TW202536073A - 液晶聚合物薄膜層積體、液晶聚合物薄膜層積體的製造方法、液晶聚合物薄膜的製造方法,及液晶聚合物薄膜 - Google Patents

液晶聚合物薄膜層積體、液晶聚合物薄膜層積體的製造方法、液晶聚合物薄膜的製造方法,及液晶聚合物薄膜

Info

Publication number
TW202536073A
TW202536073A TW113148155A TW113148155A TW202536073A TW 202536073 A TW202536073 A TW 202536073A TW 113148155 A TW113148155 A TW 113148155A TW 113148155 A TW113148155 A TW 113148155A TW 202536073 A TW202536073 A TW 202536073A
Authority
TW
Taiwan
Prior art keywords
liquid crystal
crystal polymer
thin film
aforementioned
film layer
Prior art date
Application number
TW113148155A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤由実
河村悟史
佐藤優斗
埃弗特 Na
池田保之
Original Assignee
日商東洋鋼鈑股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東洋鋼鈑股份有限公司 filed Critical 日商東洋鋼鈑股份有限公司
Publication of TW202536073A publication Critical patent/TW202536073A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/027Thermal properties
    • B32B7/028Heat-shrinkability

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW113148155A 2023-12-12 2024-12-11 液晶聚合物薄膜層積體、液晶聚合物薄膜層積體的製造方法、液晶聚合物薄膜的製造方法,及液晶聚合物薄膜 TW202536073A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-209611 2023-12-12
JP2023209611 2023-12-12

Publications (1)

Publication Number Publication Date
TW202536073A true TW202536073A (zh) 2025-09-16

Family

ID=96057379

Family Applications (2)

Application Number Title Priority Date Filing Date
TW113148155A TW202536073A (zh) 2023-12-12 2024-12-11 液晶聚合物薄膜層積體、液晶聚合物薄膜層積體的製造方法、液晶聚合物薄膜的製造方法,及液晶聚合物薄膜
TW113148410A TW202539889A (zh) 2023-12-12 2024-12-12 液晶聚合物薄膜層積體、液晶聚合物薄膜層積體之製造方法及液晶聚合物薄膜之製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113148410A TW202539889A (zh) 2023-12-12 2024-12-12 液晶聚合物薄膜層積體、液晶聚合物薄膜層積體之製造方法及液晶聚合物薄膜之製造方法

Country Status (3)

Country Link
JP (1) JPWO2025127113A1 (https=)
TW (2) TW202536073A (https=)
WO (2) WO2025127110A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3659721B2 (ja) * 1995-12-22 2005-06-15 ジャパンゴアテックス株式会社 接着性表面又は金属表面を有する液晶ポリマーフィルム延伸物
US5744204A (en) * 1996-12-05 1998-04-28 Hoechst Celanese Corp. Laminates comprising coextruded liquid crystal polymer films and discardable thermoplastic outside layers
JPWO2004060656A1 (ja) * 2003-01-06 2006-05-11 東レ株式会社 積層フィルムおよびその製造方法
JP2005325299A (ja) * 2004-05-17 2005-11-24 Toray Ind Inc 二軸配向ポリエステルフィルム
JP2011145642A (ja) * 2009-12-16 2011-07-28 Mitsui Chemicals Inc 偏光性拡散フィルム、偏光性拡散フィルムの製造方法、および偏光性拡散フィルムを含む液晶表示装置
CN113544191B (zh) * 2019-03-01 2024-03-29 Jsr株式会社 高频电路用层叠体及其制造方法、柔性印刷基板、b阶片、以及层叠体卷绕体
WO2022113961A1 (ja) * 2020-11-24 2022-06-02 富士フイルム株式会社 液晶ポリマーフィルム、ポリマーフィルム、及び、積層体
KR20240001269A (ko) * 2020-12-09 2024-01-03 덴카 주식회사 Lcp 압출 필름 및 그의 제조 방법, 연신 처리용 lcp 압출 필름, lcp 연신 필름, 열수축성 lcp 연신 필름, 회로 기판용 절연 재료, 그리고 금속박을 붙인 적층판
JP7676563B2 (ja) * 2021-09-03 2025-05-14 デンカ株式会社 Lcp押出フィルム、回路基板用絶縁材料、及び金属箔張積層板
WO2023163101A1 (ja) * 2022-02-28 2023-08-31 富士フイルム株式会社 積層体、配線基板、配線基板の製造方法
JP2024049031A (ja) * 2022-09-28 2024-04-09 信越ポリマー株式会社 熱収縮性フィルム及びその製造方法
JPWO2024162372A1 (https=) * 2023-02-03 2024-08-08
WO2024166774A1 (ja) * 2023-02-09 2024-08-15 デンカ株式会社 Lcpフィルムの製造方法

Also Published As

Publication number Publication date
WO2025127113A1 (ja) 2025-06-19
JPWO2025127113A1 (https=) 2025-06-19
WO2025127110A1 (ja) 2025-06-19
TW202539889A (zh) 2025-10-16

Similar Documents

Publication Publication Date Title
JP7443553B2 (ja) 液晶ポリマーフィルム、フレキシブル銅張積層板及び液晶ポリマーフィルムの製造方法
TWI864170B (zh) 電路基板用lcp膜之製造方法、及電路基板用t型模頭熔融押出lcp膜
TWI864169B (zh) 電路基板用lcp樹脂組合物、電路基板用lcp膜及其製造方法
US12454088B2 (en) LCP extruded film and method for manufacturing the same, LCP extruded film for stretch treatment, LCP stretched film, heat-shrinkable LCP stretched film, insulating material for circuit substrate, and metal foil-clad laminate
KR102635625B1 (ko) 금속 피복 적층판 및 그 제조 방법
CN104220236A (zh) 热塑性液晶聚合物薄膜及其制造方法
CN104781318B (zh) 脱模膜
TW202035167A (zh) 兩面覆金屬積層體及其製造方法、絕緣薄膜及電子電路基板
JP2011175988A (ja) 離型フィルム
CN117325532B (zh) 液晶聚合物薄膜拉伸用3层薄膜、拉伸3层薄膜、和拉伸液晶聚合物薄膜、以及它们的制造方法
TW202442773A (zh) 液晶聚合物薄膜延伸用3層薄膜、延伸3層薄膜,及延伸液晶聚合物薄膜,及此等之製造方法
JP7702311B2 (ja) 液晶ポリマーフィルム、積層体
TW202536073A (zh) 液晶聚合物薄膜層積體、液晶聚合物薄膜層積體的製造方法、液晶聚合物薄膜的製造方法,及液晶聚合物薄膜
CN120659833A (zh) Lcp膜
JP7703402B2 (ja) ポリマーフィルム及び積層体
JP7458396B2 (ja) 金属張積層体の製造方法
KR102648548B1 (ko) 반방향족 폴리아미드 필름 및 그것으로부터 얻어지는 적층체
TW202532212A (zh) 延伸液晶聚合物薄膜、層積體、電路基板、及延伸液晶聚合物薄膜的製造方法
TW202532544A (zh) 延伸液晶聚合物薄膜、積層體、電路基板、超材料及延伸液晶聚合物薄膜之製造方法
TW202600358A (zh) 覆金屬積層板之製造方法
CN116710278A (zh) Lcp挤出膜及其制造方法、拉伸处理用lcp挤出膜、lcp拉伸膜、热收缩性lcp拉伸膜、电路基板用绝缘材料及覆金属箔层叠板
WO2025254059A1 (ja) 液晶ポリマーフィルム、金属張積層板及びその製造方法、並びに回路基板及び多層回路基板
CN120137421A (zh) 拉伸液晶聚合物薄膜、层叠体、电路板、超材料和拉伸液晶聚合物薄膜的制造方法