AU2001265900A1 - Laser machining of materials - Google Patents

Laser machining of materials

Info

Publication number
AU2001265900A1
AU2001265900A1 AU2001265900A AU6590001A AU2001265900A1 AU 2001265900 A1 AU2001265900 A1 AU 2001265900A1 AU 2001265900 A AU2001265900 A AU 2001265900A AU 6590001 A AU6590001 A AU 6590001A AU 2001265900 A1 AU2001265900 A1 AU 2001265900A1
Authority
AU
Australia
Prior art keywords
materials
ultra short
laser machining
laser pulses
picoseconds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001265900A
Inventor
Alexander Heisterkamp
Holger Lubatschowski
Gero Maatz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LZH Laser Zentrum Hannover eV
Original Assignee
LZH Laser Zentrum Hannover eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LZH Laser Zentrum Hannover eV filed Critical LZH Laser Zentrum Hannover eV
Publication of AU2001265900A1 publication Critical patent/AU2001265900A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less

Abstract

The laser cutting device has laser device (1) providing a set of ultra short laser pulses with a duration of less than 300 picoseconds and a repetition rate of between 100 kHz and 1 GHz, converted into a second set of ultra short laser pulses with a duration of less than 300 picoseconds and a repetition rate of between 1 Hz and 1 MHz, before application to the material (4) to be cut, with detection of the first pulse of the second set for application to the material and detection of the obtained result. An independent claim for a laser cutting method using ultra short laser pulses is also included.
AU2001265900A 2000-04-27 2001-04-25 Laser machining of materials Abandoned AU2001265900A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10020559A DE10020559A1 (en) 2000-04-27 2000-04-27 Laser cutting device e.g. for laser surgery, uses ultra short laser pulses with duration of less than 300 picoseconds
DE10020559 2000-04-27
PCT/EP2001/004629 WO2001083155A1 (en) 2000-04-27 2001-04-25 Laser machining of materials

Publications (1)

Publication Number Publication Date
AU2001265900A1 true AU2001265900A1 (en) 2001-11-12

Family

ID=7640058

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001265900A Abandoned AU2001265900A1 (en) 2000-04-27 2001-04-25 Laser machining of materials

Country Status (6)

Country Link
US (1) US6787733B2 (en)
EP (1) EP1284839B1 (en)
AT (1) ATE315976T1 (en)
AU (1) AU2001265900A1 (en)
DE (2) DE10020559A1 (en)
WO (1) WO2001083155A1 (en)

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US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
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US8394084B2 (en) 2005-01-10 2013-03-12 Optimedica Corporation Apparatus for patterned plasma-mediated laser trephination of the lens capsule and three dimensional phaco-segmentation
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
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US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
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US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
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US9018562B2 (en) * 2006-04-10 2015-04-28 Board Of Trustees Of Michigan State University Laser material processing system
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DE102007028042B3 (en) * 2007-06-14 2008-08-07 Universität Zu Lübeck Using laser to make bubbles or cavities in transparent materials by focused, non-linear pulse absorption, operates at specified wavelength and pulse duration with controlled, uniform intensity
DE102007052969A1 (en) 2007-11-07 2009-05-14 Leibniz-Institut für Oberflächenmodifizierung e.V. Electrically contacting thin-film conducting webs to organic carrier by producing openings in dielectric carrier of thin-film circuits, comprises removing large part of thick material of the dielectric carrier on a rear side of circuit
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US6559413B1 (en) * 2001-11-28 2003-05-06 The Regents Of The University Of California Method for laser machining explosives and ordnance

Also Published As

Publication number Publication date
DE50108759D1 (en) 2006-04-06
WO2001083155A1 (en) 2001-11-08
EP1284839A1 (en) 2003-02-26
ATE315976T1 (en) 2006-02-15
US20030110862A1 (en) 2003-06-19
US6787733B2 (en) 2004-09-07
EP1284839B1 (en) 2006-01-18
DE10020559A1 (en) 2001-10-31

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