TW288172B - - Google Patents

Info

Publication number
TW288172B
TW288172B TW085101689A TW85101689A TW288172B TW 288172 B TW288172 B TW 288172B TW 085101689 A TW085101689 A TW 085101689A TW 85101689 A TW85101689 A TW 85101689A TW 288172 B TW288172 B TW 288172B
Authority
TW
Taiwan
Application number
TW085101689A
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4634295A external-priority patent/JPH08222522A/ja
Priority claimed from JP05197095A external-priority patent/JP3980663B2/ja
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW288172B publication Critical patent/TW288172B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
TW085101689A 1995-02-10 1996-02-10 TW288172B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4634295A JPH08222522A (ja) 1995-02-10 1995-02-10 熱処理方法及びその装置
JP05197095A JP3980663B2 (ja) 1995-02-16 1995-02-16 熱処理方法

Publications (1)

Publication Number Publication Date
TW288172B true TW288172B (zh) 1996-10-11

Family

ID=26386449

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101689A TW288172B (zh) 1995-02-10 1996-02-10

Country Status (4)

Country Link
US (1) US6322631B1 (zh)
KR (1) KR100407412B1 (zh)
TW (1) TW288172B (zh)
WO (1) WO1996024949A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406553B1 (en) * 1999-08-03 2002-06-18 Applied Materials, Inc. Method to reduce contaminants from semiconductor wafers
JP4535499B2 (ja) * 2005-04-19 2010-09-01 東京エレクトロン株式会社 加熱装置、塗布、現像装置及び加熱方法
US20070084406A1 (en) * 2005-10-13 2007-04-19 Joseph Yudovsky Reaction chamber with opposing pockets for gas injection and exhaust
US20070084408A1 (en) * 2005-10-13 2007-04-19 Applied Materials, Inc. Batch processing chamber with diffuser plate and injector assembly
JP2007201128A (ja) * 2006-01-26 2007-08-09 Sumitomo Electric Ind Ltd 半導体製造装置用ウエハ保持体及び半導体製造装置
WO2007099490A1 (en) * 2006-02-28 2007-09-07 Nxp B.V. Processing assembly and method for processing a batch of wafers
US8287648B2 (en) * 2009-02-09 2012-10-16 Asm America, Inc. Method and apparatus for minimizing contamination in semiconductor processing chamber
JP5504793B2 (ja) * 2009-09-26 2014-05-28 東京エレクトロン株式会社 熱処理装置及び冷却方法
JP5394292B2 (ja) * 2010-03-12 2014-01-22 東京エレクトロン株式会社 縦型熱処理装置および圧力検知システムと温度センサの組合体
US9513003B2 (en) * 2010-08-16 2016-12-06 Purpose Company Limited Combustion apparatus, method for combustion control, board, combustion control system and water heater
JP5732284B2 (ja) * 2010-08-27 2015-06-10 株式会社ニューフレアテクノロジー 成膜装置および成膜方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122123A (ja) * 1985-11-21 1987-06-03 Toshiba Corp 縦型熱処理装置
US4857689A (en) 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
JPH0517879Y2 (zh) * 1988-12-14 1993-05-13
JPH04118925A (ja) * 1990-09-10 1992-04-20 Fujitsu Ltd 複合型処理装置
JPH06103717B2 (ja) * 1991-07-23 1994-12-14 国際電気株式会社 縦型ｃｖｄ・拡散装置
JP3451097B2 (ja) 1991-08-16 2003-09-29 東京エレクトロン株式会社 熱処理装置
JP3179806B2 (ja) 1991-08-16 2001-06-25 東京エレクトロン株式会社 熱処理方法および熱処理装置
US5536918A (en) 1991-08-16 1996-07-16 Tokyo Electron Sagami Kabushiki Kaisha Heat treatment apparatus utilizing flat heating elements for treating semiconductor wafers
JP3138304B2 (ja) 1991-10-28 2001-02-26 東京エレクトロン株式会社 熱処理装置
JP3119708B2 (ja) 1991-12-18 2000-12-25 東京エレクトロン株式会社 熱処理装置および熱処理方法
US5429498A (en) 1991-12-13 1995-07-04 Tokyo Electron Sagami Kabushiki Kaisha Heat treatment method and apparatus thereof
JP3218488B2 (ja) 1993-03-16 2001-10-15 東京エレクトロン株式会社 処理装置
JP3190165B2 (ja) 1993-04-13 2001-07-23 東京エレクトロン株式会社 縦型熱処理装置及び熱処理方法
JP3320505B2 (ja) * 1993-06-11 2002-09-03 東京エレクトロン株式会社 熱処理装置及びその方法
US5571010A (en) 1993-06-18 1996-11-05 Tokyo Electron Kabushiki Kaisha Heat treatment method and apparatus
JP3501524B2 (ja) * 1994-07-01 2004-03-02 東京エレクトロン株式会社 処理装置の真空排気システム
US6036482A (en) * 1995-02-10 2000-03-14 Tokyo Electron Limited Heat treatment method

Also Published As

Publication number Publication date
KR19980702037A (ko) 1998-07-15
US6322631B1 (en) 2001-11-27
KR100407412B1 (ko) 2004-03-24
WO1996024949A1 (fr) 1996-08-15

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