TW224072B - - Google Patents

Info

Publication number
TW224072B
TW224072B TW082104857A TW82104857A TW224072B TW 224072 B TW224072 B TW 224072B TW 082104857 A TW082104857 A TW 082104857A TW 82104857 A TW82104857 A TW 82104857A TW 224072 B TW224072 B TW 224072B
Authority
TW
Taiwan
Application number
TW082104857A
Other languages
Chinese (zh)
Original Assignee
R H Murphy Company Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R H Murphy Company Inc filed Critical R H Murphy Company Inc
Application granted granted Critical
Publication of TW224072B publication Critical patent/TW224072B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW082104857A 1992-02-28 1993-09-23 TW224072B (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84362292A 1992-02-28 1992-02-28

Publications (1)

Publication Number Publication Date
TW224072B true TW224072B (enrdf_load_stackoverflow) 1994-05-21

Family

ID=25290540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082104857A TW224072B (enrdf_load_stackoverflow) 1992-02-28 1993-09-23

Country Status (5)

Country Link
JP (1) JPH0632384A (enrdf_load_stackoverflow)
DE (1) DE4306317A1 (enrdf_load_stackoverflow)
GB (1) GB2264696B (enrdf_load_stackoverflow)
MY (1) MY111058A (enrdf_load_stackoverflow)
TW (1) TW224072B (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0676246B1 (en) * 1993-09-29 2001-04-11 Nagoya Oilchemical Co., Ltd. Masking member
US5400904C1 (en) * 1993-10-15 2001-01-16 Murphy R H Co Inc Tray for ball terminal integrated circuits
US5636745A (en) * 1994-10-27 1997-06-10 Illinois Tool Works Inc. Tray for a component and an apparatus for accurately placing a component within the tray
IES81332B2 (en) * 1997-03-03 2000-10-04 Ranleigh Ltd Packaging aid for fragile materials
KR100464171B1 (ko) * 1997-11-27 2005-04-06 삼성전자주식회사 반도체 패키지용 트레이
JP4306322B2 (ja) * 2003-05-02 2009-07-29 株式会社Ｉｈｉ 薄膜形成装置の基板搬送装置
DE102008039913A1 (de) * 2008-08-27 2010-03-04 Berker Gmbh & Co. Kg Verpackungsanordnung
KR200471999Y1 (ko) * 2012-09-06 2014-03-28 주식회사 원강테크닉스 반도체 패키지 제조용 보트 캐리어
JP2014136606A (ja) * 2013-01-18 2014-07-28 Fujitsu Component Ltd 電子部品モジュール収納用キャリア及びキャリア収納用電子部品モジュール、キャリア収納電子部品モジュール
JP6400066B2 (ja) * 2016-12-05 2018-10-03 シノン電気産業株式会社 半導体集積回路用トレー及びこれの製造方法

Also Published As

Publication number Publication date
GB2264696A (en) 1993-09-08
GB9303350D0 (en) 1993-04-07
JPH0632384A (ja) 1994-02-08
MY111058A (en) 1999-08-30
DE4306317A1 (enrdf_load_stackoverflow) 1993-09-02
GB2264696B (en) 1995-10-04

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