TW252213B - - Google Patents
Info
- Publication number
- TW252213B TW252213B TW083111332A TW83111332A TW252213B TW 252213 B TW252213 B TW 252213B TW 083111332 A TW083111332 A TW 083111332A TW 83111332 A TW83111332 A TW 83111332A TW 252213 B TW252213 B TW 252213B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5321200A JPH07153720A (ja) | 1993-11-26 | 1993-11-26 | ダイシング装置のウェハ自給装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW252213B true TW252213B (ref) | 1995-07-21 |
Family
ID=18129915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083111332A TW252213B (ref) | 1993-11-26 | 1994-12-06 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH07153720A (ref) |
| KR (1) | KR950015630A (ref) |
| GB (1) | GB2284303B (ref) |
| TW (1) | TW252213B (ref) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022016623A1 (zh) * | 2020-07-24 | 2022-01-27 | 杭州众硅电子科技有限公司 | 晶圆传输设备、化学机械平坦化装置及晶圆传输方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013049001A (ja) * | 2011-08-30 | 2013-03-14 | Panasonic Corp | 液剤塗布装置及び液剤塗布方法 |
| JP6435669B2 (ja) * | 2014-07-04 | 2018-12-12 | 三星ダイヤモンド工業株式会社 | 基板加工装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
| US5064337A (en) * | 1988-07-19 | 1991-11-12 | Tokyo Electron Limited | Handling apparatus for transferring carriers and a method of transferring carriers |
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1993
- 1993-11-26 JP JP5321200A patent/JPH07153720A/ja active Pending
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1994
- 1994-11-25 GB GB9423850A patent/GB2284303B/en not_active Expired - Fee Related
- 1994-11-26 KR KR1019940031393A patent/KR950015630A/ko not_active Withdrawn
- 1994-12-06 TW TW083111332A patent/TW252213B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022016623A1 (zh) * | 2020-07-24 | 2022-01-27 | 杭州众硅电子科技有限公司 | 晶圆传输设备、化学机械平坦化装置及晶圆传输方法 |
| US12427619B2 (en) | 2020-07-24 | 2025-09-30 | Hangzhou Sizone Electronic Technology Inc | Wafer conveying device, chemical mechanical planarization apparatus and wafer conveying method |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9423850D0 (en) | 1995-01-11 |
| KR950015630A (ko) | 1995-06-17 |
| GB2284303B (en) | 1997-10-08 |
| JPH07153720A (ja) | 1995-06-16 |
| GB2284303A (en) | 1995-05-31 |