TW242594B - Laser processing method and device - Google Patents

Laser processing method and device

Info

Publication number
TW242594B
TW242594B TW083101784A TW83101784A TW242594B TW 242594 B TW242594 B TW 242594B TW 083101784 A TW083101784 A TW 083101784A TW 83101784 A TW83101784 A TW 83101784A TW 242594 B TW242594 B TW 242594B
Authority
TW
Taiwan
Prior art keywords
cutting conditions
processing method
laser processing
laser
laser cutting
Prior art date
Application number
TW083101784A
Other languages
Chinese (zh)
Inventor
Shigehiro Yoshiyasu
Masaru Kanaoka
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW242594B publication Critical patent/TW242594B/en

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  • Laser Beam Processing (AREA)

Abstract

A laser processing method, which comprises using a second laser cutting conditions to cut the potion which is between a certain point spaced a certain distance from the final processing point and the final processing point, which is characterized in that at least one of the cutting conditions of pulse peak output, processing gas pressure, and focus position of the second laser cutting conditions is the same as the cutting conditions of pulse peak output, processing gas pressure, and focus position of the first laser cutting conditions.
TW083101784A 1994-02-24 1994-02-28 Laser processing method and device TW242594B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2642394 1994-02-24

Publications (1)

Publication Number Publication Date
TW242594B true TW242594B (en) 1995-03-11

Family

ID=51400957

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083101784A TW242594B (en) 1994-02-24 1994-02-28 Laser processing method and device

Country Status (1)

Country Link
TW (1) TW242594B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414382B (en) * 2006-07-05 2013-11-11 Electro Scient Ind Inc Systems and methods for alignment of laser beam(s) for semiconductor link processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414382B (en) * 2006-07-05 2013-11-11 Electro Scient Ind Inc Systems and methods for alignment of laser beam(s) for semiconductor link processing

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