TW280983B - - Google Patents
Info
- Publication number
- TW280983B TW280983B TW084110485A TW84110485A TW280983B TW 280983 B TW280983 B TW 280983B TW 084110485 A TW084110485 A TW 084110485A TW 84110485 A TW84110485 A TW 84110485A TW 280983 B TW280983 B TW 280983B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Adhesive Tape Dispensing Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24279094A JP3206331B2 (en) | 1994-10-06 | 1994-10-06 | Apparatus for attaching anisotropic conductive tape and method for attaching anisotropic conductive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW280983B true TW280983B (en) | 1996-07-11 |
Family
ID=17094337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084110485A TW280983B (en) | 1994-10-06 | 1995-10-05 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3206331B2 (en) |
| KR (1) | KR100293893B1 (en) |
| TW (1) | TW280983B (en) |
| WO (1) | WO1996011494A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104221487A (en) * | 2012-04-18 | 2014-12-17 | 富士机械制造株式会社 | Automatic splicing device |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000015583A (en) * | 1998-08-31 | 2000-03-15 | 김규현 | Circuit film and elastomer tape adhesion apparatus for fabricating a semiconductor package |
| KR20000015592A (en) * | 1998-08-31 | 2000-03-15 | 김규현 | Adhesion apparatus of circuit tape and wafer for semiconductor package |
| KR100370847B1 (en) * | 1998-08-31 | 2003-07-10 | 앰코 테크놀로지 코리아 주식회사 | Lamination device and method of wafer and circuit tape for manufacturing semiconductor package |
| JP3704502B2 (en) | 2002-01-15 | 2005-10-12 | 松下電器産業株式会社 | A pressure-sensitive adhesive sheet sticking apparatus, a pressure-sensitive adhesive sheet sticking method, a component mounting machine, and a display panel manufacturing method. |
| KR100861507B1 (en) * | 2002-04-15 | 2008-10-02 | 삼성테크윈 주식회사 | An apparatus and method for attatching film circuit substrate to carrier frame |
| JP4137725B2 (en) | 2002-07-10 | 2008-08-20 | 松下電器産業株式会社 | Method and apparatus for determining processing dimension of joining member |
| JP4546820B2 (en) * | 2004-12-24 | 2010-09-22 | 立山マシン株式会社 | Film sticking device |
| KR100802660B1 (en) * | 2006-02-28 | 2008-02-13 | 주식회사 탑 엔지니어링 | Tape guide adjusting device of bonding machine |
| JP2007302398A (en) * | 2006-05-11 | 2007-11-22 | Matsushita Electric Ind Co Ltd | Device and method for affixing joining sheet |
| JP4607815B2 (en) * | 2006-05-11 | 2011-01-05 | パナソニック株式会社 | Joining sheet affixing device and method |
| JP4392766B2 (en) * | 2007-08-21 | 2010-01-06 | 株式会社日立ハイテクノロジーズ | ACF pasting device |
| JP5266582B2 (en) * | 2008-12-26 | 2013-08-21 | Ｎｌｔテクノロジー株式会社 | ACF sticking device and display device manufacturing method |
| JP2012119418A (en) | 2010-11-30 | 2012-06-21 | Hitachi High-Technologies Corp | Conductive film pasting apparatus, crystal-type solar cell module assembly apparatus, and connection method of crystal-type solar cell |
| KR20210050622A (en) | 2019-10-28 | 2021-05-10 | 삼성디스플레이 주식회사 | Method of manufacturing display device, display device manufactured by the same, and acf attaching apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02293721A (en) * | 1989-05-08 | 1990-12-04 | Sharp Corp | Method for sticking anisotropic conductive film |
| JP3045427B2 (en) * | 1992-06-22 | 2000-05-29 | ソニー株式会社 | Method and apparatus for attaching anisotropic conductive film |
| JP2769263B2 (en) * | 1992-06-22 | 1998-06-25 | ケル株式会社 | Method and apparatus for producing anisotropic adhesive tape for transfer |
| KR100706601B1 (en) * | 2003-12-03 | 2007-04-11 | 한국전자통신연구원 | MPEG-7 metadata to MPEG-4 XMT OCI or MPEG-4 XMT to MPEG-7 metadata transforming apparatus |
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1994
- 1994-10-06 JP JP24279094A patent/JP3206331B2/en not_active Expired - Fee Related
-
1995
- 1995-10-04 KR KR1019970702271A patent/KR100293893B1/en not_active IP Right Cessation
- 1995-10-04 WO PCT/JP1995/002019 patent/WO1996011494A1/en active IP Right Grant
- 1995-10-05 TW TW084110485A patent/TW280983B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104221487A (en) * | 2012-04-18 | 2014-12-17 | 富士机械制造株式会社 | Automatic splicing device |
| CN104221487B (en) * | 2012-04-18 | 2017-03-01 | 富士机械制造株式会社 | Automatic splicing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3206331B2 (en) | 2001-09-10 |
| KR100293893B1 (en) | 2001-11-30 |
| JPH08107268A (en) | 1996-04-23 |
| WO1996011494A1 (en) | 1996-04-18 |
| KR970706600A (en) | 1997-11-03 |