億格陣列之各中區塊BLa ,BLb , BLc ,BLd中,配置於記億格陣列之小區塊CAL, C A R 間》 經濟部中央橾华局員工消費合作社印11 v/因此,局部DQ線對1 8 a係延長於行方向(字元線 延長之方向)。又,資料線對(以下令此資料線對稱整體 D Q線對,與資料線對1 4區別)1 8 b係於記憶格陣列 之小區塊CAL,CAR上,延長列方向加以配置*整體 DQ線對18b之一端係經由開關21 ,連接於局部DQ 線對1 8 a ,另一端係連接於DQ緩衝器DQ。 開關2 1之開啓•關閉係經由控制信號C Ο N加以控 本紙張尺度適用中國國家梯準(CNS ) Λ4規格(210X2^7公慶) A7 B7 309657 五、發明説明(25 ) 制。 (請先閱讀背面之注意事項再填寫本頁) 共有於4個區庫之資料匯流排13係配置於區庫11 —0 ’ 1 1-1和區塊1 1 一 2,1 1-3間,延長於列 方向。資料匯流排1 3係呈區庫1 1 — 0〜1 1 — 3和資 料輸出入範圍12間之資料输出入路徑者。 本實施例中,令1 6位元型之半導體記憶體爲前提之 故’資料匯流排1 3係以1 6位元(2位元組)之資料輸 出入可同時進行地加以構成者。 資料輸出入範圍1 2係配置於記億晶片1 0之行方向 之2個端部中的一側。資料輸入範圍1 2中,爲同時進行 1 6位元(2位元組)之資料輸出入,形成1 6個之输出 入電路(I / 0 )。 上述之半導體記憶體之資料輸出入動作係如下地加以 進行。 首先、經由區庫選擇器SEL,由4個之區庫1 1 一 〇〜1 1 — 3中選擇一個區庫。選擇之1個區庫中,根據 @址信號進行記憶格之存取動作。 經濟部中央樣準局員工消費合作社印災 資料之輸出(讀取)時,2n位元(例如1 6位元( 2位元組))之資料則經由局部DQ線對1 8 a及整體 DQ線對1 8b ,自該選擇之1個區庫輸出。自區庫輸出 t 2 n位元資料係經由資料匯流排1 3 ,引導至資料輸出 圍1 2,且自資料輸出入範圍1 2輸出至半導體記憶 體(記憶晶片)外部。 資料之输入(寫入)時,2 "位元(例如1 6位元( 本·紙張尺度適用中國國家標华(CNS ) Λ4現格(210Χ 297公釐) - ^^9657 A7 B7 經濟部中夬標準局貝工消#合作社印製 五、 發明説明 (26 2 位元組 ) ) 之 資 料 則經 由 資 料輸出 入範 圍 1 2 資 料 匯 流 排1 3 > 輸 入 至 該 選擇 之 1 個區庫 。輸 入 至 該 選 擇 之 1 個 區庫的 2 "位元之資料係經由局部D Q線 1 3 a 、整體 D Q線對 1 8 及 感 測 放大 器 S A,記 億於 記 億 格 陣 列 之 記 憶 格。 上述 半 導 體 記 憶 體之 晶 片 佈局中 ,有 以 下 之 特 徵 0 第1 - 格 陣 列 控 制器 C A C和列 解碼 器 R D 係 令 記 憶 格 陣列C A L * C A R挾 於 中 央,相 互對 向 於 行 方 向 之 端 部 加以配 置 〇 又 列 解碼 器 C DO、 CD 1 和 D Q 緩 衝 器 D Q係令 記 憶 格 陣 列 C A L •CAR 挾 於 中 央 相 互 對 向 於列方 向 之 端 部 加 以配 置 〇 即, 格 陣 列 控 制 器C A C ,行解 碼器 R D 列 解 碼 器 C D0, C D 1 及 D Q緩 衝 器 D Q係 皆連 接 於 記 億 格 陣 列 C A L , C A R 之 — 邊加 以 配 置。 因此 可 容 易 進 行構 成 格 陣列控 制器 C A C 、 行 解 碼 器 R D、 列 解 碼 器 C D0 C D 1及 D Q 緩 衝 器 D Q 的 元 件 配置或 配 線 等 〇 第2 於 區 庫 內 ,設 置 延 長於行 方向 之 局 部 D Q 線 對 1 8 a , 和設置延長於列方向之整體D Q線對1 £ t ), 資 料則自 區 庫 之 列 方 向之 端 部 的輸出 入地 加 以 構 成 0 即, 令 D Q 緩 衝 器D Q » 可設於 區庫 之 列 方 向 之 端 部 之 故,可 實 現 上 述 第 1之 特 徵 〇 又, 如 本 貫 施 例 ,於 記 憶 格陣列 之1 個 中 區 塊 中 * 進 行 輸出入 之 位 元 數 爲 4位 元 時 •配置 於小 區 塊 C A L > 本紙張尺度適用中國國家標率(CNS) Λ4規格(21 ox297公釐)_ 經濟部中央標準局員工消资合作社印製 A7 ____B7_____ 五 '發明説明(27) C A R間之局部D Q線對1 8 a ,係於列解碼器C D 0側 設置2位元分,於列解碼器C D 1側僅設置2位元分。 此係列解碼器CDO,CD 1鄰接於記憶格陣列配置 於行方向,又,資料之輸出入於區庫之列方向端部進行之 故》 因此,於局部DQ線對1 8 a令必需範圍變小時’具 體而言,爲配置DQ線對,僅需圖1及圖2之參考例之一 半。 又,整體D Q線1 8 b係於1個中區塊中’進行4位 元之資料輸出入時,於1區庫中,僅需進行1 6位元資料 傳送之數。但是,整體DQ線對18b係配置於記億格陣 列CAL,CAR上之故,無需新設置配置整體DQ線對 1 8 b之範圍。 第3,資料匯流排1 3係於區庫1 1 — 0,1 1 — 2 和區庫11 — 1 ,11 一 3間,延長於行方向配置。此係 區庫內之D Q緩衝器D Q則配置於列方向之2個端部中之 一個之緣故。 結果,經由區庫及資料輸出入電路之配置之設計’可 減少資料匯流排1 3構成之配線,可縮小於記憶晶片1 〇 所佔之資料匯流排1 3之範圍。 xyi 1 2係顯示構成圖1 0及圖1 1之半導體記憶體之 開關1 6 ,2 1之構成例。 列選擇開關16係自N通道型MOS電晶體N1 ’ N2所構成。MOS電晶體N1’N2之閘極係連接於 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210 X 297公釐) l^n In 1 - ti I - -- - T 士...... -I— ^^1· I 1 In Tlv (請先閱讀' 背面之注意事項再填寫本頁} 五、發明説明(狀) 經濟部中夬標隼局員工消費合作社印製 A7 B7 列 選 擇 線 1 5 * 源 極 • 汲 極 範 圍 之 一 方 9 係 連 接 於 感 測 放 大 器 S A > 源 極 • 汲 極 範 圍 之 另 一 方 » 係 連 接 於 局 部 D Q 線 對 D Q 〇 V ’圖 1 3 係 顯 示 圖 1 0 及 圖 1 之 半 導 體 記 憶 體 之 列 解 碼 器 之 構 成 例 0 本 例 中 » 以 列 解 碼 器 C D 0 加 以 說 明 0 列 位 址 信 號 A 0 A 1 0 係 輸 入 至 列 解 碼 器 C D 0 0 列 位 址 信 號 A 0 «"•Ο-/ A 7 係 令 預 解 碼 器 ( N A N D 電 路 ) 2 3 — 1 > 2 3 — 2 2 3 — N 中 之 任 — 預 解 碼 器 之 輸 出 信 號 的 準 位 呈 % L ( 低 ) ¥ > 令 殘 留 之 所 有 預 解 碼 器 之 輸 出 信 號 準 位 呈 % Η ( 高 ) 事 〇 又 » 列 位 址 信 號 A 8 A 1 0 係 令 解 碼 器 2 4 — 1 > 2 4 一 2 2 4 — Μ 中 之 任 —· 解 碼 器 之 輸 出 信 號 的 準 位 呈 % L ( 低 ) 0 I 令 殘 留 之 所 有 解 碼 器 之 輸 出 信 準 位 呈 Η ( 高 ) 〇 預 解 碼 器 2 3 — 1 、 2 3 — 2 ' 2 3 — Ν 之 輸 出 信 號 係 輸 入 至 區 塊 2 5 — 1 t 2 5 — 2 » 2 5 — Ν 解 碼 器 2 4 — 1 ' 2 4 — 2 2 4 一 N 之 輸 出 信 號 係 输 入 至 區 塊 2 5 — 1 » 2 5 — 2 > 2 5 — Ν 〇 Ν 0 R 電 路 2 6 0 j 2 6 — 1 2 6 — 7 中 > 輸 入 預 解 碼 器 2 3 — 1 、 2 3 一 2 ' 2 3 — N 之 输 出 信 號 和 解 碼 器 2 4 — 1 2 4 — 2 > 2 4 — Μ 之 輸 出 信 號 〇 例 如 1 預 解 碼 器 2 3 一 1 之 輸 出 信 號 準 位 爲 L 9 解 碼 器 2 4 — 1 之 輸 出 信 號 準 位 爲 L 0 時 t 僅 Ν 0 R 電 路2 6 — 0之輸出信號之準位呈,殘留之所有 II ........ I..... -* - *-- —II -'- I —.1 - - I I ^1 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度遠用中國國家標準(CNS ) Λ4規格(210X2W公慶) 309657 Α7 Β7 五、發明説明(29 ) NOR電路的輸出信號準位則呈*L ·。 NOR電路26 — 0,26 — 1 ,〜26-7之輸出 (請先閱讀背面之注意事項再填寫本頁) 信號係於控制信號L之準位爲〃之期間,經由轉換間 27 — 0,27-1 ,〜27 — 7,輸入至閂鎖電路28 —0,28 — 1,〜28_7。 閂鎖電路28 — 0,28 — 1 ,〜28 — 7之輸出信 號係於控制信號Τ之準位爲之期間,經由AND閘 29 — 0,29 — 1 ,〜29 — 7,供予列選擇線15。 例如,預解碼器23 — 1之輸出信號準位爲, 解碼器2 4 - 1之输出信號準位爲iLf時,僅列選擇線 15中之一個列選擇線CSL0之準位呈、!!',殘留之 所有列選擇線的準位則呈t L 〃 。連接於* Η ^準位之 列選擇線的列選擇開關係呈開啓狀態。 BW係區塊寫入信號。此區塊寫入信號BW之準位係 於通常模式時爲,區塊寫入模式時呈•Η"。即, 區塊寫入模式時,所有解碼器24 - 1 ,24 — 2,〜 2 4— Μ之輸出信號的準位則不需依列位址信號 A 8〜 經濟部中央標隼局員工消#合作社印裝 A 1 0 而呈、L '。 因此,例如預解碼器23 — 1之输出信號的準位爲t L #時,經由區塊2 5 — 1控制之8條列選擇線C S L 〇 〜CSL7的所有準位則呈'Η'。連接準位之 列選擇線的列選擇開關係呈開啓狀態。 由此,以區塊單位,可進行資料之寫入。 V//圖1 4係顯示圖1 〇及圖1 1之半導體記憶體之區塊 本紙張尺度適用中國國家標準(CNS ) Λ4規格(2丨0 X 297公釐) - A7 B7 經濟部中央標隼局員工消費合作社印裝 五、 發明説明 (30 1 I 選 擇 電路 S Ε L 之構成》 1 區塊 選 擇 電 路S E L係 經 由 連 接 於 D Q 衝器 D Q 和 1 1 資 料 匯流 排 1 3 間之轉換閘 Τ 0 1 t T 0 2 » T 1 1 9 /-—V 1 I 請 1 I T 1 2, Τ 2 1 ,Τ 2 2, Τ 3 1 T 3 2 加 以構 成 0 轉 先 閱 1 I 讀 1 J 換 閘 Τ0 1 丁 0 2,Τ 1 1 9 Τ 1 2 » T 2 1, T 2 2 背 1 I 之 1 ) T 3 1 Τ 3 2係由Ν通道型MO S電晶體和Ρ通道 意 事 1 型 Μ OS 電 晶 猶 歴 所構成。 項 再 1 填 〜1 於區 塊 1 1 —0中,於 區 塊 選 擇 電 路 S Ε L中 輸 入 寫 装 Έ 1 區 塊 選擇 信 號 ΒΝΚΟ,/ΒΝΚ0 ,即構成轉換閘 'W, 1 T 0 1 , Τ 0 2 之 Ν通道型 Μ 0 S 電 晶 體 之 閘中 输 入 1 1 區 塊 選擇 信 號 Β Ν Κ 0,構 成 轉 換 閘 T 0 1 TO 2 之 P 1 1 通 道 型Μ 0 S 電 晶體之閘中 輸 入 區 塊 選 擇 信 號/ 訂 1 B Ν Κ 0 〇 1 I 同樣 地 於 區 塊 1 1 - 1 中 於 區 塊 選 擇 電 路S E L 中 1 1 I » 輸 入區 塊 選 擇 信號Β Ν Κ 1 / B N K 1 〇 於區 塊 1 1 1 4 — 2 中, 於 區 塊 選擇電路S Ε L 中 輸 入 區 塊 選擇 信 疏 Γ B Ν Κ 2 1 / Β Ν Κ 2,於 區 塊 1 1 — 3 中 於區 塊 選 擇 1 1 電 路 S Ε L 中 * 輸入區塊選 擇 信 號 B N K 3 / B N K 3 1 1 | 區塊 選 擇 信 號 Β Ν Κ 〇 Β Ν K 3 係 任 -- 者之 準 位 呈 1 1 ·* Η 續 , 殘 留 之 所有準位則 呈 % L ψ 〇 1 1 I 例如 選 擇 區塊1 1 - 0 時 區 塊 選 擇 信 號B N K 0 1 1 1 之 準 位呈 Η 雖 ,區塊選擇 信 號 Β N K 1 * B Ν K 2 1 1 B Ν Κ 3 之 準 位 呈 ' L # 。 此 時 僅 區 塊 1 1 — 〇之 D Q 緩 1 1 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) -33 Α7 Β7 309657 五、發明説明(31 ) 衝器D Q則連接於資料匯流排1 3 ’區塊1 1 一 1 ’ 1 1 —2 ,11 — 3之DQ緩衝器DQ係與資料匯流排13切 (請先閱讀背面之注意事項再填寫本頁) 斷》 結果,資料之收受係僅於區塊1 1 一 0和資料输出入 電路1 2間。 1 5係顯示圖1 0及圖1 1之半導體記憶體之資料 輸出入電路12之構成。 本例之中,對於進行1位元之資料輸出之1個資料輸 出入電路加以說明》即,例如1 6位元型(X 1 6 )之半 導體記憶體中,本例之資料输出入電路則呈需要1 6個。 此資料輸出入電路係主要自資料感測放大器D B S A MP、資料匯流排寫入緩衝器DBWBF,輸出閂鎖電路 30、輸出電路31及輸出緩衝器32所構成。 資料寫入緩衝器D BWB F係於進行資料寫入時使用 〇 控制信號NW係輸入至同步反相器cI1 ,控制信號 經濟部中央標準局負工消费合作社印^ WX係輸入至同步反相器C I 2 ,C I 5。通常動作模式 之資料寫入中,控制信號NW之準位則呈,而活 化同步反相器C I 1。又,控制信號w X之準位則於^ Η ^之期間’輸入資料(寫入資料)RWDm (m係0 、1 ......或5 )係經由同步反相器C I 1 ,閂鎖電路 LA及 同步反相器C I 2 、C I 5 ,引導至之資料匯流排1 3。 此資料係經由資料匯流排1 3 ,輸入至選擇區庫。 控制信號BW係輸入至同步反相器c I 3 ,區塊寫入 本紙張尺度巾ϋ邮料(CNS ) 2丨()χ 297公慶)-- — 經濟部中央標华局員工消費合作社印^ A7 B7 五、發明説明(32 ) 模式之資料寫入中,控制信號BW之準位則呈,而 活化同步反相器c I 3。又,控制信號W X之準位則於 Η"之期間,彩色暫存資料CRm (m係0、1 ......或5 )係經由同步反相器C I 3 ,閂鎖電路LA及同步反相器 C I 2、C I 5 ’引導至之資料匯流排1 3。此資料係經 由資料匯流排1 3,輸入至選擇區庫。 色暫存資料C Rm係自彩色暫存器供給。於彩色暫 存器中,於區塊寫入模式時於複數記憶格同時寫入資料之 圖案,則預先記億。彩色暫存器係一般而言具備畫像記憶 體,令預先決定之圖案之資料,於複數記億格,同時使用 於寫入時。彩色暫存器之內容(資料圚案)係於變更彩色 暫存器之資料模式加以變更。 控制信號TW係輸入至同步反相器C I 4。測試模式 之資料寫入中,控制信號TW之準位則呈,!·!',而活化 同步反相器C I 4。又,控制信號WX之準位則於'Η# 之期間中,排他 OR 電路EX之輸出信號係經由同步反 相器C I 4 ,閂鎖電路 LA及同步反相器C I 2、 C I 5 ,引導至之資料匯流排1 3。此資料係經由資料匯 流排13,輸入至選擇區庫。 排他OR電路EX中,輸入彩色暫存資料/CRm及 資料R W D 〇。即本例中,令於測試模式時所使用之資料 圖案,可自彩色暫存器所得加以構成。 對於使用於本賁施例之半導體記憶體之測試電路則後 述。 本紙張尺度通用中國國家標芈(CNS ) Λ4規格(210X297公釐) -------—---^二衣-- (請先閱讀背面之注意事項再填寫本頁)The chip layout of Xy7 is compared with the chip layout of Figures 1 and 2, and differs in the following points. First, make one district library (main district library) composed of two sub-blocks. That is, the main zone library 1 1 — 0 is composed of the secondary zone library 1 1 — 0 — # 0, 1 1 — 0_ # 1, the main zone library 1 1 — 1 is composed of the secondary zone library 1 1 -1 — # 0 , 11 — 1 — # 1, the main zone library 11 — 2 is from the secondary zone library 1 1 — 2 — # 0, 1 1 2- # 1, the main zone library 1 1 — 3 is from the secondary zone Library 1 1 — 3 — # 0, 1 1 — 3- # 1. Sub-zone library 11 — 0 — # 0, 11 — 0-# 1 are selected through the zone library selection circuit at the same time. Sub-zone library 1 1 — 0-# 0, 1 1 — 0-# 1 When selected, the remaining zone library is not selected. Similarly, for example, when the sub-zone library 1 1 — 1 one # 0 and 1 1_1 one # 1 are selected, the remaining zone libraries are not selected. In addition, through 4 sub-district libraries 1 1 — 〇 — # 0 '1 1 — 1 A paper standard is applicable to the Chinese National Standard Falcon (CNS) A4 specification (210X 297 mm) ~ ... »1 — ^ ϋ ft W— I — ^ ilk (Please read the precautions on the back before filling out this page) Order --- _β57 A7 Β7 Printed by the Central Bureau of Standards of the Ministry of Economic Affairs, only the Consumers F Cooperative. V. Description of the invention ------ ~ | # 0 > 1 1 one 2 — # 0) 1 1 — 3 one # 0 constitutes a group »Jing 1 I consists of 4 sub-zones 1 1 one 0 — # 1 I 1 1 — 1 — # 1 1 1 — 1 1 2 — # 1 > 1 1 one 3 one # 1 constitutes a group 0 1 1 that is y in the secondary library 1 1 — 0 — # 0 1 1 1 — 1 — # 0 »1 ---- V Please 1 1 1 — 2 — # 0 > 1 1 — 3 — # 0 Simultaneously perform 8-bit reading on the back 1 side Γ 1 data input and output ◆ in the secondary area Library 1 1 — 0 one # 1 »1 1 — 1 of Note 1 # 1 > 1 1 one 2 — # 1» 1 1 — 3 one # 1 Simultaneously entering items in the group 1 1 line of 8-bit data Lose Fill in and out again and then fill in this 1 Ί. 2nd page of 8-bit (1 byte) in a sub-zone library, Sw- 1 1 Data input and output location constitute 〇 1 1 Sub-zone library layout system and diagram 1 and Figure 2 when comparing the library layout 1 1 The decoder CD is that only one is the difference. Because in this example, 1 is ordered in a sub-region library for 8-bit data output »Column decoding! 1 CD exists-only 0, but the column decoder CD is the same as the semiconductor memory of Figure 1 and 1 1 I Figure 2 * Select 2 columns in each middle area of the memory cell array 1 I Block BL a »BL b» BLC »BL d middle> Execution 2 1 I bit data output I / O volume 1 I Memory cell array CAL, CAR column decoder in the secondary library 1 IRDDQ line pair 1 8 The layout of the DQ and DQ buffer is the same as that of Figures 1 and 1 1 Figure 2 The layout in the body area library is the same. 1 The third data input / output circuit (I / 0) 1 2 a 1 2 b is 1 1 in the center of the billion chip 1 0. The length is increased in the row direction. Configuration 9 1 1 The data bus 1 3 a is allocated in the sub-zone library 1 1 -0 one- # 0 1 1 1 1 1 — # 0 1 1 — 2 — # 0 9 1 1 — 3 — # 0 ______ ^ 1 1 The scale of this paper is applicable to the Chinese National Standard (CNS) Λ4 is now available (210X297 public) f-II / Printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 ______B7 V. Invention description (19) Placed in the data output Into both sides of the circuit 1 2 a, the data bus 1 3 b is in the sub-zone library 11-0 — # 1, 11 — 1 — # 1, 11 — 2 — # 1 '11 — 3-# 1 , Configured on both sides of the data input and output circuit 1 2 b. The data buses 13a and 13b are located between the sub-zones, extend in the row direction, and are connected to the data input / output circuits 12a and 12b in the central data section of the memory chip 10. The data bus 13a, 13b can be configured to transmit 8-bit data. In such a semiconductor memory of the chip layout, for example, when the sub-region library 11 — 〇- # 〇, 1 1 — 〇- # 1 is selected , In the sub-region library 1 ΙΟ _ # 0 and the data input and output circuit 1 2 a, through the data bus 1 3 a '8-bit data reception, in the sub-region library 1 1 — 〇_ # 1 and data output Into the circuit 1 2 b, through the data bus 1 3 b 'to receive and receive 8-bit data. ^ 3 8 shows a modification of the layout of the semiconductor memory chip in the first reference example shown in FIGS. 1 and 2. FIG. 9 shows the chip layout of the semiconductor memory of FIG. 8 in detail. This chip layout is different from the chip layout of FIGS. 1 and 2 in the following points. The first 1 'order that a district library (main district library) is composed of two sub-blocks. That is, the main zone library 1 1-0 is composed of the sub zone library 1 1 — 0 — # 0, 1 1-0 — # 1, and the main zone library 1 1_1 is from the sub zone library 1 1 — 1 — # 0, The main area library 11-2 is composed of the auxiliary area library 1 1 — 2 — # 0,1 1-2- # 1, the paper size of the main area is applicable to China National Standard (CNS) A4 specifications (210X297 PC) I! --- ί-IV— --- ^-* Cloth II. I I-…! I.-— ^ 1 (please read the precautions on the back before filling in this page) -2 ^ ·-309657 a? B7 The Ministry of Economic Affairs Central Bureau of Standardization and Employee's Cooperation in the Disposal of Funds for Printing V. Description of Inventions (20) Library 1 1 — 3 is composed of the sub-zone library 1 1 one 3 — # 0,1 1 — 3- # 1. The sub-zone library 1 1 — 〇 — # 〇 ’1 i-o-ti is selected through the zone library selection circuit at the same time. Sub-zone library 1 1 — 〇 — # 〇, 1 1 — 0 — # 1 When selected, the remaining zone library is not selected. Similarly, for example, when the sub-zone library 1 1 — 1 — # 〇 ′ 1 i — l— # 1 is selected, the remaining zone library is not selected. In addition, through four sub-zone libraries 11 one, 11 one 1 one # 0, 11-2 — # 0 '11 — 3 ~ constitute a group, through four sub-zone libraries 11 one 0 — # 1' # 1, 11 1 2 — # 1, 11-3 — # 1 form a group. In other words, 8-bit data input and output are simultaneously performed in the sub-zone library 11 1 0- # 〇, 11 1 1- # 0, 1 1 — 2 — # 0, 1 1-3 — # ◦ In the sub-zone library 1 1 — 0 — # 1, 1 1 — 1 — # 1, 11-2 — # 1, 11_3 ~ # 1, 8-bit data input and output are performed simultaneously. Second, in a sub-zone library, 8-bit (1-byte) data input and output are constructed. When the layout of the secondary bank is compared with the layout of the bank of Figs. 1 and 2, the column decoder CD has only one difference. This is because, in this example, there is only one column decoder CD to output 8-bit data in a sub-region library. However, the column decoder CD is the same as the semiconductor memory of FIG. 1 and FIG. 2, select two columns, and execute in the blocks BLa, BLb, BLc, and BLd of the memory grid (please read first The weeping matters on the back are to be filled out in the form of \\ 〇. The size of the paper is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297mm) (21) The input and output of 2-bit data. The layout of the memory cell array CAL, CAR, column decoder RD, DQ line pair 18 and DQ buffer DQ in the sub-zone library is the same as the semiconductor memory of FIGS. 1 and 2. The layout in the body area library is the same. Third, the data bus 1 3 a is in the auxiliary area library 1 1-0-〇, 11- 1- # 〇, 11-2- # 0, 11-3- # 〇 In the group, they are arranged to extend in the column direction, and the data bus 1 3 b is connected to the I! Zone I library 11 — 〇 — # 1, 11 — 1 — # 1 '11_2 — # 1' 11 — 3 — # 1 之In the group, it is arranged to extend in the column direction. That is, the data bus 13a is located between the sub-zones, and the data output from the end arranged in the column direction is input to the circuit 1 2 a extends in the column direction, the data bus 1 3 b is located in the secondary area, and the data input and output circuit 1 2 b is extended in the column direction from the end arranged in the column direction. Also, the data bus 1 3 a, 1 3 b is composed of data that can be transmitted with 8 bits each. In such a semiconductor memory of the chip layout, for example, when selecting the sub-region library 1 1 — 0 — # 〇, 1 1 — 〇- # 1, the sub District library 1 Ι ο — # 0 and the data wheel access circuit i 2 a, through the data bus 1 3 a, 8-bit data is received and received from the subsidiary district library 1 1 — 〇— # 1 and the data input and output circuit Between 1 and 2 b, 8-bit data is received and received through the data bus 1 3 b. • 1 〇 shows the chip layout of the semiconductor memory of the first embodiment of the present invention. FIG. 1 1 shows in detail FIG. 1 0 The layout of the paper in one of the districts is in the paper size suitable for the financial home (CNS) Λ4 present grid (2U) 'X Gongkang)' — '-21} .- (please read the precautions on the back before filling in this page) " Subscription A7 B7 309657 V. Description of the invention (22) In this embodiment, for the i 6-bit type that can simultaneously output 16-bit data X 1 6) 'of the semiconductor memory will be described. Four bank libraries 1 1 to 1 1 to 3 are arranged on one billion wafer 10. Each zone library 1 1 10 ~ 1 work-3 in the form of a memory grid array CAL, CAR, memory grid array controller CAC, and row decoder RD, column decoder CD〇, CD1, DQ buffer (called area The input / output buffer of the library) peripheral circuits such as DQ. The memory cell array in one district library is divided into 4 middle blocks B L a ′ BLb, BLc, BLd. Also, each middle block is divided into two small blocks, CAL and CAR. Therefore, the memory cell array in the 1 bank is composed of 8 blocks. The row decoder RD is provided in each of the four middle blocks BLa'BLb'BLc, BLd, and one each. The row decoder RD selects any one of the two small blocks CAL and CAR according to the row address signal, and selects one row from the plural rows in the selected one block (character line 17) The selection of the small blocks of the grid array is performed on either of the two word lines 19a and 19b by applying a high voltage. For example, when a high voltage is applied to the word line 19 a, the switch 20 a is turned on, and the small block CAL is selected. At this time, due to the low voltage applied to the word line 19b, the switch 20b is turned off, and the small block CAR is not selected. The column decoders CD0 and CD1 are installed in one zone library. The column decoders CD 0 and CD 1 are based on the address signals of each column, and select one of the paper standards for the Chinese National Standard (CNS) Λ4 specification (210X2W mm) _-n, / 1 —ί--·- -J * κ 1-«: —---__ I m T -J Ge-a (please read the precautions on the back before filling in this page) Ministry of Economic Affairs Bian Zhuren Zheng Gong Consumer Cooperative Indica A7 B7 Ministry of Economic Affairs Printed by the Central Consumer Service Cooperative Staff V. Description of invention (23) 1 or the plural 4 mid-blocks BL a, BL b, BLC * BL d 1 1 1 For example, through the column decoder CD 1 »select xsg The two column selection switches 1 6 connected to the column selection lines 1 5 and 1 1 1 in the column selection line 1 5 are turned on, and the 1 1 state is read first. Then, the two data lines connected to the two column selection switches 16 are backed by 1 1 1 to 14. The 2-bit data is selected by the sense amplifier SA and the column selection fjm. Output to data line pair (f below makes this data line symmetrical. Item 1 I and then 1 DQ line pair, which is different from data line pair 1 4) 18 a 〇 fill in this frame I in this example »1 row decoding The device selects 2 columns to form a 1 1 〇 At this time, due to the presence of 2 column decoders, the 9 blocks in each block BL a 9 B 1 [L b, BL c BL d »output 4-bit data 〇Is a white 1 I area library, input and output 16-bit (2-byte) data 〇1 Order 1 sense amplifier SA and row selection switch 16 are in the 1 1 I middle area of the memory cell array Block BL a 'BL b BL (: BL d is arranged in a small block CALCAR of 1 1 billion grid array. 1 1 The decoder RD and the grid array controller CAC enable the memory grid array f CAL, CAR to be placed opposite each other in the center. That is, the row 1 1 The decoder RD is configured with 4 middle blocks BL a, BL b 1 The direction of IBL c * BL d is arranged in the row direction (the direction of the word line 1 7 9 1 I 1 9 a, 19 b extension). One of the two sides 1 1 The array controller CAC is arranged in The other side of the two ends 〇1 1 grid array controller CAC is to control the data input and output actions 1 1 in the library. 1 1 column decoder CD 0 t CD 1 is configured with 4 Middle block 1 1 This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) f ~ 2b-A7 B7 309657 V. Description of the invention (24) The direction of BLa, BLb, BLc, BLd, which is configured in One of the two ends of the column direction (the direction in which the data line pair or column selection line extends) "(Please read the precautions on the back first (Fill in this page) The two column decoders CD 0 and CD 1 divide the columns of the C D 0 and C D 1 in the billion-element array into two rows and arrange them in the row direction. The DQ buffer DQ is matched to the other side of the two ends in the column direction (the direction in which the data line pair or the column selection line extends), that is, CD 1 and the DQ buffer DQ are ordered in billion grid array CAL, CAR Holding it in the center, they are arranged to face each other. After the DQ buffer DQ, generally speaking, the bank selector SEL configured to select the bank »The data is guided to the local DQ line pair 18a after the data line pair 14, the sense amplifier SA and the column selection switch 16» The local DQ line pair 18a is in the middle blocks BLa, BLb, BLc, BLd of the billion grid array, and is arranged in the small blocks CAL, CAR of the billion grid array. v / Therefore, the local DQ line pair 18 a extends in the row direction (the direction in which the word line extends). In addition, the data line pair (the following makes this data line symmetrical overall DQ line pair, which is different from the data line pair 1 4) 1 8 b is placed on the small block CAL, CAR of the memory grid array, and is arranged in the direction of the extended column * overall DQ line One end of the pair 18b is connected to the local DQ line pair 18a via the switch 21, and the other end is connected to the DQ buffer DQ. The opening and closing of the switch 2 1 is controlled by the control signal C Ο N. The paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X2 ^ 7 Gongqing) A7 B7 309657 5. The invention description (25) system. (Please read the precautions on the back before filling in this page) The data bus 13 in 4 district libraries is located in the district library 11 — 0 ′ 1 1-1 and block 1 1 1-2, 1 1-3 , Extending in the column direction. The data bus 13 is the data input / output path between the data base 1 1 — 0 ~ 1 1 — 3 and the data input / output range 12. In this embodiment, the premise is that a 16-bit semiconductor memory is used. The 'data bus 13 is a 16-bit (2-byte) data input and output that can be constructed simultaneously. The data input / output range 12 is arranged on one side of the two ends of the memory chip 10 in the traveling direction. In the data input range 1 2, for 16-bit (2-byte) data input and output at the same time, 16 input / output circuits (I / 0) are formed. The data input and output operations of the semiconductor memory described above are performed as follows. First, select one zone library from four zone libraries 1 1 to 10 1 to 3 via the zone library selector SEL. In the selected one bank, the memory cell is accessed according to the @address signal. When outputting (reading) the printed disaster data of the Employee Consumer Cooperative of the Central Sample Agency of the Ministry of Economic Affairs, the 2n-bit (eg 16-bit (2-byte)) data passes through the local DQ line pair 18 a and the overall DQ Line pair 18b is output from the selected bank. The t 2 n-bit data output from the library is guided to the data output area 12 through the data bus 13 and output from the data input / output range 12 to the outside of the semiconductor memory (memory chip). When inputting (writing) data, 2 " bits (for example, 16 bits (this · paper standard applies to China National Standard (CNS) Λ4 present grid (210Χ 297mm)-^^ 9657 A7 B7 Ministry of Economic Affairs Printed by Zhongshang Standard Bureau Beigongxiao #Cooperative V. Description of the invention (26 2 bytes)) The data is input into the range 1 2 through the data input and output data bus 1 3 > input to the selected 1 library. The data of 2 " bits input to the selected one bank is through the local DQ line 1 3 a, the overall DQ line pair 1 8 and the sense amplifier SA, and the memory cell of 100 million grid is recorded. The chip layout of the semiconductor memory has the following features. 0 1st-The grid array controller CAC and the column decoder RD make the memory grid array CAL * CAR placed in the center, opposite to each other in the row direction. The decoders C DO, CD 1 and DQ buffer DQ make the memory cell array CAL • CAR centered on each other To the end of the column direction is configured. That is, the grid array controller CAC, row decoder RD column decoder CD0, CD 1 and DQ buffer DQ are connected to the memory grid array CAL, CAR Configuration. Therefore, it is easy to configure the components or wiring of the grid array controller CAC, row decoder RD, column decoder C D0 CD 1 and DQ buffer DQ. 2nd In the library, set the extension in the row direction The local DQ line pair 1 8 a, and the overall DQ line pair set to extend in the column direction 1 £ t), the data is formed from the input and output ground of the column direction end of the bank 0. That is, let the DQ buffer DQ » It can be set at the end in the column direction of the bank, so that the first feature described above can be achieved. Also, as in the conventional embodiment, the number of bits that are input / output in 1 middle block of the memory cell array is 4 bit time • Allocation in small block CA L > This paper scale is applicable to China ’s National Standard Rate (CNS) Λ4 specification (21 ox297 mm) 1 8 a, it is set on the CD 0 side of the column decoder 2 bits, and only 2 bit points on the CD 1 side of the column decoder. This series of decoders CDO, CD 1 is adjacent to the memory cell array and is arranged in the row direction. Also, the output of the data is performed at the end of the column direction of the library. Therefore, the local DQ line pair 18 a makes the necessary range change Hour 'Specifically, in order to configure the DQ line pair, only one and a half of the reference examples in FIGS. 1 and 2 are required. In addition, the overall D Q line 18 b is the number of 16-bit data transfers required in the zone 1 library when 4-bit data is input and output in a middle block. However, the overall DQ line pair 18b is configured in the CAL grid array CAL, so there is no need to newly configure the range of the overall DQ line pair 18 b for CAR. Third, the data bus 13 is located in the district library 1 1-0, 1 1-2 and the district library 11-1, 11-3, extended in the row direction. This is because the DQ buffer DQ in the bank is arranged at one of the two ends in the column direction. As a result, the design of the configuration of the bank and the data input and output circuits can reduce the wiring of the data bus 13 and reduce the range of the data bus 13 that the memory chip 10 occupies. xyi 1 2 shows an example of the configuration of the switches 16 and 21 which constitute the semiconductor memory of FIGS. 10 and 11. The column selection switch 16 is composed of N-channel type MOS transistors N1'N2. The gates of MOS transistors N1'N2 are connected to this paper. The Chinese standard (CNS) Λ4 specification (210 X 297 mm) is applicable. L ^ n In 1-ti I---T ... . -I— ^^ 1 · I 1 In Tlv (please read the notes on the back before filling in this page) V. Description of the invention (statement) A7 B7 line selection line printed by the Consumer Cooperative of the China National Standard Falcon Bureau 1 5 * Source • One side of the drain range 9 is connected to the sense amplifier SA > Source • The other side of the drain range »is connected to the local DQ line pair DQ 〇V 'Figure 1 3 is shown in Figure 1 0 And the configuration example 0 of the column decoder of the semiconductor memory of FIG. 1 In this example »the column decoder CD 0 is used to describe 0 column address signal A 0 A 1 0 is input to the column decoder CD 0 0 column address signal A 0 «" • Ο- / A 7 is a pre-decoder (NAND circuit) 2 3 — 1 > 2 3 — 2 2 3 — N of any — the output signal of the pre-decoder The bit is% L (low) ¥ > The output signal level of all remaining predecoders is% Η (high). The column address signal A 8 A 1 0 makes the decoder 2 4 — 1 > 2 4 1 2 2 4 — any of Μ—the output level of the decoder is% L (low) 0 I makes the output signal level of all remaining decoders be Η (high) 〇 predecoder 2 3 — 1, 2 3 — 2 '2 3 — Ν The output signal is input to the block 2 5 — 1 t 2 5 — 2 »2 5 — Ν Decoder 2 4 — 1' 2 4 — 2 2 4 one The output signal of N is input to block 2 5 — 1 »2 5 — 2 > 2 5 — Ν 〇Ν 0 R circuit 2 6 0 j 2 6 — 1 2 6 — 7 middle > input predecoder 2 3 — 1, 2 3-2 '2 3 — N output signal and decoder 2 4 — 1 2 4 — 2 > 2 4 — M output signal 〇 For example 1 predecoder 2 3-1 output signal level For L 9 decoder 2 4-1 of When the level of the output signal is L 0 t only the level of the output signal of the Ν 0 R circuit 2 6 — 0 is present, and all remaining II ........ I .....-*-*- —II -'- I —.1--II ^ 1 (Please read the precautions on the back before filling in this page) The paper size is far from the Chinese National Standard (CNS) Λ4 specification (210X2W celebration) 309657 Α7 Β7 5. Description of the invention (29) The output signal level of the NOR circuit is * L. NOR circuit 26 — 0, 26 — 1, output of ~ 26-7 (please read the precautions on the back before filling in this page) The signal is during the period when the level of the control signal L is 〃, through the conversion room 27 — 0, 27-1, ~ 27-7, input to the latch circuit 28-0, 28-1, ~ 28_7. The output signal of the latch circuit 28-0, 28-1, ~ 28-7 is during the period of the level of the control signal T, via the AND gate 29-0, 29-1, ~ 29-7, for column selection Line 15. For example, when the output signal level of the predecoder 23-1 is, and the output signal level of the decoder 2 4-1 is iLf, only the level of one of the column selection lines 15 is CSL0,! ! ', The level of all remaining column selection lines is t L 〃. The column selection open relationship connected to the column selection line of * H ^ level is turned on. BW is a block write signal. The level of the block write signal BW is in the normal mode, and it appears as "H" in the block write mode. That is, in the block writing mode, the level of the output signals of all decoders 24-1, 24-2, 2-4-M does not need to be addressed according to the column address signal A 8 ~ employees of the Central Standard Falconry Bureau of the Ministry of Economic Affairs # Cooperative society printed A 1 0 and presented, L '. Therefore, for example, when the level of the output signal of the predecoder 23-1 is t L #, all the levels of the eight column selection lines C S L 〇 ~ CSL 7 controlled by the block 25-1 are 'H'. The column selection open relationship connecting the column selection lines of the level is turned on. Thus, data can be written in block units. V // Figure 1 4 shows the blocks of the semiconductor memory of Figure 1 and Figure 1 1. The paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (2 丨 0 X 297 mm)-A7 B7 Central Standard of the Ministry of Economic Affairs Printed by Falcon Staff Consumer Cooperative V. Description of the invention (30 1 I composition of the selection circuit S Ε L) 1 The block selection circuit SEL is connected to the DQ hopper DQ and the 1 1 data bus 13 through the transfer gate Τ 0 1 t T 0 2 »T 1 1 9 / -— V 1 I please 1 IT 1 2, Τ 2 1, Τ 2 2, Τ 3 1 T 3 2 to make up 0 turn to read 1 I read 1 J switch Τ0 1 丁 0 2, Τ1 1 9 Τ1 2 »T2 1, T2 2 back 1 1 of 1) T 3 1 Τ 3 2 is composed of N channel type MO S transistor and P channel intention 1 type M It is composed of OS transistors. Item 1 is filled with ~ 1 again in block 1 1-0, and the block selection circuit S Ε L is input with writing Έ 1 block selection signal BNK 0, / BNK 0, which constitutes the switching gate 'W, 1 T 0 1, Input 1 1 block selection signal B Ν Κ 0 to the gate of the N channel type M 0 S transistor of T 0 2 to form the input of the gate of the P 1 1 channel type M 0 S transistor of the switching gate T 0 1 TO 2 Block selection signal / order 1 B Ν Κ 0 〇1 I is also in block 1 1-1 in block selection circuit SEL 1 1 I »Input block selection signal Β Ν Κ 1 / BNK 1 〇 in the area In block 1 1 1 4-2, input block selection information Γ B Ν Κ 2 1 / Β Ν Κ 2 in block selection circuit S Ε L, in block selection 1 1 in block 1 1-3 Circuit S Ε L * Input block selection signal BNK 3 / BNK 3 1 1 | Block selection signal Β Ν Κ 〇Β Ν K 3 is any-the level of which is 1 1 * Η Continue, All the remaining levels are% L ψ 〇1 1 I For example, when the block 1 1-0 is selected, the level of the block selection signal BNK 0 1 1 1 is H. Although, the block selection signal B NK 1 * B Ν K 2 The level of 1 1 B Ν Κ 3 is' L #. At this time, only the DQ of block 1 1-〇 is 1 1 This paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X 297 mm) -33 Α7 Β7 309657 V. Description of invention (31) The punch DQ is connected Data bus 1 3 'Block 1 1 1 1' 1 1-2, 11-3 DQ buffer DQ is 13 cut from the data bus (please read the precautions on the back before filling in this page) The data is received only in blocks 1 1-10 and the data is output to and from the circuit 12. 15 shows the structure of the data input / output circuit 12 of the semiconductor memory shown in FIGS. 10 and 11. In this example, a data input / output circuit that performs 1-bit data output is described. That is, for example, in a 16-bit type (X 16) semiconductor memory, the data input / output circuit in this example 16 submissions are required. This data input / output circuit is mainly composed of a data sense amplifier DBSA MP, a data bus write buffer DBWBF, an output latch circuit 30, an output circuit 31, and an output buffer 32. The data writing buffer D BWB F is used when writing data. The control signal NW is input to the synchronous inverter cI1, and the control signal is printed by the Consumer Labor Cooperative of the Central Standards Bureau of the Ministry of Economy. ^ WX is input to the synchronous inverter CI 2, CI 5. During data writing in the normal operation mode, the level of the control signal NW is present, and the synchronous inverter C I 1 is activated. In addition, the level of the control signal w X is input data (writing data) RWDm (m is 0, 1... Or 5) during the period of ^ Η ^ through the synchronous inverter CI 1, latch The lock circuit LA and the synchronous inverters CI 2 and CI 5 lead to the data bus 13. This data is entered into the selection area library via the data bus 1 3. The control signal BW is input to the synchronous inverter c I 3, and the block is written in the paper standard paper (CNS) 2 丨 () χ 297 Gongqing) --- Printed by the Staff Consumer Cooperative of the Central Standardization Bureau of the Ministry of Economic Affairs ^ A7 B7 V. Description of invention (32) In the data writing mode, the level of the control signal BW is presented, and the synchronous inverter c I 3 is activated. In addition, the level of the control signal WX is during the period of H ", and the color temporary data CRm (m is 0, 1, ..., or 5) is passed through the synchronous inverter CI 3, the latch circuit LA, and the synchronization Inverter CI 2, CI 5 'leads to data bus 1 3. This data is entered into the selection area via the data bus 13. The color temporary data C Rm is supplied from the color register. In the color register, in the block writing mode, data patterns are simultaneously written in a plurality of memory cells. The color register is generally equipped with a portrait memory, so that the data of the predetermined pattern can be recorded in a number of hundreds of millions of grids and used for writing at the same time. The content of the color register (data case) is changed by changing the data mode of the color register. The control signal TW is input to the synchronous inverter C I 4. During the writing of the test mode data, the level of the control signal TW is presented! ·! ', While activating the synchronous inverter C I 4. In addition, the level of the control signal WX is in the period of 'Η #, the output signal of the exclusive OR circuit EX is guided to the synchronous inverter CI 4, the latch circuit LA and the synchronous inverters CI 2, CI 5 to The data bus 1 3. This data is input into the selection area library through the data bus 13. In the exclusive OR circuit EX, input color temporary data / CRm and data R W D 〇. That is, in this example, the data pattern used in the test mode can be constructed from the color register. The test circuit for the semiconductor memory used in this embodiment will be described later. The standard of this paper is the general Chinese National Standard (CNS) Λ4 specification (210X297mm) ------------ ^ IIi-- (please read the precautions on the back before filling this page)
*tT - A7 B7 經 濟 部 夬 標 隼 消 k 合 社 印 五、發明説明(33) ^料匯流排感測放大器D B S AMP係於進行資料讀 取時加以使用。 資料匯流排感測放大器D B S AMP係具有N通道型 之操作放大器S AN和P通道型之操作放大器SAp。資 料匯流排感測放大器D B S AMP係於活性信號 RENBL之準位呈時,加以活化,活性信號 RENBL之準位呈時,呈非活化。 活性信號RENBL之準位呈,L,時,同步反相器 C I 6係呈非活化,資料匯流排感測放大器SAMP 係自讀取寫入資料線RWD線加以切離。讀取寫入資料線 RWD線係呈輸出資料(讀取資料)之路徑的同時,呈輸 入資料(寫入資料)之路徑 預充電電晶體PR係輸出資料RWDm (m係〇、工 ……或5 )則輸出至讀取寫入資料RWD線前,令此讀取 寫入資料RWD線之準位,爲充電呈,η,。 輸出資料rWd m則自資料匯流排感測放大器 D AMP輸出時,此輸出資料RWDm係經由輸出問 鎖電路3 〇,輸入至输出電路3 1 ^ 輸出W鎖電路3 0係經由重置信號/r 5重置。同步 信號QST係輸入至输出電路31。即輸出資料 (系〇 1 ......或5 )則同步於同步信號q s T自輸出 電路3 1輸出,經由輸出緩衝器3 2,輸出至記憶晶片之 外部。 .——_ ^路3 3及排他NOR電路3 4係於測試模 ^張尺度中2⑴X况公慶)-- (請先閱讀背面之注意事項再填寫本頁) • - I 1 ϊ II -»1 . .74* tT-A7 B7 Ministry of Economics and Trademark Hayabusa Consumers Co., Ltd. Printed V. Description of Invention (33) ^ The data bus sense amplifier DBS AMP is used when reading data. The data bus sense amplifier D B S AMP is an N-channel type operational amplifier S AN and a P-channel type operational amplifier SAp. The data bus sense amplifier D B S AMP is activated when the level of the active signal RENBL is present, and is inactive when the level of the active signal RENBL is present. When the level of the active signal RENBL is L, the synchronous inverter C I 6 is inactive, and the data bus sense amplifier SAMP is cut off from the read and write data line RWD. Reading and writing data line RWD line presents the path of output data (reading data), while presenting the path of input data (writing data), precharged transistor PR is output data RWDm (m system 〇, engineering ... or 5) It is output to the RWD line of the read and write data, and the level of the RWD line of the read and write data is shown as η for charging. When the output data rWd m is output from the data bus sense amplifier D AMP, the output data RWDm is output through the output lock circuit 3 〇 and input to the output circuit 3 1 ^ The output W lock circuit 3 0 is output through the reset signal / r 5 Reset. The synchronization signal QST is input to the output circuit 31. That is, the output data (which is 0 1 ... or 5) is output from the output circuit 31 in synchronization with the synchronization signal q s T, and is output to the outside of the memory chip through the output buffer 32. .——_ ^ Road 3 3 and exclusive NOR circuit 3 4 are in the test mode ^ Zhang scale 2 ⑴X condition public celebration)-(please read the precautions on the back before filling this page) •-I 1 ϊ II-»1. .74
*ST A7 B7 經濟部中央標準局員工消費合作社印製* ST A7 B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs
五、 發明説明 (34 ) 1 I 式 時 爲 使 用 測 試 電 路 之 一 部 分 〇 1 I Ν A N D 電 路 3 3 中 » 輸 入 輸 出 閂 Λ/1> 鎖 電 路 3 0 之 輸 出 1 1 | 資 料 及 測 試 信 號 e D 丁 〇 於 測 試 模 式 時 測 試 信 號 1 I 請 1 R e D T 之 準 位 則 呈 Η •於排他 0 R 電 路 3 4 中 9 先 閱 1 I 讀 1 1 輸 入 Ν A N D 電 路 3 3 之 輸 出 信 號 及 彩 色 暫 存 資 料 / 背 面 f I 之 1 I C R m 0 排 他 0 R 電 路 3 4 係 輸 出 顯 示 測 試 結 果 爲 可 或 不 注 意 1 事 1 可 之 輸 出 信 m T R D m ( m 係 0 1 … … 或 5 ) 〇 項 再 填 1 -J rm 圖 1 6 係 顯 示 使 用 於 顯 示 本 發 明 之 半 導 體 記 憶 體 的 測 寫 表 試 頁 1 電 路 的 整 體 AS. 構 成 〇 於 圖 1 6 中 t 於 對 應 於 圖 1 5 之 資 料 >—^ 1 輸 出 入 電 路 的 構 成 要 素 中 與 圖 1 5 所 附 符 號 附 上 相 同 之 1 1 符 號 0 1 1 此 測 試 電 路 係 令 3 2 位 元 型 ( X 3 2 ) 之 半 導 體 記 億 訂 I 體 的 測 試 爲 ^ ·-刖 提 〇 1 I 本 實 施 例 之 測 試 電 路 係 白 N A N D 電 路 3 3 排 他 1 1 I 0 R 電 路 3 4 、 測 試 用 切 換 電 路 1 0 0 及 測 試 用 输 出 電 路 1 1 2 0 0 所 構 成 〇 k> 1 測 試 模 式 時 1 測 試 信 號 R e D T 之 準 位 呈 % Η ¥ 〇 排 1 1 他 0 R 電 路 3 4 之 輸 出 信 號 T R D m ( m 係 0 1 … … 或 1 | 3 1 ) 係 輸 入 至 測 試 用 切 換 電 路 1 0 0 0 J 測 試 用 切 換 電 路 1 0 0 中 » 输 入 顯 示 測 示 結 果 之 3 2 1 1 J 位 元 資 料 〇 測 試 用 切 換 電 路 1 0 0 係 令 此 3 2 位 元 之 資 料 1 I 順 序 ( 串 列 ) 輸 出 至 測 試 用 輸 出 電 路 2 0 0 〇 I I 試 用 輸 出 電 路 2 0 0 係 令 控 制 信 號 T Q S T 之 準 位 呈 I I Η • 時 » 則 活 化 〇 此 時 控 制 信 號 Q S T 之 準 位 係 呈 I I 本紙張尺度適用中國_家標準(CNS ) A4規格(2丨0X297公釐) A7 B7 經濟部中央標準局員工消費合作杜印製 五、 發明説明 (35 ) 1 | L 通 常 模 式 所 使 用 之 輸 出 電 路 3 1 則 呈 非 活 化 〇 1 1 圖 1 7 係 顯 示 本 發 明 半 導 體 記 億 體 所 使 用 之 測 試 電 路 1 1 的 詳細 〇 於 圖 1 7 中 > 對 nftr 應 圖 1 5 之 資 料 輸 出 入 電 路 之 構 1 | 成 要件 的 請 1 | 構 成 要 件 中 » 與 面 圖 1 5 所 附 符 硫 附 上 相 同 之 符 先 閲 1 | 讀 I 〇 背 } ιέ I 此 測 之 1 試 電 路 係 令 3 2 位 元 型 ( X 3 2 ) 之 半 導 體 記 憶 意 I 體 的測 試 爲 W. 刖 提 0 事 項 1 I 於 彩 色 暫 存 器 3 5 記 億 具 有 預 先 所 定 圖 案 之 資 料 ( 再 填 本 4. 0 ,1 9 0 〇 唯 彩 色 暫 存 器 3 5 之 內 容 ( 圖 案 ) 係 於 頁 1 1 變 更圖 案 之 模 式 中 經 由 控 制 信 號 Z 之 输 出 可 加 以 變 更 Ο 1 1 排 他 0 R 電 路 E X 中 输 入 彩 色 暫 存 器 3 5 之 資 料 / 1 I C R 0 / C R 1 -/ C R 3 ] L及输入資料RWD C ) 訂 ! 0 輸入 資 料 R W D 0 之 準 位 爲 a L /f 亦可 又 ' Η ^ 亦 1 1 | 可 0 1 1 例 如 » 輸 入 資 料 R W D 0 之 準 位 爲 L /r 時 1 格 陣 列 1 1 0 中輸 入 % Η ff 之 資 料 9 格 陣 列 1 中 輸 入 L 之 資 料 » W 1 格 陣列 2 中 输 入 Η 之 資 料 1 格 陣 列 3 1 中 輸 入 L ff 1 I 之 資料 1 I 又 於 所 有 之 格 陣 列 0 3 1 爲 正 常 時 當 然 地 白 I J 格 陣列 0 中 輸 出 Η 之 資 料 > 格 陣 列 1 中 輸 出 L tt 之 1 1 J 資 料, 格 陣 列 2 中 輸 出 Η 之 資 料 > 格 陣 列 3 1 中 輸 出 1 1 L ^ 之 資 料 〇 1 1 此 時 ♦ 排 他 0 R 電 路 3 4 之 输 出 信 號 T R D m 係 所 有 1 1 呈 ' L 〇 1 1 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公釐) 經濟部中央橾準局員工消费合作社印^ 309657 A7 B7 五、發明説明(36) 排他OR電路3 4之輸出信號TRDm係經由測試模 式切換電路1 0 0及測試模式輸出電路2 0 0 ’做爲判定 信號DQ0 ,輸出至記憶晶片。 測試模式切換電路1 0 0之中,進行判定測試結果爲 可(格陣列正常)或不可(格陣列不正常)。格陣列正常 時,排他OR電路3 4之輸出信號TRDm之準位所有呈 之故,,L"準位之输出信號則自測試模式切換 電路1 0 0輸出,判定測試結果爲可。 一方,格陣列爲異常之時,接受異常格陣列之輸出資 料排他OR電路34之輸出信號TRDm準位,係呈^ 。此時,測試模式切換電路1 0 0之輸出信號準位係 呈Η,判定測試結果爲不良。 於測試結果爲不可時,調查格陣列〇〜3 2中之何者 格陣列爲異常。此調査係於閂鎖電路LATCH0〜3 1 ,閂鎖排他OR電路3 4之輸出信號,令此閂鎖資料順 序讀取串列加以進行。 根據如此之測試電路,令彩色暫存器3 5之資料利用 半導體記憶體之測試的同時,測試結果爲不良時,將顯示 何者爲格陣列之記億格爲不良的信號,串列輸出地加以構 成》 因此,本實施例之測試電路中,測試電路本身之構成 則會變得簡單的同時,僅使用於測試的測試用墊片(端子 )係只要有一個便充分,可貢獻於記憶晶片之縮小或成本 之減低。 本紙悵尺度適用中國國家標隼(CNS ) Λ4現格(210X297公埯) ----„---.---j <------IT------f I (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局κΜ消費合作社印裝 A7 B7 五、發明説明(37) 'y圖1 8係顯示圖1 7之測試模式切換電路1 0 0之構 成之一例。 排他NOR部3 6係檢査於格陣列0〜3 1是否存在 不良的部分。 排他NOR部36係自排他OR電路EX—ORO, EX — 〇ri,〜 EX — OR30和同步反相器CI7 所構成。 輸出信號TRD0〜TRD31係輸入排他OR電路 EX-OR0,EX- OR1,〜EX-OR30。輸 出信號TRD0〜TRD3 1之準位則全爲'L 〃時,排 他OR電路EX — OR3 0之輸出信號的準位係呈 〇 控制信號/SRCH之準位呈〃時,活化同步反 相器C I 7。此時顯示測試結果之輸出信號Re DRD係 自同步反相器CI7輸出。 輸出信號TRD0〜TRD3 1之準位則所有呈 #時,輸出信號R e D R D準位則呈,Η '。即,顯示測 試結果爲可之信號,自測試用輸出電路輸出。 輸出信號TRD0〜TRD 3 1之至少一個之準位呈 'Η "時,輸出信號ReDRD準位則呈。即,顯 示測試結果爲不可之信號,自測試用輸出電路輸出。 開關電路部3 7係於測試結果爲不可時,何者格陣列 存在不良,爲特定不良之格陣列者。 開關電路部37係自轉換閘TG〇 ,TG1 ,〜 本紙張尺度適用中國國家標率(CNS ) Λ4現格(210X 297公缝1 ~ ' -斗〇 - ----.------^ -衣------訂------f) (請先閱讀背面之注意事項再填寫本頁) A7 B7 經濟部中央標準局員工消費合作杜印货 五、 發明説明 (38 ) 1 | T G 3 1 及 同 步 反 相 器 C I 8 加 以 構 成 0 各 轉 換 閘 Τ G 0 1 1 > Τ G 1 > Τ G 3 1 係 由 N 通 道 型 Μ 〇 S 電 晶 體 和 Ρ 道 1 1 型 Μ 0 S 電 晶 體 構 成 〇 轉 換 閘 T G 0 > T G 1 » I | 由 請 1 T G 3 1 之 開 啓 • 開 閉 動 作 係 經 串 列 選 擇 器 3 8 加 以 控 先 1 I 讀 1 制 0 背 ιέ 1- | 串 列 選 擇 器 3 8 係 於 控 制 信 Pfla 號 S R C Η 之 準 位 爲 Η 之 注 意 f 時 活 化 » 同 3 步 於 時 脈 信 號 C L K 輸 出 控 制 信 號 Q 0 9 事 項 1 | Q 1 Q 1 0 控 制 信 號 Q 0 Q 1 〜Q ί i ] L中之 填 寫 本 ▲ 一 個 係 呈 Η 準 位 殘 留 之 所 有 係 呈 L JT 準 位 〇 Η 頁 S___ 1 1 準 位 之 控 制 信 號 係 向 Q 0 至 Q 3 1 順 序 ( 串 列 ) 加 以 切 1 1 換 〇 即 資 料 丁 R D 0 T R D 1 T R D 3 1 爲 順 序 1 I ( 串 列 ) 經 由 同 步 反 相 器 C I 8 加 以 輸 出 〇 訂 I 同 步 反 相 器 C I 8 係 於 控 制 信 號 S R C Η 之 準 位 爲 1 1 I Η 摩 時 可 活 化 〇 1 1 J '圖 1 9 及 圖 2 0 係 顯 示 測 試 時 本 發 明 之 半 導 體 記 憶 體 1 1 之 動 作 〇 k 1 補 救 • 測 試 模 式 中 於 半 導 體 記 憶 體 flsz· 之 格 陣 列 進 行 是 1 1 否 存 在 不 良 的 檢 査 〇 串 列 捜 索 • 測 試 摸 式 中 進 行 檢 査 特 1 I 定 複 數 之 格 陣 列 之 不 良 存 在 格 陣 列 者 0 1 J / R E 係 決 定 令 行 位 址 信 Qr^ 號 置 入 半 導 體 記 憶 體 眼 內 的 時 1 1 間 〇 即 » / R E 之 準 位 爲 % L 時 行 位 址 信 號 則 置 於 半 1 導 體 記 億 體 內 0 1 1 / C E 係 決 定 令 列 位 址 信 號 置 入 半 導 體 記 憶 體 內 的 時 1 1 間 0 即 9 / C E 之 準 位 爲 L 續 時 列 位 址 信 號 則 置 於 半 1 1 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210/:2^7公釐) - 4/ _ A7 B7 經濟部中央標孪局員工消#合作杜印災 五、 發明説明 (39 ) 1 I 導 體 記 億 體 內 〇 1 1 補 救 • 測 試 模 式 係 例 如 / C E 之 準 位 爲 L 聲 時 > 令 1 1 測 試 信 號 T E S T 之 準 位 設 定 爲 L 地 加 以 執 行 〇 /---- 1 I 請 1 1 串 列 捜 索 • 測 試 模 式 係 例 如 / C E 之 準 位 爲 L 時 先 閱 1 | 讀 1 1 令 測 試 信 號 丁 E S T 之 準 位 > 設 定 爲 % Η 聲 地 加 以 執 行 背 面 \ 1 之 1 〇 注 意 I 之 事 1 v/ 圖 2 1 係 顯 示 本 發 明 之 第 2 實 施 例 之 半 導 體 記 憶 猶 歴 項 1 填 晶 片 佈 局 〇 寫 中 2 Έ 1 此 實 施 例 對 於 可 同 時 输 出 入 3 2 位 元 資 料 之 3 1 位 元 型 ( X 3 2 ) 之 半 導 體 記 憶 體 加 以 說 明 〇 1 1 於 — 個 記 憶 晶 片 1 0 上 配 置 4 個 區 庫 1 1 — 0 1 1 1 1 一 3 0 各 區 庫 1 1 — 0 1 1 — 3 中 形 成 記 億 格 陣 訂 1 列 C A L C A R 記 憶 格 陣 列 控 制 器 C A C 且 行 解 碼 1 I 器 R D 列 解 碼 器 C D 0 C D 3 D Q 緩 衝 器 ( 稱 區 庫 1 1 之 輸 出 入 部 緩 衝 器 ) D Q 等 之 周 邊 電 路 〇 1 1 1 個 區 庫 內 之 記 憶 格 陣 列 係 分 爲 4 個 中 區 塊 B L a > 1 B L b B L c B L d « 又 各中區塊係分爲2個小 1 1 區 塊 C A L » C A R 〇 因 此 1 個 區 庫 內 之 記 憶 格 陣 列 係 1 1 由 8 個 區 塊 構 成 〇 1 行 解 碼 器 R D 係 於 各 4 個 之 中 區 塊 B L a B L b 9 1 B L C » B L d 中 各 設 置 1 個 〇 行 解 碼 器 R D 係 根 據 行 1 1 f 位 址 信 號 » 選 擇 2 個 小 區 塊 C A L 、 C A R 中 之 任 一 個 1 1 且 白 選 擇 1 個 之 區 塊 中 的 複 數 行 選 擇 1 個 行 ( 字 元 線 ) 〇 1 1 列 解 碼 器 C D 0 C D 1 係 於 1 個 區 庫 內 設 置 4 個 〇 1 1 本紙張尺度適用中國國家標隼(CNS ) Α4規格(210X297公釐) —— 309657 A7 B7 M濟部中央標準局員工消费合作社印製 五、發明説明(40 ) 列解碼器C D 0 塊 B L a,B L 複數之列。 例如,經由 於該列選擇線之 連接於該2個列 則輸出至局部D y實施例中 。此時因存在4 B L b,B L c 1個區庫,輸出 感測放大器 B L a ,B L b 之小區塊C A L 列解碼器R CAL - CAR 列解碼器R D係 B L c ,B L d 方向)之2個端 置於該2個之端 格陣列控制 的控制。 列解碼器C B L a · B L b 〜CD 3係根據各列位址信號,選擇中區 b ,BLc ,BLd記億格陣列之1個或 列解碼器C D 0,選擇列選擇線時,連接 2個列選擇開關則呈開啓狀態9然後,自 選擇開關之2個資料線對,2位元之資料 Q線對1 8 a。 ,1個列解碼器則選擇2個列地加以構成 個列解碼器之故,自各中區塊BLa ’ ,BLd,输出入8位元之資料。即’自 入32位元(4位元組)之資料° 及列選擇開關係於記億格陣列之各中區塊 ,BLc ,BLd中,配置於記憶格陣列 ,C A R 間。 D和格陣列控制器C A C係令記憶格陣列 挾於中央,相互對向地加以配置。即, 於配置4個之中區塊BLa ’ BLb ’ 的方向,即配置於行方向(字元線延長之 部中的一方側,格陣列控制器C A C係配 部中之另一側。 器C A C係進行區庫內之資料輸出入動作 D 0〜C D 3係於配置4個之中區塊 ,BLc ,BLd的方向,即配置於列方 (請先閲讀背面之注意事項再填寫本頁)V. Description of the invention (34) 1 Type I is a part of the test circuit used 〇1 I Ν AND circuit 3 3 in »Input and output latch Λ / 1> Output of the lock circuit 3 0 1 1 | Data and test signal e D 丁〇In the test mode, the test signal 1 I asks 1 R e DT level is Η • Exclusive 0 R circuit 3 4 in 9 first read 1 I read 1 1 input N AND circuit 3 3 output signal and color temporary Information / 1 fCR on the back of I I m 0 exclusive 0 R circuit 3 4 series output shows the test result is possible or not to pay attention 1 thing 1 output signal m TRD m (m series 0 1…… or 5) and then fill in 1 -J rm Figure 16 shows the overall AS of the circuit used to display the test page 1 of the semiconductor memory of the present invention. The structure is shown in Figure 16 where t corresponds to Figure 1 5 data>-^ 1 The components of the input and output circuits are the same as those attached to the attached symbols in Figure 1 1 1 Symbol 0 1 1 This test circuit is made of 3 2 bit type (X 3 2) The test of the semiconductor memory module is ^ ·-刖 提 〇1 I The test circuit of this embodiment is a white NAND circuit 3 3 exclusive 1 1 I 0 R circuit 3 4, the test switching circuit 1 0 0 and the test output Circuit 1 1 2 0 0 constitutes 〇k > 1 test mode 1 test signal Re e DT level is% Η ¥ 〇 row 1 1 other 0 R circuit 3 4 output signal TRD m (m is 0 1…… Or 1 | 3 1) It is input to the test switching circuit 1 0 0 0 J Test switching circuit 1 0 0 »Input and display the measurement result 3 2 1 1 J bit data 〇 Test switching circuit 1 0 0 system Make this 32-bit data 1 I sequence (serial) output to Trial output circuit 2 0 0 〇II Trial output circuit 2 0 0 Make the level of the control signal TQST is II Η • When »is activated. At this time the level of the control signal QST is II This paper standard is applicable to China_Home Standard (CNS) A4 specification (2 丨 0X297mm) A7 B7 Printed by the consumer cooperation of the Central Standards Bureau of the Ministry of Economy V. Invention description (35) 1 | L The output circuit 3 1 used in the normal mode is non-activated 〇1 1 FIG. 17 shows the details of the test circuit 1 1 used in the semiconductor memory device of the present invention. 1 is shown in FIG. 7> For nftr, the structure of the data input and output circuit according to FIG. 1 5 is 1 | In the composition requirements »As shown in the picture above, the attached characters are the same. First read 1 | Read I 〇 背} ιέ I The test circuit for this test is a 3 2 bit type ( X 3 2) The test of the semiconductor memory I body is W. Reminder 0 Item 1 I in the color register 35 5 billion data with a predetermined pattern (refill 4.0, 1 9 0 〇 color only The content (pattern) of the register 3 5 is changed on page 1 1 in the pattern change mode through the output of the control signal Z. Ο 1 1 Exclusive 0 R The data input to the color register 3 5 in the circuit EX / 1 ICR 0 / CR 1-/ CR 3] L and input data RWD C) Order! 0 Input data RWD 0 Level is a L / f Can also be 'Η ^ 亦 1 1 | Available 0 1 1 For example »Input data RWD When the level of 0 is L / r, 1 cell array 1 1 0 0% ff data input 9 cell array 1 L data input »W 1 cell array 2 Η data input 1 cell array 3 1 L input ff 1 I data 1 I is in all grid arrays 0 3 1 is normal White IJ Array 0 output data > 1 Array 1 output L tt 1 1 J data, Grid array 2 output Η data > Grid array 3 1 output 1 1 L ^ data 〇1 1 At this time ♦ Exclusive 0 R The output signal TRD m of the circuit 3 4 is all 1 1 presents' L 〇1 1 This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 mm) Employee Consumer Cooperative of Central Central Bureau of Economic Affairs印 ^ 309657 A7 B7 5. Description of the invention (36) The output signal TRDm of the exclusive OR circuit 34 is output to the memory chip as the determination signal DQ0 through the test mode switching circuit 1 0 0 and the test mode output circuit 2 0 0 '. In the test mode switching circuit 1 0 0, the judgment test result is yes (the grid array is normal) or not (the grid array is abnormal). When the grid array is normal, the level of the output signal TRDm of the exclusive OR circuit 34 is all presented, and the output signal of the L " level is output from the test mode switching circuit 100, and the test result is determined to be OK. On the one hand, when the grid array is abnormal, the output signal TRDm level of the OR circuit 34, which receives the output data of the abnormal grid array, is presented as ^. At this time, the output signal level of the test mode switching circuit 100 is H, and the test result is determined to be bad. When the test result is not possible, investigate which of the grid arrays 0 to 32 is abnormal. This investigation is based on the latch circuit LATCH0 ~ 3 1 and the output signal of the latch exclusive OR circuit 34, so that the latch data is sequentially read in series. According to such a test circuit, when the data of the color register 35 is tested using semiconductor memory, when the test result is bad, it will show which is the signal of the grid array. The signal of 100 million grids is bad. Structure> Therefore, in the test circuit of this embodiment, the structure of the test circuit itself becomes simple, and only one test pad (terminal) used for testing is sufficient, which can contribute to the memory chip. Reduce or reduce costs. The scale of this paper is applicable to the Chinese national standard falcon (CNS) Λ4 present grid (210X297 gong) ---- „---.--- j < ------ IT ------ f I ( Please read the precautions on the back and then fill out this page) A7 B7 printed by κΜ Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (37) 'y Figure 1 8 shows the test mode switching circuit 1 0 0 of Figure 17 An example of the structure. The exclusive NOR unit 36 checks whether there are defective parts in the grid array 0 to 31. The exclusive NOR unit 36 comes from the exclusive OR circuit EX-ORO, EX-ORi, ~ EX-OR30 and synchronous inversion It consists of CI7. The output signals TRD0 ~ TRD31 are input to the exclusive OR circuits EX-OR0, EX-OR1, ~ EX-OR30. When the output signal TRD0 ~ TRD3 1 are all 'L 〃, the exclusive OR circuit EX — The level of the output signal of OR3 0 is 0. When the level of the control signal / SRCH is 〃, the synchronous inverter CI 7 is activated. At this time, the output signal Re DRD showing the test result is output from the synchronous inverter CI7. When the levels of signals TRD0 ~ TRD3 1 are all #, the output signal Re DRD level is, Η '. That is, the signal showing the test result is acceptable, since Try the output from the output circuit. When the level of at least one of the output signals TRD0 ~ TRD 3 1 is' H ", the output signal ReDRD level is displayed. That is, the test result is displayed as an impossible signal, and it is output from the test output circuit. The switch circuit part 37 is the one where the grid array is defective when the test result is not possible, which is a specific bad grid array. The switch circuit part 37 is a self-switching gate TG〇, TG1, ~ This paper standard is applicable to China ’s national standard rate ( CNS) Λ4 present grid (210X 297 male seam 1 ~ '-Dou〇- ----.------ ^ -clothing -------- order ------ f) (Please read first (Notes on the back and then fill in this page) A7 B7 Central Government Bureau of Economic Affairs Employee Consumer Cooperation Du Printed Goods 5. Description of the Invention (38) 1 | TG 3 1 and synchronous inverter CI 8 are formed 0 Each switching gate TG 0 1 1 > TG 1 > TG 3 1 is composed of N channel type M 〇S transistor and P channel 1 1 type M 0 S transistor. Shift gate TG 0 > TG 1 »I | You please 1 Opening and closing of TG 3 1 The selector 3 8 is controlled first 1 I read 1 system 0 back 1- | The serial selector 3 8 is activated when the level of the control signal Pfla No. SRC Η is Η Note that f is activated »Same 3 steps as the clock signal CLK output control signal Q 0 9 Item 1 | Q 1 Q 1 0 Control signal Q 0 Q 1 ~ Q ί i] Fill in the L ▲ One is the Η level and all the remaining is the L JT level 〇Η page S___ 1 1 The control signal of the level is switched to the sequence Q 0 to Q 3 1 (serial) 1 1 is exchanged for the data RD 0 TRD 1 TRD 3 1 is the sequence 1 I (serial) via the synchronous inverter CI 8 is output. The synchronous inverter CI 8 is activated when the level of the control signal SRC Η is 1 1 I Η can be activated at the moment. 1 1 J 'Figure 1 9 and Figure 2 0 show the invention in the test Operation of semiconductor memory 1 1 〇k 1 recovery • In the test mode, check whether there is a defect in the grid array of the semiconductor memory flsz · 1 1 Check whether there is a defect ○ Serial search • Check in the test mode 1 I Defect of a certain complex grid array There is a grid array 0 1 J / RE decides that the line address signal Qr ^ is placed in the eye of the semiconductor memory when it is 1 1 0. That is »/ RE when the level is% L When the line address signal is placed in a half 1 conductor memory body 0 1 1 / CE determines the time when the column address signal is placed in the semiconductor memory 1 1 0 0 9 9 / CE level is L continued when the column address signal is set to half 1 1 This paper standard is applicable to Chinese national standards (CNS) Λ4 specification (210 /: 2 ^ 7mm)-4 / _ A7 B7 Ministry of Economic Affairs Central Standard Twin Bureau Employee Elimination # Cooperation Du Yin Disaster V. Description of the Invention (39) 1 I Conductor Billion Body 〇1 1 Remedy • The test mode is eg / CE level When it is L sound> Let 1 1 test signal TEST level be set to L ground to execute 〇 / ---- 1 I please 1 1 serial search • Test mode is for example / CE level is L read first 1 | Read 1 1 Let the level of the test signal DEST be set to% Η to be executed acoustically on the back \ 1 of 1 〇 Note I 1 v / FIG. 2 1 is a semiconductor showing the second embodiment of the present invention Memory still item 1 Filling the chip layout 〇 Writing 2 Έ 1 This embodiment describes a 3 1 bit type (X 3 2) semiconductor memory that can simultaneously input and output 3 2 bit data. 〇 1 1 in- Memory chip 1 0 is equipped with 4 banks 1 1 — 0 1 1 1 1 1 3 0 Banks 1 1 — 0 1 1-3 form a 100 million grid order 1 column CALCAR memory grid array controller CAC and row decoding 1 I device RD column decoder CD 0 CD 3 DQ buffer (called I / O buffer of zone library 1 1) DQ etc. The peripheral circuit 〇1 1 1 The memory cell array in the bank is divided into 4 middle blocks BL a > 1 BL b BL c BL d «and each middle block is divided into 2 small 1 1 blocks CAL »CAR 〇 Therefore, the memory cell array in one bank is 1 1 composed of 8 blocks 〇1 row decoder RD is in each of the 4 middle blocks BL a BL b 9 1 BLC» BL d Set 1 〇 line decoder RD is based on the line 1 1 f address signal »Select any one of the two small blocks CAL, CAR 1 1 and white select one of the plural lines in the block select 1 line (word Yuan line) 〇1 1 column decoder CD 0 CD 1 is tied to a district library Set four 〇1 1 paper standards for China National Falcon (CNS) Α4 specifications (210X297 mm)-309657 A7 B7 M printed by the Employee Consumer Cooperative of the Central Bureau of Standards, Ministry of Economy V. Description of invention (40) Column decoder CD 0 block BL a, BL plural column. For example, the connection to the two columns via the selection line of the column is output to the local D y embodiment. At this time, due to the existence of 4 BL b, BL c 1 bank, output sense amplifiers BL a, BL b small block CAL column decoder R CAL-CAR column decoder RD (BL c, BL d direction) 2 The end is placed under the control of the two end grid arrays. Column decoders CBL a · BL b ~ CD 3 select one of the middle zone b, BLc, BLd or the column decoder CD 0 according to the signal of each column address, when selecting the column selection line, connect two The row selection switch is in the on state 9 Then, the two data line pairs of the self-selection switch and the 2-bit data Q line pair 1 8 a. One column decoder selects two columns to form a column decoder, and outputs 8-bit data from each middle block BLa ', BLd. That is, the 32-bit (4-byte) data and row selection are related to each block in the memory grid, BLc and BLd, and are arranged between the memory grid array and CAR. D and the grid array controller CAC make the memory grid array centrally located and configured to face each other. That is, in the direction in which the four blocks BLa 'BLb' are arranged, that is, in the row direction (one side of the portion where the word line extends, the grid array controller CAC is the other side in the matching portion. The data input and output actions D 0 ~ CD 3 in the library are arranged in the direction of the 4 middle blocks, BLc and BLd, that is, they are arranged in the row (please read the precautions on the back before filling this page)
J 訂 本紙悵尺度適用中國國家標準(CNS ) Λ4現格(210/ 21厂公t ) Α7 Β7 經濟部中央標準局段工消f合作社印裝 五、 發明説明 (41 ) I 1 向 ( 資 料 線 對 或 列 選 擇 線 延 長 之 方 向 ) 之 2 個 端 部 中 的 一 1 1 方 側 〇 1 1 4 個 列 解 碼 器 C D 0 C D 3 係 將 負 責 各 列 解 碼 器 1 I 請 1 | C D 0 C D 3 之 記 憶 格 陣 列 之 列 加 以 4 分 地 * 配 置 於 行 先 閱 I | 讀 1 方 向 〇 背 δ | 之 1 D Q 緩 衝 器 D Q 係 配 於 列 方 向 ( 資 料 線 對 或 列 選 擇 線 意 解 碼 器 事 1 延 長 之 方 向 ) 之 2 個 端 部 中 的 另 方 側 〇 即 列 項 再 填 1 ««Ji, C D 0 C D 3 和 D Q 緩 衝 器 D Q 係 令 記 憶 格 陣 列 C A L 寫 本 » C A R 挾 於 中 央 » 相 互 對 向 地 加 以 配 置 〇 頁 'w*· 1 1 資 料 係 經 由 資 料 線 對 感 測 放 大 器 及 列 選 擇 開 關 之 後 1 1 » 引 導 至 局 部 D Q 線 對 1 8 a 〇 局 部 D Q 線 對 1 8 a 係 於 1 1 記 億 格 陣 列 之 各 中 區 塊 B L a B L b B L C B L d 訂 I 中 配 置 於 記 億 格 陣 列 之 小 區 塊 C A L C A R 間 〇 1 I 此 局 部 D Q 線 對 1 8 a 係 延 長 於 行 方 向 ( 字 元 線 1 1 | 延 長 之 方 向 ) 0 1 1 又 整 體 資 料 線 對 1 8 b 係 於 記 憶 格 陣 列 之 小 區 塊 1 C A L C A R 上 延 長 列 方 向 加 以 配 置 0 整 體 D Q 線 對 1 1 1 8 b 之 — 端 係 經 由 開 關 2 1 連 接 於 局 部 D Q 線 對 1 1 1 8 a 另 — 端 係 連 接 於 D Q 緩衝器D Q 1 1 共 有 於 4 個 區 庫 之 資 料 匯 流 排 1 3 係 配 置 於 區 庫 1 1 1 1 J — 0 1 1 — 1 和 區 塊 1 1 — 2 1 1 — 3 間 延 長 於 列 1 1 方 向 0 資 料 匯 流 排 1 3 係 呈 區 庫 1 1 — 0 1 1 — 3 和 資 1 1 料 輸 出 入 範 圍 1 2 間 之 資 料 輸 出 入 路 徑 者 Ο 1 1 本 實 施 例 中 » 令 3 2 位 元 型 之 半 導 體 記 億 體 爲 > ·-刖 提 之 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨ϋχπ7公釐) . -44 - A7 B7 309657 五、發明説明(42 ) 故,資料匯流排1 3係以3 2位元(4位元組)之資料輸 出入可同時進行地加以構成者》 記憶晶片1 0 圍1 2中,爲 入,形成3 2 之行方向 同時進行 個之輸出 資料輸出入範圍12係配置於 之2個端部中的一側》資料输入範 3 2位元(4位元組)之資料輸出 入電路(I / 0 )。 y述之半導體記憶體之資料输出入動作係如下地加以 進行 首先、經由區庫選擇器SEL ’由4個之區庫1 1 — 0 (請先閱讀背面之注意事項再填寫本頁) 1 1 — 3中選擇一個區庫。選擇之1個區庫中,根據 位址信號進行記憶格之存取動作》 資料之輸出(讀取)時,32 料則經由局部DQ線對1 8 a及整 自該選擇之1個區庫輸出。自區庫 經由資料匯流排1 3 ,引導至資料 資料輸出入範圍12輸出至半導體 部。 經濟部中央標準局員工消费合作杜印狄J The standard format of the paper is applicable to the Chinese National Standard (CNS) Λ4 present grid (210/21 factory t) Α7 Β7 Printed by the Central Standards Bureau of the Ministry of Economic Affairs Section Cooperative Fifth, the invention description (41) I 1 direction (data line The direction of the extension of the pair or column selection line) is one of the two ends 1 1 1 square side 〇1 1 4 column decoders CD 0 CD 3 will be responsible for each column decoder 1 I please 1 | CD 0 CD 3 The column of the memory grid array is divided into 4 points *. It is arranged in the row first read I | read 1 direction 〇 back delta | 1 DQ buffer DQ is allocated to the column direction (data line pair or column selection line means decoder 1 extension direction ) The other side of the 2 ends. That is, fill in the column and fill in 1 «« Ji, CD 0 CD 3 and DQ buffer DQ make the memory cell array CAL copybook »CAR in the center» opposite each other 1) The data is sent through the data line pair sense amplifier and the row selection switch 1 1 »Guided to the local DQ line pair 1 8 a 〇 The local DQ line pair 1 8 a is in 1 1 Each middle block BL a BL b BLCBL d of the Yige array is arranged in the small block CALCAR of the Yige array. The local DQ line pair 1 8 a is extended in the row direction (character line 1 1 | The direction of extension) 0 1 1 and the overall data line pair 1 8 b is arranged in the extended column direction on the small block of the memory grid array 1 CALCAR 0 The overall DQ line pair 1 1 1 8 b-the end is through the switch 2 1 Connected to the local DQ line pair 1 1 1 8 a The other end is connected to the DQ buffer DQ 1 1 A total of 4 data bank data bus 1 3 is configured in the bank 1 1 1 1 J — 0 1 1 — 1 and block 1 1 — 2 1 1 — 3 extend from column 1 1 Direction 0 The data bus 1 3 is the district library 1 1 — 0 1 1 — 3 and the capital 1 1 The data input / output path between the data input and output range 1 2 Ο 1 1 In this embodiment »Let 3 2 bit type The semi-conductor of the semiconductor is > ·-刖 提 1 1 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 ϋχπ7mm). -44-A7 B7 309657 V. Invention description (42) Therefore, The data bus 13 is composed of 32-bit (4-byte) data input and output that can be constructed simultaneously. "Memory chip 1 0 in the circumference 1 2 for input, forming a row of 3 2 simultaneously. The output data input / output range 12 is configured on one side of the two ends. The data input range 32 is a 2-bit (4-byte) data input / output circuit (I / 0). The data input and output operations of the semiconductor memory described in y are carried out as follows. First, through the bank selector SEL 'from 4 bank 1 1 — 0 (please read the precautions on the back before filling this page) 1 1 — Select a zone library in 3. In the selected 1 zone library, the memory cell is accessed according to the address signal. When the data is output (read), 32 data are paired via the local DQ line for 1 8 a and the whole zone is selected. Output. From the zone library to the data through the data bus 1 3, leading to the data input and output range 12 output to the semiconductor department. Du Yindi, Staff Consumption Cooperation, Central Bureau of Standards, Ministry of Economic Affairs
位元(4位元 體D Q線對1 輸出之3 2位 輸出入範圍1 記億體(記憶 位元(4位元 資料匯流排1 擇之1個區庫 、整體D Q線 列之記億格。 中,有以下之 列解碼器R D 組)之資 8 b , 元資料係 2,且自 晶片)外 組))之 3,輸入 的3 2位 對1 8及 特徵。 係令記憶 資料之輸入(寫入)時,32 資料則經由資料輸出入範圍1 2、 至該選擇之1個區庫。輸入至該選 元之資料係經由局部D Q線1 8 a 感測放大器S A,記億於記憶格陣 \/上述半導體記憶體之晶片佈局 第1、格陣列控制器CAC和 本紙悵尺度適用中國國家標準(CNS )八4規格(2 ΙΟ X 297公釐) 經濟部中央標準局員工消费合作杜印製 A7 B7 五、發明説明(43 ) 格陣列CAL,CAR挾於中央,相互對向於行方向之端 部加以配置。又、列解碼器CD0〜CD3和DQ緩衝器 DQ係令記億格陣列CAL,CAR挾於中央,相互對向 於列方向之端部加以配置。 即,格陣列控制器C A C ’行解碼器R D、列解碼器 C D 〇〜C D 3及D Q緩衝器D Q係皆連接於記億格陣列 CAL,CAR之一邊加以配置。 因此,可容易進行構成格陣列控制器C A C、行解碼 器RD、列解碼器CDO〜CD3及DQ緩衝器DQ的元 件配置或配線等。 第2,於區庫內•設置延長於行方向之局部DQ線對 18a ,和設置延長於列方向之整體DQ線對18b, 資料則自區庫之列方向之端部的輸出入地加以構成。 即,令DQ緩衝器DQ,可設於區庫之列方向之端部 之故,可實現上述第1之特徵。 又,如本實施例,於記憶格陣列之1個中區塊中’進 行輸出入之位元數爲8位元時,配置於小區塊CAL、 CAR間之局部DQ線對1 8 a ,係於列解碼器CD 0側 設置2位元分,同樣地於列解碼器c D 1〜C D 3側各僅 設置2位元分即可。 此係列解碼器CD 〇〜CD 3鄰接於記億格陣列配置 於行方向,又,資料之輸出入於區庫之列方向端部進行之 故。 因此’於局部DQ線對1 8 a令必需範圍變小。 本紙張尺度適用中賴家標準(CNS 格(2_ 297公慶) _ ~ -私- -------l·---1 衣------訂------^ (請先閱讀背面之注意事項再填寫本頁) A7 B7 經濟部中央標準局貝工消費合作社印萁 五、發明説明(44) 又,整體DQ線1 8b係於1個中區塊中,進行8位 元之資料輸出入時,於1區庫中,僅需進行3 2位元資料 傳送之數。但是,整體DQ線對1 8 b係配置於記憶格陣 列CAL,CAR上之故,無需新設置配置整體DQ線對 1 8 b之範圍。 第3 ,資料匯流排1 3係於區庫1 1 — 0,1 1 一 2 和區庫11 — 1 ,11 — 3間,延長於行方向配置。此係 區庫內之DQ緩衝器DQ則配置於列方向之2個端部中 之一個之緣故。 結果,經由區庫及資料輸出入電路之配置之設計,可 減少資料匯流排1 3構成之配線,可縮小於記憶晶片1 〇 所佔之資料匯流排13之範圍。 2 2係概略顯示構成圖1 0之第1實施例之半導體 記憶體之區庫位置和資料匯流排之位置。 記憶晶片1 0上之範圍係主要由區庫1 1一〇〜1 1 _3及資料輸出入範圍(I/O) 12所占據。資料輸出 入範圍1 2係鄰接記億晶片1 0之4個邊之一個,即鄰接 於列方向之2個邊中之一個加以配置。 區庫內之記憶格陣列係由配置於列方向之複數小區塊 構成,且經由2個小區塊構成1個中區塊。 於各小區塊內,配置於延長於行方向之字元線,和延 長於列方向(配置小區塊之方向)之資料線及列選擇線。 DQ線對1 8係於2個小區塊間’延長於行方向。2 個小區塊間之D Q線對1 8係僅存在可傳送4位元資料之 -η- 本紙張尺度適州中國國家標準(CNS ) Λ4現恪(210X 297公趫) (請先閱讀背面之注意事項再填寫本頁) 1" 訂 * Τ— n J—* 309657 A7 B7 五、發明説明(45 數 資料匯流排1 3係配置於區庫1 1 — 〇 , 1 1_1和 區庫11 — 2 ’ 11 — 3間,延長於列方向。資料匯流排 1 3係令1 6位元(2位元組)之資料可傳送地加以構成 2 3係顯示圖1 0及圖2 2之半導體記億體之第 變形例者。 此變形例之特徵 配置於記憶晶片10 之兩側’各設置區庫 1 3 a,1 3 b ° 即,記憶晶片1 係令資料輸出入電路(I /0) 1 2 之中央部,及於資料輸出入電路1 2 11-0 11 3和資料匯流排 0上之範圍係主要由區庫11一0〜 11 — 3及資料輸出入範圍(I/O) 12所占據。資料 2係配置於記億晶片1 0之中央部,於列方 (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部中央標隼局員工消f合作杜印裝 輸出入範圍1 向變長。 區庫內之 構成,且經由 ,配置於延長 線及列選擇線 整體D Q 向。又,於局 於列方向。整 經由開關相互 資料匯流 記憶格陣列係由配置於列方向之複數小區塊 2個小區塊構成1個中區塊。於各小區塊內 於行方向之字元線,和延長於列方向之資料 〇 線對1 8 a係於2個小區塊間’延長於行方 部DQ線對1 8 b係於記億格陣列上’延長 體DQ線對1 8 a和局部DQ線對1 8 b係 連接。 排1 3 a係配置於區庫1 1 一〇和區庫1 1 本紙張尺度適用中國囤家標準(CNS )八4蚬格(210X2SH公t ) -你- A7 B7 經濟部中央標车局員工消費合作it印背 五、 發明説明( 46 ) 1 — 1間 延 長 於 列 方 向 t 連 接 於 資 料 輸 出 入 電 路 1 2 〇 同 1 1 W 地, 資 料 匯 流 排 1 3 b 係 配 置 於 區 庫 1 1 — 2 和 區 庫 1 1 1 1 - 3 間 延 長 於 行 方 向 » 連 接 於 資 料 輸 出 入 電 路 1 2 1 1 I 〇 資料 匯 流 排 1 3 a I 1 3 b 係 令 1 6 位 元 ( 2 位 元 組 ) 請 先 閲 1 1 I 之 資料 可 傳 送 地 加 以 構 成 0 讀 背 而 1 \jM 2 4 係 詳 細 顧 示 於 圖 2 3 之 半 導 體 記 憶 體 之 晶 片 佈 之 注 1 局 〇 思 事 項 1 I 再 1 | 各 區 庫 內 之 佈 局 係 與 圖 1 0 之 半 導 體 記 億 體 之 各 ΤΤΓ m 庫 填 % —j 本 內 之佈 局 相 同 0 頁 '««wV 1 | \β 2 5 係 顯 示 圖 2 1 之 半 導 體 記 憶 體 之 第 1 變 形 例 者 1 1 1 此 變 形 例 之 特 徵 係 令 資 料 輸 出 入 電 路 ( I / 0 ) 1 2 1 1 訂 | 配 置於 記 憶 晶 片 1 0 之 中 央 部 » 及 於 資 料 輸 出 入 電 路 1 2 1 1 之 兩側 各 設 置 區 庫 1 1 — 0 1 1 — 3 和 資 料 匯 流 排 1 1 1 3 a 1 3 b 〇 1 1 即 記 憶 晶 片 1 0 上 之 範 圍 係 主 要 由 區 庫 1 1 — 0 | 1 1 — 3 及 資 料 输 出 入 範 圍 ( I / 0 ) 1 2 所 占 據 0 資 料 1 I 輸 出入 範 圍 1 2 係 配 置 於 記 億 晶 片 1 0 之 中 央 部 » 於 列 方 1 1 I 向 變長 〇 1 1 區 庫 1 1 — 0 1 1 — 1 係 配 置 於 資 料 輸 出 入 範 圍 1 1 1 2之 — 側 區 庫 1 1 一 2 1 1 — 3 係 配 置 於 資 料 輸 出 •1 1 入 範圍 1 2 之 另 一 側 〇 1 1 區 庫 內 之 記 憶 格 陣 列 係 由 配 置 於 列 方 向 之 複 數 小 區 塊 1 | 構 成, 且 經 由 2 個 小 區 塊 構 成 1 個 中 區 塊 〇 於 各 小 區 塊 內 1 1 本紙張尺度通州肀囤國家標準(CNS ) Λ4坭格(210X 297公碴) 經濟部中央標準局Μ工消f合作杜印裂 A7 _ B7 五、發明説明(47) ’配置於延長於行方向之字元線,和延長於列方向之資料 線及列選擇線。 整體D Q線對1 8 a係於2個小區塊間,延長於行方 向。又,於局部DQ線對1 8 b係於記億格陣列上,延長 於列方向。整體DQ線對1 8 a和局部DQ線對1 8 b係 經由開關相互連接。 資料匯流排1 3 a係配置於區庫1 1 一 〇和區庫1 1 一1間*延長於列方向,連接於資料輸出入電路1 2。同 樣地,資料匯流排1 3b係配置於區庫1 1 — 2和區庫 1 1 一 3間,延長於行方向,連接於資料輸出入電路1 2 。資料匯流排13a,13b係令32位元(4位元組) 之資料可傳送地加以構成。 各區庫內之佈局係與圖2 2之半導體記憶體之各區庫 內之佈局相同。 此晶片佈局係較圖1 0及圖2 2之晶片佈局,在於以 下之點上有所不同。 第1 ,令1個區庫(主區庫)自2個副區塊構成。 即’主區庫1 1 — 0係自副區庫1 1 一 〇 — #〇 , 1 1 — 0 — #1所構成’主區庫1 1 — 1係自副區庫1 1 -l-#0,1 1 — 1-#1所構成,主區庫1 1 — 2係 自副區庫1 1 一 2 — #〇 ,1 1 — 2 — #1所構成,主區 庫 1 1~3 係自副區庫 1 1 — 3-#〇,1 1 — 3-#1 所構成。 副區庫1 1— 0 — #〇 ,1 1 — 〇 — #1係經由區庫 本紙張尺度通用中賴家標準(CNS ) Λ4"Ιϋ( 2H)x297公缓)— ~t〇 - (請先閱讀背面之注意事項再填寫本頁)Bits (4 bits of DQ line pair 1 output 3 2 bits input and output range of 1 billion body (memory bit (4 bit data bus 1 selected one bank, 100 million grid of the entire DQ line In the following, there are the following decoder RD group), the capital 8 b, the metadata is 2, and it is from the chip) outside group)) 3, the input 3 2 bit pairs 1 8 and characteristics. When inputting (writing) the memory data, 32 data will be input / output range 1 2 through the data to the selected one bank. The data input to this selector is through the local DQ line 18 a sense amplifier SA, which is recorded in the memory grid. The chip layout of the above semiconductor memory is the first. The grid controller CAC and the original paper are suitable for China. Standard (CNS) 8.4 specifications (2 ΙΟ X 297 mm) A7 B7 printed by the consumer cooperation of the Central Bureau of Standards of the Ministry of Economic Affairs V. Invention description (43) Grid grid CAL, CAR is placed in the center, facing each other in the direction of travel At the end. In addition, the column decoders CD0 to CD3 and the DQ buffer DQ are the mega-array CAL and CAR, which are placed in the center and arranged opposite to each other in the column direction. That is, the grid array controller CAC 'row decoder RD, column decoder CD-0 ~ CD3, and DQ buffer DQ are all connected to one side of the memory grid array CAL, CAR. Therefore, it is possible to easily arrange and wire the components constituting the lattice array controller CAC, the row decoder RD, the column decoders CDO to CD3, and the DQ buffer DQ. Second, in the district library: set up a local DQ line pair 18a that extends in the row direction, and set an overall DQ line pair 18b that extends in the column direction, and the data is constructed from the input and output grounds in the column direction end of the library . That is, the DQ buffer DQ can be provided at the end in the column direction of the bank, so that the first feature described above can be realized. Moreover, as in this embodiment, when the number of bits to be input and output in a middle block of the memory cell array is 8 bits, the local DQ line pair 1 8 a arranged between the small blocks CAL and CAR is A 2-bit minute is provided on the CD 0 side of the column decoder, and similarly, only a 2-bit minute is provided on each of the column decoders C D 1 to CD 3 side. This series of decoders CD 〇 ~ CD 3 is adjacent to the memory grid array and is arranged in the row direction, and the output of the data is carried out at the end of the column direction of the bank. Therefore, the necessary range is reduced for the local DQ line pair 18a. The standard of this paper is applicable to the China Lai Family Standard (CNS format (2_297 Gongqing) _ ~ -private- ------- l · --- 1 clothing ------ order ------ ^ (Please read the precautions on the back before filling out this page) A7 B7 Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs V. Description of Invention (44) In addition, the overall DQ line 1 8b is in a middle block. When the 8-bit data is input and output, only the number of 32-bit data transmission is needed in the library of area 1. However, the overall DQ line pair 1 8 b is configured on the memory cell array CAL, CAR. The new setting configures the range of the overall DQ line pair 1 8 b. Third, the data bus 1 3 is located in the zone library 1 1 — 0, 1 1 — 2 and the zone library 11 — 1, 11 — 3, extending in the row direction Configuration. This is the reason that the DQ buffer DQ in the zone library is arranged in one of the two ends in the column direction. As a result, the design of the arrangement of the zone library and the data input and output circuits can reduce the data bus 1 3 The structured wiring can be narrowed to the range of the data bus 13 occupied by the memory chip 10. 2 2 is a schematic diagram showing the location of the bank of the semiconductor memory constituting the first embodiment of FIG. 10 and The location of the material bus. The range on the memory chip 10 is mainly occupied by the library 1 1 10 ~ 1 1 _3 and the data input and output range (I / O) 12. The data input and output range 1 2 is adjacent to the billion One of the four sides of chip 10, that is, one of the two sides adjacent to the column direction is arranged. The memory cell array in the bank is composed of a plurality of small blocks arranged in the column direction, and passes through two small blocks It constitutes a middle block. Within each small block, it is arranged in a character line extending in the row direction, and a data line and a column selection line extending in the column direction (the direction in which the small blocks are arranged). DQ line pair 18 Between 2 small blocks' extension in the row direction. The DQ line pair 18 between 2 small blocks can only transmit 4-bit data -η- This paper size is suitable for the Chinese National Standard (CNS) Λ4 of this paper. (210X 297 Gong) (Please read the precautions on the back before filling in this page) 1 " Order * Τ— n J— * 309657 A7 B7 5. Description of the invention (45 number data bus 1 3 series is arranged in the district library 1 1 — 〇, 1 1_1 and the district library 11 — 2 ′ 11 — 3, extending in the row direction. Data bus 1 3 The 16-bit (2-byte) data can be transmitted to be formed. 2 3 is the first modification of the semiconductor memory device shown in FIGS. 10 and 22. The characteristics of this modification are arranged on the memory chip 10 The two sides' each set area library 1 3 a, 1 3 b ° That is, the memory chip 1 makes the data input and output circuit (I / 0) 1 2 the central part, and the data input and output circuit 1 2 11-0 11 3 and the range on the data bus 0 are mainly occupied by the library 11-10 ~ 11-3 and the data input / output range (I / O) 12. Data 2 is placed in the central part of the 100 million chip 10, in the column (please read the precautions on the back and then fill out this page). The Ministry of Economic Affairs, Central Standard Falcon Bureau, employee cooperation, du printing, I / O range 1 direction change long. The structure within the library, and via, is arranged in the overall DQ direction of the extension line and the column selection line. In addition, the situation is in the column direction. Through the switch mutual data convergence memory array is composed of a plurality of small blocks arranged in the row direction 2 small blocks to form a middle block. The character lines in the row direction in each small block, and the data extending in the column direction. The line pair 1 8 a is between 2 small blocks' extended in the row side DQ line pair 1 8 b is in the billion grid array The upper extension DQ wire pair 18 a and the local DQ wire pair 18 b are connected. Row 1 3 a is configured in the district warehouse 1 1 10 and district warehouse 1 1 This paper standard is applicable to the Chinese hoarding standard (CNS) eight 4 clam (210X2SH male t)-you-A7 B7 employees of the Central Standardization Bureau of the Ministry of Economic Affairs Consumer cooperation it printed back 5. Description of the invention (46) 1-1 extended in the row direction t connected to the data input and output circuit 1 2 〇 The same 1 1 W, the data bus 1 3 b is located in the district library 1 1- 2 and the library 1 1 1 1-3 extended in the row direction »Connected to the data input and output circuit 1 2 1 1 I 〇 data bus 1 3 a I 1 3 b order 16 bits (2 bytes) Please read first 1 1 I data can be transmitted to form 0 read back and 1 \ jM 2 4 is shown in detail in the wafer layout of the semiconductor memory shown in Figure 2 1 Note 1 Bureau 1 Thinking 1 I Re 1 | Each The layout in the area library is the same as that of each ΤΓΓ m library in the semiconductor memory of Fig. 10. Same page 0 '«« wV 1 | \ β 2 5 shows the first modified example of the semiconductor memory of Figure 2 1 1 1 1 The characteristics of this modified example are the data input and output circuit (I / 0) 1 2 1 1 Order | Arranged in the central part of the memory chip 1 0 »and on both sides of the data input and output circuit 1 2 1 1 Set up the library 1 1 — 0 1 1 — 3 and the data bus 1 1 1 3 a 1 3 b 〇1 1 means the range on the memory chip 1 0 is mainly composed of the library 1 1 — 0 | 1 1 — 3 and the data input / output range (I / 0) 1 2 occupied 0 data 1 I input / output range 1 2 system configuration The central part of Yu Jiyi wafer 1 0 »Yu Lifang 1 1 I direction lengthening 〇1 1 Zone library 1 1 — 0 1 1 — 1 is arranged in the data input / output range 1 1 1 2 — Side zone library 1 1 One 2 1 1 — 3 is configured on the other side of the data output • 1 1 into the range 1 2 The grid array is composed of a plurality of small blocks 1 | arranged in the column direction, and 1 medium block is formed by 2 small blocks. 1 Within each small block 1 1 paper standard Tongzhou National Standard (CNS) Λ4 (210X 297 gongs) Cooperation with the Central Bureau of Standards of the Ministry of Economic Affairs, M Industry and Consumers, Du Yin crack A7 _ B7 V. Description of invention (47) 'Configured on the character line extended in the row direction, and the data line extended in the column direction and Column selection line. The overall D Q line pair 1 8 a is tied between 2 small blocks, extending in the row direction. In addition, the local DQ line pair 18 b is tied to the grid array and extends in the column direction. The overall DQ line pair 18 a and the local DQ line pair 18 b are connected to each other via a switch. The data bus 1 3 a is arranged between the zone library 1 1 -10 and the zone library 1 1-1 * extended in the column direction and connected to the data input / output circuit 12. In the same way, the data bus 13b is arranged between the bank 1 1-2 and the bank 1 1-3, extending in the row direction, and connected to the data input / output circuit 1 2. The data bus 13a, 13b is composed of 32-bit (4-byte) data that can be transmitted. The layout in each bank is the same as the layout in each bank of the semiconductor memory of FIG. 22. This chip layout is different from the chip layouts of Fig. 10 and Fig. 2 in the following points. First, make one district library (main district library) composed of two sub-blocks. That is, the 'main zone library 1 1 — 0 is composed of the sub-zone library 1 1 — 10 — # 〇, 1 1 — 0 — # 1 constitutes the' main zone library 1 1 — 1 is composed of the sub-zone library 1 1 -l- # 0, 1 1 — 1- # 1, the main zone library 1 1 — 2 is composed of the secondary zone library 1 1 2 — # 〇, 1 1 — 2 — # 1, the main zone library 1 1 ~ 3 system It is composed of the sub-zone library 1 1 — 3- # 〇, 1 1 — 3- # 1. The sub-zone library 1 1 — 0 — # 〇, 1 1 — 〇 — # 1 is the standard of the Laijia standard (CNS) Λ4 " Ιϋ (2H) x297 public slow through the zone library paper standard-~ t〇- (please (Read the notes on the back before filling this page)
J -*δ 309657 Λ7 B7 五、發明説明(48) 選擇電路,同 # 1被 區庫1 之區庫 —0 — 經濟部中央標隼局Μ工消f合作杜印製 例如副 ,殘留 又 # 1, 群之區 副區庫 #0 , 資料匯 第 資料輸 副 器C D 1個副 c D係 半導體 區塊B 資料之 副 R D、 D Q緩 之佈局 第 時加以選擇。副區庫1 1 — 0 — #0,1 1 選擇之時,殘留之區庫則不選擇》同樣地, 1 — i— #〇,11 — 1 — #1被選擇之時 則不選 擇》 經由4個副區庫1 1 0*11 庫係連接於資料匯流排 0*11 1構成1個群,此群之區庫係連接於 -0-#0' 11-0-—1 — #1構成1個群,此 13a。同樣地,經由4個 -2-#l , 11-3- 1 1 - 3 - # 流排1 2,於 出入地 區庫之 則在於 區庫中 存在一 記憶體 La , 输出入 區庫內 局部D 衝器D 幾近相3 ,資 3 b。 1個副 構成。 佈局係 只有1 ,爲進 個即可 同樣地 B L b 區庫中’進行8位元(1位元組)之 與圖1 0 個爲其不 行8位元 。但是, ,選擇2 ,B L c 之記億格陣列C Q線對1 8 a Q之佈局係與圖 同。 料輸出入電路( 之區庫佈局比較時,列解碼 同之處。因爲,本例時,於 之資料之輸出,列解碼器 列解碼器CD係與圖1〇之 個列,於記憶格陣列之各中 ,BLd中’執行2位元之 AL、CAR、列解碼器 整體DQ線對1 8 b及 1 0之半導體記憶體區庫內 / Ο (請先閱讀背面之注意事項再填寫本頁) -¾ 本紙浪尺度適;兩圏家 2係於記億晶片 - - r ^ 經濟部中央標準局員工消费合作社印t A7 B7 五、發明説明(49 ) 1 0之中央部,向列方向延長地加以配置,資料匯流排 I 3 a係於資料輸出入電路1 2之一側,共通設於副區庫 II — 0 — #0 ' 1 1 - 0 - # 1,1 1 - 1 - # 0 ’ 1 1 — 1 — # 1之群中資料匯流排1 3 b係於資料輸出入 電路12之另一側,共通設於副區庫1 1 — 2 — #0 , 11-2-#1,11-3-#1,11-3_#0。 資料匯流排1 3 a、1 3 b係於各副區庫間,向列方 向延長,連接於記憶晶片1 0之中央部資料输出入電路 12。資料匯流排13a、13b 係可各傳送16位元 之資料地加以構成, 於如此之晶片佈局之半導體記憶體中,例如選擇副區 庫 1 1 -〇-#〇,1 1 — 〇-#1 時,於副區庫 1 Ι Ο— #0 和資料輸出入電路 1 2 間 ,經由資料匯流排 1 3· a ’進行8位元資料之收受,同樣地於副區庫1 1 一 〇 - # 1和資料输出入電路1 2間,經由資料匯流排1 3 a , 進行8位元資料之收受。 ^圖2 8係顯示圖2 1之第2實施例之半導體記憶體之 晶片之第2變形例。 此晶片佈局係較圖2 1之晶片佈局,在於以下之點上 有所不同。 第1 ’令1個區庫(主區庫)自2個副區塊構成。 即,主區庫1 1 — 〇係自副區庫〗1 _ 〇 一 # 〇 , 1 1 一 0_#1所構成,主區庫1 1 — 1係自副區庫1 1 —1— #0,1 1 — 1-#1所構成,主區庫1 1-2係 本紙張尺度適用中國國家標準(CNS ) Λ4現格(210Χ 297公楚) (請先閱讀背面之注意事項再填寫本頁) .1 訂 經濟部中央標条.灼Η工消费合作杜印聚 A7 B7 五、發明説明(5〇 ) 自副區庫1 1 — 2 — #〇,1 1 一 2-#1所構成,主區 庫 1 1 — 3 係自副區庫 1 1 — 3-#0,1 1 — 3 — #1 所構成。 副區庫1 1— 0 一 #〇 ’ 1 1-0 — #1係經由區庫 選擇電路,同時加以選擇。副區庫1 1 — 0 — #〇,1 1 —0 — # 1被選擇之時’殘留之區庫則不選擇。同樣地, 例如副區庫1 1 — 1_#〇 ’ 1 1 — 1_#1被選擇之時 ,殘留之區庫則不選擇。 又,經由4個副區庫1 1 — 0 — #0,1 1 — 0 — #1 ,11 — 1— #0 ’ 11 — 1-#1 構成 1 個群,此 群之區庫係連接於資料匯流排1 3 a。同樣地,經由4個 副區庫 11 — 2 — #〇,11-2 — #1 ,11 — 3 — # 0,1 1一3 - #1構成1個群,此群之區庫係連接於資 料匯流排1 3 b。 第2 ,於1個副區庫中,進行16位元(2位元組) 之資料輸出入地構成》 副區庫之佈局係與圖2 1之區庫佈局比較時,列解碼 器 C D則在於只有1個爲其不同之處。即,副區庫之佈 局係與圖10之佈局相同。 因爲,本例時,於1個副區庫中,爲進行8位元之資 料之輸出,列解碼器C D係存在一個即可。但是,列解碼 器CD係與圖2 1之半導體記憶體同樣地,選擇2個列, 於記億格陣列之各中區塊BLa ,BLb ,BLc , B L d中,執行4位元之資料之輸出入。 本紙乐尺度適用中國國家標準(CNS ) Λ4规格(210Χ 297公雄) - - - ·:Γ- —^1 — I- I ! I 一 - - -I I (请先閱讀背面之注意事項真填寫本莧) 訂 - [’3 - A7 __ B7 五、發明説明(51 ) 副區庫內之記億格陣列c A L、C A R、列解碼器 RD'局部DQ 線對18a、整體DQ線對18b及 D Q緩衝器D Q之佈局係與圖1 0之半導體記億體區庫內 之佈局幾近相同。 第3 ,資料輸出入電路(I/O) 12係於記億晶片 1 0之中央部,向列方向延長地加以配置,資料匯流排 1 3 a係於資料輸出入電路1 2之一側,共通設於副區庫 11-〇-#〇 . 11-0-#1 > 11-1-#〇 > 1 1 — 1 一 # 1之群中資料匯流排1 3 b係於資料輸出入 電路1 2之另一側,共通設於副區庫1 1 — 2 - #0, 11一2-#1,11-3-#0,11-3-#1。 資料匯流排1 3 a、1 3 b係於各副區庫間,向列方 向延長’連接於記億晶片1〇之中央部資料輸出入電路 1 2。資料匯流排1 3 a、1 3b係可各傳送3 2位元 之資料地加以構成。 經濟部中央標隼局員工消費合作社印製 於如此之晶片佈局之半導體記憶體中,例如選擇副區 庫 1 1-0 — #〇 ’ 1 1-0 — #1 時,於副區庫 1 Ιο - # 0 和資料輸出入電路 1 2 間 ,經由資料匯流排 1 3 a ,進行8位元資料之收受,同樣地於副區庫1 1 一 0_# 1和資料輸出入電路1 2間,經由資料匯流排1 3 a ,進行16位元資料之收受》 2 8係顯示圖1 0及圖2 2之第1實施例之半導體 記億體之晶片之第3變形例》圖3 0係詳細顯示圖2 9之 半導體記憶體之晶片佈局。 -tii - I : nn —^n n .n ^ (請先閱讀背面之注意事項再填寫本1) 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210><297公康) A7 B7 308657 五、發明説明(52 ) 此晶片佈局係較圖1 0及圖2 2之晶片佈局’在於以 下之點上有所不同。 HI ' I _ - « I - -I - - - ··1-nf I (請先閱讀背面之注意事項再填寫本頁) 第1 ,令1個區庫(主區庫)自2個副區塊構成。 即,主區庫1 1 — 0係自副區庫1 1 一 〇一#〇, 1 1 — 〇 — #1所構成,主區庫1 1 — 1係自副區庫1 1 —1 — #0,1 1 一 1-#1所構成’主區庫11 一 2係 自副區庫1 1 — 2 — #0 , 1 1 一 所構成,主區 庫 1 1 一 3 係自副區庫 1 1 一 3 一 ,1 1 一 3 — #1 所構成。 副區庫1 1 一 〇 -#〇 ’ 1 1 一0 一#1係經由區庫 選擇電路,同時加以選擇。副區庫1丨―〇 — #0,1 1 —0 — # 1被選擇之時,殘留之區庫則不選擇。同樣地’ 例如副區庫1 1-1— #〇,1 1一1_#1被選擇之時 ,殘留之區庫則不選擇。 經濟部中央標孪局®:工消f合作杜印製 又,經由4個副區庫1 1 — 0 — #〇,1工一1 — #0,11-2 — #0,11 — 3 — #1 構成 1 個群’此 群之區庫係經由資料匯流排13a、13 b,連接於資 料輸出入電路1 2 a。同樣地,經由4個副區庫1 1 — 〇 -# 1,1 1 - 1 - # 1,1 1 - 2 - # 1 ’ 11-3-# 1構成1個群,此群之區庫係經由資料匯流排1 3 C 、 1 3 d,連接於資料输出入電路1 2 b。 \y第2,於1個副區庫中,進行8位元(1位元組)之 資料輸出入地構成。 副區庫之佈局係與圖1 0之區庫佈局比較時,列解碼 本紙張尺度適用中國國家標隼(CNS ) Λ4坭格(210X297公鼇) 經濟部中央標隼局資工消#合作社印裝 A7 ________B7__ 五、發明説明(53 ) 器c D則在於只有1個爲其不同之處。因爲,本例時,於 1個副區庫中,爲進行8位元之資料之輸出,列解碼器 CD係存在一個即可。但是,列解碼器CD係與圖2 1之 半導體記億體同樣地,選擇2個列,於記億格陣列之各中 區塊BLa ,BLb,BLc ,BLd中,執行2位元之 資料之輸出入。 副區庫內之記億格陣列C A L、C A R、列解碼器 RD、局部DQ線對18a、整體DQ線對18b及 DQ緩衝器DQ之佈局係與圖1 〇之半導體記憶體區庫內 之佈局幾近相同。 第3,資料輸出入電路(I/O) 12a ' 12b係 於記憶晶片1 0上,向列方向延長地加以配置,資料匯流 排13a、13b係設於資料輸出入電路12a之兩側, 資料匯流排1 3 c、1 3 d係設於資料輸出入電路1 2 b 之兩側 資料匯流排1 3 a係共通設於副區庫1 1一0〜#〇 ’ 11 — 1 — #0,11一1一#0。資料匯流排 13b 係共通設於副區庫1 1 — 2 — #0,1 1 — 3 — #〇 ,資 料匯流排1 3 c係共通設於副區庫1 1 — 〇 — # 1 ,1 1 —1 — # 1 ,資料匯流排1 3 d係共通設於副區庫1 1 _ 2_#1,11-3-#1。 資料匯流排1 3 a 、1 3 b係於各副區庫間,向列方 向延長,連接於資料輸出入電路1 2 a ,同樣地,資料匯 流排1 3 c 、1 3 d係於各副區庫間,向行方向延長,連 本紙張尺度適用中國國家標华(CNS ) Λ4^格(21()Χ297公釐) 7/ ~~- ^^^1 111 I m^i ........I in —^n 一 V (請先閲讀背面之注意事項再填艿本頁) A7 __B7_ 五、發明説明(54 ) 接於資料輸出入電路12b,資料匯流排13a〜13d 係可各傳送8位元之資料地加以構成。。 於如此之晶片佈局之半導體記憶體中,例如選擇副區 庫 1 1-0 — #0 ’ 1 時,於副區庫 1 Ι ο—# 0 和資料輸出入電路 1 2 a 間 ,經 由資料匯流排 1 3 a ,進行8位元資料之收受,副區庫1 1 — 〇 — 和資料输出入電路1 2 b間,經由資料匯流排1 3 c,進 行8位元資料之收受。 即’於1 6位元型之半導體記憶體中,資料匯流排 1 3 a〜1 3 d係經由可傳送8位元之資料數之配線加 以構成即可’可令記憶晶片上之資料匯流排之範圍變小。 圖3 1係顯示圖2 1之第2實施例之半導體記億體之 晶片之第3變形例。圖3 0係詳細顯示圖2 9之半導體記 憶體之晶片佈局。 此晶片佈局係較圖2 1之晶片佈局,在於以下之點上 有所不同。 第1 ’令1個區庫(主區庫)自2個副區塊構成。 經濟部中央標準局Μ工消费合作社印掣 I - —i. i i 1 n^p j--I I - ! I (請先閱讀背面之注意事項再填寫本頁) 即’主區庫1 1一0係自副區庫1 , 1 1 — 0 — #1所構成’主區庫1 1 — 1係自副區庫1 1 —1— #〇,11_1_#1所構成,主區庫工工—乞係 自副區庫1 1 — 2 - #〇,;[ 1_2_#1所構成,主區 庫1 1 — 3係自副區庫1 i — 3 — #〇 , 1 1 所構成。 副區庫1 1 — 〇_#〇 ’ 1 1 — 〇_#1係經由區庫 本紙張尺度適用中國國家標窣(CNS ) Λ4規格 (2丨0χ247公緣) 勺 A7 B7 3〇9657 五、發明説明(55 ) 選擇電路,同時加以選擇》副區庫1 1 — 0 — #〇 ,1 1 _ 0 _# 1被選擇之時,殘留之區庫則不選擇。同樣地, 例如副區庫1 1 一 1 一 #〇,;[ 被選擇之時 ,殘留之區庫則不選擇β 又,經由4個副區庫1 1 — 〇 — #〇,1 1_1_ #0,11 — 2 — #0 , 11 — 3_#〇 構成工個群,此 群之區庫係經由資料匯流排l3a、13 b,連接於資 料輸出入電路1 2 a。同樣地,經由4個副區庫1 1 — 〇 -#1 ’ 11一1-#1,11-2-#1,11-3-# 1構成1個群,此群之區庫係經由資料匯流排1 3 c 、 13d,連接於資料輸出入電路12 b。 第2 ’於1個副區庫中,進行1 6位元(2位元組) 之資料輸出入地構成。 副區庫之佈局係與圖2 1之區庫佈局比較時,列解碼 器 CD則爲2個爲其不同之處。即,副區庫之佈局係與 圖10之區庫佈局相同。 因爲,本例時,於1個副區庫中,爲進行1 6位元;^ 資料之輸出,列解碼器C D係存在二個即可。但是,列解 碼器 CD係與圖21之半導體記憶體同樣地,選擇2個 列’於記億格陣列之各中區塊BLa, B L b - B L c ,B L d中,執行4位元之資料之輸出入· 副區庫內之記億格陣列C A L、C A R、列解碼器 RD、局部DQ線對1 8a、整體DQ線對1 8b及DQ 緩衝器DQ之佈局係與圖1 〇之半導體記億體區庫內之佈 (請先閱讀背面之注意事項再填舄本頁) 装- 、-· 鲤濟部中央橾準局員工消t合作社印製 本紙張尺度適用中國國家標準(CNS ) Λ4現格(2丨0X 297公釐〉 A7 B7 309657 五、發明説明(5δ ) 局幾近相同。 (請先閱讀背面之注意事項再填寫本頁) 第3 ,資料輸出入電路(I/O) 12a 、12b係 於記億晶片1 0上,向列方向延長地加以配置,資料匯流 排13 a、13b係設於資料输出入電路12 a之兩側 ,資料匯流排1 3 c 、1 3 d係設於資料輸出入電路 1 2 b之兩側》 \^料匯流排1 3 a係共通設於副區庫1 1 — 〇 — #〇 ,1 1一1— #0。資料匯流排1 3b係共通設於副區庫 11-2 - #0,11 — 3 — #0,資料匯流排 13c 係 共通設於副區庫11 — 0 - #1 ,11 — 1 一 #1 ,資料 匯流排1 3d係共通設於副區庫11 — 2 — #1,11一 3 - # 1。 資料匯流排1 3 a、1 3 b係於各副區庫間,向列方 向延長,連接於資料输出入電路1 2 a ,同樣地,資料匯 流排1 3 c 、1 3 d係於各副區庫間,向行方向延長,連 接於資料輸出入電路1 2b,資料匯流排1 3 a〜1 3 d 係可各傳送16位元之資料地加以構成。。 經濟部中央標準局0'工消费合作社印^ 於如此之晶片佈局之半導體記憶體中,例如選擇副區 庫 1 1-0 — #0 ,1 1— 〇-#1 時,於副區庫 1 1 一 0 - #0和資料輸出入電路1 2 a間,經由資料匯流排 13a ,進行16位元資料之收受,副區庫11 — 〇 — # 1和資料輸出入電路1 2 b間,經由資料匯流排1 3 c ,進行16位元資料之收受。 即’於3 2位元型之半導體記憶體中,資料匯流排 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公犛) A7 B7 五、發明説明(57 ) 13 a〜13d 係經由可傅送16位元之資料數之配線 加以構成即可,可令記億晶片上之資料匯流排之範圍變小 〇 3 2係顯示圖1 〇及圖2 2之第1實施例之半導體 記憶體之晶片之第4變形例。圖3 3係詳細顯示圖3 2之 半導體記憶體之晶片佈局。 此晶片佈局係較圖1 〇及圖2 2之晶片佈局,在於以 下之點上有所不同。 第1 ’令1個區庫(主區庫)自2個副區塊構成。 即’主區庫1 1 — 0係自副區庫1 1-0 — #0 , 1 1 — 0 — #1所構成,主區庫1 1 — 1係自副區庫1 1 —1— #0,11-1 一 #1所構成,主區庫11 一 2係 自副區庫1 1-2 — #0,1 1 一 2-#1所構成,主區 庫 1 1 — 3 係自副區庫 1 1 — 3 — #0,1 1 — 3 — #1 所構成。 副區庫1 1 — 〇 — #〇,1 1 — 〇-#1係經由區庫 選擇電路,同時加以選擇。副區庫1 1 — 〇 — #〇,1 1 _ 0 — # 1被選擇之時,殘留之區庫則不選擇。同樣地, 例如副區庫1 1-1— #〇,1 1 一 1— #1被選擇之時 ,殘留之區庫則不選擇》 又’經由4個副區庫1 1-0 — #〇,11 — 1一 #0 ’ 11 — 2 — #0,11 — 3 - #0 構成 1 個群,此 群之區庫係經由資料匯流排1 3 a ,連接於資料輸出入電 路12 »同樣地,經由4個副區庫1 1 一 〇 — #1 ,1 1 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) ------:---^衣 — I (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部中央標準局員工消費合作社印聚 經濟部中央標準局Μ工消费合作社印繁 A7 ________ B7 五、發明説明(58 ) 一 1一#1 ,11 — 2 - #1 , 11 — 3_#1 構成 1 個 群’此群之區庫係經由資料匯流排1 3 b,連接於資料输 出入電路1 2。 ' 第2 ’於1個副區庫中,進行8位元(1位元組)之 資料輸出入地構成。 副區庫之佈局係與圖1 〇之區庫佈局比較時,列解碼 器CD則僅爲1個爲其不同之處。因爲,本例時,於1個 副區庫中’爲進行8位元之資料之輸出,列解碼器CD係 存在一個即可。但是,列解碼器CD係與圖1 0之半導體 記億體同樣地,選擇2個列,於記億格陣列之各中區塊 BLa ’BLb,BLc ,BLd中,執行2位元之資料 之輸出入" 副區庫內之記億格陣列C A L、C A R、列解碼器 RD、局部DQ 線對18a、整體DQ線對18b及 D Q緩衝器D Q之佈局係與圖1 〇之半導體記憶體區庫內 之佈局幾近相同》 第3,資料輸出入電路(I/O) 12係於記億晶片 1 0上,向列方向延長地加以配置,資料匯流排1 3 a 、 1 3 b係設於資料輸出入電路1 2之兩側。 資料匯流排1 3a係共通設於副區庫1 1 — 0 - #0 ,1 1 — 1 — # 0 * 11 — 2 — #0,11 — 3 — #0。 資料匯流排1 3 b係共通設於副區庫1 1 - # 1 , ,11一2 — #1,11-3-#1。 資料匯流排1 3 a 、1 3 b係於各副區庫間’向列方 -n - I - I - I J Ά — I ---I I 丁 —·4 ,-° (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) -έ/ - 309657 五、發明説明(59 ) 向延長,連接於資料輸出入電路1 2。資料匯流排1 3 a 、13b係可各傳送8位元之資料地加以構成。。 於如此之晶片佈局之半導體記憶體中,例如選擇副區 庫 1 1-0-#0,1 1-0 — #1 時,於副區庫 1 ίο— #0 和資料輸出入電路 1 2 間 ,經 由資料匯流排 13a ,進行8位元資料之收受,副區庫11-0 — #1 和資料輸出入電路1 2間,經由資料匯流排1 3 b,進行 8位元資料之收受。 即,’於1 6位元型之半導體記憶體中,資料匯流排 13a、13b 係經由可傅送8位元之資料數之配線加 以構成即可,可令記億晶片上之資料匯流排之範圍變小。 >3 4係顯示圖2 1之第2實施例之半導體記憶體之 晶片之第4變形例。圖3 0係詳細顯示圖2 9之半導體記 億體之晶片佈局。 晶片佈局係較圖2 1之晶片佈局,在於以下之點上 有所不同。 第1 ’令1個區庫(主區庫)自2個副區塊構成。 經濟部中央標準局員工消費合作社印裝 (請先閱讀背面之注意事項再填寫本頁) 良P’主區庫1 1 — 〇係自副區庫1 1-0 — #〇 , 1 1 — 0 — #1所構成,主區庫1 1_1係自副區庫1 1 一 1—#〇,11一1 一 #1所構成,主區庫11_2係 自副區庫1 1 — 2-#0 , 1 1 — 2 — #1所構成,主區 庫 1 1 — 3 係自副區庫 1 1 一 3 - #〇,1 1一3-#1 所構成。 副遥庫1 1 — 〇 — #〇 , 1 1 — 〇 一 #1係經由區庫 本紙張尺度適用中國國家標辛(CNS ) Λ4現格(210X297公釐) -- 309657 at __B7__ 五、發明説明(6〇 ) 選擇電路,同時加以選擇。副區庫1 1 — 〇 一 #〇,1 1 —0 — # 1被選擇之時,殘留之區庫則不選擇。同樣地, 例如副區庫1 1—·1 一 #0,1 1 一 1— #1被選擇之時 ,殘留之區庫則不選擇。 又,經由4個副區庫11—0—#0,11一1一 #0,11-2-#0,11 — 3 — #0 構成 1 個群,此 群之區庫係經由資料匯流排1 3 a ,連接於資料输出入電 路1 2。同樣地,經由4個副區庫1 1一0_#1 ,1 1 —1— #1 ,11 — 2 — #1 ,11 — 3_#1 構成 1 個 群,此群之區庫係經由資料匯流排1 3 b,連接於資料輸 出入電路1 2。 第2,於1個副區庫中,進行16位元(2位元組) 之資料輸出入地構成。 副區庫之佈局係與圖2 1之區庫佈局比較時,列解碼 器CD則爲2個爲其不同之處。即,副區庫之佈局係與圖 10之區庫佈局相同。 因爲,本例時,於1個副區庫中,爲進行1 6位元之 (請先閱讀背面之注意事項再填寫本I) 訂 f 經濟部中央橾準局員工消f合作杜印製 可地 即樣 個同 二體 在億 存記 係體 D 導 C 半 器之 碼 1 解 2 列圖 ’ 與 出係 输D 之 C 料器 資碼J-* δ 309657 Λ7 B7 V. Description of the invention (48) The selection circuit, in cooperation with # 1 by the district bank of the district bank 1 — 0 — the Central Standard Falconry Bureau of the Ministry of Economic Affairs Μ 工 消 f cooperation du printing such as deputy, residual and # 1. The group sub-region library # 0, the data sink, the data input sub-device CD, one sub-c, and the sub-RD, DQ of the semiconductor block B data are selected at the time of the layout. Sub-zone library 1 1 — 0 — # 0, 1 1 When selected, the remaining zone library is not selected》 Similarly, 1 — i— # 〇, 11 — 1 — # 1 is selected when it is selected》 Via 4 sub-zone libraries 1 1 0 * 11 The library system is connected to the data bus 0 * 11 1 to form a group, and the group library system of this group is connected to -0- # 0 '11-0--1 — # 1 composition 1 group, this 13a. Similarly, through 4-2- # l, 11-3- 1 1-3-# stream row 1 2, when entering and leaving the regional library, there is a memory La in the regional library, which is exported to the local D in the regional library Punch D is almost the same as 3, with a capital of 3b. 1 sub-composition. The layout system has only one, and it can be entered in the same way. In the B L b area library, 8-bit (1-byte) is performed, which is not 8-bit as shown in Figure 10. However, select 2, and the layout of the C Q line pair 1 8 a Q of the B L c in memory grid array is the same as the figure. When comparing the layout of the data input and output circuits, the column decoding is the same. Because, in this example, the output of the data, the column decoder, the column decoder CD and the row in Figure 10 are in the memory grid array. In each of the BLd's, the 2-bit AL, CAR, column decoder overall DQ line pair 1 8 b and 1 0 in the semiconductor memory area library / Ο (please read the precautions on the back before filling this page ) -¾ The size of the paper is suitable; the two families of the 2nd family are on the 100 million chip--r ^ Printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs t A7 B7 V. Description of the invention (49) 10 The central part of the 10, extending in the direction of the column The data bus I 3 a is located on one side of the data input / output circuit 1 2 and is commonly located in the secondary area library II — 0 — # 0 '1 1-0-# 1, 1 1-1-# 0 '1 1 — 1 — # 1 group of data bus 1 3 b is on the other side of the data input and output circuit 12 and is commonly set in the sub-zone library 1 1 — 2 — # 0, 11-2- # 1, 11-3- # 1, 11-3_ # 0. The data bus 1 3 a, 1 3 b is located between the sub-zones and extends in the direction of the column. It is connected to the central part of the memory chip 10 and the data input / output circuit 12 . The bus bars 13a and 13b can be configured to transmit 16-bit data each. In the semiconductor memory of such a chip layout, for example, the sub-zone library 1 1 -〇- # 〇, 1 1 — 〇- # 1 At the time, between the sub-zone library 1 Ι Ο — # 0 and the data output and input circuit 12 through the data bus 1 3 · a '8-bit data reception, similarly in the sub-zone library 1 1 1 〇- # 1 and data input and output circuit 12 through the data bus 1 3 a, 8-bit data reception. ^ Figure 2 8 shows the second modification of the semiconductor memory chip of the second embodiment of Figure 21 Example. This chip layout is different from the chip layout of Figure 21 in the following points. The first 1 'makes 1 zone library (main zone library) composed of 2 sub-blocks. That is, the main zone library 1 1 — 〇 is from the sub-zone library〗 1 _ 〇 一 # 〇, 1 1 1 0_ # 1, the main zone library 1 1-1 is from the sub zone library 1 1 — 1 — # 0, 1 1 — 1- # 1 is composed of the main zone library 1 1-2 series. The paper size is applicable to the Chinese National Standard (CNS) Λ4 present grid (210Χ 297 Gong Chu) (please read the precautions on the back before filling this page). 1 order The central banner of the Ministry of Economic Affairs. The cooperation of industrial and consumer cooperation Du Yinju A7 B7 5. Description of the invention (5〇) From the sub-district library 1 1 — 2 — # 〇, 1 1 1- 2- # 1, the main district library 1 1 — 3 is composed of the sub-zone library 1 1 — 3- # 0, 1 1 — 3 — # 1. Sub-zone library 1 1 — 0 one # 〇 ′ 1 1-0 — # 1 is selected through the zone library selection circuit at the same time. Sub-zone library 1 1 — 0 — # 〇, 1 1 — 0 — # 1 When selected, the remaining zone library is not selected. Similarly, for example, when the sub-zone library 1 1 — 1_ # 〇 '1 1 — 1_ # 1 is selected, the remaining zone library is not selected. In addition, via 4 sub-zone libraries 1 1 — 0 — # 0, 1 1 — 0 — # 1, 11 — 1 — # 0 '11 — 1- # 1 form a group, and the zone library of this group is connected to Data bus 1 3 a. Similarly, via 4 sub-regional libraries 11 — 2 — # 〇, 11-2 — # 1, 11 — 3 — # 0, 1 1—3-# 1 form a group, and the group library of this group is connected to Data bus 1 3 b. Second, in a sub-zone library, the 16-bit (2-byte) data input and output structure is composed. When the layout of the sub-zone library is compared with the layout of the zone library in Figure 21, the column decoder CD Only one is the difference. That is, the layout of the sub-zone library is the same as the layout of FIG. This is because, in this example, there is only one column decoder CD in order to output 8-bit data in a secondary bank. However, the column decoder CD is the same as the semiconductor memory of FIG. 21, selects two columns, and executes 4-bit data in each block BLa, BLb, BLc, BL d Import and export. The standard of this paper is applicable to the Chinese National Standard (CNS) Λ4 specification (210Χ 297 male)---·: Γ- — ^ 1 — I- I! I one---II (please read the precautions on the back and fill in this amaranth first ) Order-['3-A7 __ B7 V. Description of the invention (51) Billion grid array c AL, CAR, column decoder RD' local DQ line pair 18a, overall DQ line pair 18b and DQ buffer The layout of the device DQ is almost the same as the layout in the semiconductor memory bank of Figure 10. Third, the data input / output circuit (I / O) 12 is located in the central part of the 100 million chip 10 and is arranged to extend in the column direction. The data bus 1 3 a is on the side of the data input / output circuit 12. Commonly located in the sub-zone library 11-〇- # 〇. 11-0- # 1 & 11-1- # 〇 > 1 1 — 1 1 # 1 in the group data bus 1 3 b is in the data input and output The other side of the circuit 1 2 is commonly set in the sub-zone library 1 1-2-# 0, 11-2- # 1, 11-3- # 0, 11-3- # 1. The data buses 1 3 a and 1 3 b are located between the sub-zones, and are extended in the column direction to the data input / output circuit 12 in the central part of the billion chip 10. The data buses 1 3 a and 1 3 b are composed of data that can transmit 32 bits each. The Ministry of Economic Affairs Central Standard Falcon Bureau Employee Consumer Cooperative is printed in the semiconductor memory of such a wafer layout, for example, when selecting the sub-zone library 1 1-0 — # 〇 '1 1-0 — # 1, in the sub-zone library 1 Ιο -Between # 0 and the data input and output circuit 12 through the data bus 1 3 a, 8-bit data is received and received in the same way in the secondary area library 1 1 1 0_ # 1 and the data output and input circuit 12 between Data bus 1 3 a, receiving 16-bit data》 2 8 shows the first modification of the semiconductor memory chip of the first embodiment shown in FIGS. 10 and 22 2》 FIG. 30 shows in detail Figure 29 shows the chip layout of the semiconductor memory. -tii-I: nn — ^ nn .n ^ (Please read the precautions on the back before filling in this 1) This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (210 > < 297 public health) A7 B7 308657 V. DESCRIPTION OF THE INVENTION (52) This chip layout is different from the chip layouts of FIGS. 10 and 22 in the following points. HI 'I _-«I--I---· 1-nf I (please read the precautions on the back before filling out this page) Article 1, make 1 district library (main district library) from 2 subsidiary districts Block composition. That is, the main zone library 1 1-0 is composed of the sub-zone library 1 1 1 〇 一 # 〇, 1 1 — 〇 — # 1, the main zone library 1 1-1 is from the sub-zone library 1 1 — 1 — # 0, 1 1 1- # 1 constitutes the 'main area library 11 1 2 series from the secondary area library 1 1 — 2 — # 0, 1 1 constitutes the primary area library 1 1 3 from the secondary area library 1 1 one 3 one, 1 1 one 3 — # 1. The sub-zone library 1 1-0-# 〇 '1 1-0-# 1 is selected through the zone library selection circuit at the same time. Sub-zone library 1 丨 ―〇 — # 0,1 1 —0 — # 1When selected, the remaining zone library is not selected. Similarly, for example, when the sub-zone library 1 1-1 — # 〇, 1 1 — 1_ # 1 is selected, the remaining zone library is not selected. The Ministry of Economic Affairs Central Standardization Bureau®: Cooperative Du Printing Co., Ltd. Printed again, through 4 sub-district libraries 1 1 — 0 — # 〇, 1 Gongyi 1 — # 0, 11-2 — # 0, 11 — 3 — # 1 Make up a group 'The district library is connected to the data input / output circuit 12a through the data bus 13a, 13b. Similarly, through 4 sub-regional libraries 1 1 — 〇- # 1, 1 1-1-# 1, 1 1-2-# 1 '11-3- # 1 constitute a group, the group of this group It is connected to the data input / output circuit 1 2 b through the data bus 1 3 C and 1 3 d. \ ySecond, 8-bit (1-byte) data input and output are formed in a sub-region library. The layout of the sub-regional library is compared with the layout of the regional library in Figure 10, and the paper size of the decoded code is applicable to the Chinese National Standard Falcon (CNS) Λ4 尭 格 (210X297 鳌). Install A7 ________B7__ V. Description of the invention (53) The device c D is that only one is its difference. This is because, in this example, there is only one column decoder CD to output 8-bit data in a sub-region library. However, the column decoder CD selects two columns in the same way as the semiconductor memory of FIG. 21, and executes 2-bit data in each of the blocks BLa, BLb, BLc, and BLd in the memory grid array. Import and export. The layout of the memory grid array CAL, CAR, column decoder RD, local DQ line pair 18a, overall DQ line pair 18b and DQ buffer DQ in the sub-region library is the same as the layout in the semiconductor memory region library of FIG. 10 It's almost the same. Third, the data input / output circuit (I / O) 12a '12b is arranged on the memory chip 10 and is extended in the column direction. The data bus 13a, 13b is provided on both sides of the data input / output circuit 12a. The bus bars 1 3 c, 1 3 d are provided on both sides of the data input / output circuit 1 2 b. The data bus bars 1 3 a are commonly provided in the sub-zone library 1 1 1 0 ~ # 〇 '11 — 1 — # 0, 11 一 1 一 # 0. The data bus 13b is commonly located in the sub-district 1 1 — 2 — # 0, 1 1 — 3 — # 〇, the data bus 1 3 c is commonly located in the sub-division 1 1 — 〇 — # 1, 1 1 —1 — # 1, the data bus 1 3 d is set in the sub-zone library 1 1 _ 2_ # 1, 11-3- # 1. The data bus 1 3 a and 1 3 b are connected between the sub-zones, extending in the column direction, and connected to the data input and output circuit 1 2 a. Similarly, the data bus 1 3 c and 1 3 d are connected to each sub Between the warehouses, the direction of the row is extended, and even the size of this paper is applicable to China National Standard (CNS) Λ4 ^ 格 (21 () Χ297mm) 7 / ~~-^^^ 1 111 I m ^ i .... .... I in — ^ n one V (please read the precautions on the back before filling in this page) A7 __B7_ 5. Description of the invention (54) Connected to the data input / output circuit 12b, the data bus 13a ~ 13d can be Each 8-bit data is transmitted. . In the semiconductor memory with such a chip layout, for example, when the sub-zone library 1 1-0 — # 0 '1 is selected, between the sub-zone library 1 Ι ο — # 0 and the data output and input circuit 1 2 a, via the data bus Row 1 3 a is for receiving 8-bit data, the sub-zone library 1 1 — 〇— and the data output and input circuit 1 2 b, through the data bus 1 3 c for 8-bit data receiving. That is, in a 16-bit semiconductor memory, the data bus 1 3 a ~ 1 3 d can be constructed by wiring that can transmit 8-bit data. The data bus on the memory chip can be made The range becomes smaller. Fig. 3 1 shows a third modification of the semiconductor billion wafer of the second embodiment of Fig. 2 1. Fig. 30 shows the chip layout of the semiconductor memory of Fig. 29 in detail. This chip layout is different from the chip layout of FIG. 21 in that it differs in the following points. The first 1 'order that a district library (main district library) is composed of two sub-blocks. Central Standards Bureau of the Ministry of Economic Affairs, M Industry and Consumer Cooperatives, I --- i. Ii 1 n ^ p j--II-! I (please read the precautions on the back before filling out this page), that is, the main zone library 1 1 1 0 It is composed of the deputy zone library 1, 1 1 — 0 — # 1. The main zone library 1 1 — 1 is composed of the deputy zone library 1 1 — 1 — # 〇, 11_1_ # 1. It is composed of the secondary district library 1 1 — 2 — # 〇 ,; [1_2_ # 1, the primary district library 1 1 — 3 is composed of the secondary district library 1 i — 3 — # 〇, 1 1. Sub-zone library 1 1 — 〇_ # 〇 '1 1 — 〇_ # 1 is based on the size of the zone library paper and is applicable to the Chinese National Standard (CNS) Λ4 specification (2 丨 0χ247 common edge) spoon A7 B7 3〇9657 V. Description of the invention (55) Select the circuit and select it at the same time> Sub-zone library 1 1 — 0 — # 〇, 1 1 _ 0 _ # 1 When the selected zone library is selected, the remaining zone library is not selected. Similarly, for example, the sub-zone library 1 1 — 1 — # 〇 ,; [When selected, the remaining zone library does not select β, and through the 4 sub-zone libraries 1 1 — 〇 — # 〇, 1 1_1_ # 0 , 11 — 2 — # 0, 11 — 3_ # 〇 constitutes a group of workers, and the district library of this group is connected to the data input / output circuit 1 2 a through the data bus 13a, 13 b. Similarly, through 4 sub-zone libraries 1 1 — 〇- # 1 '11 一 1- # 1, 11-2- # 1, 11-3- # 1 form a group, the group library of this group is through data The bus bars 1 3 c and 13 d are connected to the data input / output circuit 12 b. The second 2 'is composed of a 16-bit (2-byte) data input and output in a sub-region library. When the layout of the sub-zone library is compared with the layout of the zone library in Fig. 21, the column decoder CD has two differences. That is, the layout of the sub-zone library is the same as the layout of the zone library of FIG. Because, in this example, in a sub-region library, in order to carry out 16-bit; ^ data output, there are only two column decoder CD. However, the row decoder CD is the same as the semiconductor memory of FIG. 21, and selects two rows to execute 4-bit data in each of the blocks BLa, BL b-BL c, and BL d The input and output of the sub-area library: the layout of the billion grid array CAL, CAR, column decoder RD, local DQ line pair 18a, overall DQ line pair 18b, and DQ buffer DQ are as shown in the semiconductor record of FIG. 10. The cloth in the library of the body area (please read the precautions on the back and fill in this page).-,-· Printed by the Liji Ministry of Central Bureau of Industry and Commerce Cooperative Society. The paper size is applicable to the Chinese National Standard (CNS) Λ4 Present case (2 丨 0X 297mm) A7 B7 309657 5. The description of the invention (5δ) is almost the same. (Please read the precautions on the back and then fill out this page) Article 3, data input and output circuit (I / O) 12a and 12b are arranged on the billion-element chip 10 and are extended in the column direction. The data buses 13a and 13b are located on both sides of the data input and output circuit 12a. The data buses 13c and 13d It is located on both sides of the data input / output circuit 1 2 b. \ ^ Material bus 1 3 a is commonly located in the sub-zone library 1 1 — 〇— # 〇 , 1 1 一 1 — # 0. The data bus 1 3b is commonly located in the sub-zone library 11-2-# 0,11 — 3 — # 0, the data bus 13c is commonly located in the sub-zone library 11 — 0- # 1 , 11 — 1 一 # 1, data bus 1 3d is commonly located in the secondary area library 11 — 2 — # 1,11 一 3-# 1. The data bus 1 3 a, 1 3 b is in each sub Between the warehouses, it extends in the column direction and connects to the data input / output circuit 1 2 a. Similarly, the data bus 1 3 c and 1 3 d are connected between the warehouses of each sub-area, extend in the row direction, and connect to the data input and output. Circuit 1 2b, data bus 1 3 a ~ 1 3 d can be composed of 16-bit data .. Central Bureau of Standards of the Ministry of Economic Affairs Printed in the semiconductor memory of such a chip layout. , For example, when selecting the sub-zone library 1 1-0 — # 0, 1 1 — 〇- # 1, between the sub-zone library 1 1 — 0-# 0 and the data output and input circuit 1 2 a, via the data bus 13a, To receive and receive 16-bit data, the sub-zone library 11 — 〇 — # 1 and the data output and input circuit 1 2 b, through the data bus 1 3 c, to receive and receive 16-bit data. That is, at 3 2 bits In the semiconductor memory, the data sheet format of the data bus is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 g) A7 B7 5. Description of the invention (57) 13 a ~ 13d is the number of 16-bit data that can be sent via Fu The wiring can be structured to reduce the range of the data bus on the 100 million chip. The third is a fourth modification of the semiconductor memory chip of the first embodiment shown in FIGS. 10 and 22. FIG. 3 3 shows the chip layout of the semiconductor memory of FIG. 32 in detail. This chip layout is different from the chip layout of FIG. 10 and FIG. 2 in the following points. The first 1 'order that a district library (main district library) is composed of two sub-blocks. That is, the main area library 1 1 — 0 is composed of the auxiliary area library 1 1-0 — # 0, 1 1 — 0 — # 1, the main area library 1 1 — 1 is composed of the auxiliary area library 1 1 — 1 — # Composed of 0, 11-1 and # 1, the main zone library 11 and 2 are from the secondary zone library 1 1-2 — # 0, 1 1 and 2- # 1, the main zone library 1 1 and 3 are from the secondary zone District library 1 1 — 3 — # 0, 1 1 — 3 — # 1. Sub-zone library 1 1 — 〇 — # 〇, 1 1 — 〇- # 1 is selected through the zone library selection circuit at the same time. When the secondary bank 1 1 — 〇 — # 〇, 1 1 _ 0 — # 1 is selected, the remaining bank is not selected. Similarly, for example, when the sub-zone library 1 1-1 — # 〇, 1 1 — 1 — # 1 is selected, the remaining zone library is not selected ”again” via 4 sub-zone libraries 1 1-0 — # 〇 , 11 — 1 一 # 0 '11 — 2 — # 0,11 — 3-# 0 form a group, and the district library of this group is connected to the data input / output circuit 12 via the data bus 1 3 a »Similarly , Through 4 sub-district libraries 1 1 10 — # 1, 1 1 The paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X 297 mm) ------: --- ^ Cloth—I ( Please read the precautions on the back before filling in this page) Order the Ministry of Economic Affairs Central Standards Bureau employee consumer cooperatives to print and gather the Ministry of Economics Central Standards Bureau Mgong Consumer Cooperatives Indigenous A7 ________ B7 5. Invention Instructions (58) One 1 One # 1 11 — 2-# 1, 11 — 3_ # 1 form a group. The district library of this group is connected to the data input / output circuit 1 2 via the data bus 1 3 b. 'No. 2' is composed of 8-bit (1-byte) data in and out of a sub-region library. When the layout of the secondary bank is compared with the layout of the bank in Figure 10, only one column decoder CD is the difference. Because, in this example, in order to output 8-bit data in a sub-region library, there is only one column decoder CD. However, the column decoder CD is the same as the semiconductor memory device of FIG. 10, selects two columns, and executes 2-bit data in each block BLa'BLb, BLc, BLd of the memory cell array. I / O; the layout of the mega-array CAL, CAR, column decoder RD, local DQ line pair 18a, overall DQ line pair 18b and DQ buffer DQ in the sub-region library is the same as the semiconductor memory area of FIG. 10 The layout in the library is almost the same. "Third, the data input and output circuit (I / O) 12 is on the memory chip 10, which is arranged to extend in the column direction. The data bus 1 3 a and 1 3 b are designed. On both sides of the data input and output circuit 12. The data bus 1 3a is set in the sub-zone library 1 1 — 0-# 0, 1 1 — 1 — # 0 * 11 — 2 — # 0, 11 — 3 — # 0. The data bus 1 3 b is commonly located in the sub-zone library 1 1-# 1,, 11 1 2 — # 1, 11-3- # 1. The data bus 1 3 a and 1 3 b are located between the depots of each sub-district 'n-I-I-I-IJ Ά — I --- II Ding — · 4,-° (please read the notes on the back first Please fill in this page for details) This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (210X 297mm)-έ /-309657 5. Description of invention (59) Direction extension, connected to the data input and output circuit 12. The data buses 1 3 a and 13 b are composed of 8-bit data. . In the semiconductor memory with such a chip layout, for example, when the sub-zone library 1 1-0- # 0, 1 1-0 — # 1 is selected, between the sub-zone library 1 ίο — # 0 and the data output and input circuit 1 2 Through the data bus 13a, the 8-bit data is received, the secondary library 11-0 — # 1 and the data output and input circuit 12 between the data bus 1 3b, the 8-bit data is received. That is, in a 16-bit semiconductor memory, the data bus 13a, 13b can be formed by wiring that can send 8-bit data, which can make the data bus on the 100 million chip The range becomes smaller. > 3 4 shows a fourth modification of the semiconductor memory chip of the second embodiment shown in FIG. 21. Fig. 30 shows the detailed layout of the semiconductor memory device of Fig. 29. The chip layout is different from the chip layout of FIG. 21 in that it differs in the following points. The first 1 'order that a district library (main district library) is composed of two sub-blocks. Printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling in this page) Liang P 'Main Zone Library 1 1 — 〇 is from the Deputy Zone Library 1 1-0 — # 〇, 1 1 — 0 — Constituted by # 1, the main zone library 1 1_1 is composed of the secondary zone library 1 1 — 1 — # 〇, 11 — 1 — # 1, the main zone library 11_2 is composed of the secondary zone library 1 1 — 2- # 0, 1 1 — 2 — # 1, the main zone library 1 1 — 3 is composed of the secondary zone library 1 1 3-# 〇, 1 1 3-# 1. Deputy Yaoku 1 1 — 〇 — # 〇, 1 1 — 〇 一 # 1 is applicable to the Chinese national standard (CNS) Λ4 present grid (210X297 mm) through the regional library paper scale-309657 at __B7__ (6〇) Select the circuit and select it at the same time. Sub-zone library 1 1 — 〇 一 # 〇, 1 1 — 0 — # 1 is selected, the remaining zone library is not selected. Similarly, for example, when the sub-zone library 1 1— · 1 one # 0, 1 1—1— # 1 is selected, the remaining zone library is not selected. In addition, via 4 sub-zone libraries 11—0— # 0, 11—1—1 # 0, 11-2- # 0, 11—3— # 0 form a group, and the zone library of this group is via the data bus 1 3 a, connected to the data input and output circuit 1 2. Similarly, through 4 sub-regional libraries 1 1 1 0_ # 1, 1 1 — 1 — # 1, 11 — 2 — # 1, 11 — 3_ # 1 form a group, the group library of this group is via data convergence Row 1 3 b, connected to the data input and output circuit 1 2. Second, in a sub-region library, 16-bit (2-byte) data input and output structure. When the layout of the sub-zone library is compared with the layout of the zone library in Fig. 21, the column decoder CD has two differences. That is, the layout of the secondary library is the same as the layout of the library in FIG. Because, in this example, in a deputy district library, in order to carry out 16-bit (please read the precautions on the back before filling in this I). The land is the same two-body code in the E-store system D-leading C half-device 1 solution 2 column diagram 'and the C feeder code for the output D
b L . B 入 ’ 出 3 輸 L 之 B 料 塊資 區之 中元 各位 之 4 列行 Jml ft. 格, 億中 記 d 於 Lb L. B in ’out 3 out L of the B material block in the middle of the block area 4 rows of everyone in the Jml ft. grid, billion in the record d in L
解列 列個 , 2 是擇 L 但選 BUnpack the columns, 2 is L but B
CC
D R 畐 歹 bR· 格 1 憶對 記線 之 Q 內 D 庫部 區局 8 a 器 碼及 解 b 列 8 、 1 R 對 A 線 c Q 、 D L 體 A 整D R 畐 歹 bR · grid 1 within the Q of the memory line D library department 8 a device code and solution b column 8, 1 R to A line c Q, D L body A integer
內 區 體 億 記 體 導 半 之 ο IX 圖 與 係 局 佈 之 Q D 器 衝 緩 Q D 隼 標 家 國 國 一中 I用 |通 尺 I張 紙 I本 I釐 公 7 9 2 經濟部中央標準局員工消費合作社印製 Α7 Β7 五、發明説明(61 ) 之佈局幾近相同。 V/7第3 ’資料輸出入電路(I / 0 ) 1 2係於記憶晶片 1 〇上’向列方向延長地加以配置,資料匯流排1 3 a 、 1 3 b係設於資料输出入電路1 2之兩側。 資料匯流排1 3 a係共通設於副區庫1 1 — 〇 — #〇 ’ 1 1 - 1 - # 0,1 1 - 2 - # 0,1 1 - 3 - # 0, 資料匯流排13b係共通設於副區庫11— 〇_#1 , ,11-2-#1,11-3-#1。 資料匯流排1 3 a、1 3 b係於各副區庫間,向列方 向延長’連接於資料輸出入電路1 2。資料匯流排1 3 a 、1 3 b係可各傳送1 6位元之資料地加以構成。 於如此之晶片佈局之半導體記憶體中,例如選擇副區 庫 1 1 — 〇-#〇,1 1 — 〇 — #1 時,於副區庫 1 ίο - # 0 和資料輸出入電路 1 2 間 ,經由資料匯流排 1 3 a,進行1 6位元資料之收受,副區庫1 1_〇 -# 1和資料输出入電路1 2間,經由資料匯流排1 3 b ,進 行16位元資料之收受。 即’於3 2位元型之半導體記憶體中,資料匯流排 1 3 a、1 3 b係經由可傅送1 6位元之資料數之配線加 以構成即可,可令記憶晶片上之資料匯流排之範圍變小》 x/ia 3 5係顯示本發明之資料傳送系統。 η (η係複數)個之區塊BLO〜BLn係自各同樣 要素加以構成*區塊B L 〇〜B L η係延長於列方向加以 配置。區塊B L 〇爲例,對於該構成加以說明。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X2^7公慶) -糾- --------;---^--- (請先閱讀背面之注意事項再填寫本頁)Inner District Body Billion Records Half of the Body IX IX Figures and Department of Layout QD Device Relief QD Falcon Bakers Guoguo No. 1 Middle School | General Ruler I Sheets of Paper I Books I Ligong 7 9 2 Central Bureau of Standards, Ministry of Economic Affairs Printed by employees' consumer cooperatives Α7 Β7 5. The layout of the invention description (61) is almost the same. V / 7 No. 3 'Data input and output circuit (I / 0) 1 2 is on the memory chip 1 〇' extended in the column direction, the data bus 1 3 a, 1 3 b is set in the data input and output circuit 1 2 on both sides. The data bus 1 3 a is set in the sub-zone library 1 1 — 〇 — # 〇 '1 1-1-# 0, 1 1-2-# 0, 1 1-3-# 0, the data bus 13b is Commonly located in the sub-zone library 11-〇_ # 1, 11-2- # 1, 11-3- # 1. The data buses 1 3 a and 1 3 b are connected between the sub-zones, and are extended in the column direction to the data input / output circuit 12. The data buses 1 3 a and 1 3 b are each composed of 16 bits of data. In the semiconductor memory with such a chip layout, for example, when the sub-region library 1 1 — 〇- # 〇, 1 1 — 〇 — # 1 is selected, between the sub-region library 1 ίο-# 0 and the data output and input circuit 1 2 , Through the data bus 1 3 a, to receive 16-bit data, the sub-zone library 1 1_〇- # 1 and the data input and output circuit 12 between, through the data bus 1 3 b, 16-bit data Acceptance. That is, in a 32-bit semiconductor memory, the data bus 1 3 a, 1 3 b can be formed by wiring that can send 16-bit data, which can make the data on the memory chip The scope of the bus becomes smaller "x / ia 3 5 shows the data transmission system of the present invention. η (η is plural) blocks BLO ~ BLn are constructed from the same elements * Blocks B L 〇 ~ B L η are arranged to extend in the column direction. Block B L 〇 is taken as an example, and the configuration will be described. This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X2 ^ 7 Gongqing) -Correct- --------; --- ^ --- (Please read the precautions on the back before filling this page )
,tT 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) A7 _B7______ 五 '發明説明(62) 區塊B L 0係具有配置於列方向之2個開關陣列 41a,41b 。各開關陣列41a’41b係自配置 呈矩陣狀之複數開關(M0S 電晶體)46 a ’ 46b 所構成β 行解碼器4 2 a係鄰接開關陣列4 1 a之列方向之2 個端部中的一個加以配置。行解碼器4 2 b係鄰接開關陣 列4 1 b之列方向之2個端部中的一個加以配置。字元線 44a,44b之一端,係連接於列解碼器42a, 42b ,且字元線44a ,44b係連接於同靥於列之複 數開關46 a ,46b之控制端子(閘)。 列解碼器4 3係鄰接開關陣列4 1 a之列方向之2個端 部中的一個加以配置。列選擇線4 9之一端係連接於列解 碼器4 3。 暫存器47a ,47b及列選擇開關48a ,48b 係配置於2個開關陣列41a ,41b間。資料線45a ,45b之一端係連接於暫存器47a ,47b及列選擇 開關48a ,48b ,且資料線45a ,45b 係連接 於同屬於列之複數開關4 6 a ,4 6 b之输出端(汲極) 。列選擇線49係連接於列選擇開關48a ,48b。 資料係施加於複數開關4 6 a ,4 6 b之輸入端(源 極)。 局部DQ線5 0 — 0係配置於2個開關陣列4 1 a , 41 b間,延長於行方向•局部DQ線50-0係連接 於暫存器47a ,47b及列選擇開關48a ,48b。 --I L— - L,---1--- (請先閱讀背面之注意事項再填寫本頁) 訂 ^09657 A7 B7 經濟部中央標準局員工消費合作杜印製 五、 發明説明 (63 ) 1 | 整 體D Q 線5 1 — 0 係 配置於 η 個 區 塊 B L 0 1 1 B L η 之開 關 陣列 上 > 延 長 於列方 向 〇 整 體 D Q 線 5 1 — 1 1 0 之 — 端係 連 接於 局 部 D Q 線5 0 - - 3 ’整體D Q線 1 I 請 1 | 5 1 — 0之 另 一端 係 連 接 於 資料輸 出 入 電 路 ( I / 0 ) 先 1 1 讀 1 5 2 〇 背 ! I 路 之 1 資 料輸 出 入電 5 2 係 鄰接於 η 個 區 塊 B L 0 * B L η 之列 方 向之 2 個 端 部 中之一 加 以 配 置 0 事 項 再 1 i I 上 述資 料 傳送 系 統 特 徵 係於η 個 區 塊 B L 0 B L η 填 寫 本 —4 延 長 於 列方 向 時, 例 如 白 區 塊B L 0 B L η 輸 出 之 資 料 頁 ^—' 1 1 則 經 由 開關 陣 列4 1 a 4 1 b上 之 整 體 D Q 線 5 1 — 0 1 1 5 1 —η » 導入 資 料 输 出 入電路 5 2 〇 1 | 即 ,自 區 塊Β L 0 B L η输 出 之 資 料 係 集 合 於 鄰 接 訂 I 於 區 塊 B L 0 〜Β L η 之 列 方向之 2 個 端 部 2 個 端 部 中 之 1 1 | 1 個 加 以配 置 之資 料 輸 出 入 電路5 2 的 同 時 白 此 資 料 輸 1 1 出 入 電 路5 2 输出 至 L S 之外部 1 1 3 6 係 顯示 於 本 發 明 之記憶 體 fia· 系 統 之 構 成 0 1 在 此, 對 於使 用 f 1 園 1 圓3 4 之 半 導 體 記 憶 體 之 記 憶 1 1 體 系 統 之一 例 加以 說 明 〇 1 1 1 0係 記 億晶 片 4 記 憶 晶片1 0 之 構 成 係 與 於 [S3 圖 1 1 圖 3 4 所說 明 之半 導 體 記 憶 體中選 擇 之 1 個 半 導 體 記 憶 體 1 i 之 構 成 同樣 地 加以 設 定 0 1 1 I 記 憶晶 片 10 中 1 形 成 記億格 陣 列 5 1 讀 取 • 寫 入 1 1 電 路 5 2、 輸 入電 路 5 3 輸出電 路 5 4 、 同 步 電 路 5 5 1 1 及 時 脈 緩衝 器 5 6 〇 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨OX 297公釐) A7 B7 經濟部中央標準局員工消費合作杜印裝 五、 發明説明 (64 ) 1 I C P U 5 8 係 輸 出 時 脈 信 號 C K 〇 時 脈 信 號 C K 係 供 1 1 予 記 憶 晶 片 1 0 呈 內 部 時 脈 信 OtL· Wt C L K 〇 於 記 憶 晶 片 1 1 1 0 內 內 部 時 脈 信 號 C L K 係 供 予 讀 取 參 寫 入 電 路 5 2 1 | 讀 寫 請 1 | 0 取 • 入 爾 路 5 2 係 同 步 於 內 部 時 脈 信 號 C L K動 先 閱 1 | 讀 1 作 9 背 I 時 脈 信 之 1 號 C K 和 內 部 時 脈 信 號 C L K 之 偏 移 係 經 由 同 注 意 1 電 路 事 1 步 5 5 t 除 去 0 同 步 電 路 5 5 係 輸 出 內 部 時 脈 信 號 項 再 1 K 內 填 J C 0 部 時 脈 信 號 C K f 係 供 予 輸 入 電 路 5 3 及 輸 出 寫 本 〆、-1 電 路 5 4 0 输 入 電 路 5 3 及 輸 出 電 路 5 4 係 同 步 於 內 部 時 賁 V__« 1 1 脈 信 號 C K t 動 作 0 1 1 I / 0 匯 流 排 5 7 係 連 接 記 憶 晶 片 1 0 和 C P U 晶 片 1 1 5 8 0 資 料 係 經 由 I / 〇 匯 流 排 5 7 進 行 至 記 憶 晶 片 訂 I 1 0 和 C P U 晶 片 5 8 0 1 1 I [ 發 明 之 效 果 ] 1 1 1 試 如 以 上 之 說 明 » 根 據 本 發 明 之 半 導 體 記 憶 體 及 該 測 1 電 路 及 資 料 傳 送 系 統 時 會 產 生 以 下 之 效 果 〇 1 1 設 置 複 數 區 庫 » 於 各 區 庫 內 設 置 配 置 於 記 憶 格 陣 列 1 1 之 小 區 塊 間 向 行 方 向 延 伸 之 局 部 D Q 線 和 配 置 於 記 億 1 格 陣 列 上 向 列 方 向 延 伸 之 整 體 D Q 線 0 然 後 輸 出 入 資 1 料 係 經 由 局 部 D Q 線 和 整 體 D Q 線 進 行 設 於 區 庫 之 列 方 1 I 向 之 端 部 的 D Q 緩 衝 器 和 記 億 格 陣 列 間 地 加 以 構 成 〇 1 1 1 經 由 呈 如 此 之 構 成 * 令 各 區 庫 內 之 記 憶 格 控 制 器 、 行 1 1 解 碼 器 列 解 碼 器 % D Q 緩 衝 器 9 鄰 接 於 各 記 億 格 陣 列 之 1 1 本紙浪尺度適用中國國家標準(CNS ) A4現格(210X297公釐) 0 Α7 Β7 S09657 五、發明説明(65) 一邊加以配置之故,於多位元型、時脈同步型、區庫型之 半導體記億體中,不增加晶片面稹,可提高資料傳送速度 0 【圚面簡單說明】 【圖1】, tT The Ministry of Economic Affairs Central Standards Bureau employee consumer cooperatives printed this paper standard is applicable to the Chinese National Standard (CNS) Λ4 specifications (210X 297 mm) A7 _B7______ Five 'invention description (62) Block BL 0 is configured in the column direction Two switch arrays 41a, 41b. The switch arrays 41a'41b are self-arranged matrix-like complex switches (MOS transistors) 46a'46b. The β-row decoder 4 2a is adjacent to the two ends in the column direction of the switch array 4 1a One is configured. The row decoder 4 2 b is arranged adjacent to one of the two ends in the column direction of the switch array 4 1 b. One end of the word lines 44a, 44b is connected to the column decoders 42a, 42b, and the word lines 44a, 44b are connected to the control terminals (gates) of the plural switches 46a, 46b which are also in the column. The column decoder 43 is arranged adjacent to one of the two ends in the column direction of the switch array 4 1 a. One end of the column selection line 49 is connected to the column decoder 43. The registers 47a and 47b and the column selection switches 48a and 48b are arranged between the two switch arrays 41a and 41b. One end of the data lines 45a, 45b is connected to the registers 47a, 47b and the column selection switches 48a, 48b, and the data lines 45a, 45b are connected to the output ends of the plural switches 4 6a, 4 6 b which both belong to the column ( Jiji). The column selection line 49 is connected to the column selection switches 48a, 48b. The data is applied to the input (source) of the complex switches 4 6 a and 4 6 b. The local DQ lines 5 0-0 are arranged between the two switch arrays 4 1 a and 41 b and extend in the row direction. The local DQ lines 50-0 are connected to the registers 47a and 47b and the column selection switches 48a and 48b. --IL---L, --- 1 --- (please read the precautions on the back before filling in this page) Order ^ 09657 A7 B7 Central China Bureau of Economic Affairs Employee's consumer cooperation du printing 5. Invention description (63) 1 | The overall DQ line 5 1 — 0 is arranged on the switch array of n blocks BL 0 1 1 BL η> extended in the column direction. The end of the overall DQ line 5 1 — 1 1 0 is connected to the local DQ Line 5 0--3 'Overall DQ line 1 I Please 1 | 5 1 — 0 The other end is connected to the data input / output circuit (I / 0) First 1 1 Read 1 5 2 〇Back! I Road 1 Data output Incoming power 5 2 is adjacent to one of the two ends in the row direction of η blocks BL 0 * BL η to be placed 0 items and then 1 i I The characteristics of the above data transmission system are filled in η blocks BL 0 BL η When Ben-4 is extended in the column direction, for example, the data page output by the white block BL 0 BL η ^ — '1 1 is passed The overall DQ line 5 1-0 1 1 5 1-η on the array 4 1 a 4 1 b »Import data I / O circuit 5 2 〇1 | That is, the data output from the block B L 0 BL η is collected in Adjacent to the two ends in the column direction of the blocks BL 0 ~ B L η 1 1 | 1 of the configured data input and output circuit 5 2 while the data input 1 1 input and output circuit 5 2 External output to LS 1 1 3 6 is shown in the configuration of the memory fia · system of the present invention. 0 1 Here, an example of a memory 1 1 body system using a semiconductor memory of f 1 circle 1 circle 3 4 Explanation 〇1 1 1 0 is a billion-element chip. 4 The configuration of the memory chip 10 is the same as the configuration of one semiconductor memory 1 i selected from the semiconductor memories described in [S3 FIG. 1 1 FIG. 3 4 Set 0 1 1 I Memory chip 10 in 1 to form a memory grid array 5 1 Read • Write 1 1 circuit 5 2, input circuit 5 3 output circuit 5 4, synchronous circuit 5 5 1 1 and clock buffer 5 6 〇1 1 The paper standard is applicable to China National Standard (CNS) A4 specification (2 丨 OX 297 Mm) A7 B7 Employee's consumption cooperation of the Central Bureau of Standards of the Ministry of Economic Affairs Du Printed Fifth, invention description (64) 1 ICPU 5 8 series output clock signal CK 〇 clock signal CK for 1 1 to memory chip Pulse signal OtL · Wt CLK 〇In the memory chip 1 1 1 0 Internal clock signal CLK is for reading and writing circuit 5 2 1 | Read and write please 1 | 0 fetching • Erlu 5 2 is synchronized internally The clock signal CLK moves first. Read 1 | Read 1 as 9. Back I. The clock signal No. 1 CK and the internal clock signal CLK are shifted by the same attention. 1 circuit matter 1 step 5 5 t remove 0 synchronization circuit 5 5 series output internal clock signal item and then 1 K filled with JC 0 part clock signal CK f is supplied to input circuit 5 3 and output script 〆, -1 circuit 5 4 0 input circuit 5 3 and output circuit 5 4 are synchronized Internally, V__ «1 1 pulse signal CK t action 0 1 1 I / 0 bus 5 7 is connected to memory chip 1 0 and CPU chip 1 1 5 8 0 The data is transferred to memory via I / 〇 bus 5 7 Chip order I 1 0 and CPU chip 5 8 0 1 1 I [Effects of the invention] 1 1 1 Try as described above »The semiconductor memory according to the present invention and the test circuit and data transmission system will produce the following effects 〇1 1 Set up multiple zone libraries »Set up local DQ lines extending in the row direction between the small blocks of the memory cell array 1 1 in each zone library The overall DQ line 0 extending in the column direction on the grid array, and then the input and output 1 materials are carried out through the local DQ line and the overall DQ line. Intermittently constitute 〇1 1 1 With such a configuration *, make the memory cell controller and row 1 1 decoder column decoder% DQ buffer 9 in each zone library adjacent to 1 1 paper wave of each memory cell array The standard is applicable to the Chinese National Standard (CNS) A4 (210X297mm) 0 Α7 Β7 S09657 V. Description of the invention (65) Because of the configuration on one side, it is a multi-bit type, clock synchronization type, regional library type semiconductor record In the 100 million body, the data transfer speed can be improved without increasing the chip surface area.
V 顯示本發明之第1參考例之半導體記憶體之晶片佈局 圖。 \/【圖2】 詳細顯示圖1之區庫內之晶片佈局。 \/【圖3】 顯示本發明之第2參考例之半導體記億體之晶片佈局 (請先閲讀背面之注意事項再填寫本頁)V shows the chip layout of the semiconductor memory according to the first reference example of the present invention. \ / 【Figure 2】 Detailed display of the chip layout in the district library of Figure 1. \ / 【Figure 3】 Show the second reference example of the present invention, the layout of the semiconductor memory chip
【圖4】 詳細顯示圖3之區庫內之晶片佈局^ ^【圖5】 簡略顯示圖1之晶片佈局圖》 經濟部中央標準局員工消費合作社印裝 4:圖6】 顯示圖1之第1參考例之變形例之晶片佈局圖。 4圖7】 詳細顯示圖6之晶片佈局圖。 I"[圖8】 顯示圖1之第1參考例之變形例之晶片佈局圖。 圖9】 本紙浪尺度適用中國囷家標準(CNS ) Λ4現格(2丨0Χ 297公釐) -味- A7 B7 五、發明説明(66 ) 詳細顯示圖8之晶片佈局圖。 v/【圖1 0】 顯示本發明之第1實施例之半導體記憶體之晶片佈局 圖。 v/【圖1 1】 詳細顯示圖10之區庫內之晶片佈局圖。 V【圖1 2】 顯示圖1 1之開關構成之一例圖。 7【圖1 3】 顯示列解碼器之構成例圖。 v【圖1 4】 顯示區庫選擇電路之構成例圖。 17【圖15】 顯示資料輸出入電路構成例圖。 1/ 【圖1 6】 顯示測試電路之構成之主要部圖。 7【圖1 7】 經濟部中央標準局員工消費合作社印製 顯示詳細圖16之測試電路之構成圖。 b{圖1 8】 顯示測試用切換電路之構成例圖。[Figure 4] Detailed display of the chip layout in the district library of FIG. ^ ^ [Figure 5] A simplified display of the chip layout of FIG. 1 "Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 4: Figure 6] 1 Wafer layout diagram of a modification of the reference example. 4 Figure 7] The chip layout of Figure 6 is shown in detail. I " [FIG. 8] A chip layout diagram showing a modification of the first reference example in FIG. 1. Figure 9] The scale of this paper is applicable to the Chinese standard (CNS) Λ4 present grid (2 丨 0Χ 297mm)-flavor-A7 B7 5. Description of the invention (66) Detailed display of the wafer layout of Figure 8. v / [Figure 1 0] shows the chip layout of the semiconductor memory according to the first embodiment of the present invention. v / 【Figure 11】 Detailed display of the chip layout in the district library of Figure 10. V [Figure 1 2] shows an example of the switch configuration shown in Figure 11. 7 [Figure 1 3] A diagram showing an example of the configuration of a column decoder. v [Figure 14] An example of the structure of the display area library selection circuit. 17 [Figure 15] A diagram showing an example of the structure of the data input / output circuit. 1 / [Figure 16] Shows the main part of the structure of the test circuit. 7 [Figure 1 7] Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. b {Figure 18] A diagram showing an example of the configuration of the test switching circuit.
VyC圖1 9】 顯示測試模式時之信號波形圖。 圖2 0】 顯示測試模式時之信號波形圖。 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X297公釐) (請先閱讀背面之注意事項再填寫本頁) -^ - A7 B7 經濟部中央標準局員工消費合作社印製 五、 發明説明( 67 ) 1 I vyt rgi 圖 2 1 ] 1 1 顯 示本 發 明 之 第 2 實 施 例 之 半 導 體 記 憶 體之晶片佈局 1 1 圖 ο 1 I [A 請 1 圖 2 2 ] 先 閱 1 1 讀 1 概 略顯 示 圖 1 0 之 晶 片 佈 局 圚 〇 背 之 1 圖 2 3 ] i | 顯 示圖 2 2 之 晶 片 佈 局 之 第 1 變 形 例 圖 0 事 項 再 1 1 」 \χ 圖 2 4 ] 填 寫 本 1 詳 細顯 示 圖 2 3 之 晶 片 佈 局 圖 〇 頁 Sw·* 1 1 ν【 圖 2 5 ] 1 1 顯 示圖 2 1 之 晶 片 佈 局 之 第 1 變 形 例 圖 0 i | \Λ 圖 2 6 ] 訂 I 顯 示圖 2 2 之 晶 片 佈 局 之 第 2 變 形 例 圖 0 1 1 I VI mrr 圖 2 7 ] 1 1 | 詳 細顯 示 圖 2 6 之 晶 片 佈 局 ΓΒΠ 圖 〇 1 1 \Λ ΓΒΊ 圖 2 8 ] 1 顯 示圖 2 1 之 晶 片 佈 局 之 第 2 變 形 例 ΓΒΠ 圖 〇 1 1 '>【 圖 2 9 ] 1 I 顯 示圖 2 2 之 晶 片 佈 局 之 第 3 變 形 例 IWI 圖 〇 1 | 圖 3 0 ] 1 1 % 詳 細顯 示 圖 2 9 之 晶 片 佈 局 圖 9 1 1 α ΓΈΓΤ 圖 3 1 ] 1 1 顯 示圖 2 1 之 晶 片 佈 局 之 第 3 變 形 例 圇 〇 1 1 圖 3 2 ] 1 1VyC Figure 1 9] Display the signal waveform in test mode. Figure 2 0] Display the signal waveform in test mode. This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (21〇X297 mm) (please read the notes on the back before filling this page)-^-A7 B7 Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Description (67) 1 I vyt rgi Figure 2 1] 1 1 shows the chip layout of the semiconductor memory according to the second embodiment of the invention 1 1 Figure ο 1 I [A Please 1 Figure 2 2] Read 1 1 Read 1 Overview Show the chip layout of Figure 1 0. Back to the first Figure 2 3] i | Show the first modification of the chip layout of Figure 2 2 Figure 0 Matters 1 1 ”\ χ Figure 2 4] Fill in this 1 Detailed display Figure 2 3 Layout of the chip 〇 page Sw · * 1 1 ν [Figure 2 5] 1 1 shows the first modification of the chip layout of Figure 2 1 Figure 0 i | \ Λ Figure 2 6] Order I shows the chip of Figure 2 2 Layout 2nd Modification Figure 0 1 1 I VI mrr Figure 2 7] 1 1 | Detailed display of the chip layout of Figure 2 6 ΓΒΠ Figure 〇1 1 \ Λ ΓΒΊ Figure 2 8] 1 shows the second modification of the chip layout of Figure 2 1 Example ΓΒΠ Figure 〇1 1 '> [Figure 2 9] 1 I shows the third modification of the chip layout of Figure 2 2 IWI Figure 〇1 | Figure 3 0] 1 1% shows the chip layout of Figure 2 9 in detail 9 1 1 α ΓΈΓΤ Figure 3 1] 1 1 shows the third modification of the chip layout of Figure 2 1 囵 〇1 1 Figure 3 2] 1 1
本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐) A -ΊΟ - A7 S09657 五 '發明説明(68 ) B7 經濟部中央標準局員工消費合作社印製 顯 示 圖 2 2 之晶片 佈 局 之 第 4 變形例 圖。 α ·... 圖 3 3 ] 詳 細 顯 示圖 3. 2之 晶 片 佈 局 圖 〇 【 圖 3 4 ] 顯 示 圖 2 1 之晶片 佈 局 之 第 4 變形例 圖。 □sa 圚 3 5 ] 顯 示 本 發明 之資料 傳 送 系 統 1 M.I 圖 0 1 圖 3 6 顯 示 本 發明 之記憶 體 系 統 0 y 圖 3 7 ] 顯 示 以 往之 半導體 記 憶 體 之 晶 片佈局 圖。 [ 符 號 之 說 明】 1 0 記憶晶片 1 1 — 0 11 —3 — — 區庫 (主區庫) 1 1 — 0 — # 0 ,11 — 0 — # 1 1 1 1 - 3 - # 0 1 1 — 3 - # 1 : 副 區 庫 1 2 1 2 a * 12b -- 資 料 輸 出入( I / 0 ) 範 圍 1 3 1 3 a 〜 13d -- 資 料 匯 流排 1 4 資料線對 1 5 9 1 5 -0 〜1 5 — 3 -: 列選擇線 1 6 列選擇開關 1 7 ) 1 9 a , 19b __ ; 字 元 線 I 1 —- ^1. - - - —-I —1,^!1 -——I. - - - I (請先閱讀背面之注意事項再填寫本頁) 18-----: D Q線對 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公釐)_ u 經濟部中央標準局員工消費合作杜印袈 A7 B7 五、發明説明(69 ) 18a-----:局部D Q線對 18b-----:整體D Q線對 2 0a ,20b ,' 21 開關 2 2-----:控制線 23- 1〜23— N--:預解碼器 24- 1〜24— Μ 解碼器 25- 1〜25-1^--:區塊 2 6-0 〜2 6 — 7---: NOR 電路 27 — 0 〜27-7,Τ〇1,T〇2,T11,T12 ,T21,T22,T31,T32,TG0〜 TG3 1--:轉換閘 2 8 — 0〜2 8 - 7 ---:閂鎖電路 2 9 — 0 〜2 9 — 7---: AND 電路 3 0-----:輸出閂鎖電路 3 1-----:輸出電路 3 2-----:輸出緩衝器 3 3-----: N A N D 電路 3 4-----:排他OR電路 3 5-----:彩色暫存器 3 6-----:排他NOR電路 3 7-----:開關電路部 3 8-----:串列選擇器 4 1 a ,4 1 b ---:開關陣列 42a ,42b---:行解碼器 本紙張尺度適用中國國家揉準(CNS ) A4規格(210X297公t ) _ p _ ----^---κ I--f '衣-- (請先閱讀背面之注意事項再填寫本頁)This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (210X 297mm) A-ΊΟ-A7 S09657 Five'Invention Description (68) B7 The layout of the chip shown in Figure 2 2 printed by the Staff Consumer Cooperative of the Central Bureau of Standards The fourth modification example. α · ... Fig. 3 3] Detailed display of the wafer layout of Fig. 3.2. [Fig. 3 4] A fourth variation of the wafer layout of Fig. 2 1 is displayed. □ sa 圚 3 5] shows the data transmission system of the present invention 1 M.I Figure 0 1 Figure 3 6 shows the memory system of the present invention 0 y Figure 3 7] shows the layout diagram of the past semiconductor memory wafers. [Explanation of symbols] 1 0 Memory chip 1 1 — 0 11 — 3 — — Area library (main area library) 1 1 — 0 — # 0, 11 — 0 — # 1 1 1 1-3-# 0 1 1 — 3-# 1: Sub-zone library 1 2 1 2 a * 12b-data input / output (I / 0) range 1 3 1 3 a ~ 13d-data bus 1 4 data line pair 1 5 9 1 5 -0 ~ 1 5 — 3-: Column selection line 1 6 Column selection switch 1 7) 1 9 a, 19b __; Character line I 1 —- ^ 1.---—-I —1, ^! 1 ----- I.---I (please read the precautions on the back before filling in this page) 18 -----: DQ line applies to Chinese paper standard (CNS) Λ4 specification (210X297mm) for this paper standard_ u Central Ministry of Economic Affairs Bureau of Standards and Staff Consumer Cooperation Du Yinjia A7 B7 V. Description of the invention (69) 18a -----: partial DQ line pair 18b -----: overall DQ line pair 2 0a, 20b, '21 switch 2 2- ----: control line 23- 1 ~ 23- N--: pre-decoder 24- 1 ~ 24- MU decoder 25- 1 ~ 25-1 ^-: block 2 6-0 ~ 2 6 — 7 ---: NOR circuit 27 — 0 to 27-7, T〇1, T〇2, T11, T12, T21, T22, T31, T32, TG0 ~ TG3 1--: changeover gate 2 8 — 0 ~ 2 8-7 ---: latch circuit 2 9 — 0 ~ 2 9 — 7 ---: AND circuit 3 0 -----: output latch circuit 3 1 -----: output circuit 3 2 -----: output buffer 3 3 -----: NAND circuit 3 4 --- -: Exclusive OR circuit 3 5 -----: Color register 3 6 -----: Exclusive NOR circuit 3 7 -----: Switch circuit section 3 8 -----: Serial Selector 4 1 a, 4 1 b ---: switch array 42a, 42b ---: line decoder This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 public t) _ p _ ---- ^ --- κ I--f 'clothing-- (Please read the notes on the back before filling this page)
,1T S09657 五、發明説明(70 ) A7 B7 經濟部中央標隼局員工消費合作社印製 4 3 =列解 碼器 4 4 a > 4 4 b - :字元 線 4 5 a » 4 5 b - :資料 線 4 6 a i 4 6 b - --•開關 4 7 a » 4 7 b - :暫存 器 4 8 a > 4 8 b - :列選 擇 開關 4 9 =列選 擇線 5 0 — 0 5 0 - ~ η---: 局 部D Q線對 5 1 — 0 5 1 - -η---: 整 體D Q線對 1 0 0 :測 試用切換 電 路 2 0 0 :測 試用輸出 电 路 C A L » C A R - -:記憶格陣列 (小區塊: C A C 格陣列控制器 R D 行解 碼器 C D 0 c D 3 - :列解 碼 器 D Q D Q 緩衝器 B L a B L d - :中區 塊 S E L -- -- 區塊選擇器 S A 感測 放大器 N 1 N 4 一- 一: Ν通道Μ 0 S電 晶體 D B S A M P • — :資料 匯 流排 感測放大 D B w B F 一 --: 資料匯流排寫入緩衝器 C I 1 C I 7 - :同步 反 相器 L A 閂鎖 電路 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -- 3〇9β57五、發明説明(Ή )EX-----:排他〇 R電路 ----^---i---〆 \------訂-------ξ I (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(2l〇X 297公釐) -lr -, 1T S09657 V. Description of invention (70) A7 B7 Printed by the Employee Consumer Cooperative of the Central Standard Falcon Bureau of the Ministry of Economic Affairs 4 3 = Column decoder 4 4 a> 4 4 b-: Character line 4 5 a »4 5 b- : Data line 4 6 ai 4 6 b--• switch 4 7 a »4 7 b-: register 4 8 a> 4 8 b-: column selection switch 4 9 = column selection line 5 0 — 0 5 0-~ η ---: Local DQ line pair 5 1 — 0 5 1--η ---: Overall DQ line pair 1 0 0: Test switching circuit 2 0 0: Test output circuit CAL »CAR-- : Memory grid array (Small block: CAC grid array controller RD row decoder CD 0 c D 3-: Column decoder DQDQ buffer BL a BL d-: Middle block SEL--Block selector SA sense Sense amplifier N 1 N 4 one-one: N channel Μ 0 S transistor DBSAMP • —: data bus sense amplifier DB w BF one-: data bus write buffer CI 1 CI 7-: synchronous inversion Device LA latch circuit (please read the precautions on the back before filling this page) The Zhang scale applies the Chinese National Standard (CNS) A4 specification (210X 297mm)-3〇9β57 V. Description of invention (Ή) EX -----: Exclusive 〇R circuit ---- ^ --- i- --〆 \ ------ Subscribe ------- ξ I (Please read the precautions on the back before filling in this page) The paper standard printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs is applicable to the Chinese national standard (CNS) A4 specification (2l〇X 297mm) -lr-
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KR100363079B1 (en) * | 1999-02-01 | 2002-11-30 | 삼성전자 주식회사 | Multi-bank memory device having shared IO sense amplifier by adjacent memory banks |
DE19960557B4 (en) * | 1999-12-15 | 2006-09-07 | Infineon Technologies Ag | Integrated dynamic semiconductor memory with time-controlled read access |
DE19960558B4 (en) * | 1999-12-15 | 2008-07-24 | Qimonda Ag | Random Access Memory Type Random Access Memory (DRAM) |
JP4540889B2 (en) * | 2001-07-09 | 2010-09-08 | 富士通セミコンダクター株式会社 | Semiconductor memory |
KR100451466B1 (en) * | 2002-10-31 | 2004-10-08 | 주식회사 하이닉스반도체 | Memory device in Semiconductor for enhancing ability of test |
CN102522116B (en) * | 2003-03-18 | 2014-07-09 | 株式会社东芝 | Programmable resistance memory device |
KR100929826B1 (en) * | 2008-06-04 | 2009-12-07 | 주식회사 하이닉스반도체 | Semiconductor memory device |
KR101060899B1 (en) | 2009-12-23 | 2011-08-30 | 주식회사 하이닉스반도체 | Semiconductor memory device and operation method thereof |
KR20140008766A (en) * | 2012-07-11 | 2014-01-22 | 에스케이하이닉스 주식회사 | Semiconductor memory device |
KR102076196B1 (en) * | 2015-04-14 | 2020-02-12 | 에스케이하이닉스 주식회사 | Memory system, memory module and operation method of the same |
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