TW247967B - - Google Patents
Info
- Publication number
- TW247967B TW247967B TW082103144A TW82103144A TW247967B TW 247967 B TW247967 B TW 247967B TW 082103144 A TW082103144 A TW 082103144A TW 82103144 A TW82103144 A TW 82103144A TW 247967 B TW247967 B TW 247967B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9590892 | 1992-03-23 | ||
| JP29078792A JP3173676B2 (en) | 1992-03-23 | 1992-10-05 | Probe device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW247967B true TW247967B (en) | 1995-05-21 |
Family
ID=14150396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082103144A TW247967B (en) | 1992-03-23 | 1993-04-23 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3173676B2 (en) |
| KR (1) | KR930020629A (en) |
| TW (1) | TW247967B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI456213B (en) * | 2013-01-18 | 2014-10-11 | Hon Tech Inc | Electronic component working unit, working method and working equipment thereof |
| US11262401B2 (en) | 2020-04-22 | 2022-03-01 | Mpi Corporation | Wafer probe station |
| TWI789857B (en) * | 2020-08-03 | 2023-01-11 | 日商日本麥克隆尼股份有限公司 | Connecting device for inspection and assemble method of connecting device for inspection |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4713763B2 (en) * | 2000-05-18 | 2011-06-29 | 株式会社アドバンテスト | Probe position deviation detection method, probe position determination method, probe position deviation detection device, probe position determination device |
| WO2007032077A1 (en) * | 2005-09-15 | 2007-03-22 | Advantest Corporation | Tcp handler |
| JP4606319B2 (en) * | 2005-12-19 | 2011-01-05 | 日東電工株式会社 | Recovery support device |
| JP2011075450A (en) * | 2009-09-30 | 2011-04-14 | Hitachi High-Tech Instruments Co Ltd | Characteristic inspection device and taping device |
| JP6999321B2 (en) * | 2017-07-31 | 2022-01-18 | 東京エレクトロン株式会社 | Inspection equipment, inspection method and storage medium |
| TWI674413B (en) * | 2018-10-31 | 2019-10-11 | 致茂電子股份有限公司 | Probe pin alignment apparatus |
| JP7218909B2 (en) * | 2019-05-09 | 2023-02-07 | 株式会社昭和真空 | Probe pin alignment device and electronic device manufacturing method using probe pin alignment device |
| US11821912B2 (en) * | 2020-05-29 | 2023-11-21 | Formfactor, Inc. | Methods of producing augmented probe system images and associated probe systems |
| JP2023097019A (en) * | 2021-12-27 | 2023-07-07 | 東京エレクトロン株式会社 | Inspection device and inspection method |
-
1992
- 1992-10-05 JP JP29078792A patent/JP3173676B2/en not_active Expired - Lifetime
-
1993
- 1993-03-23 KR KR1019930004495A patent/KR930020629A/en not_active Application Discontinuation
- 1993-04-23 TW TW082103144A patent/TW247967B/zh active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI456213B (en) * | 2013-01-18 | 2014-10-11 | Hon Tech Inc | Electronic component working unit, working method and working equipment thereof |
| US11262401B2 (en) | 2020-04-22 | 2022-03-01 | Mpi Corporation | Wafer probe station |
| TWI765649B (en) * | 2020-04-22 | 2022-05-21 | 旺矽科技股份有限公司 | Wafer probe station |
| TWI789857B (en) * | 2020-08-03 | 2023-01-11 | 日商日本麥克隆尼股份有限公司 | Connecting device for inspection and assemble method of connecting device for inspection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05326675A (en) | 1993-12-10 |
| KR930020629A (en) | 1993-10-20 |
| JP3173676B2 (en) | 2001-06-04 |