TW224183B - - Google Patents

Info

Publication number
TW224183B
TW224183B TW082105534A TW82105534A TW224183B TW 224183 B TW224183 B TW 224183B TW 082105534 A TW082105534 A TW 082105534A TW 82105534 A TW82105534 A TW 82105534A TW 224183 B TW224183 B TW 224183B
Authority
TW
Taiwan
Application number
TW082105534A
Other languages
Chinese (zh)
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of TW224183B publication Critical patent/TW224183B/zh

Links

Classifications

    • H10W40/77—
    • H10W42/121—
    • H10W72/071—
    • H10W76/134—
    • H10W70/682—
    • H10W72/07352—
    • H10W72/321—
    • H10W72/352—
    • H10W72/354—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/884—
    • H10W90/756—
TW082105534A 1992-07-13 1993-07-12 TW224183B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/912,535 US5315155A (en) 1992-07-13 1992-07-13 Electronic package with stress relief channel

Publications (1)

Publication Number Publication Date
TW224183B true TW224183B (index.php) 1994-05-21

Family

ID=25432090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082105534A TW224183B (index.php) 1992-07-13 1993-07-12

Country Status (5)

Country Link
US (1) US5315155A (index.php)
AU (1) AU4651493A (index.php)
MX (1) MX9304184A (index.php)
TW (1) TW224183B (index.php)
WO (1) WO1994001886A1 (index.php)

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JP3233535B2 (ja) * 1994-08-15 2001-11-26 株式会社東芝 半導体装置及びその製造方法
KR19990028818A (ko) * 1995-07-14 1999-04-15 와인스타인 폴 금속 볼 그리드 전자 패키지
JP2904141B2 (ja) * 1996-08-20 1999-06-14 日本電気株式会社 半導体装置
US6281572B1 (en) * 1997-12-05 2001-08-28 The Charles Stark Draper Laboratory, Inc. Integrated circuit header assembly
US6749105B2 (en) * 2002-03-21 2004-06-15 Motorola, Inc. Method and apparatus for securing a metallic substrate to a metallic housing
US6946742B2 (en) * 2002-12-19 2005-09-20 Analog Devices, Inc. Packaged microchip with isolator having selected modulus of elasticity
US20040041254A1 (en) * 2002-09-04 2004-03-04 Lewis Long Packaged microchip
US7166911B2 (en) * 2002-09-04 2007-01-23 Analog Devices, Inc. Packaged microchip with premolded-type package
US6768196B2 (en) 2002-09-04 2004-07-27 Analog Devices, Inc. Packaged microchip with isolation
US20050056870A1 (en) * 2002-12-19 2005-03-17 Karpman Maurice S. Stress sensitive microchip with premolded-type package
JP4338620B2 (ja) * 2004-11-01 2009-10-07 三菱電機株式会社 半導体装置及びその製造方法
US8344487B2 (en) * 2006-06-29 2013-01-01 Analog Devices, Inc. Stress mitigation in packaged microchips
US8084855B2 (en) 2006-08-23 2011-12-27 Rockwell Collins, Inc. Integrated circuit tampering protection and reverse engineering prevention coatings and methods
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
US8166645B2 (en) 2006-08-23 2012-05-01 Rockwell Collins, Inc. Method for providing near-hermetically coated, thermally protected integrated circuit assemblies
US8076185B1 (en) 2006-08-23 2011-12-13 Rockwell Collins, Inc. Integrated circuit protection and ruggedization coatings and methods
US7915527B1 (en) 2006-08-23 2011-03-29 Rockwell Collins, Inc. Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings
US8617913B2 (en) * 2006-08-23 2013-12-31 Rockwell Collins, Inc. Alkali silicate glass based coating and method for applying
US8174830B2 (en) * 2008-05-06 2012-05-08 Rockwell Collins, Inc. System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
US8581108B1 (en) 2006-08-23 2013-11-12 Rockwell Collins, Inc. Method for providing near-hermetically coated integrated circuit assemblies
US7694610B2 (en) * 2007-06-27 2010-04-13 Siemens Medical Solutions Usa, Inc. Photo-multiplier tube removal tool
US8363189B2 (en) * 2007-12-18 2013-01-29 Rockwell Collins, Inc. Alkali silicate glass for displays
US8616266B2 (en) * 2008-09-12 2013-12-31 Rockwell Collins, Inc. Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
US8221089B2 (en) * 2008-09-12 2012-07-17 Rockwell Collins, Inc. Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader
US8017872B2 (en) * 2008-05-06 2011-09-13 Rockwell Collins, Inc. System and method for proportional cooling with liquid metal
US8205337B2 (en) * 2008-09-12 2012-06-26 Rockwell Collins, Inc. Fabrication process for a flexible, thin thermal spreader
US8650886B2 (en) * 2008-09-12 2014-02-18 Rockwell Collins, Inc. Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections
US8119040B2 (en) 2008-09-29 2012-02-21 Rockwell Collins, Inc. Glass thick film embedded passive material
JP2011014615A (ja) * 2009-06-30 2011-01-20 Denso Corp センサ装置およびその製造方法
EP2460780A4 (en) * 2009-07-31 2013-12-04 Asahi Glass Co Ltd SEALING GLASS, SEALING MATERIAL AND SEALING MATERIAL PASTE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
RU2480860C2 (ru) * 2009-12-31 2013-04-27 Государственное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Система монтажа полупроводникового кристалла к основанию корпуса
US8237171B2 (en) * 2010-02-09 2012-08-07 Microsemi Corporation High voltage high package pressure semiconductor package
US8587107B2 (en) * 2010-02-09 2013-11-19 Microsemi Corporation Silicon carbide semiconductor
US8705237B2 (en) * 2011-06-01 2014-04-22 Honeywell International Inc. Thermally conductive and electrically insulative card guide
US9435915B1 (en) 2012-09-28 2016-09-06 Rockwell Collins, Inc. Antiglare treatment for glass
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
JP6381021B2 (ja) * 2014-06-04 2018-08-29 Ｎｅｃスペーステクノロジー株式会社 パッケージおよびパッケージの製造方法
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
DE102014119396A1 (de) * 2014-12-22 2016-06-23 Endress + Hauser Gmbh + Co. Kg Druckmesseinrichtung
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
CN106744644A (zh) * 2016-10-11 2017-05-31 中国科学院地质与地球物理研究所 一种mems传感器低应力封装管壳及封装系统
US9917040B1 (en) * 2016-12-12 2018-03-13 Stmicroelectronics, Inc. Stress relieved thermal base for integrated circuit packaging
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture

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US4185139A (en) * 1977-12-30 1980-01-22 International Standard Electric Corporation Filler for a glass-ceramic material comprising CaF2 granules overcoated with a silicon dioxide film
US4202700A (en) * 1979-05-02 1980-05-13 The United States Of America As Represented By The United States Department Of Energy Glassy composition for hermetic seals
JPS57192050A (en) * 1981-05-21 1982-11-26 Nec Corp Package for semiconductor element
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JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
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US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
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US4715892A (en) * 1986-03-12 1987-12-29 Olin Corporation Cermet substrate with glass adhesion component
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US4756754A (en) * 1987-03-06 1988-07-12 Olin Corporation Cermet composite
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Also Published As

Publication number Publication date
AU4651493A (en) 1994-01-31
US5315155A (en) 1994-05-24
WO1994001886A1 (en) 1994-01-20
MX9304184A (es) 1994-02-28

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