KR930020629A - Probe Device - Google Patents

Probe Device Download PDF

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Publication number
KR930020629A
KR930020629A KR1019930004495A KR930004495A KR930020629A KR 930020629 A KR930020629 A KR 930020629A KR 1019930004495 A KR1019930004495 A KR 1019930004495A KR 930004495 A KR930004495 A KR 930004495A KR 930020629 A KR930020629 A KR 930020629A
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KR
South Korea
Prior art keywords
optical system
contact means
contact
system member
image
Prior art date
Application number
KR1019930004495A
Other languages
Korean (ko)
Inventor
시게오키 모리
게이이치 요코다
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시끼가이샤
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Publication date
Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시끼가이샤 filed Critical 이노우에 아키라
Publication of KR930020629A publication Critical patent/KR930020629A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

관체의 상면에 프로우브 침을 가지는 콘택트링을 장착함과 동시에 콘택트링의 아래쪽에 웨이퍼 유지대를 배치한다. 프로우브 침과 웨이퍼 유지대와의 사이에 관체로 형성된 가이드 레일에 따라 웨이퍼의 상면에 평행한 방향으로 진퇴가 자유롭게 가로길이의 관형상체에 의하여 되는 유지부재를 설치함과 동시에, 이 유지부재에 하프 미러 및 전반사 미러로 되는 광학계 부재를 부착하고, 이 광학계부재에 의하여 접촉수단인 프로우브 침과 웨이퍼의 IC 칩의 전극 패드와의 각화상을 유지부재에 설치한 카메라에 집어 넣도록 한다. 본 발명의 프로우브 장치에 의하면, 이들 화상을 보면서 웨이퍼의 위치 맞춤을 할수가 있으므로 별도위치 맞춤용의 영역을 확보 하지 않고 마친다. 이에 의하여 프로우브 장치전체의 소형화를 도모할수가 있다.At the same time as mounting the contact ring having a probe needle on the upper surface of the tubular body, a wafer holder is arranged below the contact ring. A retaining member is formed by a tubular body having a transverse length freely moving forward and backward in a direction parallel to the upper surface of the wafer along the guide rail formed by the tubular body between the probe needle and the wafer holder. An optical system member, which is a mirror and a total reflection mirror, is attached, and by this optical system member an angle image of the probe needle, which is a contact means, and the electrode pad of the IC chip of the wafer is inserted into a camera provided in the holding member. According to the probe device of the present invention, since the wafer can be aligned while viewing these images, it is finished without securing an area for separate positioning. Thereby, the whole probe apparatus can be miniaturized.

Description

프로우브 장치Probe Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 프로우브 장치의 실시예를 나타내는 종단 측면도.1 is a longitudinal side view showing an embodiment of the probe device of the present invention.

제2도는 본 발명의 실시예의 외관을 나타내는 사시도.2 is a perspective view showing the appearance of an embodiment of the present invention.

제3도는 본 발명의 실시예의 요부를 나타내는 평면도.3 is a plan view showing the main parts of an embodiment of the present invention;

제4도는 전극패드와 프로우브 침의 화상을 나타내는 설명도.4 is an explanatory diagram showing an image of an electrode pad and a probe needle.

Claims (7)

피검사체 유지대상에 유지된 피검사체의 전극패드에 접촉수단을 접촉시키고, 이 접촉수단을 통하여 테스터에 의하여 피검사체의 전기적 측정을 하는 프로우프 장치에 있어서, 피검사체 유지대 및 접촉수단의 사이에 피검사체의 상면에 평행한 방향으로 진퇴가 자유롭게 설치되고, 상기 피검사체의 전극패드의 화상과 상기 접촉수단의 화상을 전송하기 위한 광학계 부재와, 이 광학계 부재에 의하여 전송된 화상을 표시한는 화상표시 수단을 구비한 것을 특징으로 하는 프로우브 장치.A probe device in which a contact means is brought into contact with an electrode pad of a subject held on a subject to be held, and an electrical measurement of the subject is performed by a tester through the contact means, wherein the probe is placed between the subject holder and the contact means. An image display in which an advancing and retreat is provided freely in a direction parallel to the upper surface of the inspected object, and an optical system member for transmitting an image of the electrode pad of the inspected object and the image of the contact means, and an image transmitted by the optical system member. A probe device comprising means. 피검사체 유지대상에 유지된 피검사체의 전극패드에 접촉수단을 접촉시키고, 이 접촉수단을 통하여 테스터에 의하여 피검사체의 전기적 측정을 하는 프로우브 장치에 있어서, 상기 피검사체 유지대와 접촉수단의 사이에 피검사체의 상면으로 평행한 방향으로 진퇴가 자유롭게 설치되어 상기 피검사체의 전극패드의 화상과 접촉수단의 화상을 전송하기 위한 광학계 부재와, 이 광학계 부재에 의하여 전송된 화상을 표시하는 화상표시 수단과, 상면측에 접촉용의 면을 가지는 투명한 접촉면 형성체와, 이 접촉면 형성체를 접촉수단에 대하여 상대적으로 상승시키는 승강기구를 설치하며, 상기 접촉수단을 접촉면 형성체의 접촉용의 면에 접촉시킨 상태에서 상기 광학계 부재에 의하여 상기 접촉수단의 화상을 전송하는 것을 특징으로 하는 프로우브 장치.A probe device for contacting a contact means with an electrode pad of a test subject held on a test subject holding object, and performing electrical measurement of the test subject by a tester through the contact means, wherein the probe holder is placed between the test target holder and the contact means. An optical system member for freely moving forward and backward in a direction parallel to the upper surface of the inspected object, for transmitting an image of the electrode pad of the inspected object and the image of the contact means, and an image display means for displaying the image transmitted by the optical system member And a transparent contact surface forming body having a contact surface on the upper surface side, and a lifting mechanism for raising the contact surface forming body relative to the contact means, wherein the contact means contacts with the contact surface of the contact surface forming body. A probe field, characterized in that for transmitting the image of the contact means by the optical system member. . 제1항에 있어서, 상기 피검사체 유지대에 유지된 피검사체의 피검사면에 대여 상기 광학계 부재를 피검사면에 평행 및 직교하는 방향으로 구동시키는 구동수단을 설치한 것을 특징으로 하는 프로우브 장치.The probe apparatus according to claim 1, wherein driving means for driving the optical member in the direction parallel and orthogonal to the inspection surface is provided on the inspection surface of the inspection object held by the object holding table. 제1항에 있어서, 광학계 부재는 고해상도용 광학계 부재와 저행도용 광학계 부재를 구비하고 있는 것을 특징으로 하는 프로우브 장치.The probe device according to claim 1, wherein the optical system member comprises a high resolution optical system member and a low-performance optical system member. 제1항에 있어서, 상기 광학계 부재에 의하여 검출된 상기 피검사체의 전극패드 및 상기 접촉수단의 앞끈단의 위치 데이터를 기억하기 위한 메모리 수단과, 이 메모리 수단에 기억된 데이터에 따라서 상기 피검사체의 전극패드와 상기 접촉수단과의 상호 위치맞춤을 하기 위하여, 상기 피검사체의 위치 및 평면상의 각도를 제어하는 제어부를 설치한 것을 특징으로 하는 프로우브 장치.2. The apparatus according to claim 1, further comprising: memory means for storing the position data of the electrode pad of the subject under test and the front end of the contact means detected by the optical system member, and the data of the subject under test according to the data stored in the memory means; And a control unit for controlling the position of the object under test and the angle on the plane in order to mutually align the electrode pad with the contact means. 제5항에 있어서, 메모리부에 기억된 상기 접촉수단 앞끝단의 위치를 나타내는 상과, 상기 광학계 부재에 의하여 검출된 피검사체의 전극패드의 상을 상기 화상 표시수단상에 중첩하여 표시하도록 구성한 것을 특징으로 하는 프로우브장치.6. The apparatus according to claim 5, wherein the image indicating the position of the front end of the contact means stored in the memory unit and the image of the electrode pad of the inspected object detected by the optical system member are superimposed on the image display means. Probe device characterized in that. 제1항에 있어서, 상기 피검사체 유지대를 X,Y,Z 및방향으로 이동이 자유롭게한 미 조정수단을 설치한것을 특징으로 하는 프로우브 장치.The method of claim 1, wherein the object holder is X, Y, Z and Probe device characterized in that the non-adjustment means provided to move freely in the direction. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930004495A 1992-03-23 1993-03-23 Probe Device KR930020629A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9590892 1992-03-23
JP92-95908 1992-03-23
JP29078792A JP3173676B2 (en) 1992-03-23 1992-10-05 Probe device
JP92-290787 1992-10-05

Publications (1)

Publication Number Publication Date
KR930020629A true KR930020629A (en) 1993-10-20

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Application Number Title Priority Date Filing Date
KR1019930004495A KR930020629A (en) 1992-03-23 1993-03-23 Probe Device

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JP (1) JP3173676B2 (en)
KR (1) KR930020629A (en)
TW (1) TW247967B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4713763B2 (en) * 2000-05-18 2011-06-29 株式会社アドバンテスト Probe position deviation detection method, probe position determination method, probe position deviation detection device, probe position determination device
JP4885139B2 (en) * 2005-09-15 2012-02-29 株式会社アドバンテスト TCP handling device
JP4606319B2 (en) * 2005-12-19 2011-01-05 日東電工株式会社 Recovery support device
JP2011075450A (en) * 2009-09-30 2011-04-14 Hitachi High-Tech Instruments Co Ltd Characteristic inspection device and taping device
TWI456213B (en) * 2013-01-18 2014-10-11 Hon Tech Inc Electronic component working unit, working method and working equipment thereof
JP6999321B2 (en) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 Inspection equipment, inspection method and storage medium
TWI674413B (en) * 2018-10-31 2019-10-11 致茂電子股份有限公司 Probe pin alignment apparatus
JP7218909B2 (en) * 2019-05-09 2023-02-07 株式会社昭和真空 Probe pin alignment device and electronic device manufacturing method using probe pin alignment device
US11262401B2 (en) * 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station
US11821912B2 (en) * 2020-05-29 2023-11-21 Formfactor, Inc. Methods of producing augmented probe system images and associated probe systems
JP7477393B2 (en) * 2020-08-03 2024-05-01 株式会社日本マイクロニクス Test connection device
JP2023097019A (en) * 2021-12-27 2023-07-07 東京エレクトロン株式会社 Inspection device and inspection method

Also Published As

Publication number Publication date
TW247967B (en) 1995-05-21
JPH05326675A (en) 1993-12-10
JP3173676B2 (en) 2001-06-04

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