TW249770B - - Google Patents
Info
- Publication number
- TW249770B TW249770B TW081106019A TW81106019A TW249770B TW 249770 B TW249770 B TW 249770B TW 081106019 A TW081106019 A TW 081106019A TW 81106019 A TW81106019 A TW 81106019A TW 249770 B TW249770 B TW 249770B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/08—Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
Landscapes
- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Economics (AREA)
- Mechanical Engineering (AREA)
- Operations Research (AREA)
- Tourism & Hospitality (AREA)
- Human Resources & Organizations (AREA)
- Marketing (AREA)
- Development Economics (AREA)
- Quality & Reliability (AREA)
- Strategic Management (AREA)
- Entrepreneurship & Innovation (AREA)
- Physics & Mathematics (AREA)
- General Business, Economics & Management (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Factory Administration (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Multi-Process Working Machines And Systems (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3014673A JPH04240058A (ja) | 1991-01-14 | 1991-01-14 | 工作物のバレル研磨装置群による研磨方法および研磨システム |
Publications (1)
Publication Number | Publication Date |
---|---|
TW249770B true TW249770B (enrdf_load_stackoverflow) | 1995-06-21 |
Family
ID=11867741
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW081106019A TW249770B (enrdf_load_stackoverflow) | 1991-01-14 | 1991-04-15 | |
TW080102901A TW201714B (enrdf_load_stackoverflow) | 1991-01-14 | 1991-04-15 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW080102901A TW201714B (enrdf_load_stackoverflow) | 1991-01-14 | 1991-04-15 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH04240058A (enrdf_load_stackoverflow) |
KR (1) | KR920014564A (enrdf_load_stackoverflow) |
DE (1) | DE4128374A1 (enrdf_load_stackoverflow) |
TW (2) | TW249770B (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8105905B2 (en) | 2006-01-24 | 2012-01-31 | Alpha & Omega Semiconductor, Ltd. | Configuration and method to form MOSFET devices with low resistance silicide gate and mesa contact regions |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4218818A1 (de) * | 1992-06-06 | 1993-12-09 | Mueller Weingarten Maschf | Transporteinrichtung |
JPH0722490A (ja) * | 1993-06-30 | 1995-01-24 | Mitsubishi Electric Corp | ロット自動編成装置及び方法 |
JPH0740239A (ja) * | 1993-08-02 | 1995-02-10 | Sony Corp | 研削研磨装置及び方法 |
DE19722536A1 (de) * | 1996-08-22 | 1998-02-26 | Truetzschler Gmbh & Co Kg | Kannenfördersystem zwischen zwei im Arbeitsgang aufeinanderfolgenden Strecken |
IT1293614B1 (it) | 1996-08-22 | 1999-03-08 | Truetzschler & Co | Dispositivo per il trasporto e l'approntamento di vasi,in particolare fra due stiratoi consecutivi nel ciclo di lavorazione |
JP4156315B2 (ja) * | 2002-09-20 | 2008-09-24 | 株式会社チップトン | 渦流バレル研磨システム |
JP6778944B2 (ja) * | 2016-04-11 | 2020-11-04 | 株式会社鉄研 | バレル研磨工程を備えた金属製品の製造方法 |
-
1991
- 1991-01-14 JP JP3014673A patent/JPH04240058A/ja active Pending
- 1991-04-15 TW TW081106019A patent/TW249770B/zh active
- 1991-04-15 TW TW080102901A patent/TW201714B/zh active
- 1991-04-23 KR KR1019910006500A patent/KR920014564A/ko not_active Abandoned
- 1991-08-27 DE DE4128374A patent/DE4128374A1/de not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8105905B2 (en) | 2006-01-24 | 2012-01-31 | Alpha & Omega Semiconductor, Ltd. | Configuration and method to form MOSFET devices with low resistance silicide gate and mesa contact regions |
Also Published As
Publication number | Publication date |
---|---|
KR920014564A (ko) | 1992-08-25 |
TW201714B (enrdf_load_stackoverflow) | 1993-03-11 |
JPH04240058A (ja) | 1992-08-27 |
DE4128374A1 (de) | 1992-07-16 |