TW262567B - - Google Patents

Info

Publication number
TW262567B
TW262567B TW083112299A TW83112299A TW262567B TW 262567 B TW262567 B TW 262567B TW 083112299 A TW083112299 A TW 083112299A TW 83112299 A TW83112299 A TW 83112299A TW 262567 B TW262567 B TW 262567B
Authority
TW
Taiwan
Application number
TW083112299A
Other languages
Chinese (zh)
Original Assignee
Samsug Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsug Electronics Co Ltd filed Critical Samsug Electronics Co Ltd
Application granted granted Critical
Publication of TW262567B publication Critical patent/TW262567B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
TW083112299A 1993-12-31 1994-12-28 TW262567B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930032280A KR970009974B1 (ko) 1993-12-31 1993-12-31 반도체 장치의 제조방법

Publications (1)

Publication Number Publication Date
TW262567B true TW262567B (ja) 1995-11-11

Family

ID=19375146

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083112299A TW262567B (ja) 1993-12-31 1994-12-28

Country Status (3)

Country Link
JP (1) JP3652392B2 (ja)
KR (1) KR970009974B1 (ja)
TW (1) TW262567B (ja)

Also Published As

Publication number Publication date
JP3652392B2 (ja) 2005-05-25
KR970009974B1 (ko) 1997-06-19
JPH07254602A (ja) 1995-10-03
KR950021193A (ko) 1995-07-26

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