TW262567B - - Google Patents
Info
- Publication number
- TW262567B TW262567B TW083112299A TW83112299A TW262567B TW 262567 B TW262567 B TW 262567B TW 083112299 A TW083112299 A TW 083112299A TW 83112299 A TW83112299 A TW 83112299A TW 262567 B TW262567 B TW 262567B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930032280A KR970009974B1 (ko) | 1993-12-31 | 1993-12-31 | 반도체 장치의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW262567B true TW262567B (ja) | 1995-11-11 |
Family
ID=19375146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083112299A TW262567B (ja) | 1993-12-31 | 1994-12-28 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3652392B2 (ja) |
KR (1) | KR970009974B1 (ja) |
TW (1) | TW262567B (ja) |
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1993
- 1993-12-31 KR KR1019930032280A patent/KR970009974B1/ko not_active IP Right Cessation
-
1994
- 1994-12-28 TW TW083112299A patent/TW262567B/zh active
- 1994-12-28 JP JP33895494A patent/JP3652392B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3652392B2 (ja) | 2005-05-25 |
KR970009974B1 (ko) | 1997-06-19 |
JPH07254602A (ja) | 1995-10-03 |
KR950021193A (ko) | 1995-07-26 |