TW269080B - Infrared rays receiver - Google Patents
Infrared rays receiverInfo
- Publication number
- TW269080B TW269080B TW84107207A TW84107207A TW269080B TW 269080 B TW269080 B TW 269080B TW 84107207 A TW84107207 A TW 84107207A TW 84107207 A TW84107207 A TW 84107207A TW 269080 B TW269080 B TW 269080B
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring pattern
- pin hold
- hold diode
- solidified
- connect
- Prior art date
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 230000005669 field effect Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Light Receiving Elements (AREA)
- Optical Communication System (AREA)
Abstract
This invention provides one light receiving device which can receive light signal in high sensitivity. On the wiring pattern of circuit substrate 20 surface, in which it has been formed 4 chipped pin hold diode PD1-4 setting inside with silver pasted and solidified alone with electric connecting. To connect pin hold diode PD1-4 surface and the others wiring pattern 16 of closely wired with wire bonding method, also to have wiring pattern go through condenser C5, C7 to connect in short distance with field effect transistors FET 1 and FET 2 gate closely. Besides, it will set up one frame 24 to surround pin hold diode PD1-4 and fill in resin of good penetratability infrared to make it solidified.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6321713A JP2858088B2 (en) | 1994-11-30 | 1994-11-30 | Light receiving device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW269080B true TW269080B (en) | 1996-01-21 |
Family
ID=18135612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW84107207A TW269080B (en) | 1994-11-30 | 1995-07-12 | Infrared rays receiver |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2858088B2 (en) |
CN (1) | CN1123975A (en) |
GB (1) | GB2295727A (en) |
TW (1) | TW269080B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112840171A (en) * | 2018-10-19 | 2021-05-25 | 三菱电机株式会社 | Bathroom drier |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2302995A (en) * | 1995-06-29 | 1997-02-05 | John Michael Walmsley Lawrence | Electromagnetic shielding of components on a circuit board |
CN100435342C (en) * | 2005-04-15 | 2008-11-19 | 业程科技股份有限公司 | Contact image display structure |
EP1643556A3 (en) * | 2006-01-16 | 2006-11-22 | Elec Vision Inc. | Contact image capturing structure |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52138888A (en) * | 1976-05-14 | 1977-11-19 | Nec Corp | Photo detector |
GB2126795B (en) * | 1982-09-09 | 1986-12-03 | Plessey Co Plc | Optical device |
JPH0695578B2 (en) * | 1984-04-13 | 1994-11-24 | 浜松ホトニクス株式会社 | Semiconductor photo detector |
JPS6430861U (en) * | 1987-08-19 | 1989-02-27 | ||
JPH01107118A (en) * | 1987-10-20 | 1989-04-25 | Yokogawa Electric Corp | Semiconductor apparatus for measuring light power |
JPH04290477A (en) * | 1991-03-19 | 1992-10-15 | Fujitsu Ltd | Semiconductor device and its mounting structure |
GB9225274D0 (en) * | 1992-12-03 | 1993-01-27 | Int Computers Ltd | Electronic circuit assemblies |
-
1994
- 1994-11-30 JP JP6321713A patent/JP2858088B2/en not_active Expired - Lifetime
-
1995
- 1995-06-26 CN CN 95107824 patent/CN1123975A/en active Pending
- 1995-07-07 GB GB9513859A patent/GB2295727A/en not_active Withdrawn
- 1995-07-12 TW TW84107207A patent/TW269080B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112840171A (en) * | 2018-10-19 | 2021-05-25 | 三菱电机株式会社 | Bathroom drier |
CN112840171B (en) * | 2018-10-19 | 2022-09-09 | 三菱电机株式会社 | Bathroom drier |
Also Published As
Publication number | Publication date |
---|---|
CN1123975A (en) | 1996-06-05 |
GB2295727A (en) | 1996-06-05 |
JP2858088B2 (en) | 1999-02-17 |
JPH08162650A (en) | 1996-06-21 |
GB9513859D0 (en) | 1995-09-06 |
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