TW270233B - - Google Patents

Info

Publication number
TW270233B
TW270233B TW084104516A TW84104516A TW270233B TW 270233 B TW270233 B TW 270233B TW 084104516 A TW084104516 A TW 084104516A TW 84104516 A TW84104516 A TW 84104516A TW 270233 B TW270233 B TW 270233B
Authority
TW
Taiwan
Application number
TW084104516A
Other languages
Chinese (zh)
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TW270233B publication Critical patent/TW270233B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4916Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
    • H01L29/4925Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement
    • H01L29/4933Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with a silicide layer contacting the silicon layer, e.g. Polycide gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW084104516A 1994-03-17 1995-05-06 TW270233B (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6046674A JPH07263674A (ja) 1994-03-17 1994-03-17 電界効果型半導体装置とその製造方法

Publications (1)

Publication Number Publication Date
TW270233B true TW270233B (hu) 1996-02-11

Family

ID=12753928

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084104516A TW270233B (hu) 1994-03-17 1995-05-06

Country Status (3)

Country Link
JP (1) JPH07263674A (hu)
KR (1) KR0185461B1 (hu)
TW (1) TW270233B (hu)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5958508A (en) * 1997-03-31 1999-09-28 Motorlola, Inc. Process for forming a semiconductor device
JPH10308454A (ja) * 1997-05-02 1998-11-17 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6284636B1 (en) 2000-01-21 2001-09-04 Advanced Micro Devices, Inc. Tungsten gate method and apparatus
US6277744B1 (en) 2000-01-21 2001-08-21 Advanced Micro Devices, Inc. Two-level silane nucleation for blanket tungsten deposition
US6274472B1 (en) 2000-01-21 2001-08-14 Advanced Micro Devices, Inc. Tungsten interconnect method
KR100745604B1 (ko) * 2006-07-03 2007-08-02 삼성전자주식회사 반도체 소자 및 그 형성 방법

Also Published As

Publication number Publication date
KR0185461B1 (ko) 1999-03-20
JPH07263674A (ja) 1995-10-13
KR950028175A (ko) 1995-10-18

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