TW225038B - - Google Patents
Info
- Publication number
- TW225038B TW225038B TW082101527A TW82101527A TW225038B TW 225038 B TW225038 B TW 225038B TW 082101527 A TW082101527 A TW 082101527A TW 82101527 A TW82101527 A TW 82101527A TW 225038 B TW225038 B TW 225038B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
- H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
- H10W20/035—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
- H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
- H10W20/036—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics the barrier, adhesion or liner layers being within a main fill metal
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4575192A JPH05167063A (ja) | 1991-10-15 | 1992-03-03 | オーミック電極とその形成方法及び半導体装置 |
| JP5540892 | 1992-03-13 | ||
| JP6229992 | 1992-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW225038B true TW225038B (https=) | 1994-06-11 |
Family
ID=26396300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082101527A TW225038B (https=) | 1992-03-03 | 1993-03-02 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH05326518A (https=) |
| KR (1) | KR930020586A (https=) |
| TW (1) | TW225038B (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183377A (ja) * | 1993-12-24 | 1995-07-21 | Nec Corp | 半導体装置 |
| JP5314963B2 (ja) * | 2008-08-12 | 2013-10-16 | 富士フイルム株式会社 | 積層体、圧電素子、および液体吐出装置 |
| JP5371329B2 (ja) * | 2008-08-29 | 2013-12-18 | 富士フイルム株式会社 | 圧電素子、および液体吐出装置 |
-
1993
- 1993-02-02 JP JP5015480A patent/JPH05326518A/ja active Pending
- 1993-03-02 TW TW082101527A patent/TW225038B/zh active
- 1993-03-03 KR KR1019930003079A patent/KR930020586A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| KR930020586A (ko) | 1993-10-20 |
| JPH05326518A (ja) | 1993-12-10 |