TW273601B - - Google Patents

Info

Publication number
TW273601B
TW273601B TW082107397A TW82107397A TW273601B TW 273601 B TW273601 B TW 273601B TW 082107397 A TW082107397 A TW 082107397A TW 82107397 A TW82107397 A TW 82107397A TW 273601 B TW273601 B TW 273601B
Authority
TW
Taiwan
Application number
TW082107397A
Original Assignee
Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics Nv filed Critical Philips Electronics Nv
Application granted granted Critical
Publication of TW273601B publication Critical patent/TW273601B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemically Coating (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
TW082107397A 1992-09-09 1993-09-09 TW273601B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92202730 1992-09-09

Publications (1)

Publication Number Publication Date
TW273601B true TW273601B (zh) 1996-04-01

Family

ID=8210902

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082107397A TW273601B (zh) 1992-09-09 1993-09-09

Country Status (4)

Country Link
US (1) US5378502A (zh)
JP (1) JP3288153B2 (zh)
DE (1) DE69319517T2 (zh)
TW (1) TW273601B (zh)

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US6531591B1 (en) 1999-07-07 2003-03-11 Exiqon A/S Synthesis of stable quinone and photoreactive ketone phosphoramidite reagents for solid phase synthesis of photoreactive-oligomer conjugates
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US6882782B2 (en) * 2000-11-01 2005-04-19 Schott Glas Photonic devices for optical and optoelectronic information processing
US6899999B2 (en) 2001-03-28 2005-05-31 Kabushiki Kaisha Toshiba Method of manufacturing composite member, photosensitive composition, porous base material, insulating body and composite member
US6673287B2 (en) * 2001-05-16 2004-01-06 International Business Machines Corporation Vapor phase surface modification of composite substrates to form a molecularly thin release layer
US6969541B2 (en) * 2001-07-25 2005-11-29 Heidelberger Druckmaschinen Ag Method and device for structuring a surface to form hydrophilic and hydrophobic regions
KR100473800B1 (ko) * 2001-09-12 2005-03-07 학교법인 포항공과대학교 저에너지 전자빔을 이용하는 고정밀 패턴 형성 방법
KR100473799B1 (ko) * 2001-09-12 2005-03-07 학교법인 포항공과대학교 나노미터 수준의 고정밀 패턴 형성방법
KR100845256B1 (ko) * 2001-12-24 2008-07-10 엘지디스플레이 주식회사 액정표시소자의 제조방법
JP3698138B2 (ja) * 2001-12-26 2005-09-21 セイコーエプソン株式会社 撥水化処理の方法、薄膜形成方法及びこの方法を用いた有機ｅｌ装置の製造方法、有機ｅｌ装置、電子機器
US6955725B2 (en) * 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US7581511B2 (en) * 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
JP3949118B2 (ja) * 2004-03-12 2007-07-25 ジーエルサイエンス株式会社 マイクロチップ
US8133554B2 (en) * 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US7699932B2 (en) 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
EP1670298A1 (en) * 2004-12-07 2006-06-14 Samsung SDI Germany GmbH Substrate for a display and method for manufacturing the same
US20060135028A1 (en) * 2004-12-07 2006-06-22 Andreas Klyszcz Substrate for a display and method for manufacturing the same
JP4797701B2 (ja) * 2006-03-02 2011-10-19 日立化成工業株式会社 感放射線性組成物
JP2007246417A (ja) * 2006-03-14 2007-09-27 Canon Inc 感光性シランカップリング剤、表面修飾方法、パターン形成方法およびデバイスの製造方法
US7416991B2 (en) * 2006-05-11 2008-08-26 Hitachi Global Storage Technologies Netherlands B. V. High resolution patterning of surface energy utilizing high resolution monomolecular resist for fabrication of patterned media masters
JP5132117B2 (ja) * 2006-10-10 2013-01-30 キヤノン株式会社 パターン形成方法
JP2008244139A (ja) * 2007-03-27 2008-10-09 Hioki Ee Corp 金属パターンの電気回路板
US8323172B2 (en) * 2008-05-02 2012-12-04 Civatech Oncology Brachytherapy devices and related methods and computer program products
DE102008046707A1 (de) * 2008-09-11 2010-03-18 Universität Bielefeld Vollständig vernetzte chemisch strukturierte Monoschichten
WO2011036816A1 (ja) * 2009-09-28 2011-03-31 株式会社 東芝 パターン形成方法
US8354333B2 (en) * 2010-02-03 2013-01-15 International Business Machines Corporation Patterned doping of semiconductor substrates using photosensitive monolayers
KR101401803B1 (ko) * 2010-02-26 2014-05-29 가부시키가이샤 니콘 패턴 형성 방법
ITMI20110363A1 (it) * 2011-03-09 2012-09-10 Cretec Co Ltd Metodo per ricavare un percorso conduttivo mediante irradiazione laser
JP2015089951A (ja) * 2013-11-05 2015-05-11 キヤノン・コンポーネンツ株式会社 金属皮膜付物品及びその製造方法並びに配線板
US10787574B2 (en) 2014-02-28 2020-09-29 Melior Innovations, Inc. Polymer derived ceramic effects particles, uses and methods of making
TWI550131B (zh) * 2015-09-18 2016-09-21 Triumphant Gate Ltd The circuit of the substrate directly forms the system
CN107708320A (zh) * 2016-08-08 2018-02-16 凯基有限公司 基板的电路直接形成系统
EP3589709A4 (en) * 2016-09-09 2021-08-18 Melior Innovations Inc. SURFACE EFFECT POLYMER-DERIVED CERAMICS, METHODS, MATERIALS AND USES

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US4690838A (en) * 1986-08-25 1987-09-01 International Business Machines Corporation Process for enhancing the resistance of a resist image to reactive ion etching and to thermal flow
US5079600A (en) * 1987-03-06 1992-01-07 Schnur Joel M High resolution patterning on solid substrates
JPH0234984A (ja) * 1988-04-13 1990-02-05 Mitsubishi Electric Corp プリント回路基板の製造方法
US4996074A (en) * 1988-11-14 1991-02-26 The Procter & Gamble Company Tailored beta-prime stable triglyceride hardstock
DE69016076T2 (de) * 1989-04-03 1995-06-01 Fuji Photo Film Co Ltd Verfahren zur Behandlung einer Metallfläche.
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JP2603148B2 (ja) * 1990-06-08 1997-04-23 三菱電機株式会社 パターン形成方法
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Also Published As

Publication number Publication date
DE69319517D1 (de) 1998-08-13
JP3288153B2 (ja) 2002-06-04
JPH06202343A (ja) 1994-07-22
DE69319517T2 (de) 1999-02-25
US5378502A (en) 1995-01-03

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