TW225038B - - Google Patents
Info
- Publication number
- TW225038B TW225038B TW082101527A TW82101527A TW225038B TW 225038 B TW225038 B TW 225038B TW 082101527 A TW082101527 A TW 082101527A TW 82101527 A TW82101527 A TW 82101527A TW 225038 B TW225038 B TW 225038B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4575192A JPH05167063A (ja) | 1991-10-15 | 1992-03-03 | オーミック電極とその形成方法及び半導体装置 |
| JP5540892 | 1992-03-13 | ||
| JP6229992 | 1992-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW225038B true TW225038B (ja) | 1994-06-11 |
Family
ID=26396300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082101527A TW225038B (ja) | 1992-03-03 | 1993-03-02 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH05326518A (ja) |
| KR (1) | KR930020586A (ja) |
| TW (1) | TW225038B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183377A (ja) * | 1993-12-24 | 1995-07-21 | Nec Corp | 半導体装置 |
| JP5314963B2 (ja) | 2008-08-12 | 2013-10-16 | 富士フイルム株式会社 | 積層体、圧電素子、および液体吐出装置 |
| JP5371329B2 (ja) * | 2008-08-29 | 2013-12-18 | 富士フイルム株式会社 | 圧電素子、および液体吐出装置 |
-
1993
- 1993-02-02 JP JP5015480A patent/JPH05326518A/ja active Pending
- 1993-03-02 TW TW082101527A patent/TW225038B/zh active
- 1993-03-03 KR KR1019930003079A patent/KR930020586A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05326518A (ja) | 1993-12-10 |
| KR930020586A (ko) | 1993-10-20 |