TW278206B - - Google Patents

Info

Publication number
TW278206B
TW278206B TW083109549A TW83109549A TW278206B TW 278206 B TW278206 B TW 278206B TW 083109549 A TW083109549 A TW 083109549A TW 83109549 A TW83109549 A TW 83109549A TW 278206 B TW278206 B TW 278206B
Authority
TW
Taiwan
Application number
TW083109549A
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials Research Corp filed Critical Materials Research Corp
Application granted granted Critical
Publication of TW278206B publication Critical patent/TW278206B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3473—Composition uniformity or desired gradient

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
TW083109549A 1994-03-28 1994-10-14 TW278206B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21873194A 1994-03-28 1994-03-28

Publications (1)

Publication Number Publication Date
TW278206B true TW278206B (zh) 1996-06-11

Family

ID=22816287

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083109549A TW278206B (zh) 1994-03-28 1994-10-14

Country Status (8)

Country Link
EP (1) EP0753201B1 (zh)
JP (1) JPH09512588A (zh)
KR (1) KR100326506B1 (zh)
AU (1) AU1263395A (zh)
CA (1) CA2186505A1 (zh)
DE (1) DE69418729T2 (zh)
TW (1) TW278206B (zh)
WO (1) WO1995026566A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5985581B2 (ja) * 2014-11-05 2016-09-06 株式会社東芝 処理装置及びコリメータ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001825B1 (ko) * 1984-11-14 1990-03-24 가부시끼가이샤 히다찌세이사꾸쇼 성막 지향성을 고려한 스퍼터링장치
US4824544A (en) * 1987-10-29 1989-04-25 International Business Machines Corporation Large area cathode lift-off sputter deposition device
JP2627651B2 (ja) * 1988-10-17 1997-07-09 アネルバ株式会社 マグネトロンスパッタリング装置
US5130005A (en) * 1990-10-31 1992-07-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
EP0440377B1 (en) * 1990-01-29 1998-03-18 Varian Associates, Inc. Collimated deposition apparatus and method

Also Published As

Publication number Publication date
AU1263395A (en) 1995-10-17
CA2186505A1 (en) 1995-10-05
JPH09512588A (ja) 1997-12-16
EP0753201B1 (en) 1999-05-26
KR970702570A (ko) 1997-05-13
DE69418729T2 (de) 1999-12-30
WO1995026566A1 (en) 1995-10-05
DE69418729D1 (de) 1999-07-01
EP0753201A1 (en) 1997-01-15
KR100326506B1 (ko) 2002-06-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees