TW232094B - - Google Patents

Info

Publication number
TW232094B
TW232094B TW082106719A TW82106719A TW232094B TW 232094 B TW232094 B TW 232094B TW 082106719 A TW082106719 A TW 082106719A TW 82106719 A TW82106719 A TW 82106719A TW 232094 B TW232094 B TW 232094B
Authority
TW
Taiwan
Application number
TW082106719A
Other languages
Chinese (zh)
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of TW232094B publication Critical patent/TW232094B/zh

Links

Classifications

    • H10W74/43—
    • H10W74/01—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • H10W72/019—
    • H10W74/476—
    • H10W72/075—
    • H10W72/07536—
    • H10W72/07537—
    • H10W72/923—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW082106719A 1992-08-28 1993-08-20 TW232094B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93647592A 1992-08-28 1992-08-28

Publications (1)

Publication Number Publication Date
TW232094B true TW232094B (index.php) 1994-10-11

Family

ID=25468695

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082106719A TW232094B (index.php) 1992-08-28 1993-08-20

Country Status (6)

Country Link
EP (1) EP0590780B1 (index.php)
JP (1) JPH06177185A (index.php)
KR (1) KR100287487B1 (index.php)
CA (1) CA2104487A1 (index.php)
DE (1) DE69311774T2 (index.php)
TW (1) TW232094B (index.php)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
DE19548046C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen
US5935638A (en) * 1998-08-06 1999-08-10 Dow Corning Corporation Silicon dioxide containing coating
WO2008122292A1 (en) * 2007-04-04 2008-10-16 Ecole Polytechnique Federale De Lausanne (Epfl) Diffusion-barrier coating for protection of moisture and oxygen sensitive devices
US10399256B1 (en) 2018-04-17 2019-09-03 Goodrich Corporation Sealed circuit card assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63213347A (ja) * 1987-02-27 1988-09-06 Mitsubishi Electric Corp 半導体装置
US4849296A (en) * 1987-12-28 1989-07-18 Dow Corning Corporation Multilayer ceramic coatings from metal oxides and hydrogen silsesquioxane resin ceramified in ammonia
US4888226A (en) * 1988-08-08 1989-12-19 American Telephone And Telegraph Company Silicone gel electronic device encapsulant
CA2027031A1 (en) * 1989-10-18 1991-04-19 Loren A. Haluska Hermetic substrate coatings in an inert gas atmosphere
US5136364A (en) * 1991-06-12 1992-08-04 National Semiconductor Corporation Semiconductor die sealing

Also Published As

Publication number Publication date
KR940004761A (ko) 1994-03-15
EP0590780B1 (en) 1997-06-25
DE69311774D1 (de) 1997-07-31
KR100287487B1 (ko) 2001-04-16
EP0590780A1 (en) 1994-04-06
DE69311774T2 (de) 1998-01-08
CA2104487A1 (en) 1994-03-01
JPH06177185A (ja) 1994-06-24

Similar Documents

Publication Publication Date Title
TW249255B (index.php)
TW254012B (index.php)
FR2686711B1 (index.php)
FR2692226B1 (index.php)
TW221036B (index.php)
TW232094B (index.php)
TW241265B (index.php)
TW236679B (index.php)
AU631518B2 (index.php)
AU632452B2 (index.php)
BR9304980A (index.php)
IN186682B (index.php)
IN185541B (index.php)
IN179757B (index.php)
AU2098792A (index.php)
AU634138B1 (index.php)
AU1313092A (index.php)
CN3012489S (index.php)
CN3011935S (index.php)
CN3011928S (index.php)
CN3011927S (index.php)
CN3015342S (index.php)
AU634143B1 (index.php)
AU634140B1 (index.php)
EP0580252A3 (index.php)