TW256947B - - Google Patents
Info
- Publication number
- TW256947B TW256947B TW083109177A TW83109177A TW256947B TW 256947 B TW256947 B TW 256947B TW 083109177 A TW083109177 A TW 083109177A TW 83109177 A TW83109177 A TW 83109177A TW 256947 B TW256947 B TW 256947B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25127493 | 1993-10-07 | ||
| JP6174423A JP2727970B2 (ja) | 1993-10-07 | 1994-07-26 | ボンディングツール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW256947B true TW256947B (OSRAM) | 1995-09-11 |
Family
ID=26496038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083109177A TW256947B (OSRAM) | 1993-10-07 | 1994-10-04 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5503321A (OSRAM) |
| JP (1) | JP2727970B2 (OSRAM) |
| KR (1) | KR0149057B1 (OSRAM) |
| TW (1) | TW256947B (OSRAM) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3371242B2 (ja) * | 1998-06-22 | 2003-01-27 | ソニーケミカル株式会社 | 熱圧着ヘッド及びこれを用いた熱圧着装置 |
| KR100330400B1 (ko) * | 1999-09-14 | 2002-03-27 | 이용철 | 캐피러리 제작용 툴 및 캐피러리 재생방법 |
| US7377416B2 (en) * | 2004-10-01 | 2008-05-27 | Xerox Corporation | Ultrasonic welding horn for welding a seam in an imaging receptor belt |
| DE102005045100A1 (de) * | 2005-09-21 | 2007-03-29 | Infineon Technologies Ag | Verfahren zum Herstellen eines Leistungshalbleitermoduls |
| KR100718889B1 (ko) * | 2005-11-28 | 2007-05-16 | 이정구 | 투스텝 하이 보틀넥을 갖는 와이어 본딩 캐필러리 |
| US7597231B2 (en) * | 2006-04-10 | 2009-10-06 | Small Precision Tools Inc. | Wire bonding capillary tool having multiple outer steps |
| EP2167269B1 (en) * | 2007-07-24 | 2011-06-08 | Small Precision Tools INC. | Wire bonding capillary tool having multiple outer steps |
| CN105598573B (zh) * | 2009-02-06 | 2019-08-20 | 奥托戴尼电气公司 | 带式焊接工具及采用所述工具的方法 |
| US10847491B2 (en) | 2009-02-06 | 2020-11-24 | Kulicke And Soffa Industries, Inc. | Ribbon bonding tools and methods of using the same |
| CN106206525A (zh) * | 2016-07-18 | 2016-12-07 | 无锡宏纳科技有限公司 | 芯片引脚打线针 |
| US20250125303A1 (en) * | 2023-10-12 | 2025-04-17 | Kulicke And Soffa Industries, Inc. | Wedge bonding tools and methods of forming wire bonds |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3690538A (en) * | 1970-02-25 | 1972-09-12 | Gaiser Tool Co | Bonding tool |
| US3954217A (en) * | 1974-09-30 | 1976-05-04 | Orthodyne Electronics | Method and apparatus for bonding and breaking leads to semiconductors |
| JPS62210634A (ja) * | 1986-03-07 | 1987-09-16 | オ−ソダイン エレクトロニクス コ−ポレイシヨン | ワイヤ−の超音波接着用ツ−ル |
| GB8624513D0 (en) * | 1986-10-13 | 1986-11-19 | Microelectronics & Computer | Single point bonding method |
| US4778097A (en) * | 1986-12-04 | 1988-10-18 | Hauser John G | Ultrasonic wire bonding tool |
| US5223063A (en) * | 1989-04-17 | 1993-06-29 | Kabushiki Kaisha Shinkawa | Method for bonding semiconductor elements to a tab tape |
| JP2697411B2 (ja) * | 1991-03-27 | 1998-01-14 | 日本電気株式会社 | Ｔａｂインナーリードの接合方法 |
| JPH04335546A (ja) * | 1991-05-10 | 1992-11-24 | Toshiba Corp | シングルポイントボンディング方法及びその装置 |
| US5269452A (en) * | 1992-11-12 | 1993-12-14 | Northern Telecom Limited | Method and apparatus for wirebonding |
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1994
- 1994-07-26 JP JP6174423A patent/JP2727970B2/ja not_active Expired - Fee Related
- 1994-09-29 US US08/317,602 patent/US5503321A/en not_active Expired - Fee Related
- 1994-10-04 TW TW083109177A patent/TW256947B/zh active
- 1994-10-07 KR KR1019940025757A patent/KR0149057B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2727970B2 (ja) | 1998-03-18 |
| KR0149057B1 (ko) | 1998-12-01 |
| JPH07153800A (ja) | 1995-06-16 |
| US5503321A (en) | 1996-04-02 |