TW290645B - - Google Patents

Info

Publication number
TW290645B
TW290645B TW085103546A TW85103546A TW290645B TW 290645 B TW290645 B TW 290645B TW 085103546 A TW085103546 A TW 085103546A TW 85103546 A TW85103546 A TW 85103546A TW 290645 B TW290645 B TW 290645B
Authority
TW
Taiwan
Application number
TW085103546A
Original Assignee
Tokyo Electron Tohoku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7086177A external-priority patent/JPH08262091A/ja
Priority claimed from JP7086176A external-priority patent/JPH08262090A/ja
Priority claimed from JP7091766A external-priority patent/JPH08264619A/ja
Application filed by Tokyo Electron Tohoku Kk filed Critical Tokyo Electron Tohoku Kk
Application granted granted Critical
Publication of TW290645B publication Critical patent/TW290645B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW085103546A 1995-03-18 1996-03-25 TW290645B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7086177A JPH08262091A (ja) 1995-03-18 1995-03-18 検査装置
JP7086176A JPH08262090A (ja) 1995-03-18 1995-03-18 液晶表示体用基板の検査装置
JP7091766A JPH08264619A (ja) 1995-03-24 1995-03-24 搬送装置及びこの搬送装置を有する検査装置
JP10001995 1995-03-31

Publications (1)

Publication Number Publication Date
TW290645B true TW290645B (zh) 1996-11-11

Family

ID=27467230

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085103546A TW290645B (zh) 1995-03-18 1996-03-25

Country Status (3)

Country Link
US (1) US5742173A (zh)
TW (1) TW290645B (zh)
WO (1) WO1996029607A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427295B (zh) * 2007-09-21 2014-02-21 Tokyo Electron Ltd Probe device and detection method
TWI451103B (zh) * 2009-09-03 2014-09-01 Applied Materials Inc 測試設備與相關方法
TWI550373B (zh) * 2011-11-14 2016-09-21 鴻海精密工業股份有限公司 自動更換測針系統及方法

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6009187A (en) * 1996-12-02 1999-12-28 Motorola, Inc. Wafer prober having an emissive display inspection system and method of use
JP3430015B2 (ja) * 1998-05-20 2003-07-28 東京エレクトロン株式会社 信頼性試験システム
TW518705B (en) * 2000-12-27 2003-01-21 Tokyo Electron Ltd Workpiece transfer system, transfer method, vacuum chuck, and wafer centering method
US7457680B2 (en) * 2000-12-27 2008-11-25 Tokyo Electron Limited Conveyance method for transporting objects
KR100710149B1 (ko) * 2000-12-28 2007-04-20 엘지.필립스 엘시디 주식회사 액정표시소자
US20020135395A1 (en) * 2001-02-08 2002-09-26 Pete Smith System and method for testing a display device
US20020152046A1 (en) * 2001-04-13 2002-10-17 Velichko Sergey A. Concurrent control of semiconductor parametric testing
US6933738B2 (en) * 2001-07-16 2005-08-23 Formfactor, Inc. Fiducial alignment marks on microelectronic spring contacts
US6781394B1 (en) * 2001-10-22 2004-08-24 Electroglas, Inc. Testing circuits on substrate
US6771060B1 (en) 2001-10-22 2004-08-03 Electroglas, Inc. Testing circuits on substrates
US6861859B1 (en) * 2001-10-22 2005-03-01 Electroglas, Inc. Testing circuits on substrates
TW531776B (en) * 2002-03-21 2003-05-11 Nanya Technology Corp Metal pad structure suitable for connection pad and inspection pad
US7162386B2 (en) * 2002-04-25 2007-01-09 Micron Technology, Inc. Dynamically adaptable semiconductor parametric testing
KR100489522B1 (ko) * 2002-06-04 2005-05-16 참이앤티 주식회사 평면디스플레이 검사장치
DE10227332A1 (de) * 2002-06-19 2004-01-15 Akt Electron Beam Technology Gmbh Ansteuervorrichtung mit verbesserten Testeneigenschaften
KR100928917B1 (ko) 2002-09-26 2009-11-30 엘지디스플레이 주식회사 액정 패널의 제전방법 및 이를 이용한 횡전계방식 액정패널의 제조방법
US7275577B2 (en) 2002-11-16 2007-10-02 Lg.Philips Lcd Co., Ltd. Substrate bonding machine for liquid crystal display device
TWI257515B (en) * 2002-11-16 2006-07-01 Lg Philips Lcd Co Ltd Substrate bonding apparatus for liquid crystal display device
KR100720447B1 (ko) * 2002-11-16 2007-05-22 엘지.필립스 엘시디 주식회사 액정표시소자용 기판 합착 장치
DE10253717B4 (de) * 2002-11-18 2011-05-19 Applied Materials Gmbh Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten
US7010451B2 (en) * 2003-04-17 2006-03-07 Micron Technology, Inc. Dynamic creation and modification of wafer test maps during wafer testing
JP4339631B2 (ja) * 2003-06-20 2009-10-07 東京エレクトロン株式会社 検査方法及び検査装置
JP4073372B2 (ja) * 2003-07-24 2008-04-09 シャープ株式会社 表示モジュールの検査装置
JP4647197B2 (ja) * 2003-09-17 2011-03-09 東京エレクトロン株式会社 被処理体の搬送方法及びコンピュータ読取可能な記憶媒体
US20060038554A1 (en) * 2004-02-12 2006-02-23 Applied Materials, Inc. Electron beam test system stage
US6833717B1 (en) * 2004-02-12 2004-12-21 Applied Materials, Inc. Electron beam test system with integrated substrate transfer module
US7355418B2 (en) * 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
US7319335B2 (en) * 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
KR100621627B1 (ko) * 2004-05-28 2006-09-19 삼성전자주식회사 웨이퍼 테스트 설비 및 그 설비의 정렬 방법
US20090169342A1 (en) * 2004-06-21 2009-07-02 Takehiko Yoshimura Load port
US9010384B2 (en) 2004-06-21 2015-04-21 Right Mfg. Co. Ltd. Load port
JP4413130B2 (ja) * 2004-11-29 2010-02-10 Ｏｋｉセミコンダクタ株式会社 プローブカードを用いた半導体素子の検査方法およびその検査方法により検査した半導体装置
US7535238B2 (en) * 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
US20060273815A1 (en) * 2005-06-06 2006-12-07 Applied Materials, Inc. Substrate support with integrated prober drive
CN1956650A (zh) * 2005-10-28 2007-05-02 鸿富锦精密工业（深圳）有限公司 贴片机供料器校正系统及方法
JP5829376B2 (ja) * 2006-03-14 2015-12-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ マルチカラム電子ビーム検査システムにおけるクロストークの軽減方法
US7602199B2 (en) * 2006-05-31 2009-10-13 Applied Materials, Inc. Mini-prober for TFT-LCD testing
JP4451416B2 (ja) * 2006-05-31 2010-04-14 東京エレクトロン株式会社 プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置
US7786742B2 (en) * 2006-05-31 2010-08-31 Applied Materials, Inc. Prober for electronic device testing on large area substrates
JP5018183B2 (ja) * 2007-03-30 2012-09-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
US20080251019A1 (en) * 2007-04-12 2008-10-16 Sriram Krishnaswami System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
JP5120017B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
US8922229B2 (en) 2009-06-22 2014-12-30 Cascade Microtech, Inc. Method for measurement of a power device
CN102590566B (zh) * 2012-03-16 2014-06-04 苏州工业园区世纪福科技有限公司 一种电子产品测试夹具的自动对准方法
CN102933013B (zh) * 2012-10-29 2015-09-02 深圳市华星光电技术有限公司 一种堆垛机及静电消除装置
CN104464583B (zh) * 2014-12-09 2018-05-25 合肥鑫晟光电科技有限公司 一种点灯检测装置以及方法
GB2545496B (en) 2015-12-18 2020-06-03 Teraview Ltd A Test System
EP3800477A1 (en) * 2019-10-04 2021-04-07 Afore Oy Testing device and method for electrically testing an integrated circuit

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
JPH0265150A (ja) * 1988-08-30 1990-03-05 Fujitsu Ltd プローブカードの自動位置合せ方法
JPH03209737A (ja) * 1990-01-11 1991-09-12 Tokyo Electron Ltd プローブ装置
JP2913609B2 (ja) * 1991-03-08 1999-06-28 東京エレクトロン株式会社 プロービング装置、プロービング方法およびプローブカード
JP3245227B2 (ja) * 1992-08-03 2002-01-07 東京エレクトロン株式会社 プローブ装置
JPH0691550A (ja) * 1992-09-14 1994-04-05 Hitachi Ltd 吸着ベース
US5479108A (en) * 1992-11-25 1995-12-26 David Cheng Method and apparatus for handling wafers
JP3401702B2 (ja) * 1993-03-22 2003-04-28 高砂熱学工業株式会社 帯電物品の中和装置
JP2842986B2 (ja) * 1993-12-17 1999-01-06 シャープ株式会社 搬送装置
JPH08124978A (ja) * 1994-10-21 1996-05-17 Hitachi Ltd プローバ装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427295B (zh) * 2007-09-21 2014-02-21 Tokyo Electron Ltd Probe device and detection method
TWI451103B (zh) * 2009-09-03 2014-09-01 Applied Materials Inc 測試設備與相關方法
US9412898B2 (en) 2009-09-03 2016-08-09 Applied Materials, Inc. Apparatus and method of testing a substrate using a supporting nest and testing probes
TWI550290B (zh) * 2009-09-03 2016-09-21 應用材料股份有限公司 用於電子裝置的測試設備
TWI550373B (zh) * 2011-11-14 2016-09-21 鴻海精密工業股份有限公司 自動更換測針系統及方法

Also Published As

Publication number Publication date
US5742173A (en) 1998-04-21
WO1996029607A1 (fr) 1996-09-26

Similar Documents

Publication Publication Date Title
DE69638352D1 (zh)
TW290645B (zh)
DE69637714D1 (zh)
IN185967B (zh)
IN182209B (zh)
IN187594B (zh)
IN187543B (zh)
DK143195A (zh)
ECSDI950232S (zh)
EP0742644A3 (zh)
DK0727898T3 (zh)
FR2729315B1 (zh)
IN183380B (zh)
ECSDI950231S (zh)
IN186700B (zh)
IN188365B (zh)
IN185966B (zh)
IN188366B (zh)
IN182796B (zh)
IN188239B (zh)
IN181317B (zh)
DK126096A (zh)
IN188213B (zh)
ECSDI950223S (zh)
ECSDI950229S (zh)