TW283242B - Laminating type molded coil - Google Patents

Abstract

A laminating type molded coil having the same quality which requires no molding box in molding it is realized by simple processes. The laminating type molded coil of the present invention comprises at least more than one coil substrate in which coils are formed on both sides of an insulating substrate by a printed wiring technology, resin sheets which are formed into a sheet by hardening a resin material and which are laminated on both sides of the coil substrate, and coated insulating layers disposed on the surfaces of the most outside of the lamination, and these are integrated by filling gaps between the layers and between the coils with the resin composing the resin sheet. A method for fabricating a laminating type molded coil comprises steps of forming coils on both sides of an insulating substrate by a printed wiring technology, laminating resin sheets formed into a sheet by hardening a resin material on both sides of at least more than one coil substrate obtained from the previous step, placing cover sheets which turn out to be coated insulating layers on the surfaces which are the most outside of the lamination, and heating and pressuring them to fill the gaps between the layers and between the coils with the resin composing the resin sheet to integrate them. According to the present invention, because a coil pattern whose shape is predeterminedand a pattern of lead wire and others are formed on the coil substrate by the printed wiring technology, the thickness of those patterns (conductors) may thinned down and the gap between the coil patterns may be narrowed down. When the resin sheet is heated and pressurized, the resin material composing the sheet easily percolate the gaps between the coil patterns and between the coil pattern and coated insulating layer. The resin is soon hardened, thus integrating each of the coil substrates, cover sheets and others.